Chip mounting device for semiconductor chip processing

Abstract

The utility model discloses a chip mounting device for processing a semiconductor chip, relates to the technical field of semiconductor chip processing, and solves the problems that the next chip mounting operation can be carried out only after the chip mounting device resets and adsorbs another chip after the chip mounting is completed, uniform heating cannot be carried out, the chip is easy to damage, and the chip mounting efficiency is high. According to the scheme, the semiconductor chip dust removal device comprises a base, a conveyor used for conveying semiconductor chips and a placement box used for containing patches are fixedly installed on the two sides of the upper surface of the base respectively, and through arrangement of a rotating mechanism and a lifting adsorption mechanism, the chips can be subjected to dust removal through the rotary mechanism; when one lifting adsorption mechanism carries out chip mounting operation, the other lifting adsorption mechanism carries out adsorption chip mounting operation at the same time, the working efficiency is improved, through the arranged rotary heating mechanism, an air nozzle can be driven to rotate, a chip is rotationally heated, through the arranged cleaning mechanism, dust attached to the chip can be sucked away, and the chip mounting efficiency is improved. And the surface mounting effect is prevented from being influenced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip processing, in particular to a chip mounting device for semiconductor chip processing. Background Art

[0002] Semiconductor chips need to go through the patch process during processing. In the patch process, a corresponding patch device is generally required to operate. After searching, the Chinese patent authorization number CN218215237U discloses a patch device for semiconductor chip processing, including: a base and a support frame, the support frame is fixedly connected to the base; a conveyor belt, the conveyor belt is connected to the base; a patch storage slot; a patch mechanism, the patch mechanism is arranged between the base and the support frame; by setting the patch mechanism, the support component and the adsorption component move the patch in the process, the air conduction heating component can heat the patch, so that the conductive paste is directly fixed and formed, omitting the substrate heating step, and improving the processing efficiency.

[0003] Although the above technical solution can improve the efficiency of semiconductor chip mounting, it needs to be reset and adsorbed to another chip after each mounting is completed before the next mounting operation can be performed, which reduces the efficiency. In addition, the exhaust pipe position of the above technical solution is fixed, and only one position of the chip can be heated during heating, and it cannot be heated evenly. It is also easy to damage the chip, and there is no dust removal operation for the chip. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a patch device for semiconductor chip processing, which solves the problem that the prior patch device proposed in the background technology needs to be reset and adsorbed to another patch after each patch is completed before the next patch operation can be performed, thereby reducing efficiency. In addition, the exhaust pipe position of the above technical solution is fixed, and during heating, only one position of the chip can be heated centrally, and it cannot be heated evenly, and the chip is easily damaged. In addition, there is no provision for dust removal operation on the chip.

[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: a patch device for semiconductor chip processing, including a base, a conveyor for conveying semiconductor chips and a placement box for placing patches are fixedly installed on both sides of the upper surface of the base, a first U-shaped frame is fixedly installed on the upper surface of the base, a rotating mechanism is installed through the top of the first U-shaped frame, and lifting and adsorption mechanisms are fixedly installed at both ends of the movable end of the rotating mechanism, a rotating heating mechanism is sleeved on the outer surface of the lifting and adsorption mechanism, and a cleaning mechanism for cleaning semiconductor chips is fixedly installed on the upper surface of the base.

[0006] The rotating mechanism includes a rotating shaft that passes through and is rotatably connected to the top of the first U-shaped frame, a slave gear is fixedly sleeved on the outer surface of the top end of the rotating shaft, a first motor is fixedly installed on the top of the first U-shaped frame, the output shaft of the first motor is connected to a main gear that meshes with the slave gear, and a cross bar is fixedly connected to the bottom end of the rotating shaft. The rotation of the first motor can drive the rotating shaft and the cross bar to rotate, thereby driving the rotating adsorption mechanisms on both sides to rotate and exchange positions.

[0007] The lifting and adsorption mechanism includes a cylinder that passes through and is fixedly installed at one end of a cross bar, the bottom end of the movable end of the cylinder is fixedly connected to a mounting box, a column is fixedly connected to the center position of the lower surface of the mounting box, a suction cup is fixedly installed on the lower surface of the column, a vacuum pump is fixedly installed inside the mounting box, and an exhaust pipe is fixedly connected between the suction end of the vacuum pump and the suction cup, so that the patch can be adsorbed and lifted.

[0008] Preferably, the rotary heating mechanism includes a sleeve rotatably connected to the bottom of the installation box, a hot air blower is fixedly installed inside the sleeve, an air outlet end of the hot air blower is fixedly connected to an air outlet pipe, the other end of the air outlet pipe is fixedly connected to an annular tube fixedly connected to the bottom of the sleeve, a plurality of air nozzles are fixedly connected to the lower surface of the annular tube, and the hot air generated by the hot air blower can be ejected through the air nozzle, thereby heating the patch.

[0009] Preferably, the rotary heating mechanism also includes a second motor fixedly mounted on one side of the outer surface of the mounting box, the output shaft of the second motor is fixedly connected to a driving gear, the outer surface of the sleeve is fixedly sleeved with an outer gear ring meshing with the driving gear, the rotation of the second motor can drive the sleeve to rotate, thereby driving the air nozzle to rotate, so that the patch can be evenly heated to avoid concentrated heat.

[0010] Preferably, the cleaning mechanism includes a second U-shaped frame fixedly mounted on the upper surface of the base, the second U-shaped frame is arranged above the conveyor, a vacuum cleaner is fixedly mounted on the top of the second U-shaped frame, the suction end of the vacuum cleaner is fixedly connected to a connecting pipe, the bottom end of the connecting pipe is fixedly communicated with a hollow box fixedly connected to the top of the second U-shaped frame, a plurality of dust suction holes are sequentially opened on the lower surface of the hollow box, and the vacuum cleaner can suck away the dust adhered to the chip through the connecting pipe, the hollow box and the dust suction holes to avoid affecting the patch effect.

[0011] Preferably, a soft cleaning brush is fixedly connected to the lower surface of the hollow box, and the soft cleaning brush can brush up dust to facilitate vacuuming operations.

[0012] Preferably, a plurality of positioning boxes for placing semiconductor chips are fixedly connected to the outer surface of the conveyor belt of the conveyor, so as to facilitate the placement of the chips and avoid displacement of the chips.

[0013] The utility model provides a chip placement device for semiconductor chip processing, which has the following beneficial effects:

[0014] 1. This kind of patch device for semiconductor chip processing, through the provision of a rotating mechanism and a lifting and adsorption mechanism, can be used for one lifting and adsorption mechanism to perform a patch operation while the other lifting and adsorption mechanism performs an adsorption patch operation, so that the patch operation can be continued directly after the patch is completed, thereby solving the problem that the existing patch device needs to be re-adsorbed after each patch is completed before continuing the patch operation, which is cumbersome to operate and reduces work efficiency.

[0015] 2. This kind of patch device for semiconductor chip processing can drive the air nozzle to rotate through the rotary heating mechanism, and perform rotational heating on the chip, so that the chip is heated evenly and avoids concentrated heating, thereby solving the problem that the heating position in the existing patch device cannot be changed, which makes the chip easily damaged by concentrated heating.

[0016] 3. This kind of patch device for semiconductor chip processing, through the cleaning mechanism set up, the vacuum cleaner can suck away the dust adhering to the chip through the connecting pipe, hollow box and dust suction hole to avoid affecting the patch effect, thereby solving the problem that the existing patch device cannot remove the dust adhering to the chip surface and affects the patch effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 It is a schematic diagram of the internal structure of the lifting adsorption mechanism and the rotating heating mechanism of the utility model;

[0019] Figure 3 It is a schematic diagram of the internal structure of the cleaning mechanism of the utility model.

[0020] In the figure, 1, base; 2, conveyor; 3, placement box; 4, first U-shaped frame; 5, rotating mechanism; 51, rotating shaft; 52, slave gear; 53, first motor; 54, main gear; 55, cross bar; 6, lifting and adsorption mechanism; 61, cylinder; 62, installation box; 63, column; 64, suction cup; 65, vacuum pump; 66, exhaust pipe; 7, rotating heating mechanism; 71, sleeve; 72, hot air blower; 73, exhaust pipe; 74, annular pipe; 75, air nozzle; 76, second motor; 77, driving gear; 78, outer gear ring; 8, cleaning mechanism; 81, second U-shaped frame; 82, vacuum cleaner; 83, connecting pipe; 84, hollow box; 85, dust suction hole; 86, cleaning soft brush; 9, positioning box. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Embodiment 1:

[0023] like Figure 1 and Figure 2 As shown, a patch device for semiconductor chip processing includes a base 1, and a conveyor 2 for conveying semiconductor chips and a placement box 3 for holding patches are fixedly installed on both sides of the upper surface of the base 1, and a first U-shaped frame 4 is fixedly installed on the upper surface of the base 1. A rotating mechanism 5 is installed through the top of the first U-shaped frame 4. The rotating mechanism 5 includes a rotating shaft 51 that is connected to the top of the first U-shaped frame 4, and a slave gear 52 is fixedly sleeved on the outer surface of the top end of the rotating shaft 51. A first motor 53 is fixedly installed on the top of the first U-shaped frame 4. The output of the first motor 53 The output shaft is connected to a main gear 54 meshing with a slave gear 52, and a cross bar 55 is fixedly connected to the bottom end of the rotating shaft 51. The first motor 53 rotates through the main gear 54 and the slave gear 52 to drive the rotating shaft 51 and the cross bar 55 to rotate, thereby driving the lifting and adsorption mechanisms 6 on both sides to rotate and exchange positions, so that when one lifting and adsorption mechanism 6 is performing patch bonding, the other one is adsorbing the patch. After completion, they can directly exchange and continue the patch operation, thereby solving the problem that the existing patch device needs to re-adsorb after each patch is completed before continuing the patch operation, which is cumbersome to operate and reduces work efficiency.

[0024] Embodiment 2:

[0025] like Figure 1 and Figure 2 As shown, both ends of the movable end of the rotating mechanism 5 are fixedly installed with a lifting and adsorption mechanism 6, and the lifting and adsorption mechanism 6 includes a cylinder 61 that passes through and is fixedly installed at one end of the cross bar 55, and the bottom end of the movable end of the cylinder 61 is fixedly connected to a mounting box 62, and a column 63 is fixedly connected to the center position of the lower surface of the mounting box 62, and a suction cup 64 is fixedly installed on the lower surface of the column 63, and a vacuum pump 65 is fixedly installed inside the mounting box 62, and an exhaust pipe 66 is fixedly connected between the suction end of the vacuum pump 65 and the suction cup 64, and the vacuum pump 65 cooperates with the suction cup 64 to facilitate the adsorption of the patch, and then lift it by the cylinder 61.

[0026] Embodiment 3:

[0027] like Figure 1 and Figure 2 As shown, the outer surface of the lifting adsorption mechanism 6 is sleeved with a rotating heating mechanism 7, and the rotating heating mechanism 7 includes a sleeve 71 rotatably connected to the bottom of the installation box 62, and a hot air blower 72 is fixedly installed inside the sleeve 71. The air outlet end of the hot air blower 72 is fixedly connected to an air outlet pipe 73, and the other end of the air outlet pipe 73 is fixedly connected to an annular tube 74 fixedly connected to the bottom of the sleeve 71, and a plurality of air nozzles 75 are fixedly connected to the lower surface of the annular tube 74. The hot air generated by the hot air blower 72 can be ejected through the air nozzles 75, thereby heating the patch.

[0028] The rotary heating mechanism 7 also includes a second motor 76 fixedly mounted on one side of the outer surface of the mounting box 62, the output shaft of the second motor 76 is fixedly connected to a driving gear 77, the outer surface of the sleeve 71 is fixedly sleeved with an outer gear ring 78 meshing with the driving gear 77, the rotation of the second motor 76 can drive the sleeve 71 to rotate, thereby driving the air nozzle 75 to rotate, so that the patch can be heated evenly to avoid concentrated heating, thereby solving the problem that the heating position in the existing patch device cannot be changed, which makes the chip easily damaged by concentrated heating.

[0029] Embodiment 4:

[0030] like Figure 1 and Figure 3 As shown, a cleaning mechanism 8 for cleaning semiconductor chips is fixedly installed on the upper surface of the base 1, and the cleaning mechanism 8 includes a second U-shaped frame 81 fixedly installed on the upper surface of the base 1, and the second U-shaped frame 81 is erected above the conveyor 2. A vacuum cleaner 82 is fixedly installed on the top of the second U-shaped frame 81, and the suction end of the vacuum cleaner 82 is fixedly connected with a connecting pipe 83, and the bottom end of the connecting pipe 83 is fixedly communicated with a hollow box 84 fixedly connected to the top of the second U-shaped frame 81, and a plurality of dust suction holes 85 are sequentially opened on the lower surface of the hollow box 84. The vacuum cleaner 82 can suck away the dust adhered to the chip through the connecting pipe 83, the hollow box 84 and the dust suction holes 85 to avoid affecting the patch effect, thereby solving the problem that the existing patch device cannot remove the dust adhered to the chip surface and affects the patch effect.

[0031] A cleaning soft brush 86 is fixedly connected to the lower surface of the hollow box 84, which can sweep up the dust adhering to the chip, thereby facilitating absorption.

[0032] A plurality of positioning boxes 9 for placing semiconductor chips are fixedly connected to the outer surface of the conveyor belt of the conveyor 2, so as to facilitate the positioning of the chips and avoid movement.

[0033] Working principle: put the chip into the positioning box 9, and then convey it through the conveyor 2. When the chip passes through the second U-shaped frame 81, the cleaning soft brush 86 will sweep up the dust adhering to the chip. At this time, the vacuum cleaner 82 can suck away the dust adhering to the chip through the connecting pipe 83, the hollow box 84 and the dust suction hole 85 to avoid affecting the patch effect, thereby solving the problem that the existing patch device cannot remove the dust adhering to the surface of the chip and affects the patch effect. When the chip moves to the bottom of the suction cup 64, the cylinder 61 drives the adsorbed patch to move downward and contact the chip surface, and then the hot air generated by the hot air blower 72 can be sprayed out through the air nozzle 75 to heat the patch. The rotation of the second motor 76 can drive the sleeve 71 to rotate, thereby driving the air nozzle 75 to rotate, so that it can be evenly The patch is heated to avoid concentrated heating, thereby solving the problem that the heating position in the existing patch device cannot be changed, which makes the chip easily damaged by concentrated heating, thereby realizing the patch operation, and at this time another lifting and adsorption mechanism 6 can suck up the patch to be processed, and directly start the first motor 53 when the patch is completed. The first motor 53 rotates through the main gear 54 and the slave gear 52 to drive the rotating shaft 51 and the cross bar 55 to rotate, thereby driving the lifting and adsorption mechanisms 6 on both sides to rotate and exchange positions, so that when one lifting and adsorption mechanism 6 is performing patching, the other one is adsorbing the patch, and after completion, they can directly exchange and continue the patch operation, thereby solving the problem that the existing patch device needs to be re-adsorbed after each patch is completed before continuing the patch operation, which is cumbersome and reduces work efficiency.

[0034] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is defined by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0035] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A chip bonding device for semiconductor chip processing, comprising a base (1), characterized in that: A conveyor (2) for conveying semiconductor chips and a placement box (3) for holding patches are fixedly mounted on both sides of the upper surface of the base (1), a first U-shaped frame (4) is fixedly mounted on the upper surface of the base (1), a rotating mechanism (5) is installed through the top of the first U-shaped frame (4), both ends of the movable end of the rotating mechanism (5) are fixedly mounted with lifting and adsorption mechanisms (6), the outer surface of the lifting and adsorption mechanism (6) is sleeved with a rotating heating mechanism (7), and a cleaning mechanism (8) for cleaning semiconductor chips is fixedly mounted on the upper surface of the base (1); The rotating mechanism (5) comprises a rotating shaft (51) penetrating and rotatably connected to the top of the first U-shaped frame (4); a slave gear (52) is fixedly sleeved on the outer surface of the top end of the rotating shaft (51); a first motor (53) is fixedly mounted on the top of the first U-shaped frame (4); an output shaft of the first motor (53) is connected to a main gear (54) meshing with the slave gear (52); and a crossbar (55) is fixedly connected to the bottom end of the rotating shaft (51); The lifting and adsorption mechanism (6) comprises a cylinder (61) which passes through and is fixedly mounted on one end of the cross bar (55); the bottom end of the movable end of the cylinder (61) is fixedly connected to a mounting box (62); a column (63) is fixedly connected to the center position of the lower surface of the mounting box (62); a suction cup (64) is fixedly mounted on the lower surface of the column (63); a vacuum pump (65) is fixedly mounted inside the mounting box (62); and an exhaust pipe (66) is fixedly connected between the suction end of the vacuum pump (65) and the suction cup (64).

2. A chip bonding device for semiconductor chip processing according to claim 1, characterized in that: The rotary heating mechanism (7) comprises a sleeve (71) rotatably connected to the bottom of the installation box (62); a hot air blower (72) is fixedly installed inside the sleeve (71); an air outlet end of the hot air blower (72) is fixedly connected to an air outlet pipe (73); the other end of the air outlet pipe (73) is fixedly connected to an annular tube (74) fixedly connected to the bottom of the sleeve (71); and a plurality of air nozzles (75) are fixedly connected to the lower surface of the annular tube (74).

3. A chip bonding device for semiconductor chip processing according to claim 2, characterized in that: The rotary heating mechanism (7) further comprises a second motor (76) fixedly mounted on one side of the outer surface of the mounting box (62); an output shaft of the second motor (76) is fixedly connected to a driving gear (77); and an outer gear ring (78) meshing with the driving gear (77) is fixedly sleeved on the outer surface of the sleeve (71).

4. A chip bonding device for semiconductor chip processing according to claim 1, characterized in that: The cleaning mechanism (8) comprises a second U-shaped frame (81) fixedly mounted on the upper surface of the base (1), the second U-shaped frame (81) being mounted above the conveyor (2), a dust collector (82) being fixedly mounted on the top of the second U-shaped frame (81), a suction end of the dust collector (82) being fixedly connected to a connecting pipe (83), a bottom end of the connecting pipe (83) being fixedly connected to a hollow box (84) fixedly connected to the top of the second U-shaped frame (81), a lower surface of the hollow box (84) being sequentially provided with a plurality of dust suction holes (85).

5. A chip bonding device for semiconductor chip processing according to claim 4, characterized in that: A cleaning soft brush (86) is fixedly connected to the lower surface of the hollow box (84).

6. A chip bonding device for semiconductor chip processing according to claim 1, characterized in that: A plurality of positioning boxes (9) for placing semiconductor chips are fixedly connected to the outer surface of the conveyor belt of the conveyor (2).

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