Semiconductor wafer surface defect detection device

Abstract

The utility model discloses a semiconductor wafer surface defect detection device which comprises a detection box, a motor is fixedly connected to the side surface of the detection box, a second rotating shaft is arranged on the front surface of the motor, a second gear is fixedly connected to the front surface of the second rotating shaft, a first gear is connected to the outer surface of the second gear in a meshed mode, and a second gear is arranged on the outer surface of the first gear. And the rear surface of the first gear is fixedly connected with a first rotating shaft. Through the above structure, the device is provided with the rotating mechanism, most existing devices adopt fixed detection, but the detection range is narrow and not comprehensive enough, so that rotation detection needs to be carried out, a motor drives a second rotating shaft to drive a second gear to rotate, and a first gear is driven to rotate under meshing connection; in order to improve the stability of the wafer, the non-slip mat at the lower end is fixed with the wafer by rotating the bolt.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer detection, in particular to a semiconductor wafer surface defect detection device. Background Art

[0002] In the preparation process of semiconductor wafers, mechanical methods are often used to cut semiconductors, and then the cut wafer surfaces are coarsely ground, finely ground, and chemically and mechanically polished to meet the requirements of epitaxy. Regardless of whether it is after grinding or polishing, the surface of the semiconductor wafer needs to be inspected to determine whether further grinding or polishing is required. Most of the existing devices use fixed clamping wafers, and the detection range has certain limitations. After searching, it was found that the technical solution provided by the utility model with application number CN202221602242.4 also has the above-mentioned problems. Utility Model Content

[0003] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art and to provide a semiconductor wafer surface defect detection device, which is provided with a rotating mechanism. Most of the existing devices adopt fixed detection, but the detection range is narrow and not comprehensive enough. Therefore, rotation detection is required. The second rotating shaft is driven by a motor to drive the second gear to rotate, and the first gear is driven to rotate under the meshing connection, so that the clamped wafer at the front end is rotated. In order to improve the stability of the wafer, the anti-skid pad at the lower end is fixed to the wafer by rotating bolts.

[0004] The utility model also provides a semiconductor wafer surface defect detection device having the above-mentioned structure, comprising: a detection box, a motor is fixedly connected to the side surface of the detection box, a second rotating shaft is arranged on the front surface of the motor, a second gear is fixedly connected to the front surface of the second rotating shaft, a first gear is meshedly connected to the outer surface of the second gear, and the first rotating shaft is fixedly connected to the rear surface of the first gear;

[0005] A sensor cover is fixedly connected to the front surface of the first gear, a second detection light is fixedly connected to the bottom inner wall of the sensor cover, an electric telescopic rod is fixedly connected to the front surface of the first gear, a clamp is fixedly connected to the front surface of the electric telescopic rod, a threaded hole is provided on the outer surface of the clamp, a bolt is threadedly connected to the inner wall of the threaded hole, and a switch door is provided on the front surface of the detection box.

[0006] According to the semiconductor wafer surface defect detection device, a second hole is provided on the side surface of the detection box, and the inner wall of the second hole is rotatably connected to the second rotating shaft.

[0007] According to the semiconductor wafer surface defect detection device, a first hole is provided on the side surface of the detection box, and an inner wall of the first hole is rotatably connected to a first rotating shaft.

[0008] According to the semiconductor wafer surface defect detection device, the inner wall of the sensor cover is provided with a groove, and the inner wall of the groove is slidably connected to the electric telescopic rod.

[0009] According to the semiconductor wafer surface defect detection device, the lower surface of the bolt is fixedly connected with an anti-skid pad, the rear surface of the anti-skid pad is in contact with the clamper, and the front surface of the anti-skid pad is in contact with the wafer.

[0010] According to the semiconductor wafer surface defect detection device, the input end of the electric telescopic rod is electrically connected to the external power supply, and the input end of the motor is electrically connected to the external power supply.

[0011] According to the semiconductor wafer surface defect detection device, the inner wall of the detection box is provided with first detection lamps, and the number of the first detection lamps is multiple and evenly distributed.

[0012] According to the semiconductor wafer surface defect detection device, a display component is disposed on the upper surface of the detection box, and a control component is disposed on the upper surface of the detection box.

[0013] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0015] Figure 1 This is an overall structural diagram of a semiconductor wafer surface defect detection device of the utility model;

[0016] Figure 2 This is an internal structure diagram of a semiconductor wafer surface defect detection device of the utility model;

[0017] Figure 3 This is a rotating structural diagram of a semiconductor wafer surface defect detection device of the utility model;

[0018] Figure 4 The utility model is a clamping structure diagram of a semiconductor wafer surface defect detection device.

[0019] Legend:

[0020] 1. Detection box; 2. Switch door; 3. Motor; 4. First hole; 5. First rotating shaft; 6. First gear; 7. Second gear; 8. Second rotating shaft; 9. Second hole; 10. Sensor cover; 11. Groove; 12. Electric telescopic rod; 13. Clamp; 14. Threaded hole; 15. Bolt; 16. Anti-slip pad; 17. First detection light; 18. Wafer; 19. Display component; 20. Control component; 21. Second detection light. DETAILED DESCRIPTION

[0021] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0022] Reference Figure 1-4 The utility model embodiment is a semiconductor wafer surface defect detection device, which includes a detection box 1, a motor 3 is fixedly connected to the side surface of the detection box 1, a second rotating shaft 8 is provided on the front surface of the motor 3, a second gear 7 is fixedly connected to the front surface of the second rotating shaft 8, the outer surface of the second gear 7 is meshed with the first gear 6, and the rear surface of the first gear 6 is fixedly connected to the first rotating shaft 5.

[0023] The front surface of the first gear 6 is fixedly connected to a sensor cover 10, and the bottom inner wall of the sensor cover 10 is fixedly connected to a second detection lamp 21. The front surface of the first gear 6 is fixedly connected to an electric telescopic rod 12, and the front surface of the electric telescopic rod 12 is fixedly connected to a clamper 13. The outer surface of the clamper 13 is provided with a threaded hole 14, and the inner wall of the threaded hole 14 is threadedly connected with a bolt 15. The front surface of the detection box 1 is provided with a switch door 2, and the side surface of the detection box 1 is provided with a second hole 9, and the inner wall of the second hole 9 is rotatably connected to the second rotating shaft 8. The side surface of the detection box 1 is provided with a first hole 4, and the inner wall of the first hole 4 is rotatably connected to the first rotating shaft 8. The moving shaft 5 is rotatably connected, a groove 11 is provided on the inner wall of the sensor cover 10, the inner wall of the groove 11 is slidably connected to the electric telescopic rod 12, an anti-skid pad 16 is fixedly connected to the lower surface of the bolt 15, the rear surface of the anti-skid pad 16 is in contact with the clamp 13, the front surface of the anti-skid pad 16 is in contact with the wafer 18, the input end of the electric telescopic rod 12 is electrically connected to the external power supply, the input end of the motor 3 is electrically connected to the external power supply, a first detection light 17 is provided on the inner wall of the detection box 1, the number of the first detection lights 17 is multiple and evenly distributed, a display component 19 is provided on the upper surface of the detection box 1, and a control component 20 is provided on the upper surface of the detection box 1.

[0024] Working principle: Use the electric telescopic rod 12 to drive the clamp 13 to move forward, place the wafer 18 in the clamp 13, rotate the bolt 15 to make the anti-slip pad 16 fix the wafer 18, start the motor 3 to drive the second rotating shaft 8 to rotate so that the second gear 7 engages and connects with the first gear 6 to rotate, thereby rotating the sensor cover 10 at the front end and the clamped wafer 18, and electrically connects the first detection light 17 through the control component 20, and the control component 20 is electrically connected to the second detection light 21, so as to detect the wafer 18, and display it through the display component 19 electrically connected to the control component 20.

[0025] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A semiconductor wafer surface defect detection device, characterized in that: include: A detection box (1), wherein a motor (3) is fixedly connected to a side surface of the detection box (1), a second rotating shaft (8) is provided on a front surface of the motor (3), a second gear (7) is fixedly connected to the front surface of the second rotating shaft (8), a first gear (6) is meshedly connected to an outer surface of the second gear (7), and a first rotating shaft (5) is fixedly connected to a rear surface of the first gear (6); The front surface of the first gear (6) is fixedly connected to a sensor cover (10), the bottom inner wall of the sensor cover (10) is fixedly connected to a second detection lamp (21), the front surface of the first gear (6) is fixedly connected to an electric telescopic rod (12), the front surface of the electric telescopic rod (12) is fixedly connected to a clamp (13), the outer surface of the clamp (13) is provided with a threaded hole (14), the inner wall of the threaded hole (14) is threadedly connected to a bolt (15), and the front surface of the detection box (1) is provided with a switch door (2).

2. A semiconductor wafer surface defect detection device according to claim 1, characterized in that: A second hole (9) is provided on the side surface of the detection box (1), and the inner wall of the second hole (9) is rotatably connected to the second rotating shaft (8).

3. A semiconductor wafer surface defect detection device according to claim 1, characterized in that: A first hole (4) is provided on the side surface of the detection box (1), and an inner wall of the first hole (4) is rotatably connected to a first rotating shaft (5).

4. A semiconductor wafer surface defect detection device according to claim 1, characterized in that: The inner wall of the sensor cover (10) is provided with a groove (11), and the inner wall of the groove (11) is slidably connected to the electric telescopic rod (12).

5. The semiconductor wafer surface defect detection device according to claim 1, characterized in that: The lower surface of the bolt (15) is fixedly connected with an anti-skid pad (16), the rear surface of the anti-skid pad (16) is in contact with the clamp (13), and the front surface of the anti-skid pad (16) is in contact with the wafer (18).

6. A semiconductor wafer surface defect detection device according to claim 1, characterized in that: The input end of the electric telescopic rod (12) is electrically connected to an external power source, and the input end of the motor (3) is electrically connected to an external power source.

7. A semiconductor wafer surface defect detection device according to claim 1, characterized in that: The inner wall of the detection box (1) is provided with first detection lights (17), and the number of the first detection lights (17) is multiple and evenly distributed.

8. A semiconductor wafer surface defect detection device according to claim 1, characterized in that: The upper surface of the detection box (1) is provided with a display component (19), and the upper surface of the detection box (1) is provided with a control component (20).

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