Light receiving and transmitting integrated single-tube packaging device

Abstract

The embodiment of the utility model discloses a light receiving and transmitting integrated single-tube packaging device. The light receiving and transmitting integrated single-tube packaging device comprises a base, a light-emitting chip, a power detector and a prism, wherein the light-emitting chip, the power detector and the prism are arranged on the base; the light-emitting chip and the power detector are located on the same plane; the prism is located above the light-emitting chip, the prism is of a parallelogram structure, and part of light emitted by the light-emitting chip is reflected to the power detector through the prism.

Description

Technical Field

[0001] The present application belongs to the field of optical communication technology, and specifically, relates to an optical transceiver integrated single-tube packaged device. Background Art

[0002] Vertical-Cavity Surface-Emitting Laser (VCSEL), also known as surface-emitting laser, is a semiconductor laser that emits laser light in a direction perpendicular to its substrate. For multi-mode wavelength VCSEL lasers, its power detector and light-emitting chip are located on different surfaces, which results in a large package size after packaging of existing multi-mode wavelength VCSEL lasers, and the packaging process is also more complicated and the packaging efficiency is lower. Utility Model Content

[0003] The purpose of the present application is to provide a new technical solution for an optical transceiver integrated single-tube packaged device.

[0004] According to a first aspect of the present application, there is provided an optical transceiver integrated single tube packaged device, the optical transceiver integrated single tube packaged device comprising a base and a light emitting chip, a power detector and a prism arranged on the base;

[0005] The light emitting chip and the power detector are located in the same plane;

[0006] The prism is located above the light emitting chip and is a parallelogram structure. Part of the light emitted by the light emitting chip is reflected by the prism to the power detector.

[0007] Optionally, the light-emitting chip is a vertical cavity surface emitting laser.

[0008] Optionally, the optical transceiver integrated single tube packaged device further includes a detector chip, and the detector chip, the light emitting chip and the power detector are all arranged on the same plane, and the light emitting chip is located between the detector chip and the power detector.

[0009] Optionally, the base includes a base platform and a positive boss arranged on the base platform;

[0010] The light emitting chip, the detector chip and the power detector are all arranged on the base platform;

[0011] The prism is arranged on the forward boss and is located above the light emitting chip and the detector chip.

[0012] Optionally, the prism is formed by two opposite and parallel inclined surfaces and two opposite and parallel planes to form a parallelogram structure, wherein the inner wall of one inclined surface is a reflecting surface, the inner wall of the other inclined surface is a first filtering surface, and the outer wall is a light splitting surface;

[0013] The detector chip is located on the optical path of the light reflected by the reflecting surface;

[0014] The power detector is located on the optical path of the light reflected by the beam splitting surface.

[0015] Optionally, the light splitting surface is configured to selectively transmit and reflect the light emitted from the light emitting chip according to wavelength, and the transmittance of the light splitting surface is greater than the reflectance.

[0016] Optionally, the first filter surface is configured to transmit a first light emitted from the light-emitting chip, and reflect a second light returned to the first filter surface via an external device to the reflective surface.

[0017] Optionally, a splitter film is arranged on the splitter surface, a filter film is arranged on the first filter surface, and a reflective film is arranged on the reflective surface.

[0018] Optionally, one of the planes of the prism is a second filtering surface, and in the optical path, the second filtering surface is located between the reflecting surface and the detector chip.

[0019] Optionally, the second filter surface is configured to transmit the second light reflected from the reflective surface and reflect the first light or other light.

[0020] Optionally, a filter film is arranged on the second filter surface.

[0021] Optionally, the optical transceiver integrated single tube packaged device further includes a lens, which is located on the optical path of the first light transmitted through the beam splitting surface and the first filter surface, and is used to receive the first light and focus the coupled light.

[0022] Optionally, the base further comprises a pipe cap, the pipe cap is disposed on the base platform, and the pipe cap and the base platform enclose a receiving cavity;

[0023] The lens is arranged on the top of the tube cap.

[0024] Optionally, the optical transceiver integrated single tube packaged device further includes an amplifier, which is disposed on the base platform and electrically connected to the detector chip.

[0025] Optionally, the amplifier is a transimpedance amplifier.

[0026] Optionally, the optical transceiver integrated single tube packaged device further includes a capacitor, which is disposed on the base platform and is electrically connected to the amplifier.

[0027] Optionally, the prism is a box-shaped structure with an open top and a hollow interior;

[0028] The bottom of the prism is fixedly connected to the side wall of the positive boss through a bracket, and the prism is parallel to the base platform.

[0029] Optionally, the detector chip is mounted on the base platform via a first gasket;

[0030] and / or,

[0031] The power detector is mounted on the base platform via a second gasket.

[0032] Optionally, the light-emitting chip is mounted on the base platform via a heat sink.

[0033] Optionally, a plurality of pins are provided through the upper edge of the base platform in the thickness direction, and the plurality of pins are respectively used to electrically connect with the light emitting chip, the detector chip and the power detector.

[0034] One beneficial effect of the embodiments of the present application is:

[0035] The optical transceiver integrated single-tube packaged device proposed in the embodiment of the present application adopts a new TO packaging solution. By arranging the light-emitting chip and the power detector on the same plane, it is beneficial to integrate the light-emitting chip and the power detector, which can simplify the packaging process, improve the packaging efficiency, and reduce the size of the entire optical transceiver integrated single-tube packaged device, thereby achieving the purpose of miniaturization.

[0036] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0038] Figure 1 One of the structural schematic diagrams of the optical transceiver integrated single tube package device provided in the embodiment of the present application;

[0039] Figure 2 The second structural schematic diagram of the optical transceiver integrated single tube package device provided in the embodiment of the present application;

[0040] Figure 3 A structural diagram of a prism of an optical transceiver integrated single-tube packaged device provided in an embodiment of the present application;

[0041] Figure 4 This is a light path diagram involved in the optical transceiver integrated single tube packaged device provided in an embodiment of the present application.

[0042] Description of reference numerals:

[0043] 1. Light-emitting chip; 2. Detector chip; 3. Power detector; 4. Heat sink; 5. First gasket; 6. Second gasket; 7. Amplifier; 8. Capacitor; 9. Prism; 901. Reflection surface; 902. Beam splitting surface; 903. First filter surface; 904. Second filter surface; 10. Base platform; 11. Forward boss; 12. Cap; 13. Pin; 14. Lens; 01. First light ray; 02. Second light ray. DETAILED DESCRIPTION

[0044] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0045] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0046] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0047] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0048] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0049] The optical transceiver integrated single tube packaged device provided in the embodiment of the present application is described in detail below with reference to the accompanying drawings.

[0050] According to one aspect of the present application, a single-tube packaged optical transceiver is provided. Figures 1 to 3As shown, the optical transceiver integrated single tube packaged device includes a base and a light-emitting chip 1, a power detector 3 and a prism 9 arranged on the base, wherein the light-emitting chip 1 and the power detector 3 are located in the same plane, the prism 9 is located above the light-emitting chip 1, and the prism 9 is arranged as a parallelogram structure, and part of the light emitted by the light-emitting chip 1 can be reflected to the power detector 3 through the prism 9.

[0051] According to the optical transceiver integrated single-tube packaged device provided in the embodiment of the present application, a new TO packaging structure, also known as coaxial packaging, is adopted, and the light-emitting chip 1 (i.e., the light emitting end) and the power detector 3 (i.e., the light receiving end) are integrated on a plane of the base. In this way, the size of the entire packaged device can be greatly reduced at least in the height direction, and the production process can also be simplified.

[0052] The optical transceiver integrated single tube package device provided in the embodiment of the present application introduces a prism 9 with a special structure. The prism 9 is a parallelogram structure in appearance, and the prism 9 is at least located above the light emitting chip 1. Figure 4 The prism 9 can directly reflect a part of the light emitted by the light emitting chip 1 to the power detector 3 . After receiving this part of the reflected light, the power detector 3 can be used to monitor the forward optical power of the light emitting chip 1 .

[0053] The optical transceiver integrated single tube packaged device proposed in the embodiment of the present application realizes the integration of the light emitting chip 1 and the power detector 3 by arranging the light emitting chip 1 and the power detector 3 on the same plane. This design can simplify the packaging process and improve the packaging efficiency, and can also reduce the overall size of the entire optical transceiver integrated single tube packaged device to achieve the purpose of miniaturization.

[0054] In some examples of the present application, the light emitting chip 1 is a vertical cavity surface emitting laser.

[0055] In the optical transceiver integrated single tube packaged device provided in the embodiment of the present application, the light emitting chip 1 is a vertical cavity surface emitting laser, i.e., a VCSEL laser emitting chip, which forms an optical transceiver integrated single tube coaxial packaging structure based on the VCSEL laser emitting chip. The optical transceiver integrated single tube packaged device finally formed can have the characteristics of small size and simple packaging process.

[0056] In some examples of this application, see Figure 2 As shown, the optical transceiver integrated single tube packaged device also includes a detector chip 2, and the detector chip 2, the light emitting chip 1 and the power detector 3 are all arranged on the same plane, and the light emitting chip 1 is located between the detector chip 2 and the power detector 3.

[0057] See also Figure 2 The optical transceiver integrated single tube packaged device also includes a detector chip 2. The detector chip 2, the light emitting chip 1 and the power detector 3 are all located on the same plane of the base, and the light emitting chip 1 is located between the detector chip 2 and the power detector 3. Under this structure, part of the light emitted by the light emitting chip 1 is reflected by the prism 9 and can be received by the power detector 3, and another part of the light is transmitted through the prism 9 and then reflected twice and can be received by the detector chip 2.

[0058] In an embodiment of the present application, the light-emitting chip 1, the detector chip 2 and the power detector 3 are located on the same plane, and the three are located at the same height, so they can be easily integrated together. It should be noted that in the present application, the main functional elements such as the light-emitting chip 1, the detector chip 2 and the power detector 3 are located on the same plane, that is, all the functional chips are designed to be mounted on the same surface, which can simplify the process. Specifically, the current conventional packaging process, based on the surface emission characteristics of the VCSEL laser emitting chip, causes different functional chips to be packaged on different surfaces. In this way, the packaging machine needs more processes such as fixture flipping patches and other redundant steps, and more than one device may be involved. The solution provided in the embodiment of the present application can simplify the above steps. It only requires the packaging machine to repeat the same packaging steps on the same plane, which reduces and simplifies the packaging process on the device side, the equipment R&D cost, and the packaging process and process of the entire device.

[0059] In some examples of this application, see Figure 2 As shown, the base includes a base platform 10 and a positive boss 11 disposed on the base platform 10. The light emitting chip 1, the detector chip 2 and the power detector 3 are all disposed on the base platform 10. The prism 9 is on the positive boss 11 and is located above the light emitting chip 1 and the detector chip 2.

[0060] The base provided in the embodiment of the present application includes two parts: one part is a base platform 10 , and the other part is a positive boss 11 , and the positive boss 11 is arranged on the base platform 10 .

[0061] See also Figure 2 The base platform 10 has a relatively large plane for supporting the light emitting chip 1, the detector chip 2, the power detector 3 and the positive boss 11. The positive boss 11 is, for example, a cubic column, on one side wall of which the prism 9 is fixedly arranged so that the prism 9 can be suspended above the light emitting chip 1 and the detector chip 2.

[0062] In some examples of this application, see Figure 3 As shown, the prism 9 is formed by two opposite and parallel inclined surfaces and two opposite and parallel planes to form a parallelogram structure, wherein the inner wall of one inclined surface is a reflecting surface 901, the inner wall of the other inclined surface is a first filtering surface 903, and the outer wall is a splitting surface 902; the detector chip 2 is located on the optical path of the light reflected by the reflecting surface 901, and the power detector 3 is located on the optical path of the light reflected by the splitting surface 902.

[0063] Specifically, see Figure 4 As shown, the light emitted by the light-emitting chip 1 passes through the splitting surface 902 of the prism 9, and a small part of the light can be received by the power detector 3 after being reflected, and can be used for forward optical power detection; most of the light will pass through the splitting surface 902 and then be filtered according to the wavelength by the first filtering surface 903. For example, the first filtering surface 903 can transmit the first light ray 01, and the first light ray 01 is emitted to an external device such as an optical fiber connector (which can be located outside the entire optical transceiver integrated single-tube packaging device), and the light transmitted back through the optical fiber connector becomes the second light ray 02, and the second light ray 02 is reflected by the first filtering surface 903 and the reflecting surface 901 in turn, and then is received by the detector chip 2.

[0064] In some examples of the present application, the light splitting surface 902 is configured to selectively transmit and reflect the light emitted from the light emitting chip 1 , and the transmittance of the light splitting surface 902 is greater than the reflectance.

[0065] For example, the transmittance of the light splitting surface 902 is above 90%, and the transmittance is much greater than the reflectance.

[0066] In some examples of this application, see Figure 4 The first filter surface 903 is configured to transmit the first light 01 emitted from the light emitting chip 1 and reflect the first light 01 emitted by the peripheral device ( Figure 4 The second light 02 (not shown) returns to the first filtering surface 903 to the reflecting surface 901.

[0067] It should be noted that the optical transceiver integrated single tube package device also needs to be equipped with an external device, such as the above-mentioned optical fiber connector. The optical fiber connector is located on the optical path of the light transmitted by the light splitting surface 902.

[0068] In the embodiment of the present application, the optical fiber connector is mainly used to receive the first light 01 from the light emitting chip 1 and emit the second light 02 back to the first filter surface 903. Figure 4The wavelength ranges of the first light 01 and the second light 02 are different. Therefore, the first filter surface 903 can receive the second light 02 and reflect the second light 02 to the reflection surface 901. The reflection surface 901 reflects the second light 02 to the detector chip 2.

[0069] The prism 9 provided in the embodiment of the present application utilizes optical thin film technology. By coating a specific filter film on the inner wall of one of the inclined surfaces and coating or mounting a splitter film on the outer wall, a small part of the light emitted by the light-emitting chip 1 can be reflected and then directly received by the power detector 3, and most of the light can be transmitted and modulated and finally received by the detector chip 2. This design enables the entire optical transceiver integrated single-tube packaged device to achieve single-fiber bidirectional transmission.

[0070] In some examples of this application, see Figure 3 The splitter surface 902 is provided with a splitter film, the first filter surface 903 is provided with a filter film, and the reflective surface 901 is provided with a reflective film.

[0071] In the optical transceiver integrated single-tube packaged device provided in the embodiment of the present application, a prism 9 with a parallelogram structure is arranged on a forward boss 11, and the prism 9 has an inclined surface, and a splitter film and a filter film are respectively arranged on the outer wall and the inner wall of the inclined surface, correspondingly forming a splitter surface 902 and a first filter surface 903, the splitter surface 902 is used to reflect a part of the light to the power detector 3 for forward optical power monitoring, and the first filter surface 903 is used to filter the light from the light-emitting chip 1 so that the first light 01 can pass through, and the first light 01 forms a second light 02 after passing through an external device and returns to the first filter surface 903; the prism 9 also has another inclined surface, and a reflective film is arranged on the inner wall of the inclined surface to form a reflective surface 901, and the reflective surface 901 is used to receive and reflect the second light 02 to be received by the detector chip 2, and the entire optical path shares a fiber optic interface, realizing the function of single-fiber bidirectional transmission.

[0072] In some examples of this application, see Figure 3 and Figure 4 One of the planes of the prism 9 is a second filtering surface 904 . In the optical path, the second filtering surface 904 is located between the reflecting surface 901 and the detector chip 2 .

[0073] The second filter surface 904 is configured to transmit the second light 02 reflected from the reflective surface 901 and reflect the first light 01 or other light.

[0074] A second filter surface 904 may be provided on a plane of the prism 9, see Figure 3 and Figure 4 The second filter surface 904 is mainly used to prevent signal crosstalk.

[0075] It should be noted that, in conventional packaging devices, due to the two wavelengths of light, when the detector chip 2 receives the light emitted by the light-emitting chip 1, a portion of the light emitted by the light-emitting chip 1 on the same side will be reflected back due to the external light path. By adding the second filter surface 904, this portion of the light can be filtered out, thereby effectively reducing the signal crosstalk between the two wavelengths of light.

[0076] The optical transceiver integrated single-tube packaged device provided in the embodiment of the present application can be directly coated on the prism 9, so that the signal crosstalk problem can be solved without adding additional structures, which not only reduces the size of the packaged device and reduces the cost, but also solves the signal crosstalk problem.

[0077] Of course, to solve the signal crosstalk problem, not only the above-mentioned coating on the prism 9 can be used, but also an anti-signal crosstalk device can be mounted on the surface of the positive boss 11 between the bottom of the coating surface and the top of the detector chip. The anti-signal crosstalk device can be directly connected to the detector chip 2, or it can be attached to the positive boss 11 parallel to the detector chip 2.

[0078] Wherein, a filter film is disposed on the second filter surface 904 .

[0079] In some examples of the present application, the optical transceiver integrated single tube packaged device also includes a lens 14, which is located on the optical path of the first light 01 transmitted through the splitting surface 902 and the first filtering surface 903, and is used to receive the first light 01 and focus the coupled light.

[0080] In some examples of this application, see Figure 1 and Figure 2 The base further includes a tube cap 12, which is disposed on the base platform 10, and the tube cap 12 and the base platform 10 enclose a receiving cavity. The lens 14 is disposed on the top of the tube cap 12.

[0081] The accommodating cavity formed by the tube cap 12 and the base platform 10 can accommodate the light emitting chip 1 , the detector chip 2 , the power detector 3 , the prism 9 and other devices.

[0082] The pipe cap 12 and the base platform 10 can be enclosed into a relatively closed structure.

[0083] In some examples of this application, see Figure 2As shown, the optical transceiver integrated single tube packaged device further includes an amplifier 7 , which is disposed on the base platform 10 and electrically connected to the detector chip 2 .

[0084] The amplifier 7 is used to amplify the electrical signal, which can improve the monitoring performance of the detector chip 2 .

[0085] The amplifier 7 is designed to be disposed on the base platform 10 , so as to facilitate its integration with the detector chip 2 .

[0086] Wherein, the amplifier 7 is a transimpedance amplifier.

[0087] In some examples of this application, see Figure 2 As shown, the optical transceiver integrated single tube packaged device further includes a capacitor 8 , which is disposed on the base platform 10 and is electrically connected to the amplifier 7 .

[0088] The amplifier 7 is, for example, a transimpedance amplifier, which, when combined with a capacitor, can improve the photoelectric conversion efficiency and further optimize the performance of the detector chip 2 .

[0089] In some examples of this application, see Figure 3 As shown, the prism 9 is a box-shaped structure with an open top and a hollow interior; the bottom of the prism 9 is fixedly connected to the side wall of the positive boss 11 through a bracket, and the prism 9 is parallel to the base platform 10.

[0090] The positive boss 11 is vertically fixed on the surface of the base platform 10 on which the components are arranged. The bottom surface of the prism 9 is fixedly connected to the side wall of the positive boss 11 through a bracket.

[0091] See also Figure 3 and Figure 4 Any inclined surface of the prism 9 may form an angle of 30 degrees with the horizontal plane, for example.

[0092] Specifically, see Figure 3 and Figure 4 The reflecting surface 901 and the splitting surface 902 are both inclined surfaces of 30 degrees. Under this design, the propagation path of the light of the light emitting chip 1 after being reflected by the splitting surface 902 is parallel to the propagation path of the second light 02 that passes through the splitting surface 902 and then reflects to the reflecting surface 901. At this time, the power detector 3 and the detector chip 2 can be designed to be relatively compact in position, which is conducive to reducing the size of the packaged device.

[0093] In some examples of this application, see Figure 2As shown, the detector chip 2 is mounted on the base platform 10 through a first gasket 5 , and / or the power detector 3 is mounted on the base platform 10 through a second gasket 6 .

[0094] The first gasket 5 and / or the second gasket 6 are / is an alumina ceramic sheet. Alumina ceramic material has good conductivity, mechanical strength and high temperature resistance.

[0095] In some examples of this application, see Figure 2 As shown, the light emitting chip 1 is mounted on the base platform 10 via a heat sink 4 .

[0096] Wherein, the heat sink 4 is an aluminum nitride ceramic sheet. Aluminum nitride ceramic material has good thermal conductivity.

[0097] In some examples of this application, see Figure 1 and Figure 2 A plurality of pins 13 are provided on the base platform 10 along the thickness direction, and the plurality of pins 13 are respectively used to electrically connect with the light emitting chip 1 , the detector chip 2 and the power detector 3 .

[0098] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. An optical transceiver integrated single tube packaged device, characterized in that: It comprises a base, and a light-emitting chip (1), a power detector (3) and a prism (9) arranged on the base; The light-emitting chip (1) and the power detector (3) are located on the same plane; The prism (9) is located above the light-emitting chip (1); the prism (9) is a parallelogram structure; part of the light emitted by the light-emitting chip (1) is reflected by the prism (9) to the power detector (3).

2. The optical transceiver integrated single tube packaged device according to claim 1, characterized in that: The light-emitting chip (1) is a vertical cavity surface emitting laser.

3. The optical transceiver integrated single tube packaged device according to claim 1 or 2, characterized in that: The optical transceiver integrated single tube packaged device further comprises a detector chip (2); the detector chip (2), the light emitting chip (1) and the power detector (3) are all arranged on the same plane, and the light emitting chip (1) is located between the detector chip (2) and the power detector (3).

4. The optical transceiver integrated single tube packaged device according to claim 3, characterized in that: The base comprises a base platform (10) and a positive boss (11) arranged on the base platform (10); The light emitting chip (1), the detector chip (2) and the power detector (3) are all arranged on the base platform (10); The prism (9) is arranged on the forward boss (11) and is located above the light-emitting chip (1) and the detector chip (2).

5. The optical transceiver integrated single tube packaged device according to claim 4, characterized in that: The prism (9) is formed of two opposite and parallel inclined surfaces and two opposite and parallel planes to form a parallelogram structure, wherein the inner wall of one inclined surface is a reflection surface (901), the inner wall of the other inclined surface is a first filter surface (903), and the outer wall is a light splitting surface (902); The detector chip (2) is located on the optical path of the light reflected by the reflecting surface (901); The power detector (3) is located on the optical path of the light reflected by the light splitting surface (902).

6. The optical transceiver integrated single tube packaged device according to claim 5, characterized in that: The light splitting surface (902) is configured to selectively transmit and reflect light emitted from the light emitting chip (1), and the transmittance of the light splitting surface (902) is greater than the reflectance.

7. The optical transceiver integrated single tube packaged device according to claim 6, characterized in that: The first filter surface (903) is configured to transmit a first light ray (01) emitted by the light emitting chip (1), and to reflect a second light ray (02) returning to the first filter surface (903) via an external device to the reflective surface (901).

8. The optical transceiver integrated single tube packaged device according to claim 5, characterized in that: A beam splitting film is arranged on the beam splitting surface (902), a light filtering film is arranged on the first light filtering surface (903), and a reflection film is arranged on the reflection surface (901).

9. The optical transceiver integrated single tube packaged device according to claim 7, characterized in that: One of the planes of the prism (9) is a second filter surface (904). In the optical path, the second filter surface (904) is located between the reflection surface (901) and the detector chip (2).

10. The optical transceiver integrated single tube packaged device according to claim 9, characterized in that: The second filter surface (904) is configured to transmit the second light (02) reflected from the reflective surface (901) and reflect the first light (01) or other light.

11. The optical transceiver integrated single tube packaged device according to claim 10, characterized in that: A filter film is arranged on the second filter surface (904).

12. The optical transceiver integrated single tube packaged device according to claim 9, characterized in that: The optical transceiver integrated single tube packaged device further comprises a lens (14), wherein the lens (14) is located on the optical path of the first light (01) transmitted through the light splitting surface (902) and the first light filtering surface (903), and the lens (14) is used to receive the first light (01) and focus the coupled light.

13. The optical transceiver integrated single tube packaged device according to claim 12, characterized in that: The base further comprises a pipe cap (12), wherein the pipe cap (12) is covered on the base platform (10), and the pipe cap (12) and the base platform (10) enclose a receiving cavity; The lens (14) is arranged on the top of the tube cap (12).

14. The optical transceiver integrated single tube packaged device according to claim 4, characterized in that: The optical transceiver integrated single tube packaged device further comprises an amplifier (7), wherein the amplifier (7) is arranged on the base platform (10) and is electrically connected to the detector chip (2).

15. The optical transceiver integrated single tube packaged device according to claim 14, characterized in that: The amplifier (7) is a transimpedance amplifier.

16. The optical transceiver integrated single tube packaged device according to claim 14 or 15, characterized in that: The optical transceiver integrated single tube packaged device also includes a capacitor (8), which is arranged on the base platform (10) and is electrically connected to the amplifier (7).

17. The optical transceiver integrated single tube packaged device according to claim 5, characterized in that: The prism (9) is a box-shaped structure with an open top and a hollow interior; The bottom of the prism (9) is fixedly connected to the side wall of the forward boss (11) via a bracket, and the prism (9) is parallel to the base platform (10).

18. The optical transceiver integrated single tube packaged device according to claim 4, characterized in that: The detector chip (2) is mounted on the base platform (10) via a first gasket (5); and / or, The power detector (3) is mounted on the base platform (10) via a second gasket (6).

19. The optical transceiver integrated single tube packaged device according to claim 4, characterized in that: The light-emitting chip (1) is mounted on the base platform (10) via a heat sink (4).

20. The optical transceiver integrated single tube packaged device according to claim 4, characterized in that: A plurality of pins (13) are provided on the base platform (10) along the thickness direction, and the plurality of pins (13) are respectively used to electrically connect to the light emitting chip (1), the detector chip (2) and the power detector (3).

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