Computer mainboard ash removal device

Abstract

The utility model discloses a computer mainboard deashing device, which relates to the technical field of mainboard deashing, and comprises a base, a sealing mechanism and a deashing device, the sealing mechanism is used for sealing the computer mainboard to be dedusted; the dust removal mechanism is used for removing dust on the computer mainboard to be subjected to dust removal; the rotary conveying mechanism is used for carrying out rotary conveying on the computer mainboard to be dedusted; the rotary conveying mechanism comprises a screw rod, a rotary table, a U-shaped back plate, a spring and a clamping block; the screw penetrates through the sealing plate and is in threaded connection with the sealing plate, and the rotating disc is fixedly arranged at the right end of the screw. Compared with the prior art, the dust removal device can carry out more comprehensive dust removal treatment on the computer mainboard, the computer mainboard does not need to be fixed and unfixed for many times, the dust removal process is more coherent, and the dust removal efficiency of the mainboard can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of mainboard cleaning, in particular to a computer mainboard cleaning device. Background Art

[0002] The computer motherboard is one of the most basic and important parts of a computer. Its shape is usually rectangular. After a long period of use, a lot of dust will adhere to its surface, which will affect its heat dissipation performance.

[0003] The utility model patent with patent application publication number CN 212569660 U discloses a computer motherboard cleaning device, including a body, a clamping device and a bottom plate, characterized in that a status light is installed on one side of the top of the body, the bottom of the body is fixedly connected to the bottom block on all sides, an operating platform is provided in the middle part of the body, a clamping device is installed in the middle part of the operating platform, an LED lamp is provided on the top of the clamping device, the LED lamp is fixedly connected to the body, a drive motor is installed inside the body, the drive motor is located in the middle part of the shell, one end of the drive motor is fixedly connected to the fan blade, one end of the fan blade is provided with a protective gauze, the protective gauze is fixedly connected to the body, one end of the shell is fixedly connected to one end of the air pipe, the air pipe is fixedly connected to the vent, the inner bottom end of the body is fixedly connected to the support frame, one end of the air pump is connected to the air inlet, the air inlet is located on the outside of the bottom end of the body, a second knob is installed on one side of the first knob, and the air pump is connected to a pipe at one end of the air pipe.

[0004] However, the above device still has some shortcomings in actual use. The most obvious one is that during actual cleaning, since the motherboard needs to be placed on a placement plate, only single-sided cleaning can be performed. After a subsequent single-sided cleaning, it is necessary to unlock the motherboard and flip the motherboard before cleaning the other side. The operation is cumbersome and the cleaning process is not continuous, which also has a great impact on the cleaning efficiency of the motherboard.

[0005] Therefore, it is necessary to invent a computer mainboard cleaning device to solve the above problems. Utility Model Content

[0006] The utility model aims to provide a computer motherboard cleaning device, which is provided with a rotating conveying mechanism so as to facilitate the insertion of the computer motherboard to be cleaned between the U-shaped back plate and the clamping block. At this time, the compressed spring pushes the clamping block to complete the clamping of the computer motherboard, and then pushes the sealing plate, so that the sealing plate slides along the guide rail until the sealing plate closes the opening of the sealing box. At this time, the computer motherboard enters the inside of the sealing box, and then the air pump is started. After the air pump is started, air flow is continuously input into the inside of the sealing box through the air inlet pipe. At this time, the turntable is rotated, and the screw is driven to rotate synchronously when the turntable rotates. When the screw rotates, the computer motherboard is driven to rotate through the U-shaped back plate, and the screw drives the computer motherboard to move left. As the computer motherboard rotates, the screw drives the computer motherboard to move left. The plate keeps moving left and rotating, and the airflow ejected from the air inlet pipe removes the dust on the surface of the computer motherboard. The removed dust enters the dust filter bag through the exhaust pipe driven by the airflow. After cleaning, the turntable is rotated in the opposite direction and the sealing plate is pulled to the right, thereby driving the computer motherboard to move out of the sealing box. At this time, the computer motherboard can be pulled out to solve the problem that during actual cleaning proposed in the above background technology, since the motherboard needs to be placed on the placement plate, only single-sided cleaning can be performed. After the subsequent single-sided cleaning, it is necessary to unlock the motherboard and flip the motherboard before cleaning the other side. The operation is relatively cumbersome and the cleaning process is not consistent, which also has a great impact on the cleaning efficiency of the motherboard.

[0007] According to one aspect of the present disclosure, the following technical solution is provided: a computer mainboard cleaning device, comprising:

[0008] A base, wherein the base is used to install the sealing mechanism;

[0009] A sealing mechanism, the sealing mechanism is used to seal the computer mainboard to be cleaned;

[0010] A cleaning mechanism, the cleaning mechanism is used to clean a computer mainboard to be cleaned; and

[0011] A rotary conveying mechanism, the rotary conveying mechanism is used to rotary convey the computer mainboard to be cleaned;

[0012] The rotary conveying mechanism comprises a screw, a rotating disk, a U-shaped back plate, a spring and a clamping block;

[0013] The screw rod passes through the sealing plate and is threadedly connected to the sealing plate. The turntable is fixedly arranged at the right end of the screw rod, and the U-shaped back plate is fixedly arranged at the left end of the turntable. Two springs and two clamping blocks are respectively fixedly arranged at the two ends of the inner side of the U-shaped back plate, and two clamping blocks are respectively fixedly arranged at the bottom ends of the two springs.

[0014] According to the computer mainboard cleaning device of at least one embodiment of the present disclosure, the sealing mechanism includes a sealing box, a sealing plate and a guide rail.

[0015] According to at least one embodiment of the computer motherboard cleaning device disclosed herein, the sealing box is fixedly disposed on the left side of the top of the base, the sealing plate is slidably disposed on the right side of the top of the base, and the guide rail is slidably disposed on the bottom of the sealing plate and fixedly connected to the base.

[0016] According to a computer mainboard cleaning device of at least one embodiment of the present disclosure, the cleaning mechanism includes an air pump, an air inlet pipe, an exhaust pipe and a dust filter bag.

[0017] According to at least one embodiment of the computer motherboard cleaning device disclosed herein, the air pump is fixedly arranged on the top of the sealed box, the air intake pipe is fixedly connected to the output end of the air pump, the air intake pipe is fixedly penetrated through the top of the sealed box, the exhaust pipe is fixedly penetrated through the bottom of the sealed box, and the dust filter bag is detachably connected to the bottom end of the exhaust pipe.

[0018] Technical effects and advantages of the utility model:

[0019] The utility model is provided with a rotating conveying mechanism so as to insert the computer motherboard to be cleaned between the U-shaped back plate and the clamping block. At this time, the compressed spring pushes the clamping block to complete the clamping of the computer motherboard, and then pushes the sealing plate to make the sealing plate slide along the guide rail until the sealing plate seals the opening of the sealing box. At this time, the computer motherboard enters the inside of the sealing box, and then the air pump is started. After the air pump is started, air flow is continuously input into the inside of the sealing box through the air inlet pipe. At this time, the turntable is rotated, and the screw is driven to rotate synchronously when the turntable rotates. When the screw rotates, the computer motherboard is driven to rotate through the U-shaped back plate, and the screw drives the computer motherboard to rotate. Move left. As the computer motherboard continues to move left and rotate, the airflow ejected from the air intake pipe removes the dust on the surface of the computer motherboard. The removed dust enters the dust filter bag through the exhaust pipe driven by the airflow. After cleaning, rotate the turntable in the opposite direction and pull the sealing plate to the right, thereby driving the computer motherboard to move out of the sealing box. At this time, the computer motherboard can be pulled out. Compared with the same type of device in the prior art, the utility model can perform a more comprehensive cleaning process on the computer motherboard. There is no need to fix and release the computer motherboard multiple times. The cleaning process is more continuous, which can effectively improve the cleaning efficiency of the motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings illustrate exemplary embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification.

[0021] Figure 1 It is a schematic diagram of the overall structure of a computer mainboard cleaning device according to an embodiment of the present disclosure.

[0022] Figure 2 It is a schematic diagram of a sealing mechanism part and a cleaning mechanism structure of a computer mainboard cleaning device according to an embodiment of the present disclosure.

[0023] Figure 3 It is a schematic diagram of the structure of a partial sealing mechanism and a rotating conveying mechanism of a computer motherboard cleaning device according to an embodiment of the present disclosure.

[0024] The specific reference numerals in the figure are:

[0025] 1. Base;

[0026] 2. Sealing mechanism; 21. Sealing box; 22. Sealing plate; 23. Guide rail;

[0027] 3. Dust cleaning mechanism; 31. Air pump; 32. Air inlet pipe; 33. Exhaust pipe; 34. Dust filter bag;

[0028] 4. Rotating conveying mechanism; 41. Screw rod; 42. Turntable; 43. U-shaped back plate; 44. Spring; 45. Clamp block. DETAILED DESCRIPTION

[0029] The present disclosure is further described in detail below in conjunction with the accompanying drawings and implementations. It is understood that the specific implementations described herein are only used to explain the relevant content, rather than to limit the present disclosure. It should also be noted that, for ease of description, only the parts related to the present disclosure are shown in the accompanying drawings.

[0030] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in the present disclosure can be combined with each other. The technical solution of the present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0031] Unless otherwise specified, the exemplary embodiments / embodiments shown will be understood as providing exemplary features of various details of some ways in which the technical concept of the present disclosure can be implemented in practice. Therefore, unless otherwise specified, the features of the various embodiments / embodiments can be combined, separated, interchanged and / or rearranged without departing from the technical concept of the present disclosure.

[0032] The use of cross-hatching and / or shading in the accompanying drawings is generally used to make the boundaries between adjacent components clear. As such, unless otherwise specified, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for the specific materials, material properties, dimensions, proportions, commonalities between the components shown, and / or any other characteristics, attributes, properties, etc. of the components. In addition, in the accompanying drawings, the sizes and relative sizes of the components may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments can be implemented differently, the specific process sequence can be performed in a different order than described. For example, two successively described processes can be performed substantially simultaneously or in an order opposite to the described order. In addition, the same figure numbers represent the same components.

[0033] When a component is referred to as being "on" or "over," "connected to," or "coupled to" another component, the component may be directly on, directly connected to, or directly coupled to the other component, or intervening components may be present. However, when a component is referred to as being "directly on," "directly connected to," or "directly coupled to" another component, there are no intervening components. For this purpose, the term "connected" may refer to a physical connection, an electrical connection, etc., with or without intervening components.

[0034] For descriptive purposes, the present disclosure may use spatially relative terms such as "under," "beneath," "under," "down," "over," "upper," "above," "higher," and "side (e.g., as in "sidewall")," to describe the relationship of one component to another (other) component as shown in the accompanying drawings. The spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, components described as "under" or "beneath" other components or features would subsequently be positioned "over" the other components or features. Thus, the exemplary term "under" can encompass both the "over" and "under" orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0035] The terms used here are for the purpose of describing specific embodiments, and are not intended to be restrictive. As used here, unless the context clearly indicates otherwise, the singular forms "one (kind, person)" and "said (the)" are also intended to include plural forms. In addition, when the terms "comprise" and / or "include" and their variations are used in this specification, it is explained that there are stated features, integral bodies, steps, operations, parts, assemblies and / or their groups, but it is not excluded that there are or add one or more other features, integral bodies, steps, operations, parts, assemblies and / or their groups. It should also be noted that, as used here, the terms "substantially", "approximately" and other similar terms are used as approximate terms and not as degree terms, so that they are used to explain the inherent deviations of the measured values, calculated values ​​and / or the values ​​provided that will be recognized by those of ordinary skill in the art.

[0036] Figure 1 It is a schematic diagram of the overall structure of a computer mainboard cleaning device according to an embodiment of the present disclosure.

[0037] Figure 2 It is a structural schematic diagram of a part of a sealing mechanism 2 and a cleaning mechanism 3 of a computer motherboard cleaning device according to an embodiment of the present disclosure.

[0038] Figure 3 It is a structural schematic diagram of a part of a sealing mechanism 2 and a rotating conveying mechanism 4 of a computer motherboard cleaning device according to an embodiment of the present disclosure.

[0039] like Figure 1-Figure 3 As shown, the computer mainboard cleaning device disclosed in the present invention may include: a base 1, a sealing mechanism 2, a cleaning mechanism 3 and other components.

[0040] like Figure 2 and Figure 3 As shown, in the present disclosure, the sealing mechanism 2 includes a sealing box 21, a sealing plate 22 and a guide rail 23, wherein the sealing box 21 is fixedly arranged on the top left side of the base 1, the sealing plate 22 is slidably arranged on the top right side of the base 1, and the guide rail 23 is slidably arranged on the bottom of the sealing plate 22 and fixedly connected to the base 1.

[0041] Thereby, the sealing plate 22 is pushed and then slid along the guide rail 23 until the sealing plate 22 closes the opening of the sealing box 21. During subsequent cleaning, since the opening of the sealing box 21 is closed, dust will not float into the air from the opening of the sealing box 21.

[0042] like Figure 2As shown, in a preferred embodiment, the cleaning mechanism 3 includes an air pump 31, an air intake pipe 32, an exhaust pipe 33 and a dust filter bag 34, wherein the air pump 31 is fixedly arranged on the top of the sealing box 21, the air intake pipe 32 is fixedly connected to the output end of the air pump 31, the air intake pipe 32 is fixedly penetrated through the top of the sealing box 21, the exhaust pipe 33 is fixedly penetrated through the bottom of the sealing box 21, and the dust filter bag 34 is detachably connected to the bottom end of the exhaust pipe 33.

[0043] Therefore, after the air pump 31 is started, air flow is continuously input into the sealed box 21 through the air inlet pipe 32. The air flow ejected from the air inlet pipe 32 removes dust on the surface of the computer motherboard. The removed dust enters the dust filter bag 34 through the exhaust pipe 33 driven by the air flow.

[0044] like Figure 3 As shown, in the present disclosure, the rotating conveying mechanism 4 includes a screw 41, a turntable 42, a U-shaped back plate 43, a spring 44 and a clamp 45, wherein the screw 41 passes through the sealing plate 22 and is threadedly connected to the sealing plate 22, the turntable 42 is fixedly arranged at the right end of the screw 41, the U-shaped back plate 43 is fixedly arranged at the left end of the turntable 42, and two springs 44 and two clamps 45 are each provided, and the two springs 44 are respectively fixedly arranged at the two ends of the inner side of the U-shaped back plate 43, and the two clamps 45 are respectively fixedly arranged at the bottom ends of the two springs 44.

[0045] Thus, the computer motherboard to be cleaned is inserted between the U-shaped back plate 43 and the clamping block 45. At this time, the compressed spring 44 pushes the clamping block 45 to complete the clamping of the computer motherboard, and then pushes the sealing plate 22, so that the sealing plate 22 slides along the guide rail 23 until the sealing plate 22 closes the opening of the sealing box 21. At this time, the computer motherboard enters the sealing box 21, and then the air pump 31 is started. After the air pump 31 is started, the air flow is continuously input into the sealing box 21 through the air inlet pipe 32. At this time, the turntable 42 is rotated. When the screw 41 rotates, it drives the computer main board to rotate through the U-shaped back plate 43. At the same time, the screw 41 drives the computer main board to move left. As the computer main board continues to move left and rotate, the airflow ejected from the air inlet pipe 32 removes the dust on the surface of the computer main board. The removed dust enters the dust filter bag 34 through the exhaust pipe 33 driven by the airflow. After cleaning, the turntable 42 is rotated in the opposite direction and the sealing plate 22 is pulled to the right, thereby driving the computer main board to move out of the sealing box 21. At this time, the computer main board can be pulled out.

[0046] In the description of this specification, the description with reference to the terms "one embodiment / method", "some embodiments / methods", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment / method or example are included in at least one embodiment / method or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment / method or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments / methods or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments / methods or examples described in this specification and the features of different embodiments / methods or examples, unless they are contradictory.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0048] Those skilled in the art should understand that the above embodiments are only for the purpose of clearly illustrating the present disclosure, and are not intended to limit the scope of the present disclosure. For those skilled in the art, other changes or modifications may be made based on the above disclosure, and these changes or modifications are still within the scope of the present disclosure.

Claims

1. A computer motherboard cleaning device, characterized in that: include: A base, wherein the base is used to install the sealing mechanism; A sealing mechanism, the sealing mechanism is used to seal the computer mainboard to be cleaned; A cleaning mechanism, the cleaning mechanism is used to clean a computer mainboard to be cleaned; and A rotary conveying mechanism, the rotary conveying mechanism is used to rotary convey the computer mainboard to be cleaned; The rotary conveying mechanism comprises a screw, a rotating disk, a U-shaped back plate, a spring and a clamping block; The screw rod passes through the sealing plate and is threadedly connected to the sealing plate. The turntable is fixedly arranged at the right end of the screw rod, and the U-shaped back plate is fixedly arranged at the left end of the turntable. Two springs and two clamping blocks are respectively fixedly arranged at the two ends of the inner side of the U-shaped back plate, and two clamping blocks are respectively fixedly arranged at the bottom ends of the two springs.

2. The computer mainboard cleaning device according to claim 1, characterized in that: The sealing mechanism comprises a sealing box, a sealing plate and a guide rail.

3. The computer mainboard cleaning device according to claim 2, characterized in that: The sealing box is fixedly arranged on the left side of the top of the base, the sealing plate is slidably arranged on the right side of the top of the base, and the guide rail is slidably arranged on the bottom of the sealing plate and fixedly connected with the base.

4. The computer mainboard cleaning device according to claim 3, characterized in that: The dust cleaning mechanism comprises an air pump, an air inlet pipe, an exhaust pipe and a dust filter bag.

5. The computer mainboard cleaning device according to claim 4, characterized in that: The air pump is fixedly arranged on the top of the sealed box, the air intake pipe is fixedly connected to the output end of the air pump, the air intake pipe is fixedly penetrated through the top of the sealed box, the exhaust pipe is fixedly penetrated through the bottom of the sealed box, and the dust filter bag is detachably connected to the bottom end of the exhaust pipe.

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