Pick-up mechanism for IC chips

Abstract

The utility model discloses a pick-up mechanism used for an IC chip, which is characterized in that pick-up clamps and an infrared sensor are arranged, the infrared sensor senses the chip, a pair of pick-up clamps are communicated with a chip suction nozzle to move in opposite directions, and the picked-up IC chip is sucked, supported and positioned. The problem that due to the fact that a single suction structure is prone to incomplete suction, an IC chip falls off is effectively solved, and the problem that the IC chip is prone to falling off after being picked up is solved. By arranging the chip suction nozzles, the pair of chip suction nozzles perform adsorption positioning at the outer end of the chip, so that the IC chip is more stable in the picking work; a positioning clamp and an anti-falling piece are arranged, so that chips of different specifications can be positioned through position adjustment, the chips are positioned in cooperation with the anti-falling piece, and the problem that picking is unstable due to the fact that the chips deviate in the picking process is solved; and the guide block is arranged, and the guide block can be driven under the acting force of the rotating screw rod, so that the guide block can conveniently drive the positioning clamp to adjust the position to position the chip.

Description

Technical Field

[0001] The utility model relates to the field of IC chip picking, in particular to a picking mechanism for IC chips. Background Art

[0002] Picking up IC chips is an important process in IC chip production and preparation. Chips are products formed by different types of integrated circuits or a single type of integrated circuit. Therefore, it is very important to ensure the quality of IC chips during production and preparation.

[0003] Chinese patent authorization application number: CN201410593412.0 provides a chip picking device. The scheme sets up a picking box and a picking tube. The air pump in the picking box transmits gas through the gas pipe, which can output or input gas into the picking tube, making it convenient for the suction cup to pick up the semiconductor chip, and the suction cup will not cause damage to the semiconductor chip.

[0004] The existing IC chip picking device has certain drawbacks when in use. First, the IC chip picking device mostly uses a suction cup to directly adsorb and pick up the chip during the suction process. This results in the chip not being in complete contact with the suction piece when being picked up, and it is easy to fall off, resulting in reduced picking stability. For this reason, we propose a picking mechanism for IC chips. Utility Model Content

[0005] In order to overcome the deficiencies of the prior art, the purpose of the utility model is to provide a picking mechanism for IC chips, which provides a picking clamp and an infrared sensor, the infrared sensor senses the chip, and a pair of picking clamps connect the chip suction nozzle and move in relative directions to suck and support the picked IC chip for positioning, effectively avoiding the problem that a single suction structure is prone to incomplete adsorption, resulting in the IC chip falling off, and is used to solve the problem that the IC chip is easy to fall off when picked up; by providing a chip suction nozzle, a pair of chip suction nozzles are adsorbed and positioned at the outer end of the chip, making the IC chip more stable during the picking work; by providing a positioning clamp and an anti-slip sheet, the position can be adjusted to position chips of different specifications, and the chip can be positioned in conjunction with the anti-slip sheet to prevent the chip from offsetting during the picking process, resulting in the problem of unstable picking; a guide block is provided, and the guide block can be driven under the action of the rotating screw, so that the guide block can conveniently drive the positioning clamp to adjust the position and position the chip.

[0006] The above technical objectives of the utility model are achieved through the following technical solutions:

[0007] A picking mechanism for IC chips, comprising a main body mechanism, an inner end of the main body mechanism is provided with a receiving mechanism, and a picking structure is slidably connected to the upper part of the receiving mechanism;

[0008] The picking structure includes a support frame, which is in an L-shaped structure. A telescopic rod is installed at the bottom end of the support frame. The transmission end of the telescopic rod is fixedly connected to an adjustment frame. A driving assembly is installed at the inner end of the adjustment frame. A picking clamp is installed at the lower end of the driving assembly. The picking clamp is in an L-shaped structure. An infrared sensor is installed at the lower end of the adjustment frame. A connecting pump is installed at the outer end of the picking clamp.

[0009] By installing a pickup clamp and an infrared sensor, the problem of incomplete adsorption caused by a single suction structure, which leads to the IC chip falling off, can be effectively avoided. In addition, the device structures are convenient to cooperate with each other, so that the IC chip picking mechanism can easily locate and pick up chips of different specifications.

[0010] Furthermore, an outer end of the connecting pump is fixedly connected to an air extraction component, and a front end of the air extraction component is fixedly connected to a chip suction nozzle.

[0011] By installing a chip nozzle, the IC chip can be more stable during the picking process.

[0012] Furthermore, a guide groove is provided at the outer end of the driving assembly, and the guide groove is located at the inner end of the adjusting frame.

[0013] By installing the guide groove, the drive assembly can be more stable when the operation adjustment drives the pick-up clamp to move.

[0014] Furthermore, the main body mechanism includes an operating table, and a mounting frame is installed on the upper end of the operating table, and the mounting frames are symmetrically distributed.

[0015] By installing the mounting frame, the mounting frame can form a connection structure outside the receiving mechanism, making the overall structure of the receiving mechanism more stable in use.

[0016] Furthermore, a connecting frame is installed at the inner end of each of the mounting frames, a controller is movably connected below the connecting frame, and the controller is located at the outer end of the operating table.

[0017] By installing the connecting frame, the connecting frame can form a connecting structure outside the operating frame, so that the connection between the operating frame and the overall structure of the device is more stable during the clamping process.

[0018] Furthermore, an operating frame is installed at the inner end of the connecting frame, and the operating frame is in a U-shaped structure. The inner end of the operating frame is slidably connected with evenly distributed positioning clips, the outer ends of the positioning clips are fixedly connected with anti-dropping plates, and the outer end of the operating frame is installed with a driving member.

[0019] By installing the positioning clip and the anti-drop sheet, the chip can be prevented from being offset during the picking process, which may cause the problem of unstable picking, thereby improving the success rate of the picking of the device.

[0020] Furthermore, a screw rod is fixedly connected to the transmission end of the driving member, and the outer end of the screw rod is sleeved with evenly distributed guide blocks, and the outer end of the guide block is provided with a sliding groove.

[0021] By installing the guide block, the guide block can conveniently drive the positioning clamp to adjust the position of the positioning chip.

[0022] Furthermore, an air pump is movably connected to the rear of the slide slot, the air pump is located at the outer end of the mounting frame, an extraction pipe is fixedly connected to the outer end of the air pump, a receiving rod is installed at the front end of the extraction pipe, and a suction cup is installed at the front end of the receiving rod.

[0023] By installing the suction cup, the positioning clamp cooperates with multiple suction cups at the rear to form a multi-structure positioning on the outside of the chip, making the positioning of the IC chip more stable during the picking operation.

[0024] In summary, the utility model has the following beneficial effects:

[0025] 1. By setting a picking clamp and an infrared sensor, when the device is picking up, the infrared sensor senses the chip, and the controller controls the drive component to start. The drive component is composed of a motor, a screw rod and a sleeve block, which can allow a pair of picking clamps to connect the chip suction nozzle to move in relative directions, absorb and support the picked IC chip, effectively avoiding the problem of incomplete adsorption caused by a single suction structure, resulting in the IC chip falling off, and the device structure is convenient to cooperate, so that the IC chip picking mechanism can realize convenient positioning and picking of chips of different specifications;

[0026] 2. By setting up a chip suction nozzle, a pair of chip suction nozzles can cooperate with the vacuum component to perform suction work, and adsorb and position the outer end of the chip, making the IC chip more stable during the picking work;

[0027] 3. By setting the positioning clip and the anti-drop sheet, the inner end of the U-shaped operating frame is slid with multiple positioning clips, which allows the inner end of the operating frame to form multiple positioning spaces. When the driving part is started, the positioning clip can be adjusted to position chips of different specifications. With the anti-drop sheet positioning chip, the device can position multiple chips during the picking process, preventing the chip from offsetting during the picking process, resulting in unstable picking, and improving the success rate of the device picking;

[0028] 4. By setting a guide block, the guide block can be driven under the force of the rotating screw, and the outside of the screw is provided with threads set in opposite directions, so that the guide block can easily drive the positioning clamp to adjust the position of the positioning chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1Schematic diagram of the overall structure of this embodiment;

[0030] Figure 2 is a structural schematic diagram of the picking structure plane in this embodiment;

[0031] Figure 3 In this embodiment Figure 2 A schematic diagram of the structure with an enlarged plane at point A;

[0032] Figure 4 It is a schematic diagram of the three-dimensional structure of the operating frame in this embodiment;

[0033] Figure 5 In this embodiment Figure 4 Schematic diagram of the three-dimensional enlarged structure at point B in the middle.

[0034] In the figure, 1. main body mechanism; 101. operating table; 102. mounting frame; 103. connecting frame; 104. controller; 2. receiving mechanism; 201. operating frame; 202. positioning clamp; 203. anti-drop sheet; 204. driving member; 205. screw; 206. guide block; 207. slide groove; 208. vacuum pump; 209. extraction tube; 210. receiving rod; 211. suction cup; 3. picking structure; 301. supporting frame; 302. telescopic rod; 303. adjusting frame; 304. driving assembly; 305. picking clamp; 306. infrared sensor; 307. connecting pump; 308. vacuum assembly; 309. chip suction nozzle; 310. guide groove. DETAILED DESCRIPTION

[0035] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0036] The same parts are denoted by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the drawings, and the words "bottom" and "top", "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0037] Reference Figure 1-5 As shown, a pickup mechanism for IC chips in a preferred embodiment of the utility model comprises a main body mechanism 1, a receiving mechanism 2 is installed at the inner end of the main body mechanism 1, and a pickup structure 3 is slidably connected to the upper side of the receiving mechanism 2;

[0038] The picking structure 3 includes a support frame 301, which is in an L-shaped structure. A telescopic rod 302 is installed at the bottom end of the support frame 301. The transmission end of the telescopic rod 302 is fixedly connected to an adjusting frame 303. A driving assembly 304 is installed at the inner end of the adjusting frame 303. A picking clamp 305 is installed at the lower end of the driving assembly 304. The picking clamp 305 is in an L-shaped structure. An infrared sensor 306 is installed at the lower end of the adjusting frame 303. A connecting pump 307 is installed at the outer end of the picking clamp 305.

[0039] Reference Figure 2-3 As shown, further, the outer end of the connection pump 307 is fixedly connected to a vacuum component 308 , and the front end of the vacuum component 308 is fixedly connected to a chip suction nozzle 309 .

[0040] Reference Figure 3 As shown, further, a guide groove 310 is opened at the rear of the outer end of the driving assembly 304 , and the guide groove 310 is located at the inner end of the adjustment frame 303 .

[0041] By installing the picking clamp 305 and the infrared sensor 306, when the device performs the picking work, the infrared sensor 306 senses the chip, and the controller 104 controls the driving component 304 to start. The driving component 304 is composed of a motor, a screw rod and a sleeve block, which can allow a pair of picking clamps 305 to connect the chip suction nozzle 309 to move in relative directions, absorb and support the picked IC chip, and a pair of chip suction nozzles 309 can cooperate with the vacuum component 308 to perform the suction work, so that the IC chip is more stable during the picking work, and effectively avoids the problem that a single suction structure is prone to incomplete adsorption, resulting in the IC chip falling off. In addition, the device structures are convenient to cooperate with each other, so that the IC chip picking mechanism can realize convenient positioning and picking of chips of different specifications.

[0042] Reference Figure 1 As shown, further, the main body mechanism 1 includes an operating table 101, and a mounting frame 102 is installed on the upper end of the operating table 101, and the mounting frame 102 is symmetrically distributed.

[0043] Reference Figure 1 As shown, further, a connecting frame 103 is installed at the inner end of the mounting frame 102 , and a controller 104 is movably connected below the connecting frame 103 , and the controller 104 is located at the outer end of the operating table 101 .

[0044] By installing the mounting frame 102, the mounting frame 102 can form a connection structure outside the receiving mechanism 2, so that the overall structure of the receiving mechanism 2 is more stable in use.

[0045] Reference Figure 1 and Figure 4As shown, further, an operating frame 201 is installed at the inner end of the connecting frame 103, and the operating frame 201 is a U-shaped structure. The inner end of the operating frame 201 is slidably connected with evenly distributed positioning clips 202, and the outer ends of the positioning clips 202 are fixedly connected with anti-slip sheets 203, and the outer ends of the operating frame 201 are installed with a driving member 204.

[0046] Reference Figure 4-5 As shown, further, the transmission end of the driving member 204 is fixedly connected with a screw rod 205 , the outer end of the screw rod 205 is sleeved with evenly distributed guide blocks 206 , and the outer end of the guide block 206 is provided with a slide groove 207 .

[0047] Reference Figure 4-5 As shown, further, the rear of the slide 207 is movably connected with an air pump 208, the air pump 208 is located at the outer end of the mounting frame 102, the outer end of the air pump 208 is fixedly connected with an extraction pipe 209, the front end of the extraction pipe 209 is installed with a receiving rod 210, and the front end of the receiving rod 210 is installed with a suction cup 211

[0048] By installing the positioning clamps 202 and the anti-slip sheets 203, a plurality of positioning clamps 202 are slidably arranged at the inner end of the U-shaped operating frame 201, and the guide block 206 can be driven under the action of the rotating screw 205. The outer portion of the screw 205 is provided with threads arranged in opposite directions, so that the guide block 206 can conveniently drive the positioning clamps 202 to adjust the position and position the chip. This allows a plurality of positioning spaces to be formed at the inner end of the operating frame 201, and the anti-slip sheets 203 are used to position the chip, so that the device can position a plurality of chips during the picking process, thereby preventing the chip from being offset during the picking process, resulting in unstable picking, and improving the success rate of the picking by the device.

[0049] Specific implementation process: start the driving member 204, the driving member 204 drives the screw rod 205 to rotate, and the guide block 206 can be transmitted under the action of the rotating screw rod 205. The outer side of the screw rod 205 is provided with threads arranged in opposite directions, so that the guide block 206 can easily drive the positioning clamp 202 to adjust the position. At this time, a plurality of positioning clamps 202 are slidably arranged at the inner end of the U-shaped operating frame 201, which forms a plurality of positioning spaces at the inner end of the operating frame 201. The positioning clamp 202 can be adjusted to position chips of different specifications, and cooperate with the anti-slip sheet 203 to position the chip, so that the device can position multiple chips during the picking process to prevent the chip from offsetting during the picking process, resulting in unstable picking.

[0050] The telescopic rod 302 is then started to extend and retract, driving the picking clamp 305. The infrared sensor 306 senses the chip, and the controller 104 controls the driving component 304 to start. The driving component 304 is composed of a motor, a screw and a sleeve block, which can allow a pair of picking clamps 305 to connect the chip suction nozzle 309 and move in relative directions. The pair of chip suction nozzles 309 can cooperate with the vacuum component 308 to perform suction work, so that the IC chip is more stable during the picking work. The picking clamp 305 absorbs and supports the positioning of the picked IC chip, effectively avoiding the problem that a single suction structure is prone to incomplete adsorption, resulting in the IC chip falling off. In addition, the device structures are convenient to cooperate with each other, so that the IC chip picking mechanism can easily position and pick up chips of different specifications.

[0051] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A pickup mechanism for IC chips, characterized in that: It comprises a main body mechanism (1), a receiving mechanism (2) is installed at the inner end of the main body mechanism (1), and a picking structure (3) is slidably connected above the receiving mechanism (2); The picking structure (3) comprises a support frame (301), the support frame (301) is in an L-shaped structure, a telescopic rod (302) is installed at the bottom end of the support frame (301), the transmission end of the telescopic rod (302) is fixedly connected to an adjustment frame (303), a driving component (304) is installed at the inner end of the adjustment frame (303), a picking clamp (305) is installed at the lower end of the driving component (304), the picking clamp (305) is in an L-shaped structure, an infrared sensor (306) is installed at the lower end of the adjustment frame (303), and a connecting pump (307) is installed at the outer end of the picking clamp (305).

2. A pickup mechanism for IC chips according to claim 1, characterized in that: The outer end of the connecting pump (307) is fixedly connected to a vacuum assembly (308), and the front end of the vacuum assembly (308) is fixedly connected to a chip suction nozzle (309).

3. A pickup mechanism for IC chips according to claim 1, characterized in that: A guide groove (310) is formed at the outer end of the driving assembly (304), and the guide groove (310) is located at the inner end of the adjustment frame (303).

4. A pickup mechanism for IC chips according to claim 1, characterized in that: The main body mechanism (1) comprises an operating table (101), a mounting frame (102) is mounted on the upper end of the operating table (101), and the mounting frames (102) are symmetrically distributed.

5. A pickup mechanism for IC chips according to claim 4, characterized in that: A connecting frame (103) is installed at the inner end of each of the mounting frames (102), and a controller (104) is movably connected below the connecting frame (103), and the controller (104) is located at the outer end of the operating table (101).

6. A pickup mechanism for IC chips according to claim 5, characterized in that: An operating frame (201) is installed at the inner end of the connecting frame (103), the operating frame (201) is in a U-shaped structure, the inner end of the operating frame (201) is slidably connected to evenly distributed positioning clips (202), the outer ends of the positioning clips (202) are fixedly connected to anti-dropping sheets (203), and the outer end of the operating frame (201) is installed with a driving member (204).

7. A pickup mechanism for IC chips according to claim 6, characterized in that: The transmission end of the driving member (204) is fixedly connected with a screw rod (205), the outer end of the screw rod (205) is sleeved with evenly distributed guide blocks (206), and the outer end of the guide block (206) is provided with a slide groove (207).

8. A pickup mechanism for IC chips according to claim 7, characterized in that: An air pump (208) is movably connected to the rear of the slide groove (207), and the air pump (208) is located at the outer end of the mounting frame (102). An extraction pipe (209) is fixedly connected to the outer end of the air pump (208), and a receiving rod (210) is installed at the front end of the extraction pipe (209), and a suction cup (211) is installed at the front end of the receiving rod (210).

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