Plating bath structure for solar cell

Abstract

The utility model discloses a plating bath structure for a solar cell, which comprises a plating bath body, a plating reaction tank and a pinch point type carrier, an operation side track is arranged in the plating bath body, is connected to a bottom track fixing plate through a track connecting plate and is arranged on the operation side of the plating bath body; a non-operation side track is arranged on the other side corresponding to the operation side track, and a wheel piece type rolling wheel is installed between the operation side track and the non-operation side track. The electroplating reaction tank is a closed reaction tank composed of a front lower partition plate, a front adjusting partition plate, a front upper adjusting partition plate, a rear lower partition plate, a rear adjusting partition plate, a rear upper adjusting partition plate, a reaction tank bottom plate, an operation side track and a non-operation side track, and an upper anode titanium mesh and a lower anode titanium mesh are closely arranged in the electroplating reaction tank at certain intervals. And the connecting copper bars are respectively connected with the positive electrode of the rectification power supply. The clamping point type carrier electroplating mode is adopted, a stable groove body structure is adopted, the electroplating uniformity is good, and batch automation can be achieved conveniently.

Description

Technical Field

[0001] The utility model relates to the field of electroplating equipment, in particular to a plating tank structure used for solar cell sheets. Background Art

[0002] At present, the electroplating process of solar cells mainly adopts VCP electroplating equipment. The existing VCP electroplating equipment has the problems of large size, large water consumption, difficulty in realizing batch automation production, high manufacturing and maintenance costs. With the continuous expansion and development of the scale of the solar cell industry, the existing VCP electroplating equipment is not conducive to achieving high output, low energy consumption, and easy to realize batch automation. At this stage, major photovoltaic companies are increasing their research and development efforts on horizontal electroplating equipment, hoping to replace the existing VCP electroplating equipment with horizontal electroplating equipment to make up for the problems of large size, large water consumption, difficulty in realizing batch automation production, high manufacturing and maintenance costs of VCP electroplating equipment. At present, photovoltaic horizontal electroplating equipment is still mainly in the research and development test stage, and the technology has not yet achieved full maturity and mass production. At the current research and development stage, the horizontal electroplating equipment uses the battery cell to be driven forward to each electroplating process tank by a roller, and the cathode conduction method is mainly the way in which the upper and lower conductive rollers or the upper and lower conductive brushes contact the grid line of the battery cell, so that the output of the horizontal electroplating equipment is not conducive to a substantial increase, and the battery grid line has poor uniformity, low contact stability, and serious damage to the battery cell.

[0003] Horizontal electroplating equipment is widely recognized in the industry for its advantages such as low cost, high production capacity, and ease of batch automation. This patent provides a plating tank structure for solar cells, which will largely solve the problems encountered in current electroplating production. Utility Model Content

[0004] In view of the above problems, the utility model provides a plating tank structure for solar cells which adopts a clamping-point carrier electroplating method, has a stable tank structure, and has good electroplating uniformity.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is: a plating tank structure for solar cell sheets, including a plating tank body, a plating reaction tank and a clamping point carrier, an operating side track is arranged in the plating tank body, which is connected to the bottom track fixing plate through a track connecting plate and installed on the operating side of the plating tank body, a non-operating side track is arranged on the other side corresponding to the operating side track, and the non-operating side track is fixed on the rear side plate of the plating tank body, a wheel-type roller is installed between the operating side track and the non-operating side track, the plating reaction tank is composed of a front lower partition, a front adjustment partition, a front upper adjustment partition, a rear lower partition, a rear adjustment partition, a rear upper adjustment partition, a reaction tank bottom plate, an operating side track and a non-operating side track to form a closed reaction tank, the A front solid grooved upper roller and a front solid lower roller are arranged at the front lower partition of the electroplating reaction tank, and a rear solid grooved upper roller and a rear solid lower roller are arranged at the rear lower partition. The groove positions on the front solid grooved upper roller and the rear solid grooved upper roller correspond to the guide column positions on the clamp-type carrier, and left limit rollers and right limit rollers are evenly distributed on the left and right sides of the clamp-type carrier. A capacity reduction box is arranged at the bottom of the electroplating reaction tank. The plating solution in the electroplating reaction tank is vertically sprayed toward the battery cell through the upper nozzle and the lower nozzle via the filter. A nozzle protective cover is provided at the upper nozzle, and the lower nozzle is fixed on both sides of the capacity reduction box. An upper anode titanium mesh and a lower anode titanium mesh are closely arranged at a certain interval in the electroplating reaction tank, and are respectively connected to the positive electrode of the rectifier power supply through a connecting copper bus.

[0006] Furthermore, the operating side rail is arranged at a certain distance from the front side plate of the electroplating tank body.

[0007] Furthermore, a liquid level meter is provided on the outer side of the rear side plate of the electroplating tank body and is connected to the electroplating reaction tank to monitor the plating solution level in the tank.

[0008] Furthermore, a waste gas outlet is provided on the top of the electroplating tank body and is connected to a factory waste gas treatment terminal.

[0009] Furthermore, an inclined electroplating tank bottom plate is provided at the bottom of the electroplating tank body. The plating solution overflowing from the electroplating reaction tank flows to the reflux port and enters the electroplating sub-tank, and is then sprayed out to the electroplating reaction tank through the nozzle by the filter, thereby being recycled.

[0010] Furthermore, a pneumatic ball valve is also provided on the bottom plate of the reaction tank for draining residual plating solution during daily cleaning and maintenance.

[0011] Furthermore, a supporting device is provided in the middle of the wheel-type roller and is fixed to the bottom of the electroplating reaction tank.

[0012] Furthermore, the upper nozzle and the lower nozzle are both provided with a manual ball valve for adjusting the flow rate in the nozzle, and a flow meter for monitoring the real-time value of the flow rate.

[0013] Furthermore, a solid upper roller with grooves and a solid lower roller for feeding are arranged at the feeding port of the electroplating reaction tank, and a solid upper roller with grooves and a solid lower roller for discharging are arranged at the discharging port.

[0014] Furthermore, the roller systems in the electroplating reaction tank are connected to the transmission power through the spiral gear transmission system for rotational transmission, thereby driving the clamping point carrier to be smoothly transmitted to each process tank body.

[0015] From the above description of the structure of the utility model, it can be seen that compared with the prior art, the utility model has the following advantages:

[0016] 1. The clamp-type carrier electroplating method is adopted. On the one hand, the clamp-type carrier is driven forward by contact on the roller. This method avoids the problem that the battery cell is directly in contact with the roller and is easily damaged by the roller, and solves the disadvantages of VCP electroplating equipment such as high water consumption, difficulty in realizing mass automated production, high manufacturing and maintenance costs. At the same time, since the clamp-type carrier adopts an elastic device to contact the battery cell grid line, the negative electrode of the rectifier power supply is connected to the carrier through the conductive device fixed in the slot body and is transmitted to the battery cell grid line, so that the battery cell and the negative electrode of the rectifier power supply are in contact with each other and are conductive, which is more conducive to the film formation yield of the battery cell.

[0017] 2. The electroplating tank adopts a connected electroplating tank, and multiple anode titanium meshes are closely arranged and fixed in the electroplating tank above and below the roller, avoiding the empty plating area without electric line distribution formed during the electroplating process, resulting in oxidation of the copper at the bottom of the battery cell and poor plating uniformity. During the electroplating process, in order to ensure better uniformity of the plating surface, spray nozzles are arranged at a certain interval above and below the roller of the plating tank, so that the plating solution can flow vertically to the battery panel surface freshly, which better supplements the number of metal ions on the cathode coating, is conducive to the uniform distribution of the electroplating layer, and adopts a wide tank body, which realizes the increase of output to a greater extent and facilitates automated production. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0019] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0020] Figure 2 It is a side structural schematic diagram of the utility model. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0022] Example

[0023] refer to Figure 1 , Figure 2A plating tank structure for solar cells, comprising a plating tank body 1, a plating reaction tank 2 and a clamping point carrier 14, wherein an operating side track 6 is arranged in the plating tank body 1, connected to a bottom track fixing plate 4 through a track connecting plate 5 and installed on the operating side of the plating tank body, the operating side track 6 is arranged at a certain distance from a front side plate 7 of the plating tank body 1, so as to facilitate the installation and maintenance of a transmission system in the future, a non-operating side track 8 is arranged on the other side corresponding to the operating side track 6, and the non-operating side track 8 is fixed on a rear side plate 9 of the plating tank body 1, a wheel-type roller 27 is installed between the operating side track 6 and the non-operating side track 8, the plating reaction tank 2 is composed of a front lower partition plate 19, The front adjustment partition 20, the front upper adjustment partition 21, the rear lower partition 31, the rear adjustment partition 32, the rear upper adjustment partition 33, the reaction tank bottom plate 13, the operating side track 6 and the non-operating side track 8 constitute a closed reaction tank, the front lower partition 19 of the electroplating reaction tank 2 is provided with a front solid grooved upper roller 22 and a front solid lower roller 23, and the rear lower partition 31 is provided with a rear solid grooved upper roller 34 and a rear solid lower roller 35. When the clamping point carrier 14 passes through, the front solid grooved upper roller 22 and the rear solid grooved upper roller 34 are respectively lifted, and when the clamping point carrier 14 does not pass through, the front solid grooved upper roller 22 and the rear solid grooved upper roller 34 are respectively The bottom of the electroplating reaction tank 2 is provided with a volume reduction box 30 for reducing the volume in the electroplating reaction tank 2, so that the plating solution can not pass the upper anode titanium mesh 26 position in a shorter time and reduce the consumption of the plating solution. The plating solution in the electroplating reaction tank 2 passes through the upper nozzle 24 and the lower nozzle through the filter. The tube 29 sprays vertically toward the battery cell, and a nozzle protective cover 41 is provided at the upper nozzle 24 to protect the plating solution sprayed from the nozzle from splashing. The lower nozzle 29 is fixed on both sides of the reduction box 30. The upper anode titanium mesh 26 and the lower anode titanium mesh 25 are closely arranged at a certain interval in the electroplating reaction tank 2, and are respectively connected to the positive electrode of the rectifier power supply through the connecting copper bus. When the clamp-type carrier 14 enters the electroplating reaction tank, the elastic cathode conductive device on the clamp-type carrier 14 is connected by sliding contact with the guide rail fixed in the electroplating reaction tank 2, and the guide rail is connected to the negative electrode of the rectifier power supply, so that the battery cell is connected to conduction through the elastic conductive sheet on the clamp-type carrier 14 to carry out the electroplating reaction.

[0024] A liquid level gauge 10 is provided on the outer side of the rear side plate 9 of the electroplating tank body 1 and is connected to the electroplating reaction tank 2 to monitor the plating liquid level in the tank. An exhaust port 40 is provided on the top of the electroplating tank body 1 and is connected to the factory waste gas treatment end. An inclined electroplating tank bottom plate 16 is provided at the bottom of the electroplating tank body 1 to effectively prevent a large amount of plating liquid from remaining at the bottom of the tank when the machine is shut down, and a bottom reflux port is provided to be connected to the electroplating sub-tank. The plating liquid overflowing from the electroplating reaction tank 2 flows to the reflux port and then enters the electroplating sub-tank, and is then sprayed out by the filter through the nozzle to the electroplating reaction tank 2 for recycling.

[0025] Since the electroplating tank 1 adopts multi-row battery cells to be electroplated simultaneously, the overall width of the tank is wider and the length of the wheel-type roller 27 is longer. In order to prevent the wheel-type roller 27 from bending and deformation due to its large span, a supporting device 15 is provided in the middle of the wheel-type roller 27 and fixed to the bottom of the electroplating reaction tank 2. A pneumatic ball valve 28 is also provided on the bottom plate 13 of the reaction tank for draining residual plating solution during daily cleaning and maintenance.

[0026] The upper nozzle 24 and the lower nozzle 29 are both provided with a manual ball valve 17 for adjusting the flow rate in the nozzle, and a flow meter 18 for monitoring the instantaneous value of the flow rate.

[0027] The electroplating reaction tank 2 is provided with a solid upper roller 38 with grooves and a solid lower roller 39 at the inlet, and a solid upper roller 36 with grooves and a solid lower roller 37 at the outlet, so as to prevent the plating solution in the electroplating tank body 1 from flowing out to other process equipment, squeeze or block the plating solution on the clamping point carrier 14, prevent the liquid from other process sections from being brought in through the inlet to contaminate the plating solution, and prevent the plating solution from being brought out of the plating tank and affecting subsequent process equipment.

[0028] The roller systems in the electroplating reaction tank 2 are connected to the transmission power through the spiral gear transmission system 3 for rotation transmission, thereby driving the clamping point carrier 14 to be smoothly transmitted to each process tank body.

[0029] The present application adopts a clamping-point carrier electroplating method. On the one hand, the clamping-point carrier is driven forward by contact on the roller, which avoids the problem that the battery cell is directly in contact with the roller and is easily damaged by the roller, and solves the disadvantages of VCP electroplating equipment, such as high water consumption, difficulty in realizing mass automated production, and high manufacturing and maintenance costs. At the same time, since the clamping-point carrier adopts an elastic device to contact the grid line of the battery cell, the negative electrode of the rectifier power supply is connected to the carrier through a conductive device fixed in the tank body and is transmitted to the grid line of the battery cell, so that the stability of the contact and conduction between the battery cell and the negative electrode of the rectifier power supply is high, which is more conducive to the film formation yield of the battery cell. Electroplating The tank body adopts a connected electroplating tank, and multiple anode titanium meshes are closely arranged and fixed in the electroplating tank above and below the roller, avoiding the empty plating area without electric line distribution formed during the electroplating process, resulting in oxidation of the copper at the bottom of the battery cell and poor plating uniformity. During the electroplating process, in order to ensure better uniformity of the plating surface, spray nozzles are arranged at a certain interval above and below the roller of the plating tank, so that the plating solution can flow vertically to the battery panel surface freshly, which better supplements the number of metal ions in the cathode coating, is beneficial to the uniform distribution of the electroplating layer, and the wide tank body is adopted to achieve a greater increase in output and facilitate automated production.

[0030] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A plating tank structure for solar cells, characterized in that: The electroplating tank comprises an electroplating tank body (1), an electroplating reaction tank (2) and a clamping point carrier (14); an operating side track (6) is arranged in the electroplating tank body (1) and is connected to a bottom track fixing plate (4) through a track connecting plate (5) and is installed on the operating side of the electroplating tank body; a non-operating side track (8) is arranged on the other side corresponding to the operating side track (6); the non-operating side track (8) is fixed on a rear side plate (9) of the electroplating tank body (1); the operating side track (6) and the non-operating side track are connected to each other. (8) is provided with a wheel-type roller (27), the electroplating reaction tank (2) is composed of a front lower partition (19), a front adjustment partition (20), a front upper adjustment partition (21), a rear lower partition (31), a rear adjustment partition (32), a rear upper adjustment partition (33), a reaction tank bottom plate (13), an operating side track (6) and a non-operating side track (8) to form a closed reaction tank, and a front solid groove upper track is provided at the front lower partition (19) of the electroplating reaction tank (2) The roller (22) and the front solid lower roller (23), the rear lower partition (31) is provided with a rear solid grooved upper roller (34) and a rear solid lower roller (35), the groove positions on the front solid grooved upper roller (22) and the rear solid grooved upper roller (34) correspond to the guide column positions on the clamping point carrier (14), and the left limiting roller (12) and the right limiting roller (11) are evenly distributed on the left and right sides of the clamping point carrier (14), and the bottom of the electroplating reaction tank (2) is provided with a plurality of rollers (22) and a plurality of rollers (23) at the bottom of the electroplating reaction tank (2). A capacity reduction box (30) is provided, and the plating solution in the electroplating reaction tank (2) is vertically sprayed toward the battery sheet through an upper spray pipe (24) and a lower spray pipe (29) via a filter, and a spray pipe protective cover (41) is provided at the upper spray pipe (24), and the lower spray pipe (29) is fixed on both sides of the capacity reduction box (30). An upper anode titanium mesh (26) and a lower anode titanium mesh (25) are closely arranged at a certain interval in the electroplating reaction tank (2), and are respectively connected to the positive electrode of a rectifier power supply through a connecting copper bar.

2. A plating tank structure for solar cells according to claim 1, characterized in that: A liquid level meter (10) is arranged on the outer side of the rear side plate (9) of the electroplating tank body (1) and is connected to the electroplating reaction tank (2) to monitor the liquid level of the plating solution in the tank.

3. A plating tank structure for solar cells according to claim 1, characterized in that: The top of the electroplating tank (1) is provided with an exhaust gas outlet (40) connected to a factory waste gas treatment terminal.

4. A plating tank structure for solar cells according to claim 1, characterized in that: The bottom of the electroplating tank body (1) is provided with an inclined electroplating tank bottom plate (16); the plating solution overflowing from the electroplating reaction tank (2) flows to the reflux port and enters the electroplating sub-tank, and is then sprayed out by the filter through the nozzle to the electroplating reaction tank (2), thereby being recycled.

5. A plating tank structure for solar cells according to claim 1, characterized in that: A pneumatic ball valve (28) is also provided on the bottom plate (13) of the reaction tank.

6. A plating tank structure for solar cells according to claim 1, characterized in that: A supporting device (15) is provided in the middle of the wheel-type roller (27) and is fixed to the bottom of the electroplating reaction tank (2).

7. A plating tank structure for solar cells according to claim 1, characterized in that: The upper nozzle (24) and the lower nozzle (29) are both provided with a manual ball valve (17) for adjusting the flow rate in the nozzle, and a flow meter (18) for monitoring the instantaneous value of the flow rate.

8. A plating tank structure for solar cells according to claim 1, characterized in that: The electroplating reaction tank (2) is provided with a solid upper grooved roller (38) and a solid lower grooved roller (39) at the inlet, and a solid upper grooved roller (36) and a solid lower grooved roller (37) at the outlet.

9. A plating tank structure for solar cells according to claim 1, characterized in that: The roller systems in the electroplating reaction tank (2) are connected to the transmission power through the helical gear transmission system (3) for rotational transmission, thereby driving the clamping point carrier (14) to be smoothly transmitted to each process tank body.

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