Full-cleaning anti-splashing wafer cleaning equipment

Abstract

The utility model discloses an anti-splashing wafer cleaning device capable of fully cleaning, relates to the technical field of wafers, and aims to solve the problem that water drops splash due to the fact that cleaning water pressure directly strikes an object when an existing wafer cleaning device is used. The first inner cavity is installed in the cleaning device, a connecting pipe is arranged on the upper portion of the interior of the first inner cavity, a connector is arranged on the lower end face of the connecting pipe, a cleaning spray head is arranged on the lower end face of the connector, and an anti-splashing cover is arranged on the circle of the outer wall of the connecting pipe. And one end of the anti-splashing cover is rotationally connected with the outer wall of the connecting pipe through an electric rotating shaft.

Description

Technical Field

[0001] The utility model relates to the technical field of wafers, in particular to fully clean anti-splash wafer cleaning equipment. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. Domestic wafer production lines are mainly 8 inches and 12 inches, and the main processing methods of wafers are sheet processing and batch processing, that is, processing one or more wafers at the same time. As the feature size of semiconductors becomes smaller and smaller, and the processing and measurement equipment becomes more and more advanced, new data characteristics have emerged in wafer processing.

[0003] For example, the announcement number is CN208954954U, and the name of the Chinese authorized patent is (wafer cleaning equipment), including: a cleaning chamber, which is provided with a wafer placement position for placing the wafer to be cleaned, and the wafer placement position can drive the wafer placed on the wafer placement position to rotate to shake off the cleaning liquid on the surface of the wafer; a cleaning liquid receiving tank, which is provided in the cleaning chamber and is used to receive the cleaning liquid shaken off the wafer surface; a jet unit, which is provided at the cleaning liquid receiving tank and can spray gas to form an airflow barrier at the cleaning liquid receiving tank. The airflow barrier generated by the jet unit of the wafer cleaning equipment of the utility model is in non-elastic contact with the cleaning liquid droplets flying out of the centrifuge, and the cleaning liquid droplets will not rebound, but follow the flow direction of the airflow barrier to move into the tank, reducing the possibility of the cleaning liquid splashing back to the wafer to be cleaned and causing defects.

[0004] However, when the existing wafer cleaning is in use, the cleaning water pressure directly hits the object, which may cause water droplets to splash; therefore, it does not meet the existing needs. In this regard, we have proposed a fully clean and splash-proof wafer cleaning equipment. Utility Model Content

[0005] The utility model aims to provide a fully clean anti-splashing wafer cleaning device to solve the problem of water splashing when the cleaning water pressure directly hits the object during the use of the existing wafer cleaning mentioned in the background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a fully clean anti-splash wafer cleaning device, comprising: a cleaning device, an operating mechanism is arranged on the upper end surface of the cleaning device, a display screen is arranged on one side of the front end surface of the operating mechanism, and an operating button is arranged on the other side of the front end surface of the operating mechanism;

[0007] Also includes:

[0008] The first inner cavity is installed inside the cleaning device, a connecting pipe is arranged above the inside of the first inner cavity, a connecting head is arranged on the lower end face of the connecting pipe, the lower end face of the connecting head is used to clean the nozzle, a splash-proof cover is arranged around the outer wall of the connecting pipe, and one end of the splash-proof cover is rotatably connected to the outer wall of the connecting pipe through an electric rotating shaft.

[0009] Preferably, a storage cover is provided at the lower part of the first inner cavity, a reinforcement sleeve is provided on the upper end surface of the storage cover, a placement cover is provided above the reinforcement sleeve, a filter pump is provided on one side of the storage cover, a delivery pipe is provided at one end of the filter pump, and the delivery pipe extends to the outside of the cleaning device.

[0010] Preferably, a second inner cavity is provided inside the display cover, a motor is provided below the second inner cavity, and the motor is fixedly connected to the reinforcement sleeve via a fixing rod.

[0011] Preferably, a central rotating shaft is provided on the upper end surface of the motor, one end of the central rotating shaft passes through and extends into the interior of the motor, and a mounting disk is provided on the other end of the central rotating shaft, and the mounting disk is fixedly connected to the other end of the central rotating shaft.

[0012] Preferably, clamping blocks are provided on both sides of the upper end surface of the mounting plate, and two clamping blocks are provided, and a soft cover is provided on the inner side of the two clamping blocks, and a telescopic spring mechanism is provided inside the soft cover.

[0013] Preferably, an input terminal is provided below the second inner cavity, and one end of the input terminal is installed inside the filter pump.

[0014] Preferably, a door panel is provided on the front end surface of the cleaning device, and two door panels are provided, both of the door panels are rotatably connected to the cleaning device, and both of the front end surfaces of the two door panels are provided with handle rods.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] The utility model uses an anti-splash cover and an electric rotating shaft arranged inside the cleaning device. After the operating mechanism is turned on, cleaning water is sprayed out from the cleaning nozzle through the connecting pipe and the connecting head, and then the motor is turned on, and the rotating central rotating shaft drives the mounting plate to rotate, so that the surface of the wafer can be evenly cleaned. During the cleaning process, the anti-splash cover is flipped downward by the electric rotating shaft to cover the hollow space above the mounting plate. The splashed water droplets will flow back to the inside of the mounting plate again through the anti-splash cover, effectively avoiding the problem of water droplets splashing when the existing wafer cleaning is in use due to the cleaning water pressure directly hitting the object. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the internal structure of the cleaning device of the utility model;

[0019] Figure 3 This is a schematic diagram of the internal structure of the second inner cavity of the utility model;

[0020] Figure 4 It is a schematic diagram of the internal structure of A of the utility model;

[0021] In the figure: 100, cleaning device; 101, door panel; 102, handle bar; 103, first inner cavity; 104, connecting pipe; 105, splash shield; 106, electric shaft; 107, cleaning nozzle; 108, connecting head; 109, display cover; 110, reinforcement sleeve; 111, storage cover; 112, filter pump; 11201, input terminal; 113, delivery pipeline; 200, operating mechanism; 201, display screen; 202, operating button; 300, second inner cavity; 301, motor; 302, fixed rod; 303, central rotating shaft; 304, mounting plate; 30401, clamping block; 30402, software cover; 30403, telescopic spring mechanism. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0023] See also Figure 1-4 The utility model provides an embodiment: a fully clean anti-splash wafer cleaning device, comprising: a cleaning device 100, an operating mechanism 200 is arranged on the upper end surface of the cleaning device 100, a display screen 201 is arranged on one side of the front end surface of the operating mechanism 200, and an operating button 202 is arranged on the other side of the front end surface of the operating mechanism 200;

[0024] Also includes:

[0025] The first inner cavity 103 is installed inside the cleaning device 100, and a connecting pipe 104 is arranged above the inside of the first inner cavity 103, and a connecting head 108 is arranged on the lower end face of the connecting pipe 104, and the lower end face of the connecting head 108 is used to clean the nozzle 107, and a splash-proof cover 105 is arranged around the outer wall of the connecting pipe 104, and one end of the splash-proof cover 105 is rotatably connected to the outer wall of the connecting pipe 104 through an electric rotating shaft 106.

[0026] See also Figure 2A storage cover 111 is arranged at the lower part of the first inner cavity 103, a reinforcement sleeve 110 is arranged on the upper end surface of the storage cover 111, a display cover 109 is arranged above the reinforcement sleeve 110, a filter pump 112 is arranged on one side of the storage cover 111, a delivery pipe 113 is arranged at one end of the filter pump 112, and the delivery pipe 113 extends to the outside of the cleaning device 100.

[0027] See also Figure 3 A second inner cavity 300 is arranged inside the placement cover body 109, and a motor 301 is arranged below the second inner cavity 300. The motor 301 is fixedly connected to the reinforcement sleeve 110 through a fixing rod 302. A central rotating shaft 303 is arranged on the upper end surface of the motor 301. One end of the central rotating shaft 303 passes through and extends into the motor 301. A mounting plate 304 is arranged at the other end of the central rotating shaft 303, and the mounting plate 304 is fixedly connected to the other end of the central rotating shaft 303.

[0028] The setting of the motor 301 can provide the mounting plate 304 with rotational kinetic energy when the device is running.

[0029] See also Figure 3 and Figure 4 , clamping blocks 30401 are provided on both sides of the upper end surface of the mounting plate 304, and there are two clamping blocks 30401, and software covers 30402 are provided on the inner sides of the two clamping blocks 30401, and a telescopic spring mechanism 30403 is provided inside the software covers 30402, and an input terminal 11201 is provided at the lower part of the second inner cavity 300, and one end of the input terminal 11201 is installed inside the filter pump 112.

[0030] The telescopic spring mechanism 30403 provides clamping force for clamping the wafer.

[0031] See also Figure 1 A door panel 101 is disposed on the front end surface of the cleaning device 100 , and two door panels 101 are disposed. Both door panels 101 are rotatably connected to the cleaning device 100 , and both front end surfaces of the two door panels 101 are disposed with handle bars 102 .

[0032] Working principle: When in use, the cleaning water is transported to the operating mechanism 200 through an external pipeline, and the wafer is placed on the mounting plate 304 inside the cover body 109, and then the two clamping blocks 30401 provide clamping force to prevent it from falling off during rinsing. After the operating mechanism 200 is turned on, the cleaning water is sprayed out from the cleaning nozzle 107 through the connecting pipe 104 and the connecting head 108, and then the motor 301 is turned on, and the rotating central rotating shaft 303 drives the mounting plate 304 to rotate, so that the surface of the wafer can be evenly cleaned. During cleaning, the electric rotating shaft 106 flips the splash shield 105 downward to cover the hollow space above the mounting plate 304, and the splashing water droplets will flow back to the inside of the mounting plate 304 through the splash shield 105, and the water inside the second inner cavity 300 will be discharged to the outside of the equipment through the filter pump 112.

[0033] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A fully clean anti-splash wafer cleaning device, comprising a cleaning device (100), an operating mechanism (200) being arranged on the upper end surface of the cleaning device (100), a display screen (201) being arranged on one side of the front end surface of the operating mechanism (200), and an operating button (202) being arranged on the other side of the front end surface of the operating mechanism (200); Features: Also includes: A first inner cavity (103) is installed inside the cleaning device (100); a connecting pipe (104) is arranged above the inside of the first inner cavity (103); a connecting head (108) is arranged on the lower end surface of the connecting pipe (104); a cleaning nozzle (107) is arranged on the lower end surface of the connecting head (108); a splash-proof cover (105) is arranged around the outer wall of the connecting pipe (104); one end of the splash-proof cover (105) is rotatably connected to the outer wall of the connecting pipe (104) via an electric rotating shaft (106).

2. The fully clean anti-splash wafer cleaning equipment according to claim 1, characterized in that: A storage cover (111) is arranged at the lower part of the first inner cavity (103); a reinforcement sleeve (110) is arranged on the upper end surface of the storage cover (111); a placement cover (109) is arranged above the reinforcement sleeve (110); a filter pump (112) is arranged on one side of the storage cover (111); a delivery pipe (113) is arranged at one end of the filter pump (112); and the delivery pipe (113) extends to the outside of the cleaning device (100).

3. The fully clean anti-splash wafer cleaning equipment according to claim 2, characterized in that: A second inner cavity (300) is arranged inside the display cover (109), a motor (301) is arranged below the inside of the second inner cavity (300), and the motor (301) is fixedly connected to the reinforcement sleeve (110) via a fixing rod (302).

4. The fully clean anti-splash wafer cleaning equipment according to claim 3, characterized in that: The upper end surface of the motor (301) is provided with a central rotating shaft (303), one end of the central rotating shaft (303) passes through and extends into the interior of the motor (301), and the other end of the central rotating shaft (303) is provided with a mounting plate (304), and the mounting plate (304) is fixedly connected to the other end of the central rotating shaft (303).

5. The fully clean anti-splash wafer cleaning equipment according to claim 4, characterized in that: Clamping blocks (30401) are provided on both sides of the upper end surface of the mounting plate (304), and two clamping blocks (30401) are provided. The inner sides of the two clamping blocks (30401) are provided with soft sleeves (30402), and the inside of the soft sleeves (30402) is provided with a telescopic spring mechanism (30403).

6. The fully clean anti-splash wafer cleaning equipment according to claim 3, characterized in that: An input terminal (11201) is provided at the lower part of the second inner cavity (300), and one end of the input terminal (11201) is installed inside the filter pump (112).

7. The fully clean anti-splash wafer cleaning equipment according to claim 1, characterized in that: The front end surface of the cleaning device (100) is provided with a door panel (101), and two door panels (101) are provided. Both of the two door panels (101) are rotatably connected to the cleaning device (100), and both of the front end surfaces of the two door panels (101) are provided with a handle bar (102).

Images