Packaging device for new material of semiconductor chip

Abstract

The utility model relates to the technical field of packaging devices, and discloses a packaging device for a new material of a semiconductor chip, which comprises a bottom plate, an L-shaped plate is fixedly connected to the outer side of the bottom plate, a rotating shaft is rotatably connected to the bottom of the L-shaped plate, and a mounting plate is fixedly connected to the outer side of the rotating shaft. According to the packaging device for the new material of the semiconductor chip, a mounting plate can be driven to rotate through rotation of a rotating shaft, an electric telescopic rod can drive a first fixing plate to move up and down so as to drive a storage barrel to move up and down, a first hydraulic cylinder can work to drive a second fixing plate to move so as to drive a vacuum suction cup to move up and down, and the packaging efficiency is improved. According to the device, the semiconductor material can be ejected out of the interior of the mold without manual pressing by an operator during material taking, then manual material taking is carried out, and therefore the situation that the operator takes out the semiconductor material manually and is possibly scalded can be avoided; and practical application and operation are facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging devices, in particular to a packaging device for new semiconductor chip materials. Background Art

[0002] After searching, a Chinese patent discloses a packaging device for new semiconductor chip materials (authorization announcement number CN213958915U), including a base, a top column distributed on the top of the base, a spring fixedly connected to the top of the base, a tooling slidably sleeved on the outer side of the top column, a packaging mold connected to the top of the tooling, sliding sleeves installed on both sides of the tooling, a handle slidably connected to the inner side of the sliding sleeve, a sliding groove opened on the inner side of the sliding sleeve, a sliding rod connected to the inner side of the handle, and a fixed block fixedly installed on the top of the base. Although the patented technology can move the tooling downward by pulling the handle to both sides after the packaging and curing are completed, so as to fix the tooling, then the operator can quickly collect the semiconductors staying on the top of the top column, and the packaged semiconductors can be quickly recovered by pressing the tooling down, which saves time and is simple to operate, and accelerates the manufacturing efficiency of semiconductors;

[0003] However, in the actual application of this patented technology, the operator still needs to manually press to push the semiconductor material out of the mold 16 when taking out the material, and then manually take out the material. During packaging, a large amount of heat will be generated on the surface of the semiconductor material. Therefore, the operator may be burned when manually taking it out, which is not conducive to actual application and operation. Utility Model Content

[0004] The utility model aims to provide a packaging device for new semiconductor chip materials to solve the problem in the background art that a large amount of heat will be generated on the surface of the semiconductor material during packaging, which may cause burns when the operator manually removes the semiconductor material.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: a packaging device for new semiconductor chip materials, comprising a bottom plate, an L-shaped plate is fixedly connected to the outer side of the bottom plate, a rotating shaft is rotatably connected to the bottom of the L-shaped plate, a mounting plate is fixedly connected to the outer side of the rotating shaft, the rotating shaft can drive the mounting plate to rotate, the mounting plate is an L-shaped structure, an electric telescopic rod is fixedly installed at one end of the top of the mounting plate, the piston rod of the electric telescopic rod passes through the mounting plate and is fixedly connected to a fixing plate 1, a storage cylinder is fixedly installed at an equal distance on the top of the fixing plate 1, and the bottom of the storage cylinder passes through A fixed plate 1, an electric telescopic rod can drive the fixed plate 1 to move, a hydraulic cylinder 1 is fixedly installed on one end of the mounting plate away from the electric telescopic rod, the mounting plate can drive the electric telescopic rod and the hydraulic cylinder 1 to rotate, the piston rod of the hydraulic cylinder 1 penetrates the mounting plate and is fixedly connected to the fixed plate 2, vacuum suction cups are fixedly installed at equal distances on the top of the fixed plate 2, the bottoms of the vacuum suction cups all penetrate the fixed plate 2, the top of the bottom plate is fixedly connected to two supporting plates, a tooling is fixedly connected between the tops of the two supporting plates, and a mold for use with a storage cylinder and a vacuum suction cup is provided on the top of the tooling;

[0006] A pushing mechanism is arranged on the top of the bottom plate, and the pushing mechanism is used to push the semiconductor material.

[0007] Through the above technical scheme, the rotation of the rotating shaft can drive the mounting plate to rotate, the electric telescopic rod can drive the fixed plate 1 to move up and down, and then drive the storage cylinder to move up and down, the operation of the hydraulic cylinder 1 can drive the fixed plate 2 to move, and then drive the vacuum suction cup to move up and down, and the semiconductor material can be pushed out of the mold through the pushing mechanism. When taking out the material, the device does not require the operator to manually press to push the semiconductor material out of the mold, and then manually take out the material, thereby avoiding the operator from being burned by manual removal, which is beneficial to practical application and operation.

[0008] Preferably, the pushing mechanism includes hydraulic cylinder 2, a push plate and a push rod, wherein the hydraulic cylinder 2 is fixedly mounted on the top of the base plate, the push plate is fixedly connected to the piston rod of the hydraulic cylinder 2, the push rod is equidistantly fixedly connected to the four corners of the top of the push plate, and the tops of the push rods extend into the interior of the mold.

[0009] Through the above technical solution, the operation of the hydraulic cylinder 2 can drive the push plate to move up and down, and then the push plate drives the push rod to move up and down.

[0010] Preferably, the push plate is slidably connected to the side close to the two support plates, and the ejector rods are slidably connected to the inside of the corresponding mold.

[0011] Through the above technical solution, the movement trajectory of the push plate can be ensured by using two support plates.

[0012] Preferably, a motor is fixedly mounted on the top of the L-shaped plate, the output end of the motor extends to the inside of the L-shaped plate and is fixedly mounted with gear one, and a gear two is fixedly mounted on the bottom of the rotating shaft, and the gear two is meshingly connected with gear one.

[0013] Through the above technical solution, the motor can drive gear one to rotate, and then gear one drives gear two to rotate.

[0014] Preferably, the diameter of the gear one is smaller than the diameter of the gear two, and a heating wire is installed inside the storage cylinder.

[0015] Through the above technical solution, the rotation can be made more precise by setting the diameter of gear one to be smaller than the diameter of gear two.

[0016] Preferably, the heating wire, the motor, the second hydraulic cylinder, the electric telescopic rod and the first hydraulic cylinder are all electrically connected to an external control device.

[0017] Through the above technical solution, the heating wire, the motor, the second hydraulic cylinder, the electric telescopic rod and the first hydraulic cylinder can be controlled to work through an external control device.

[0018] Compared with the prior art, the beneficial effects achieved by the utility model are:

[0019] The utility model is configured such that the rotation of the rotating shaft can drive the mounting plate to rotate, the electric telescopic rod can drive the fixing plate one to move up and down, and then drive the storage cylinder to move up and down, the operation of the hydraulic cylinder one can drive the fixing plate two to move, and then drive the vacuum suction cup to move up and down, and the pushing mechanism can push the semiconductor material out of the mold. When taking out the material, the device does not require the operator to manually press to push the semiconductor material out of the mold and then manually take out the material, so that the operator can avoid the possibility of burns caused by manual removal, which is beneficial to practical application and operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional diagram of the utility model;

[0021] Figure 2 It is a schematic diagram of the structure of the utility model;

[0022] Figure 3 It is a structural schematic diagram of the support plate, tooling and push plate of the utility model;

[0023] Figure 4 It is a partial cross-sectional view of the utility model.

[0024] Among them: 1. Bottom plate; 2. L-shaped plate; 3. Motor; 4. Gear 1; 5. Rotating shaft; 6. Gear 2; 7. Mounting plate; 8. Electric telescopic rod; 9. Fixed plate 1; 10. Storage cylinder; 11. Hydraulic cylinder 1; 12. Fixed plate 2; 13. Vacuum suction cup; 14. Support plate; 15. Tooling; 16. Mold; 17. Hydraulic cylinder 2; 18. Push plate; 19. Push rod. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1 , Figure 2 Figure 3 and Figure 4 A packaging device for new semiconductor chip materials includes a bottom plate 1, an L-shaped plate 2 is fixedly connected to the outside of the bottom plate 1, a rotating shaft 5 is rotatably connected to the bottom of the L-shaped plate 2, a mounting plate 7 is fixedly connected to the outside of the rotating shaft 5, the rotating shaft 5 can drive the mounting plate 7 to rotate, the mounting plate 7 is an L-shaped structure, an electric telescopic rod 8 is fixedly installed at one end of the top of the mounting plate 7, the piston rod of the electric telescopic rod 8 penetrates the mounting plate 7 and is fixedly connected to a fixed plate 9, a storage cylinder 10 is fixedly installed at an equal distance on the top of the fixed plate 9, the bottom of the storage cylinder 10 penetrates the fixed plate 9, and the electric telescopic rod 8 can drive the fixed plate 9 to rotate. Move, a hydraulic cylinder 11 is fixedly installed at one end of the mounting plate 7 away from the electric telescopic rod 8, and the mounting plate 7 can drive the electric telescopic rod 8 and the hydraulic cylinder 11 to rotate, and the piston rod of the hydraulic cylinder 11 penetrates the mounting plate 7 and is fixedly connected to the fixing plate 2 12, and vacuum suction cups 13 are fixedly installed on the top of the fixing plate 2 12 at equal intervals, and the bottoms of the vacuum suction cups 13 all penetrate the fixing plate 2 12, and the top of the bottom plate 1 is fixedly connected to two supporting plates 14, and a tooling 15 is fixedly connected between the tops of the two supporting plates 14, and a mold 16 used in conjunction with the storage tube 10 and the vacuum suction cup 13 is provided on the top of the tooling 15;

[0027] A pushing mechanism is provided on the top of the base plate 1, and the pushing mechanism is used to push the semiconductor material. The pushing mechanism includes a hydraulic cylinder 17, a push plate 18 and a push rod 19. The hydraulic cylinder 17 is fixedly installed on the top of the base plate 1, and the push plate 18 is fixedly connected to the piston rod of the hydraulic cylinder 17. The push rod 19 is equidistantly fixedly connected to the four corners of the top of the push plate 18. The top of the push rod 19 extends to the inside of the mold 16. The operation of the hydraulic cylinder 17 can drive the push plate 18 to move up and down, and then the push plate 18 drives the push rod 19 to move up and down.

[0028] The rotation of the rotating shaft 5 can drive the mounting plate 7 to rotate, the electric telescopic rod 8 can drive the fixing plate 9 to move up and down, and then drive the storage tube 10 to move up and down, and the operation of the hydraulic cylinder 11 can drive the fixing plate 12 to move, and then drive the vacuum suction cup 13 to move up and down, and the semiconductor material can be ejected from the inside of the mold 16 by the pushing mechanism. When taking out the material, the device does not require the operator to manually press to eject the semiconductor material from the inside of the mold 16, and then manually take out the material, thereby avoiding the operator from being burned by manual removal, which is beneficial to practical application and operation.

[0029] See also Figure 1 and Figure 2 The push plate 18 is slidably connected to the side close to the two support plates 14, and the ejector rods 19 are slidably connected to the inside of the corresponding mold 16. The movement trajectory of the push plate 18 can be ensured by using the two support plates 14.

[0030] The diameter of gear one 4 is smaller than that of gear two 6 , and a heating wire is installed inside the storage tube 10 . By setting the diameter of gear one 4 to be smaller than that of gear two 6 , the rotation can be made more precise.

[0031] See also Figure 1 , Figure 2 Figure 3 and Figure 4 A motor 3 is fixedly installed on the top of the L-shaped plate 2, and the output end of the motor 3 extends to the inside of the L-shaped plate 2 and is fixedly installed with a gear 4. A gear 2 6 is fixedly installed on the bottom of the rotating shaft 5. The gear 2 6 is meshed and connected with the gear 1 4. The motor 3 can drive the gear 1 4 to rotate, and then the gear 1 4 drives the gear 2 6 to rotate.

[0032] The heating wire, the motor 3, the hydraulic cylinder 2 17, the electric telescopic rod 8 and the hydraulic cylinder 1 11 are all electrically connected to an external control device, and the heating wire, the motor 3, the hydraulic cylinder 2 17, the electric telescopic rod 8 and the hydraulic cylinder 1 11 can be controlled by the external control device to work.

[0033] When in use, first pour the packaging material into the storage tube 10. When the staff uses it in cold weather, the heating wire inside the storage tube 10 can be used for heating operation, so as to ensure that the packaging material will not be frozen in cold weather. When performing the packaging operation, the motor 3 can drive the gear 1 4 to rotate, and then the gear 1 4 drives the gear 2 6 to rotate, and the gear 2 6 can drive the shaft 5 to rotate, and the rotation of the shaft 5 can drive the mounting plate 7 to rotate, and the electric telescopic rod 8 can drive the fixing plate 1 9 to move up and down, and then drive the storage tube 10 to move up and down, so as to perform the packaging operation on the semiconductor material. After the packaging is completed, the hydraulic cylinder 2 The operation of 17 can drive the push plate 18 to move up and down, and then the push plate 18 drives the ejector rod 19 to move up and down, so as to eject the packaged semiconductor material from the inside of the mold 16, and then the rotation of the motor 3 drives the mounting plate 7 to rotate ninety degrees, and then the operation of the hydraulic cylinder 11 can drive the fixed plate 2 12 to move, and then drive the vacuum suction cup 13 to move up and down until it contacts the semiconductor material, and then perform the material removal operation. When taking the material, the device does not require the operator to manually press to eject the semiconductor material from the inside of the mold 16, and then manually take the material, so it can avoid the operator from being burned by manual removal, which is beneficial to practical application and operation.

[0034] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A packaging device for a semiconductor chip new material, comprising a base plate (1), characterized in that: The outer side of the bottom plate (1) is fixedly connected to an L-shaped plate (2), the bottom of the L-shaped plate (2) is rotatably connected to a rotating shaft (5), the outer side of the rotating shaft (5) is fixedly connected to a mounting plate (7), the mounting plate (7) is an L-shaped structure, one end of the top of the mounting plate (7) is fixedly mounted with an electric telescopic rod (8), the piston rod of the electric telescopic rod (8) passes through the mounting plate (7) and is fixedly connected to a fixing plate (9), the top of the fixing plate (9) is equidistantly fixedly mounted with a storage cylinder (10), the bottom of the storage cylinder (10) passes through the fixing plate (9), and the mounting plate (7) is far away from the electric telescopic rod (8). A hydraulic cylinder 1 (11) is fixedly mounted on one end of the rod (8); the piston rod of the hydraulic cylinder 1 (11) passes through the mounting plate (7) and is fixedly connected to a fixing plate 2 (12); vacuum suction cups (13) are fixedly mounted at equal distances on the top of the fixing plate 2 (12); the bottoms of the vacuum suction cups (13) all pass through the fixing plate 2 (12); two support plates (14) are fixedly connected to the top of the bottom plate (1); a tooling (15) is fixedly connected between the tops of the two support plates (14); a mold (16) for use with the storage cylinder (10) and the vacuum suction cup (13) is provided on the top of the tooling (15); A pushing mechanism is provided on the top of the base plate (1), and the pushing mechanism is used to push the semiconductor material.

2. A packaging device for a new semiconductor chip material according to claim 1, characterized in that: The pushing mechanism comprises a second hydraulic cylinder (17), a push plate (18) and a push rod (19); the second hydraulic cylinder (17) is fixedly mounted on the top of the base plate (1); the push plate (18) is fixedly connected to the piston rod of the second hydraulic cylinder (17); the push rod (19) is fixedly connected to the four corners of the top of the push plate (18) at equal distances; and the top of the push rod (19) extends to the interior of the mold (16).

3. A packaging device for a new semiconductor chip material according to claim 2, characterized in that: The push plate (18) is slidably connected to the adjacent sides of the two support plates (14), and the push rods (19) are slidably connected to the inside of the corresponding mold (16).

4. The packaging device of a new semiconductor chip material according to claim 1, characterized in that: A motor (3) is fixedly mounted on the top of the L-shaped plate (2); an output end of the motor (3) extends into the interior of the L-shaped plate (2) and is fixedly mounted with a gear 1 (4); a gear 2 (6) is fixedly mounted on the bottom of the rotating shaft (5); and the gear 2 (6) is meshingly connected with the gear 1 (4).

5. The packaging device of a new semiconductor chip material according to claim 4, characterized in that: The diameter of the gear one (4) is smaller than the diameter of the gear two (6), and a heating wire is installed inside the storage cylinder (10).

6. The packaging device of a new semiconductor chip material according to claim 5, characterized in that: The heating wire, the motor (3), the second hydraulic cylinder (17), the electric telescopic rod (8) and the first hydraulic cylinder (11) are all electrically connected to an external control device.

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