Wafer cleaning edge searching device

Abstract

The utility model relates to a wafer cleaning and edge searching device in the field of edge searching devices, which comprises a support and a rotary positioning component, a lifting component is arranged on the support and comprises a servo motor, a ball screw, a movable jacking rod, a movable jacking plate and a jacking mounting plate, the ball screw is in transmission connection with the servo motor, and the movable jacking rod is connected with the jacking mounting plate. The movable jacking plate is connected with the ball screw through a screw nut, the movable jacking rod is vertically arranged on the movable jacking plate, the jacking mounting plate is arranged above the support, one end of the movable jacking rod penetrates through the support to be connected with the movable jacking plate, and the rotary positioning assembly comprises a mounting bottom plate, a stepping motor, a rolling shaft mounting base and an edge searching rolling shaft. The edge searching rolling shaft is horizontally arranged on the rolling shaft mounting seat, the edge searching rolling shaft is rotatably connected with the rolling shaft mounting seat, the stepping motor is fixedly mounted on the mounting bottom plate, and the edge searching rolling shaft is in transmission connection with the stepping motor, so that the flat edge positions and directions of wafers are consistent, the inconsistent circuit directions during cleaning of the wafers are avoided, and the etching quality of the wafers is improved.

Description

Technical Field

[0001] The utility model relates to the field of edge-finding devices, in particular to an edge-finding device for wafer cleaning. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. Specifically, high-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. The physical properties of silicon determine the shape of the wafer. Silicon crystals naturally form a circle during the growth process, which is determined by their molecular structure. During the production process of the wafer, the circular design can ensure the uniformity of each side and improve the performance of electronic components. In addition, the circular wafer can better meet the requirements of electronic component design for uniform signal transmission and manufacturing uniformity.

[0003] The orientation of the wafer is very important for the performance and reliability of semiconductor devices. For example, in integrated circuit manufacturing, it is necessary to ensure that the specific orientation of components such as transistors and diodes is correctly aligned to ensure the correct connection and operation of the circuit. If the orientation of the wafer is incorrect, it may cause circuit connection errors, performance degradation or even failure, so the edge of the wafer is usually set to a flat edge position. The flat edge position refers to a specific edge on the wafer that is processed to be relatively flat and smooth.

[0004] During the wafer cleaning process, the flat-edge positions of the incoming wafers in the wafer box are not consistent. When they enter the process and are completely immersed in the solvent pool, the circuit directions on the wafers are inconsistent. This will result in poor wafer etching consistency when the wafers are in the process tank, which will greatly reduce the etching yield. Utility Model Content

[0005] In order to overcome the deficiencies of the prior art solutions, the utility model provides a wafer cleaning edge-finding device, which can effectively solve the technical problem of inconsistent flat edge directions during wafer cleaning.

[0006] The technical solution adopted by the utility model to solve its technical problems is:

[0007] A wafer cleaning edge-finding device comprises a bracket and a rotation positioning assembly, wherein the rotation positioning assembly is arranged above the bracket, the bracket is provided with a lifting assembly, the lifting assembly comprises a servo motor, a ball screw, a movable lifting rod, a movable lifting plate and a lifting mounting plate, the ball screw is vertically arranged in the bracket, the ball screw is transmission-connected with the servo motor, the movable lifting plate is connected with the ball screw through a screw nut, the movable lifting rod is vertically arranged on the movable lifting plate, the lifting mounting plate is arranged above the bracket, one end of the movable lifting rod away from the movable lifting plate passes through the bracket and is connected with the movable lifting plate, and the rotation positioning assembly is arranged on the lifting mounting plate;

[0008] The rotary positioning assembly includes a mounting base, a stepper motor, a roller mounting seat and an edge-finding roller. The edge-finding roller is horizontally arranged on the roller mounting seat. The edge-finding roller is rotatably connected to the roller mounting seat. The stepper motor is fixedly mounted on the mounting base, and the edge-finding roller is transmission-connected to the stepper motor.

[0009] Furthermore, the bracket includes a bottom fixing plate, a top fixing plate and two side support plates, the two side support plates are respectively arranged at the two ends of the bottom fixing plate, the top fixing plate is arranged at one end of the two side support plates away from the bottom fixing plate, the two ends of the top fixing plate extend to the outside of the side support plate, and fixed connecting holes are provided.

[0010] Furthermore, a linear bearing is provided on the top fixing plate, and a movable lifting rod passes through the linear bearing. A buffer block is provided on one end of the top fixing plate close to the lifting mounting plate and one end of the bottom fixing plate close to the top fixing plate. The servo motor is arranged on the end of the bottom fixing plate away from the top fixing plate through a fixed mounting seat. An end of the ball screw close to the servo motor passes through the bottom fixing plate and is transmission-connected to the servo motor through a shaft coupling.

[0011] Furthermore, the side support plate is provided with a mounting slot, two photoelectric switches are provided in the mounting slot, and a metal sheet is provided on the side wall of the bottom fixing plate.

[0012] Furthermore, a stepper motor is arranged on the roller mounting seat, the output shaft of the stepper motor is connected to the first pulley, and a second pulley, a third pulley and a fourth pulley are arranged on the roller mounting seat, the first pulley is connected to the second pulley by a belt, the third pulley is connected to the fourth pulley by a belt, the second pulley rotates synchronously with the third pulley via the first rotating shaft, and the fourth pulley rotates synchronously with the edge-finding roller via the second rotating shaft.

[0013] Furthermore, a zero-point disk and a sensor are arranged on the roller mounting seat. The zero-point disk rotates synchronously with the third pulley through the first rotating shaft, and the sensor is arranged on the outer side of the zero-point disk.

[0014] Furthermore, a drag chain is arranged between the bracket and the lifting installation plate, and the side walls of the bracket and the lifting installation plate are both provided with a drag chain fixing box for connecting two ends of the drag chain.

[0015] Compared with the prior art, the beneficial effects of the utility model are as follows: the rotary positioning assembly is extended into the wafer box through the lifting assembly and the wafer is lifted up for edge-finding positioning, the wafer box full of wafers is placed above the rotary positioning assembly, the servo motor drives the ball screw to rotate, the ball screw drives the movable lifting plate and the movable lifting rod to rise upward, so that the rotary positioning assembly is extended from the bottom of the wafer box and the surface of the edge-finding roller contacts the edge of the wafer, the stepper motor drives the edge-finding roller to rotate, and the edge-finding roller rotates while driving the wafer to rotate in the wafer box, so that the flat edge position direction of the wafer is consistent, avoiding inconsistent circuit direction of the wafer during cleaning, and improving the quality of wafer etching. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the main structure of a wafer cleaning edge-finding device of the utility model;

[0017] Figure 2 This is a rear view structural schematic diagram of a wafer cleaning edge-finding device of the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of a bracket in a wafer cleaning edge-finding device of the utility model;

[0019] Figure 4 This is a structural schematic diagram of a lifting component in a wafer cleaning edge-finding device of the utility model;

[0020] Figure 5 This is a structural schematic diagram of a rotary positioning component in a wafer cleaning edge-finding device of the utility model;

[0021] Figure 6 It is a schematic diagram of the position of a wafer after one-time positioning in a wafer cleaning edge-finding device of the utility model;

[0022] Figure 7 It is a schematic diagram of the wafer position after secondary positioning in a wafer cleaning edge-finding device of the utility model;

[0023] Figure 8 This is a schematic structural diagram of a wafer and a wafer box in a wafer cleaning and edge-finding device of the utility model;

[0024] Numbers in the figure: 1-wafer, 2-wafer box, 3-bracket, 301-bottom fixing plate, 302-top fixing plate, 303-side support plate, 304-buffer block, 305-fixed mounting seat, 306-metal sheet, 311-photoelectric switch, 312-mounting slide, 313-drag chain, 314-drag chain fixing box, 4-rotation positioning assembly, 401-mounting base plate, 402-stepping motor, 403-roller mounting seat, 4 04-edge-finding roller, 411-first pulley, 412-second pulley, 413-third pulley, 414-fourth pulley, 415-first rotating shaft, 416-second rotating shaft, 417-zero point disk, 418-sensor, 5-lifting assembly, 501-servo motor, 502-ball screw, 503-movable lifting rod, 504-movable lifting plate, 505-lifting mounting plate, 506-linear bearing. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Combine the following Figure 1-Figure 8 A wafer cleaning edge-finding device of the utility model is described in detail:

[0027] A wafer cleaning edge-finding device comprises a bracket 3 and a rotation positioning component 4, wherein the rotation positioning component 4 is arranged above the bracket 3, and a lifting component 5 is arranged on the bracket 3, and the lifting component 5 comprises a servo motor 501, a ball screw 502, a movable lifting rod 503, a movable lifting plate 504 and a lifting mounting plate 505, wherein the ball screw 502 is vertically arranged in the bracket 3, the ball screw 502 is transmission-connected to the servo motor 501, the movable lifting plate 504 is connected to the ball screw 502 through a screw nut, the movable lifting rod 503 is vertically arranged on the movable lifting plate 504, the lifting mounting plate 505 is arranged above the bracket 3, one end of the movable lifting rod 503 away from the movable lifting plate 504 passes through the bracket 3 and is connected to the movable lifting plate 504, and the rotation positioning component 4 is arranged on the lifting mounting plate 505.

[0028] The rotation positioning assembly 4 includes a mounting base 401, a stepper motor 402, a roller mounting seat 403 and an edge-finding roller 404. The edge-finding roller 404 is horizontally arranged on the roller mounting seat 403, and the edge-finding roller 404 is rotatably connected to the roller mounting seat 403. The stepper motor 402 is fixedly mounted on the mounting base 401, and the edge-finding roller 404 is transmission-connected to the stepper motor 402. The roller mounting seat 403 is provided with a stepper motor 402, and the output shaft of the stepper motor 402 is connected to a first pulley 411. The roller mounting seat 403 is provided with a second pulley 412 and a third pulley 413. The first pulley 411 is connected to the second pulley 412 by a belt, the third pulley 413 is connected to the fourth pulley 414 by a belt, the second pulley 412 rotates synchronously with the third pulley 413 through the first rotating shaft 415, the fourth pulley 414 rotates synchronously with the edge-finding roller 404 through the second rotating shaft 416, and a zero point disk 417 and a sensor 418 are provided on the roller mounting seat 403, the zero point disk 417 rotates synchronously with the third pulley 413 through the first rotating shaft 415, and the sensor 418 is provided on the outer side of the zero point disk 417.

[0029] The bracket 3 includes a bottom fixing plate 301, a top fixing plate 302 and two side support plates 303. The two side support plates 303 are respectively arranged at the two ends of the bottom fixing plate 301, and the top fixing plate 302 is arranged at one end of the two side support plates 303 away from the bottom fixing plate 301. The two ends of the top fixing plate 302 extend to the outside of the side support plates 303 and are provided with fixed connection holes. The top fixing plate 302 can be installed on the wafer 1 box changing device through the fixed connection holes. A linear bearing 506 is arranged on the top fixing plate 302, and a movable lifting rod 503 passes through the linear bearing 506. A buffer block 304 is arranged on one end of the top fixing plate 302 close to the lifting mounting plate 505 and one end of the bottom fixing plate 301 close to the top fixing plate 302. The servo motor 501 is arranged at one end of the bottom fixing plate 301 away from the top fixing plate 302 through a fixed mounting seat 305. The end of the ball screw 502 close to the servo motor 501 passes through the bottom fixing plate 301. , and is connected to the servo motor 501 through a shaft coupling. The side support plate 303 is provided with an installation slot 312, and two photoelectric switches 311 are arranged in the installation slot 312. The side wall of the bottom fixing plate 301 is provided with a metal sheet 306. The two photoelectric switches 311 respectively limit the height of the bottom fixing plate 301 during the first positioning and the second positioning. When the height of the bottom fixing plate 301 rises to the same height as the photoelectric switch 311, the photoelectric switch 311 senses the metal sheet 306 and controls the servo motor 501 to stop working, so that the edge-finding roller 404 rises to a preset position and then stops moving. The photoelectric switch 311 can adjust its position on the installation slot 312 according to the actual size of the wafer 1. A drag chain 313 is arranged between the bracket 3 and the lifting mounting plate 505, and the side walls of the bracket 3 and the lifting mounting plate 505 are provided with a drag chain fixing box 314 for connecting the two ends of the drag chain 313.

[0030] In the wafer cleaning edge-finding device of the present embodiment, the lifting assembly 5 is used to extend the rotary positioning assembly 4 into the wafer box 2 and lift the wafer 1 for edge-finding positioning. The wafer box 2 filled with wafers 1 is placed above the rotary positioning assembly 4. The servo motor 501 drives the ball screw 502 to rotate. The ball screw 502 drives the movable lifting plate 504 and the movable lifting rod 503 to rise upward, so that the rotary positioning assembly 4 extends from the bottom of the wafer box 2 and makes the surface of the edge-finding roller 404 contact with the edge of the wafer 1 for one positioning. The stepper motor 402 drives the edge-finding roller 404 to rotate. While the edge-finding roller 404 rotates, The wafer 1 is driven to rotate in the wafer box 2. When the flat edge position of the wafer 1 is facing downward, the highest point of the edge-finding roller 404 is highly consistent with the flat edge position of the wafer 1, and the edge-finding roller 404 stops rotating. The servo motor 501 is started to move the edge-finding roller 404 upward and lift the wafer 1. The stepper motor 402 is started for secondary positioning. The edge-finding roller 404 rotates and drives the wafer 1 to rotate, so that the flat edge position of the wafer 1 is upward. The edge-finding roller 404 descends and resets, and the flat edge position of the wafer 1 falls upward back into the wafer box 2, so as to avoid inconsistent circuit direction of the wafer 1 during cleaning and improve the etching quality of the wafer 1.

[0031] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A wafer cleaning edge-finding device, comprising a support and a rotation positioning assembly, wherein the rotation positioning assembly is arranged above the support, and is characterized in that: The bracket is provided with a lifting assembly, which includes a servo motor, a ball screw, a movable lifting rod, a movable lifting plate and a lifting mounting plate. The ball screw is vertically arranged in the bracket, the ball screw is transmission-connected to the servo motor, the movable lifting plate is connected to the ball screw through a screw nut, the movable lifting rod is vertically arranged on the movable lifting plate, the lifting mounting plate is arranged above the bracket, one end of the movable lifting rod away from the movable lifting plate passes through the bracket and is connected to the movable lifting plate, and the rotation positioning assembly is arranged on the lifting mounting plate; The rotary positioning assembly includes a mounting base, a stepper motor, a roller mounting seat and an edge-finding roller. The edge-finding roller is horizontally arranged on the roller mounting seat. The edge-finding roller is rotatably connected to the roller mounting seat. The stepper motor is fixedly mounted on the mounting base, and the edge-finding roller is transmission-connected to the stepper motor.

2. A wafer cleaning edge-finding device according to claim 1, characterized in that: The bracket includes a bottom fixing plate, a top fixing plate and two side support plates. The two side support plates are respectively arranged at the two ends of the bottom fixing plate, and the top fixing plate is arranged at one end of the two side support plates away from the bottom fixing plate. The two ends of the top fixing plate extend to the outside of the side support plates and are provided with fixed connection holes.

3. A wafer cleaning edge-finding device according to claim 2, characterized in that: The top fixing plate is provided with a linear bearing, and a movable lifting rod passes through the linear bearing. A buffer block is provided at one end of the top fixing plate close to the lifting mounting plate and one end of the bottom fixing plate close to the top fixing plate. The servo motor is arranged at the end of the bottom fixing plate away from the top fixing plate through a fixed mounting seat. The end of the ball screw close to the servo motor passes through the bottom fixing plate and is connected to the servo motor through a shaft coupling.

4. The wafer cleaning edge-finding device according to claim 2, characterized in that: The side support plate is provided with a mounting slide groove, two photoelectric switches are arranged in the mounting slide groove, and a metal sheet is arranged on the side wall of the bottom fixing plate.

5. A wafer cleaning edge-finding device according to any one of claims 1 to 4, characterized in that: A stepper motor is arranged on the roller mounting seat, and the output shaft of the stepper motor is connected to the first pulley. A second pulley, a third pulley and a fourth pulley are arranged on the roller mounting seat. The first pulley is connected to the second pulley by a belt, and the third pulley is connected to the fourth pulley by a belt. The second pulley rotates synchronously with the third pulley via the first rotating shaft, and the fourth pulley rotates synchronously with the edge-finding roller via the second rotating shaft.

6. The wafer cleaning edge-finding device according to claim 5, characterized in that: The roller mounting seat is provided with a zero-point disk and a sensor. The zero-point disk rotates synchronously with the third belt pulley through the first rotating shaft, and the sensor is arranged on the outer side of the zero-point disk.

7. A wafer cleaning edge-finding device according to any one of claims 1 to 4, characterized in that: A drag chain is arranged between the bracket and the lifting installation plate, and a drag chain fixing box for connecting two ends of the drag chain is arranged on the side walls of the bracket and the lifting installation plate.

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