L-band down-conversion module
By dividing blocks on the printed board and integrating devices, combined with the use of planar spiral inductors, the problems of large size and heavy weight of the existing L-band down-converting components are solved, and the product is lightweight, miniaturized and cost-reduced.
Patent Information
- Application Number
- CN202421161434.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-27
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-05-27
AI Technical Summary
The existing L-band down-converting components have many devices and large power, resulting in large product size and heavy weight, making it difficult to meet the weight reduction and miniaturization requirements of the bomb loading platform.
By sintering metal partitions on the printed board, dividing the printed board into multiple blocks, integrating all devices into one package, and replacing traditional winding inductors with planar spiral inductors, miniaturizing the product.
It realizes lightweight and miniaturization of the product, simplifies the wire wiring structure, reduces costs and production cycles, and improves space utilization.
Smart Images
Figure CN222602392U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of microwave communications, and in particular relates to an L-band down-conversion module. Background Art
[0002] In recent years, L-band receiving equipment has developed rapidly in various communication fields and has been widely used. As one of the main frequency bands used by modern mobile devices, the demand for L-band products is huge. With the continuous development of modern mobile communications, whether in the fields of mobile communication systems, intelligent transportation, wireless local area networks, radar information technology, electronic countermeasures, and unmanned aerial vehicles, the performance requirements are constantly increasing. Therefore, the research on L-band downconverters has far-reaching social significance and great economic value.
[0003] In the current L-band down-conversion components, most of them adopt module design because of the large number of link components and considering the interference of signals. In addition, the power of the power amplifier and other components is large, and heat dissipation and other issues must be considered. Therefore, the final designed product is large in size and heavy in weight, which is not conducive to the requirements of missile-borne platforms to reduce weight and miniaturize products. Summary of the invention
[0004] This technical solution aims at the shortcomings of the above-mentioned prior art and proposes an L-band down-conversion module, which integrates all devices into a package and then mounts it on the user's carrier board. It is light in weight, easy to maintain, low in cost and short in cycle. The LC filter inside the product is large in size, and the height of the inductor is high if the winding inductor is used, which is not convenient for product integration. The planar spiral inductor is integrated into the printed circuit board, which can greatly shorten the product size.
[0005] The above objectives are achieved specifically through the following technical solutions:
[0006] An L-band down-conversion module is provided. The L-band down-conversion module converts the input radio frequency signal to an intermediate frequency after amplification and filtering and mixing with a local oscillator. The intermediate frequency is output after a series of filtering and amplification. Based on this, the L-band down-conversion module includes a printed circuit board, a metal spacer and an L-band down-conversion circuit. The L-band down-conversion circuit is arranged on the printed circuit board, including a low-noise amplifier, a radio frequency filter, a digitally controlled attenuator, a first filter, a mixer, a first fixed attenuator, a low-pass filter, a first amplifier, a temperature-compensated attenuator, an LC filter unit, a second fixed attenuator, a second amplifier and a second filter which are electrically connected in sequence; and also includes a third fixed attenuator, a third amplifier and a third filter which are electrically connected in sequence, and the third filter is electrically connected to the mixer. The metal spacer is sintered on the printed circuit board, and is used to divide the printed circuit board into a number of blocks according to the layout of the L-band down-conversion circuit on the printed circuit board.
[0007] Preferably, the metal spacer divides the printed circuit board into four blocks; wherein the low noise amplifier, the radio frequency filter, the digitally controlled attenuator, the first filter, the mixer, the first fixed attenuator, the third fixed attenuator, the third amplifier and the third filter are arranged on the first block; the low pass filter, the first amplifier and the temperature compensated attenuator are arranged on the second block; the LC filter unit is arranged on the third block; the second fixed attenuator, the second amplifier and the second filter are arranged on the fourth block.
[0008] Preferably, the first block, the second block, the third block and the third block are arranged as a whole in a rectangular shape; wherein the third block is rectangular; the second block is L-shaped, the fourth block is a mirrored L-shape, and the second block and the fourth block cooperate to present a three-sided surrounding structure for the third block; the first block is L-shaped, presenting a two-sided surrounding structure for the second block and the fourth block from the outside of the second block.
[0009] Preferably, the lower end of the second block is connected to the first block.
[0010] Preferably, the LC filtering unit includes an inductor L1, an inductor L2 and an inductor L3 which are electrically connected in sequence between the temperature compensating attenuator and the second fixed attenuator, and a capacitor C1 is connected in parallel at both ends of the inductor L1, a capacitor C2 is connected in parallel at both ends of the inductor L2, and a capacitor C3 is connected in parallel at both ends of the inductor L3. An inductor L4 is connected between the temperature compensating attenuator and the inductor L1, and the inductor L4 is grounded to GND through the capacitor C4. An inductor L5 is connected between the inductor L1 and the inductor L2, and the inductor L5 is grounded to GND through the capacitor C5. An inductor L6 is connected between the inductor L2 and the inductor L3, and the inductor L6 is grounded to GND through the capacitor C6. An inductor L7 is connected between the inductor L3 and the second fixed attenuator, and the inductor L7 is grounded to GND through the capacitor C7.
[0011] Preferably, the printed circuit board is a four-layer board, which includes a top layer, a second layer, a third layer and a bottom layer from top to bottom, and the second layer and the bottom layer are grounded GND boards; in the L-band down-conversion circuit, the components in the first block, the second block and the fourth block, and all the capacitors in the LC filter unit are arranged on the top layer of the printed circuit board; all the inductors in the LC filter unit are arranged on the third layer of the printed circuit board.
[0012] Preferably, all inductors in the LC filter unit are planar spiral inductors.
[0013] Compared with the prior art, this technical solution has the following advantages:
[0014] 1) This technical solution establishes circuit isolation by sintering metal spacers on the printed circuit board to divide the printed circuit board into several blocks to avoid signal interference in each branch of the circuit. It lays an important foundation for integrating the L-band down-conversion circuit as a whole on the printed circuit board, which is of great significance for reducing the product size.
[0015] 2) The utility model is specifically implemented for the structure and signal direction of the L-band down-conversion circuit of the technical solution. Such a block division method is highly adaptable to the layout space requirements of various components in the L-band down-conversion circuit.
[0016] 3) The utility model specifically aims at the structure and direction of each link in the L-band down-conversion circuit, and sets the structure and relative position relationship of each block in combination with the rectangular structure of the printed circuit board, which facilitates the wire routing of the L-band down-conversion circuit and is of great significance for simplifying the wiring structure of the wire.
[0017] 4) This solution uses planar spiral inductors integrated into the printed circuit board to replace traditional winding inductors. Compared with the use of winding inductors, this technical solution saves a lot of space for the layout of the L-band down-conversion circuit. This solution also integrates the planar spiral inductors into the printed circuit board, which further improves the space utilization rate and is of great significance to reducing the product size. The SIP packaging technology is used to miniaturize the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a structural schematic diagram of the L-band down-conversion module;
[0019] Figure 2 It is the structural principle block diagram of L-band down-conversion circuit;
[0020] Figure 3 This is a schematic diagram of the layout of the planar spiral inductor on the third layer of the printed circuit board.
[0021] In the figure:
[0022] 1. Low noise amplifier; 2. RF filter; 3. Digitally controlled attenuator; 4. First filter; 5. Mixer; 6. First fixed attenuator; 7. Low pass filter; 8. First amplifier; 9. Temperature compensated attenuator; 10. LC filter unit; 11. Second fixed attenuator; 12. Second amplifier; 13. Second filter; 14. Third fixed attenuator; 15. Third amplifier; 16. Third filter; 17. First block; 18. Second block; 19. Third block; 20. Fourth block; 21. Printed circuit board; 22. Metal spacer. DETAILED DESCRIPTION
[0023] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings of the embodiments of the utility model. It should not be understood that the utility model is limited to the following examples. Without departing from the concept of the utility model, the deformation and improvement of the utility model in this field should be included in the protection scope of the claims of the utility model.
[0024] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The words "or", "comprising" and the like used in the present disclosure mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.
[0025] Example 1
[0026] This embodiment discloses an L-band down-conversion module as a preferred implementation scheme of the present technical solution. Figure 1 As shown, it includes a printed circuit board 21, a metal spacer 22 and an L-band down-conversion circuit.
[0027] Among them, the L-band down-conversion circuit is arranged on the printed circuit board 21, such as Figure 2 As shown, the L-band down-conversion circuit includes a low-noise amplifier 1, a radio frequency filter 2, a digitally controlled attenuator 3, a first filter 4, a mixer 5, a first fixed attenuator 6, a low-pass filter 7, a first amplifier 8, a temperature-compensated attenuator 9, an LC filter unit 10, a second fixed attenuator 11, a second amplifier 12 and a second filter 13, which are electrically connected in sequence; and also includes a third fixed attenuator 14, a third amplifier 15 and a third filter 16, which are electrically connected in sequence, and the third filter 16 is electrically connected to the mixer 5.
[0028] Furthermore, the metal spacers 22 are sintered on the printed board 21 to divide the printed board 21 into a plurality of blocks according to the layout of the L-band down-conversion circuit on the printed board 21 .
[0029] Among them, the working principle of the L-band down-conversion circuit is as follows: since the front-stage link has a great influence on the noise of the entire system, it is considered to use a low-noise amplifier 1 to ensure the noise of the entire module, that is, the L-band radio frequency signal RF is connected to the L-band down-conversion module described in this technical solution, and then amplified by the low-noise amplifier 1, and then filtered out by the radio frequency filter 2 to remove the spurious signal and enter the digital controlled attenuator 3; after using the digital controlled attenuator 3 to adjust the attenuation of the radio frequency signal RF according to the requirements of the link, the radio frequency signal RF is filtered again by the first filter 4 to ensure the signal purity. The signal involved in the mixing is processed by the third fixed attenuator 14, the third amplifier 15 and the third filter 16 and then input into the mixer 5. After the radio frequency signal RF is mixed in the mixer 5, an intermediate frequency signal is obtained; according to the signal index and the requirements of the subsequent circuit components, the intermediate frequency signal is power attenuated by the first fixed attenuator 6; then the intermediate frequency signal after power attenuation is filtered by the low-pass filter 7 to select the required frequency band; according to the signal index requirements, the selected frequency band after filtering is amplified by the first amplifier 8, and then the temperature-compensated attenuation is performed by the temperature-compensated attenuator 9 to compensate for the high and low temperature results; then, after the LC filter is used to filter out the spurious, it is successively passed through the second fixed attenuator 11 and the second amplifier 12 for power attenuation and amplification, and finally filtered by the second filter 13 to output the required intermediate frequency signal IF.
[0030] This technical solution establishes circuit isolation by sintering metal spacers 22 on the printed circuit board 21, dividing the printed circuit board 21 into several blocks to avoid signal interference in the branches of the circuit. This lays an important foundation for integrating the L-band down-conversion circuit as a whole on the printed circuit board 21, which is of great significance for reducing the product size.
[0031] Example 2
[0032] This embodiment discloses an L-band down-conversion module as a preferred implementation scheme of the present technical solution. Figure 1 As shown, it includes a printed circuit board 21, a metal spacer 22 and an L-band down-conversion circuit.
[0033] Among them, the L-band down-conversion circuit is arranged on the printed circuit board 21, such as Figure 2 As shown, the L-band down-conversion circuit includes a low-noise amplifier 1, a radio frequency filter 2, a digitally controlled attenuator 3, a first filter 4, a mixer 5, a first fixed attenuator 6, a low-pass filter 7, a first amplifier 8, a temperature-compensated attenuator 9, an LC filter unit 10, a second fixed attenuator 11, a second amplifier 12 and a second filter 13, which are electrically connected in sequence; and also includes a third fixed attenuator 14, a third amplifier 15 and a third filter 16, which are electrically connected in sequence, and the third filter 16 is electrically connected to the mixer 5.
[0034] Furthermore, the metal spacer 22 is sintered on the printed board 21, and is used to divide the printed board 21 into a plurality of blocks according to the layout of the L-band down-conversion circuit on the printed board 21. Figure 1 As shown, the metal spacer 22 divides the printed circuit board 21 into four blocks; among them, the low noise amplifier 1, the RF filter 2, the digitally controlled attenuator 3, the first filter 4, the mixer 5, the first fixed attenuator 6, the third fixed attenuator 14, the third amplifier 15 and the third filter 16 are arranged on the first block 17; the low pass filter 7, the first amplifier 8 and the temperature compensated attenuator 9 are arranged on the second block 18; the LC filter unit 10 is arranged on the third block 19; the second fixed attenuator 11, the second amplifier 12 and the second filter 13 are arranged on the fourth block 20.
[0035] The above technical solution is specifically implemented for the structure and signal direction of the L-band down-conversion circuit of the technical solution. Such a block division method is highly adaptable to the layout space requirements of various components in the L-band down-conversion circuit.
[0036] Example 3
[0037] This embodiment discloses an L-band down-conversion module as a preferred implementation scheme of the present technical solution. Figure 1 As shown, it includes a printed circuit board 21, a metal spacer 22 and an L-band down-conversion circuit.
[0038] Among them, the L-band down-conversion circuit is arranged on the printed circuit board 21, such as Figure 2 As shown, the L-band down-conversion circuit includes a low-noise amplifier 1, a radio frequency filter 2, a digitally controlled attenuator 3, a first filter 4, a mixer 5, a first fixed attenuator 6, a low-pass filter 7, a first amplifier 8, a temperature-compensated attenuator 9, an LC filter unit 10, a second fixed attenuator 11, a second amplifier 12 and a second filter 13, which are electrically connected in sequence; and also includes a third fixed attenuator 14, a third amplifier 15 and a third filter 16, which are electrically connected in sequence, and the third filter 16 is electrically connected to the mixer 5.
[0039] Furthermore, the metal spacer 22 is sintered on the printed board 21, and is used to divide the printed board 21 into a plurality of blocks according to the layout of the L-band down-conversion circuit on the printed board 21. Figure 1As shown, the metal spacer 22 divides the printed circuit board 21 into four blocks; among them, the low noise amplifier 1, the RF filter 2, the digitally controlled attenuator 3, the first filter 4, the mixer 5, the first fixed attenuator 6, the third fixed attenuator 14, the third amplifier 15 and the third filter 16 are arranged on the first block 17; the low pass filter 7, the first amplifier 8 and the temperature compensated attenuator 9 are arranged on the second block 18; the LC filter unit 10 is arranged on the third block 19; the second fixed attenuator 11, the second amplifier 12 and the second filter 13 are arranged on the fourth block 20.
[0040] Furthermore, the first block 17, the second block 18, the third block 19 and the third block 19 are arranged in a rectangular shape as a whole; among them, the third block 19 is rectangular; the second block 18 is L-shaped, and the fourth block 20 is a mirrored L-shape, and the second block 18 and the fourth block 20 cooperate to present a three-sided surrounding structure for the third block 19; the first block 17 is L-shaped, and presents a two-sided surrounding structure for the second block 18 and the fourth block 20 from the outside of the second block 18.
[0041] The above technical solution sets the structure and relative position relationship of each block according to the structure and direction of each link in the L-band down-conversion circuit, combined with the rectangular structure of the printed circuit board 21, which facilitates the wire routing of the L-band down-conversion circuit.
[0042] Furthermore, the lower end of the second block 18 together with the first block 17 is of great significance for simplifying the wiring structure of the wires.
[0043] Example 4
[0044] This embodiment discloses an L-band down-conversion module as a preferred implementation scheme of the present technical solution. Figure 1 As shown, it includes a printed circuit board 21, a metal spacer 22 and an L-band down-conversion circuit.
[0045] Among them, the L-band down-conversion circuit is arranged on the printed circuit board 21, such as Figure 2 As shown, the L-band down-conversion circuit includes a low-noise amplifier 1, a radio frequency filter 2, a digitally controlled attenuator 3, a first filter 4, a mixer 5, a first fixed attenuator 6, a low-pass filter 7, a first amplifier 8, a temperature-compensated attenuator 9, an LC filter unit 10, a second fixed attenuator 11, a second amplifier 12 and a second filter 13, which are electrically connected in sequence; and also includes a third fixed attenuator 14, a third amplifier 15 and a third filter 16, which are electrically connected in sequence, and the third filter 16 is electrically connected to the mixer 5.
[0046] Furthermore, the metal spacer 22 is sintered on the printed board 21, and is used to divide the printed board 21 into a plurality of blocks according to the layout of the L-band down-conversion circuit on the printed board 21. Figure 1 As shown, the metal spacer 22 divides the printed circuit board 21 into four blocks; among them, the low noise amplifier 1, the RF filter 2, the digitally controlled attenuator 3, the first filter 4, the mixer 5, the first fixed attenuator 6, the third fixed attenuator 14, the third amplifier 15 and the third filter 16 are arranged on the first block 17; the low pass filter 7, the first amplifier 8 and the temperature compensated attenuator 9 are arranged on the second block 18; the LC filter unit 10 is arranged on the third block 19; the second fixed attenuator 11, the second amplifier 12 and the second filter 13 are arranged on the fourth block 20.
[0047] Furthermore, the LC filtering unit 10 includes an inductor L1, an inductor L2 and an inductor L3 which are electrically connected in sequence between the temperature compensating attenuator 9 and the second fixed attenuator 11, and a capacitor C1 is connected in parallel at both ends of the inductor L1, a capacitor C2 is connected in parallel at both ends of the inductor L2, and a capacitor C3 is connected in parallel at both ends of the inductor L3; an inductor L4 is connected between the temperature compensating attenuator 9 and the inductor L1, and the inductor L4 is grounded GND through the capacitor C4; an inductor L5 is connected between the inductor L1 and the inductor L2, and the inductor L5 is grounded GND through the capacitor C5; an inductor L6 is connected between the inductor L2 and the inductor L3, and the inductor L6 is grounded GND through the capacitor C6; an inductor L7 is connected between the inductor L3 and the second fixed attenuator 11, and the inductor L7 is grounded GND through the capacitor C7.
[0048] Based on the composition structure of the above-mentioned L-band down-conversion circuit, the printed circuit board 21 of the present technical solution adopts a four-layer board, which is the top layer, the second layer, the third layer and the bottom layer from top to bottom, and the second layer and the bottom layer are grounded GND boards. The printed circuit board 21 is divided into a single-sided board, a double-sided board and a multi-layer board, and the four-layer board of the present technical solution belongs to a multi-layer board. Multi-layer board (Multi-Layer) In order to increase the area that can be wired, multi-layer boards use more single-sided or double-sided wiring boards. A printed circuit board having a double-sided inner layer and two single-sided outer layers or two double-sided inner layers and two single-sided outer layers is alternately connected by a positioning system and an insulating adhesive material, and the conductive pattern is printed on the circuit board interconnected according to the design requirements to become a four-layer and six-layer printed circuit board, also known as a multi-layer printed circuit board. Further, the material of the printed circuit board 21 can be RO4350B.
[0049] Based on the above four-layer board, in the L-band down-conversion circuit, the components in the first block 17, the second block 18 and the fourth block 20, and all the capacitors in the LC filter unit 10 are arranged on the top layer of the printed board 21; all the inductors in the LC filter unit 10 are arranged on the third layer of the printed board 21. In addition, the power supply and control and other related component structures involved in the L-band down-conversion circuit are also arranged on the third layer.
[0050] Furthermore, all the inductors in the LC filter unit 10 are planar spiral inductors, such as Figure 3 The layout diagram of the planar spiral inductor on the third layer of the printed circuit board 21 is shown. Among them, the connector A corresponds to the LC filter unit 10 structure shown in the figure, and is connected to the corresponding inductor on the first layer of the printed circuit board 21; the connectors B1 and B2 are connected to the first fixed attenuator 6 and the temperature compensation attenuator 9 on the first layer of the printed circuit board 21.
[0051] This solution uses a planar spiral inductor integrated into the printed circuit board 21 to replace the traditional winding inductor in the product component, which saves a lot of space for the layout of the L-band down-conversion circuit. First of all, the winding inductor has a greater space utilization rate in layout compared to the traditional spiral inductor, and this solution also integrates the planar spiral inductor into the printed circuit board 21, which further improves the space utilization rate and greatly reduces the product size. Based on the use of planar spiral inductors, a lot of space is saved for the overall layout, and this space is used to place other devices, optimizing the layout structure of the product, and using SIP packaging technology to make the product miniaturized.
Claims
1. An L-band down-conversion module, characterized in that: It includes a printed circuit board (21), a metal spacer (22) and an L-band down-conversion circuit; The L-band down-conversion circuit is arranged on a printed circuit board (21), and comprises a low-noise amplifier (1), a radio frequency filter (2), a digitally controlled attenuator (3), a first filter (4), a mixer (5), a first fixed attenuator (6), a low-pass filter (7), a first amplifier (8), a temperature-compensated attenuator (9), an LC filter unit (10), a second fixed attenuator (11), a second amplifier (12), and a second filter (13) which are electrically connected in sequence; and further comprises a third fixed attenuator (14), a third amplifier (15), and a third filter (16) which are electrically connected in sequence, and the third filter (16) is electrically connected to the mixer (5); The metal spacer (22) is sintered on the printed board (21) and is used to divide the printed board (21) into a plurality of blocks according to the layout of the L-band down-conversion circuit on the printed board (21).
2. An L-band down-conversion module as claimed in claim 1, characterized in that: The metal spacer (22) divides the printed circuit board (21) into four blocks; wherein the low noise amplifier (1), the radio frequency filter (2), the digitally controlled attenuator (3), the first filter (4), the mixer (5), the first fixed attenuator (6), the third fixed attenuator (14), the third amplifier (15) and the third filter (16) are arranged on the first block (17); the low pass filter (7), the first amplifier (8) and the temperature compensated attenuator (9) are arranged on the second block (18); the LC filter unit (10) is arranged on the third block (19); and the second fixed attenuator (11), the second amplifier (12) and the second filter (13) are arranged on the fourth block (20).
3. An L-band down-conversion module as claimed in claim 2, characterized in that: The first block (17), the second block (18), the third block (19) and the fourth block (19) are arranged in a rectangular shape as a whole; wherein the third block (19) is rectangular; the second block (18) is L-shaped, the fourth block (20) is a mirror image L-shaped, and the second block (18) and the fourth block (20) cooperate to form a three-sided surrounding structure for the third block (19); the first block (17) is L-shaped, and from the outside of the second block (18) presents a two-sided surrounding structure for the second block (18) and the fourth block (20).
4. An L-band down-conversion module as claimed in claim 3, characterized in that: The lower end of the second block (18) is connected to the first block (17).
5. The L-band down-conversion module according to claim 2, characterized in that: The LC filter unit (10) comprises an inductor L1, an inductor L2 and an inductor L3 which are electrically connected in sequence between the temperature compensating attenuator (9) and the second fixed attenuator (11), and a capacitor C1 is connected in parallel at both ends of the inductor L1, a capacitor C2 is connected in parallel at both ends of the inductor L2, and a capacitor C3 is connected in parallel at both ends of the inductor L3; An inductor L4 is connected between the temperature compensating attenuator (9) and the inductor L1, and the inductor L4 is grounded to GND via a capacitor C4; An inductor L5 is connected between the inductor L1 and the inductor L2, and the inductor L5 is grounded GND through a capacitor C5; An inductor L6 is connected between the inductor L2 and the inductor L3, and the inductor L6 is grounded to GND through a capacitor C6; An inductor L7 is connected between the inductor L3 and the second fixed attenuator (11), and the inductor L7 is grounded to GND via a capacitor C7.
6. An L-band down-conversion module as claimed in claim 5, characterized in that: The printed circuit board (21) is a four-layer board, which comprises a top layer, a second layer, a third layer and a bottom layer from top to bottom, and the second layer and the bottom layer are grounding GND boards; In the L-band down-conversion circuit, components in the first block (17), the second block (18) and the fourth block (20), and all capacitors in the LC filter unit (10) are arranged on the top layer of the printed circuit board (21); All inductors in the LC filter unit (10) are arranged on the third layer of the printed circuit board (21).
7. An L-band down-conversion module as claimed in claim 5, characterized in that: All inductors in the LC filter unit (10) are planar spiral inductors.