Wafer test platform deck

Abstract

The utility model relates to the technical field of wafer low-temperature testing, and particularly discloses a wafer testing platform deck which comprises an upper platform deck and supporting columns. The upper table top is arranged on the supporting columns and is used for placing a wafer; the supporting column is a hollow-out column body. According to the scheme, the supporting columns are hollow columns, the overall contact area of liquid nitrogen and the carrying table can be increased in the testing process, and therefore the speed of cooling the carrying table by the liquid nitrogen is increased, and the problem that an existing wafer carrying table is low in cooling speed is effectively solved.

Description

Technical Field

[0001] The present application relates to the technical field of wafer low-temperature testing, and in particular to a wafer testing carrier. Background Art

[0002] Indium antimonide wafers are used to make silicon semiconductor circuits, and their circuit testing characteristics require a liquid nitrogen environment to have the required optoelectronic performance.

[0003] In actual applications, wafers are usually placed on a stage; and during the test, liquid nitrogen not only needs to cool the wafer, but also needs to contact the stage to cool the stage. However, for existing stages, liquid nitrogen can only contact its outer surface, and the cooling speed is slow. Utility Model Content

[0004] In view of this, the purpose of the present application is to provide a wafer testing carrier to solve the problem of slow cooling speed of existing wafer carriers.

[0005] In order to achieve the above technical objectives, the present application provides a wafer testing stage, comprising: an upper table and a support column;

[0006] The upper table is arranged on the supporting column and is used for placing the wafer;

[0007] The supporting column is a hollow column.

[0008] Furthermore, a stop edge protruding upward is provided on the outer periphery of the top surface of the upper table.

[0009] Furthermore, a guide groove is arranged on the upper table surface.

[0010] Furthermore, the guide groove is centrally symmetrical on the upper table surface;

[0011] The guide groove passes through the upper table surface in a horizontal direction.

[0012] Furthermore, the guide groove includes a cross groove and a concentric circle groove;

[0013] The cross groove passes through the upper table surface in the horizontal direction;

[0014] The concentric grooves are distributed in concentric circles around the center of the cross groove.

[0015] Furthermore, the side of the support column is provided with a plurality of transverse grooves penetrating in the horizontal direction.

[0016] Furthermore, a vertical through groove penetrating in the vertical direction is provided in the middle of the support column;

[0017] The vertical through groove is communicated with the horizontal through groove.

[0018] Furthermore, a weight-reducing groove is provided at the bottom of the upper table.

[0019] Further, it also includes: a base;

[0020] The support column is arranged on the base;

[0021] The coverage area of ​​the base on the horizontal plane is larger than the coverage area of ​​the support column on the horizontal plane.

[0022] Furthermore, the base is provided with a hollow hole penetrating in the vertical direction.

[0023] It can be seen from the above technical solutions that the present application provides a wafer testing platform, comprising: an upper table and a support column; the upper table is arranged on the support column for placing the wafer; the support column is a hollow column.

[0024] The support column in this solution is a hollow column, which can increase the contact area between the liquid nitrogen and the entire carrier during the test process, thereby accelerating the cooling speed of the carrier by the liquid nitrogen, and effectively solving the problem of slow cooling speed of the existing wafer carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0026] Figure 1 A structural diagram of a wafer test carrier provided in an embodiment of the present application;

[0027] Figure 2 A structural diagram of a wafer testing platform from another perspective provided in an embodiment of the present application. DETAILED DESCRIPTION

[0028] The technical solutions of the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the specification of the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection requested by the present application.

[0029] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0030] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a replaceable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0031] See also Figure 1 and Figure 2 A wafer testing platform provided in an embodiment of the present application includes: an upper table 10 and a support column 20; the upper table 10 is arranged on the support column 20 for placing the wafer.

[0032] In this solution, the support column 20 is a hollow column, which can reduce the weight of the support column 20 and allow liquid nitrogen to flow in to increase the contact area between the liquid nitrogen and the support column 20, thereby accelerating the overall cooling speed of the carrier when adding liquid nitrogen and ensuring the circuit characteristic test effect of the wafer.

[0033] In a more specific embodiment, a plurality of transverse grooves 21 penetrating in the horizontal direction may be provided on the side of the support column 20 , through which liquid nitrogen can flow into the interior of the support column 20 .

[0034] Furthermore, a vertical through groove 22 penetrating in the vertical direction is provided in the middle of the support column 20 ; the vertical through groove 22 is communicated with the horizontal through groove 21 .

[0035] Specifically, in this embodiment, the transverse through grooves 21 may include four and are evenly distributed around the vertical through groove 22 .

[0036] In one embodiment, a stop edge 11 protruding upward is provided on the outer periphery of the top surface of the upper table 10 to prevent the wafer from sliding off the upper table 10 and being damaged during testing, placement and sampling; that is, the stop edge 11 is provided so that the upper table 10 has a concave structure, which can be used to limit the wafer.

[0037] In another embodiment, a guide groove 12 is provided on the upper table 10 to allow liquid nitrogen to flow in and fully contact the wafer, while helping the volatilized liquid nitrogen gas to be discharged through the guide groove 12 to avoid the formation of bubbles between the wafer and the upper table 10.

[0038] Furthermore, the guide groove 12 is a centrally symmetrical structure on the upper table 10; the guide groove 12 runs through the upper table 10 in a horizontal direction to facilitate the flow of liquid nitrogen and the discharge of volatilized gas.

[0039] In a more specific embodiment, the guide groove 12 includes a cross groove and concentric circle grooves; the cross groove penetrates the upper table 10 in the horizontal direction; and the concentric circle grooves are distributed in concentric circles around the center of the cross groove.

[0040] The concentric grooves can also increase the friction of the upper table 10, which helps to place the wafer stably.

[0041] Furthermore, a weight-reducing groove 13 is provided at the bottom of the upper table 10 , which can further reduce the weight of the entire carrier and increase the contact area between the liquid nitrogen and the entire carrier.

[0042] In one embodiment, it further includes: a base 30 ; and a support column 20 disposed on the base 30 .

[0043] The coverage area of ​​the base 30 on the horizontal plane is larger than the coverage area of ​​the support column 20 on the horizontal plane, which helps to place the platform stably and ensures the overall stability of the platform.

[0044] As a further improvement, the base 30 is provided with a hollow hole 31 penetrating in the vertical direction.

[0045] The hollow hole 31 increases the contact area between the carrier and the liquid nitrogen on the one hand, and helps the liquid nitrogen to flow under the base 30 to avoid the formation of an air chamber on the other hand.

[0046] It should be noted that a central hole 32 communicating with the vertical through groove 22 may be provided in the middle of the base 30 to facilitate the liquid nitrogen to flow to the bottom of the base 30 .

[0047] In the embodiment provided in the present application, the diameter of the support column 20 can be 30 mm and the height can be 40 mm; the width of the transverse groove 21 is 10 mm, and the distance between the lower edge of the transverse groove 21 and the base 30 is 5 mm; the distance between the upper edge of the transverse groove 21 and the upper surface of the upper table 10 is 5 mm.

[0048] The diameter of the center hole 32 is 20 mm, and the length of the through hole is 45 mm from the lower surface of the base 30 upwards.

[0049] The diameter of the base 30 is 80 mm; the width of the hollow hole 31 is 10 mm, the length is 20 mm, and the distance between the outer edge of the hole and the edge of the base 30 is 5 mm.

[0050] The above are only preferred embodiments of the present application and are not intended to limit the present utility model. Although the present application has been described in detail with reference to the examples, those skilled in the art can still modify the technical solutions recorded in the aforementioned examples or make equivalent substitutions for some of the technical features therein. However, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A wafer test carrier, characterized in that: include: An upper table (10) and a support column (20); The upper table (10) is arranged on the supporting column (20) and is used for placing wafers; The support column (20) is a hollow column.

2. The wafer testing platform according to claim 1, characterized in that: The outer periphery of the top surface of the upper table surface (10) is provided with a stop edge (11) protruding upward.

3. The wafer testing platform according to claim 1, characterized in that: A guide groove (12) is provided on the upper table surface (10).

4. The wafer testing platform according to claim 3, characterized in that: The guide groove (12) is in a centrally symmetrical structure on the upper table surface (10); The guide groove (12) passes through the upper table surface (10) in a horizontal direction.

5. The wafer testing platform according to claim 4, characterized in that: The guide groove (12) comprises a cross groove and concentric circular grooves; The cross groove passes through the upper table surface (10) in the horizontal direction; The concentric grooves are distributed in concentric circles around the center of the cross groove.

6. The wafer testing stage according to claim 1, characterized in that: The side of the support column (20) is provided with a plurality of transverse grooves (21) penetrating in the horizontal direction.

7. The wafer testing stage according to claim 6, characterized in that: A vertical through groove (22) penetrating in the vertical direction is provided in the middle of the support column (20); The vertical through groove (22) is communicated with the horizontal through groove (21).

8. The wafer testing stage according to claim 1, characterized in that: A weight-reducing groove (13) is provided at the bottom of the upper table (10).

9. The wafer testing stage according to claim 1, characterized in that: Also includes: Base (30); The support column (20) is arranged on the base (30); The coverage area of ​​the base (30) on the horizontal plane is greater than the coverage area of ​​the support column (20) on the horizontal plane.

10. The wafer testing stage according to claim 9, characterized in that: The base (30) is provided with a hollow hole (31) penetrating in the vertical direction.

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