Material cutting mechanism

Abstract

The utility model discloses a material cutting mechanism which comprises a bottom plate, a sliding groove is formed in the upper surface of the bottom plate, a sliding frame is connected in the sliding groove in a sliding mode, a limiting groove is formed in one side of the sliding frame, a sliding base is connected in the limiting groove in a sliding mode, a motor is fixedly connected to the bottom of the sliding base, and a cutting blade is fixedly connected to one end of an output shaft of the motor. And a driving assembly is arranged at the top of the sliding frame so that the sliding seat can move up and down along the limiting groove, an inserting assembly is arranged on one side of the sliding frame so that the sliding frame can be fixed, and two fixing seats are fixedly connected to the upper surface of the bottom plate. According to the cutting mechanism, semiconductor materials of different sizes can be clamped and fixed, the cutting quality is improved, the using effect of the cutting mechanism is improved, the semiconductor materials can be cut at different positions, the using convenience of the cutting mechanism is improved, the surfaces of the semiconductor materials can be prevented from being damaged by the clamping blocks, and the service life of the semiconductor materials is prolonged. And the clamping safety of the semiconductor material is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of cutting, in particular to a material cutting mechanism. Background Art

[0002] A semiconductor is a material with an electrical conductivity between that of an insulator and that of a conductor. Its electrical conductivity can be easily controlled and it can be used as a component material for information processing.

[0003] During the production process of semiconductors, the semiconductors need to be cut. Existing cutting devices are not convenient for stably clamping semiconductors of different sizes, resulting in poor cutting quality and low practical performance. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a material cutting mechanism.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] The top of the slide is provided with a driving assembly, which enables the slide to move up and down along the limiting groove, and one side of the slide is provided with an insert assembly, so that the slide is fixedly connected, and the upper surface of the base plate is fixedly connected with two fixed seats, a two-way threaded rod is rotatably connected between the two fixed seats, and both ends of the two-way threaded rod pass through the fixed seat, a slide is threadedly connected to the circumferential outer wall of the two-way threaded rod, a clamping block is fixedly connected to one side of the slide, and a guide component for enabling the slide to move horizontally is provided between the two fixed seats.

[0007] As a further solution of the utility model, the driving assembly includes a reduction motor, which is fixedly connected to the top of the slide. One end of the reduction motor output shaft passes through the slide and is fixedly connected to a screw rod, which passes through the slide and is threadedly connected to the slide.

[0008] As a further solution of the utility model, a connecting plate is fixedly connected to one side of the slide, and the screw rod is rotatably connected to the connecting plate.

[0009] As a further solution of the utility model, the plug-in assembly includes a fixed block, which is fixedly connected to one side of the slide near the bottom, and a sliding opening is provided on the top of the fixed block, and an insertion rod is slidably connected in the sliding opening. A plurality of sockets are provided on the upper surface of the base plate, and the insertion rod is plugged into the sockets.

[0010] As a further solution of the utility model, a spring is fixedly connected to the upper surface of the fixing block, and the spring is fixed to the insertion rod.

[0011] As a further solution of the utility model, the guide component is a support rod, the support rod is fixedly connected between two fixing seats, and the support rod passes through the slide plate.

[0012] As a further solution of the utility model, a rubber pad is fixedly connected to one side of the clamping block, and the rubber pad is equal in length to the clamping block.

[0013] The beneficial effects of the utility model are:

[0014] 1. Through the coordinated use of the bidirectional threaded rod and the clamping block, the bidirectional threaded rod is rotated, and the bidirectional threaded rod will drive the two slides to move, and the two slides will drive the clamping block to move, so that the position of the clamping block can be adjusted, and semiconductor materials of different sizes can be clamped and fixed, thereby improving the cutting quality and the use effect of the cutting mechanism.

[0015] 2. By setting the plug-in assembly, the position of the slide is fixed by the plug-in assembly, so that the position of the slide can be adjusted to cut the semiconductor material at different positions, thereby improving the convenience of using the cutting mechanism.

[0016] 3. By setting the rubber pad, when the clamping block clamps the semiconductor material, the rubber pad can prevent the clamping block from causing damage to the surface of the semiconductor material, thereby improving the safety of clamping the semiconductor material. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional structural schematic diagram of a material cutting mechanism proposed by the utility model;

[0018] Figure 2 This is a partial enlarged structural schematic diagram of a material cutting mechanism proposed by the utility model;

[0019] Figure 3 This is a schematic diagram of the enlarged structure of part A of a material cutting mechanism proposed by the utility model.

[0020] In the figure: 1. bottom plate; 2. socket; 3. slide groove; 4. connecting plate; 5. slide; 6. limit groove; 7. slide seat; 8. cutting disc; 9. screw rod; 10. fixed seat; 11. slide plate; 12. clamping block; 13. rubber pad; 14. support rod; 15. two-way threaded rod; 16. fixed block; 17. plug rod; 18. spring. DETAILED DESCRIPTION

[0021] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, so that the embodiments of the application described here, based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of this application.

[0022] Reference Figure 1-Figure 3 A material cutting mechanism includes a base plate 1, a slide groove 3 is provided on the upper surface of the base plate 1, a slide 5 is slidably connected in the slide groove 3, a limiting groove 6 is provided on one side of the slide 5, a slide seat 7 is slidably connected in the limiting groove 6, a motor is fixed to the bottom of the slide seat 7 by bolts, a cutting blade 8 is fixed to one end of the motor output shaft by bolts, a driving component is provided on the top of the slide 5, so that the slide seat 7 moves up and down along the limiting groove 6, a plug-in component is provided on one side of the slide 5, so that the slide 5 is fixed, two fixed seats 10 are fixed to the upper surface of the base plate 1 by bolts, a bidirectional threaded rod 15 is rotatably connected between the two fixed seats 10, and the bidirectional threaded rod Both ends of 15 pass through the fixed seat 10, the circumferential outer wall of the bidirectional threaded rod 15 is threadedly connected with a slide plate 11, and a clamping block 12 is fixed to one side of the slide plate 11 by bolts. A guide component for horizontally moving the slide plate 11 is provided between the two fixed seats 10. By rotating the bidirectional threaded rod 15, the bidirectional threaded rod 15 will drive the two slide plates 11 to move horizontally toward each other under the action of the guide component, and the two slide plates 11 will drive the two clamping blocks 12 to move, so that the clamping blocks 12 clamp and fix the semiconductor material, thereby clamping and fixing semiconductor materials of different sizes, improving the cutting quality and improving the use effect of the cutting mechanism.

[0023] The plug-in assembly includes a fixed block 16, which is welded to one side of the slide 5 near the bottom. A sliding opening is provided on the top of the fixed block 16, and a plug rod 17 is slidably connected in the sliding opening. A plurality of sockets 2 are provided on the upper surface of the base plate 1, and the plug rod 17 is plugged into the socket 2. A spring 18 is welded on the upper surface of the fixed block 16, and the spring 18 is fixed to the plug rod 17. When the plug rod 17 is pulled to move upward, the plug rod 17 will stretch the spring 18 and disengage from the socket 2. At this time, the slide 5 can be moved along the slide groove 3 to adjust the cutting position of the semiconductor material. When the slide 5 moves to the appropriate position, the plug rod 17 is released. At this time, the plug rod 17 will move downward under the action of the spring 18 and gravity and be inserted into the corresponding socket 2, thereby fixing the position of the slide 5.

[0024] In the utility model, the driving assembly includes a reduction motor, which is fixed to the top of the slide 5 by bolts. One end of the reduction motor output shaft passes through the slide 5 and is fixed with a screw rod 9 by bolts. The screw rod 9 passes through the slide seat 7 and is threadedly connected to the slide seat 7. A connecting plate 4 is welded on one side of the slide 5, and the screw rod 9 is rotatably connected to the connecting plate 4. The reduction motor drives the screw rod 9 to rotate, and the screw rod 9 will drive the slide seat 7 to move downward along the limit groove 6. The slide seat 7 will drive the motor and the cutting blade 8 to move downward, so that the cutting blade 8 cuts the semiconductor material. The guiding component is a support rod 14, which is fixed between two fixed seats 10 by bolts. The support rod 14 passes through the slide plate 11, and the slide plate 11 will move along the support rod 14, so that the slide plate 11 moves horizontally. A rubber pad 13 is bonded to one side of the clamping block 12, and the rubber pad 13 is the same length as the clamping block 12. The rubber pad 13 can prevent the clamping block 12 from damaging the surface of the semiconductor material.

[0025] Working principle: when it is needed, rotate the bidirectional threaded rod 15, the bidirectional threaded rod 15 will drive the two slides 11 to move horizontally toward each other along the support rod 14, the two slides 11 will drive the two clamping blocks 12 to move, so that the clamping blocks 12 can clamp and fix the semiconductor material, so that semiconductor materials of different sizes can be clamped and fixed, thereby improving the quality of cutting and the use effect of the cutting mechanism, and then pull the insertion rod 17 to move upward, the insertion rod 17 will stretch the spring 18 and disengage from the socket 2, at this time, the slide 5 can be moved along the slide groove 3 to adjust the cutting position of the semiconductor material, when the slide 5 moves to the appropriate position, release the insertion rod 17, at this time, the insertion rod 17 will move downward under the action of the spring 18 and gravity and be inserted into the corresponding socket 2, thereby fixing the position of the slide 5, and then the reduction motor drives the screw rod 9 to rotate, the screw rod 9 will drive the slide 7 to move downward along the limit groove 6, the slide 7 will drive the motor and the cutting blade 8 to move downward, so that the cutting blade 8 cuts the semiconductor material.

[0026] The present invention has been described through the above-mentioned embodiments. Those skilled in the art will appreciate that the present invention is not limited to the above-mentioned embodiments, and more modifications may be made according to the teachings of the present invention. These modifications are all within the scope of protection claimed by the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A material cutting mechanism, comprising a base plate (1), characterized in that: The upper surface of the bottom plate (1) is provided with a slide groove (3), a slide (5) is slidably connected in the slide groove (3), a limiting groove (6) is provided on one side of the slide (5), a slide seat (7) is slidably connected in the limiting groove (6), a motor is fixedly connected to the bottom of the slide seat (7), and a cutting blade (8) is fixedly connected to one end of the motor output shaft, a driving component is provided on the top of the slide (5) to enable the slide seat (7) to move up and down along the limiting groove (6), and an insertion component is provided on one side of the slide (5) to enable the slide (7) to move up and down along the limiting groove (6). 5) is fixed, the upper surface of the base plate (1) is fixedly connected to two fixing seats (10), a bidirectional threaded rod (15) is rotatably connected between the two fixing seats (10), and both ends of the bidirectional threaded rod (15) pass through the fixing seats (10), a slide plate (11) is threadedly connected to the circumferential outer wall of the bidirectional threaded rod (15), a clamping block (12) is fixedly connected to one side of the slide plate (11), and a guide component for enabling the slide plate (11) to move horizontally is provided between the two fixing seats (10).

2. A material cutting mechanism according to claim 1, characterized in that: The driving assembly comprises a reduction motor, which is fixedly connected to the top of the slide (5); one end of the reduction motor output shaft passes through the slide (5) and is fixedly connected to a screw rod (9); the screw rod (9) passes through the slide (7) and is threadedly connected to the slide (7).

3. A material cutting mechanism according to claim 2, characterized in that: A connecting plate (4) is fixedly connected to one side of the slide (5), and a screw rod (9) is rotatably connected to the connecting plate (4).

4. A material cutting mechanism according to claim 1, characterized in that: The plug-in assembly comprises a fixed block (16), the fixed block (16) being fixedly connected to a side of the slide frame (5) near the bottom, a sliding opening being provided at the top of the fixed block (16), an insert rod (17) being slidably connected in the sliding opening, a plurality of sockets (2) being provided on the upper surface of the base plate (1), and the insert rod (17) being plugged into the sockets (2).

5. A material cutting mechanism according to claim 4, characterized in that: A spring (18) is fixedly connected to the upper surface of the fixed block (16), and the spring (18) is fixed to the insertion rod (17).

6. A material cutting mechanism according to claim 1, characterized in that: The guide component is a support rod (14), the support rod (14) is fixedly connected between two fixed seats (10), and the support rod (14) passes through the slide plate (11).

7. A material cutting mechanism according to claim 1, characterized in that: A rubber pad (13) is fixedly connected to one side of the clamping block (12), and the rubber pad (13) is of the same length as the clamping block (12).

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