Sucker system and semiconductor device processing equipment

Abstract

The utility model discloses a sucking disc system and semiconductor device processing equipment, the sucking disc system comprises a sucking disc, the sucking disc is connected with a negative pressure generating pipeline, the negative pressure generating pipeline comprises a vacuum meter, and a first negative pressure generating pipeline and a second negative pressure generating pipeline which are connected in parallel, the first negative pressure generating pipeline generates negative pressure by a vacuum pump, and the second negative pressure generating pipeline generates negative pressure by a vacuum pump. The second negative pressure generating pipeline generates negative pressure through a vacuum generator. The suction cup is connected with the first negative pressure generation pipeline and the second negative pressure generation pipeline which are connected in parallel, the first negative pressure generation pipeline generates negative pressure through the vacuum pump, the second negative pressure generation pipeline generates negative pressure through the vacuum generator, and meanwhile the vacuum condition of the negative pressure generation pipelines is detected through the vacuum meter. When the vacuum generated by one negative pressure generation pipeline is unstable, compensation is carried out through the other negative pressure generation pipeline, the vacuum stability can be effectively improved, and the control redundancy is increased.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor device processing, in particular to a suction cup system and semiconductor device processing equipment. Background Art

[0002] During wafer thinning, cutting, cleaning and other processing, a suction cup is required to adsorb and transport the wafer. Patents with authorization announcement numbers CN217457851U, CN212826175U, CN218385148U, etc. disclose the specific structure of transporting wafers by suction cups.

[0003] The suction cup usually generates negative pressure through a vacuum pump or a vacuum generator to achieve adsorption.

[0004] During wafer processing, there are often multiple suction cups working at the same time. Regardless of whether a vacuum pump or a vacuum generator is used alone to generate negative pressure, there is an unstable vacuum, which poses a certain safety hazard to the safety of the wafers being transported. Utility Model Content

[0005] The purpose of the utility model is to solve the above problems existing in the prior art and to provide a suction cup system and semiconductor device processing equipment.

[0006] The purpose of the utility model is achieved through the following technical solutions:

[0007] A suction cup system includes a suction cup connected to a negative pressure generating pipeline, wherein the negative pressure generating pipeline includes a vacuum gauge and a first negative pressure generating pipeline and a second negative pressure generating pipeline connected in parallel, wherein the first negative pressure generating pipeline generates negative pressure by a vacuum pump, and the second negative pressure generating pipeline generates negative pressure by a vacuum generator.

[0008] Preferably, in the suction cup system, the first negative pressure generating pipeline includes a vacuum control valve connected to the vacuum pump, and the vacuum control valve is connected to the suction cup.

[0009] Preferably, in the suction cup system, the second negative pressure generating pipeline includes a vacuum ventilation valve connected to the vacuum generator, the vacuum ventilation valve is connected to an air source, and the vacuum generator is connected to the suction cup.

[0010] Preferably, in the suction cup system, the vacuum control valve is connected to a first pipeline, the vacuum generator is connected to a second pipeline, the first pipeline and the second pipeline are both connected to a third pipeline, and the third pipeline is connected to the suction cup.

[0011] Preferably, in the suction cup system, the air source is also connected to a vacuum release valve, and the vacuum release valve is connected to the first pipeline or the second pipeline or the third pipeline through a fourth pipeline.

[0012] Preferably, in the suction cup system, the suction cup comprises suction zones which are distributed sequentially from the center to the edge and are independent of each other, and each suction zone is connected to a control branch of the third pipeline.

[0013] Preferably, in the suction cup system, the first negative pressure generating pipeline includes a main negative pressure pipeline connected to the vacuum pump, and the main negative pressure pipeline is connected to multiple first negative pressure branches; the air source is connected to the main air supply pipeline, and the main air supply pipeline is connected to multiple second negative pressure branches; each first negative pressure branch and a second negative pressure branch are connected to the same suction cup and vacuum gauge.

[0014] Preferably, in the suction cup system, a vacuum logic valve one-way valve is provided between each connection point between the first negative pressure branch and the main negative pressure pipeline and the vacuum control valve.

[0015] Semiconductor device processing equipment includes any suction cup system as described above.

[0016] The advantages of the technical solution of the utility model are mainly reflected in:

[0017] The utility model connects a suction cup to a first negative pressure generating pipeline and a second negative pressure generating pipeline in parallel. The first negative pressure generating pipeline adopts a vacuum pump to generate negative pressure, and the second negative pressure generating pipeline adopts a vacuum generator to generate negative pressure. Under normal circumstances, the vacuum pump generates negative pressure, and at the same time, a vacuum gauge is used to detect the vacuum condition of the negative pressure generating pipeline. When the vacuum is unstable, the generator is used to compensate, which can effectively improve the stability of the vacuum, improve the safety of wafer handling, and increase the redundancy of control.

[0018] The utility model enables the air source to be connected to the suction cup through the vacuum breaking pipeline when there is an air source, so that when discharging materials, the vacuum of the suction cup can be broken through the existing air source, thereby ensuring the stable realization of discharging materials, enriching the functions, and being conducive to improving the safety of loading and unloading materials.

[0019] The utility model adopts a plurality of first negative pressure branches connected in parallel so that a set of vacuum pumps and gas sources can be shared, which is beneficial to saving equipment costs while ensuring the vacuum stability of each branch.

[0020] The utility model arranges a vacuum logic valve one-way valve on each first negative pressure branch, so as to avoid the influence on the vacuum pump and other first negative pressure branches as much as possible when a first negative pressure branch leaks vacuum. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the suction cup system of the utility model;

[0022] Figure 2 It is a schematic diagram of the suction cup system of the utility model having a vacuum logic valve check valve;

[0023] Figure 3 It is a schematic diagram showing that the suction cup of the utility model has multiple suction areas. DETAILED DESCRIPTION

[0024] The purpose, advantages and features of the present invention will be illustrated and explained through the non-limiting description of the following preferred embodiments. These embodiments are only typical examples of the application of the technical solution of the present invention, and any technical solution formed by equivalent replacement or equivalent transformation falls within the scope of protection claimed by the present invention.

[0025] In the description of the scheme, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0026] The suction cup system disclosed by the utility model is described below in conjunction with the accompanying drawings. Figure 1 As shown, it includes a suction cup 100, which is connected to a negative pressure generating pipeline, and the negative pressure generating pipeline includes a vacuum gauge 200 and a first negative pressure generating pipeline 300 and a second negative pressure generating pipeline 400 connected in parallel. The first negative pressure generating pipeline 300 generates negative pressure by a vacuum pump 310, and the second negative pressure generating pipeline 400 generates negative pressure by a vacuum generator 410.

[0027] Specifically, the first negative pressure generating pipeline 300 includes a vacuum control valve 320 connected to the vacuum pump 310 through a pipeline, and the vacuum control valve 320 is connected to the suction cup 100 through a pipeline.

[0028] The second negative pressure generating pipeline 400 includes a vacuum vent valve 420 connected to the vacuum generator 410 through a pipeline, the vacuum vent valve 410 is connected to the air source 430 through a pipeline, and the vacuum generator 410 is connected to the suction cup 100 through a pipeline. The vacuum control valve 320 and the vacuum vent valve 410 can be known solenoid valves, which are not described here.

[0029] The vacuum control valve is connected to the first pipeline 330 , the vacuum generator is connected to the second pipeline 440 , the first pipeline 330 and the second pipeline 440 are connected to the third pipeline 500 through a tee, and the third pipeline 500 is connected to the suction cup 100 .

[0030] Furthermore, the gas source 430 is also connected to a vacuum release valve 700 , and the vacuum release valve 700 is connected to the first pipeline 330 or the second pipeline 440 or the third pipeline 500 via a fourth pipeline 800 . Meanwhile, the fourth pipeline is also connected to the vacuum meter 200 .

[0031] In actual use, an independent negative pressure generating pipeline can be provided for each suction cup. More preferably, a set of negative pressure generating pipelines can be shared by multiple suction cups, that is, the first negative pressure generating pipeline 300 includes a main negative pressure pipeline 340 connected to a vacuum pump, the main negative pressure pipeline 340 connects multiple first negative pressure branches, the first negative pressure branch is the pipeline composed of the vacuum control valve 320, the air pipe connecting the vacuum control valve and the main negative pressure pipeline, and the first pipeline. The air source 430 is connected to the main air supply pipeline 450, the main air supply pipeline 450 is connected to multiple second negative pressure branches, the second negative pressure branch is the pipeline composed of the vacuum generator, the vacuum ventilation valve, and the pipeline connecting them to each other and the suction cup and the main air supply pipeline; each first negative pressure branch and a second negative pressure branch are connected to the same suction cup 100 and vacuum gauge 200.

[0032] As attached Figure 2 As shown, in actual use, the storage pipeline leaks vacuum. Therefore, a vacuum logic valve one-way valve 350 is arranged between each connection point of the first negative pressure branch and the main negative pressure pipeline and the vacuum control valve 320. At this time, if the suction cup leaks vacuum and does not adsorb the workpiece, the vacuum logic valve one-way valve 350 can effectively reduce the air sucked in the first negative pressure branch, thereby reducing the loss of the vacuum pump.

[0033] During normal operation, when the vacuum pump is started, the vacuum control valve remains normally open to directly provide vacuum to the suction cup. If vacuum is not needed at the beginning, the vacuum control valve can be closed. When the vacuum control valve is open, if you want to break the vacuum, open the vacuum release valve and turn on the air source to break the vacuum. When the vacuum gauge detects insufficient vacuum, the vacuum vent valve is turned on, so that the vacuum generator generates vacuum at the same time to ensure stable adsorption of the suction cup.

[0034] Furthermore, during the wafer processing, the size of the wafer varies. Figure 3As shown, the suction cup includes suction areas that are distributed sequentially from the center to the edge and are independent of each other. Each suction area is connected to a control branch of the third pipeline 500, that is, the third pipeline 500 includes multiple parallel control branches 510. The control branch 510 of the innermost suction area of ​​the suction cup may not be provided with a control valve, and other control branches are respectively provided with control valves 511. When a smaller wafer needs to be adsorbed, only the suction area in the central area can generate adsorption force. When the wafer size becomes larger, the peripheral adsorption areas can be opened in sequence to ensure the stability of wafer adsorption. At the same time, adjusting the adsorption area according to different wafer sizes is conducive to avoiding damage to the wafer caused by excessive adsorption force.

[0035] Example 2

[0036] This embodiment discloses a semiconductor device processing equipment, including the suction cup system as described above. The semiconductor device processing equipment can be various feasible equipment such as a dicing machine, a wafer cleaning machine, a ring cutting machine, a thinning machine, etc., which are not limited here.

[0037] There are many implementation methods of the utility model, and all technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of the utility model.

Claims

1. A suction cup system, comprising a suction cup (100), characterized in that: The suction cup (100) is connected to a negative pressure generating pipeline, wherein the negative pressure generating pipeline comprises a vacuum gauge (200) and a first negative pressure generating pipeline (300) and a second negative pressure generating pipeline (400) connected in parallel, wherein the first negative pressure generating pipeline (300) generates negative pressure by a vacuum pump (310), and the second negative pressure generating pipeline (400) generates negative pressure by a vacuum generator (410).

2. The suction cup system according to claim 1, characterized in that: The first negative pressure generating pipeline (300) comprises a vacuum control valve (320) connected to the vacuum pump (310), and the vacuum control valve (320) is connected to the suction cup (100).

3. The suction cup system according to claim 2, characterized in that: The second negative pressure generating pipeline (400) comprises a vacuum ventilation valve (420) connected to the vacuum generator (410), the vacuum ventilation valve (420) is connected to an air source (430), and the vacuum generator (410) is connected to the suction cup (100).

4. The suction cup system according to claim 3, characterized in that: The vacuum control valve is connected to the first pipeline (330), the vacuum generator is connected to the second pipeline (440), the first pipeline (330) and the second pipeline (440) are both connected to the third pipeline (500), and the third pipeline (500) is connected to the suction cup (100).

5. The suction cup system according to claim 4, characterized in that: The gas source (430) is also connected to a vacuum release valve (700), and the vacuum release valve (700) is connected to the first pipeline (330) or the second pipeline (440) or the third pipeline (500) via a fourth pipeline (800).

6. The suction cup system according to claim 5, characterized in that: The suction cup comprises adsorption areas which are distributed in sequence from the centre to the edge and are independent of each other, and each adsorption area is connected to a control branch of the third pipeline (500).

7. The suction cup system according to any one of claims 3 to 6, characterized in that: The first negative pressure generating pipeline (300) comprises a main negative pressure pipeline (350) connected to a vacuum pump, the main negative pressure pipeline (350) being connected to a plurality of first negative pressure branches; the gas source (430) being connected to a main gas supply pipeline (450), the main gas supply pipeline (450) being connected to a plurality of second negative pressure branches; each first negative pressure branch and a second negative pressure branch being connected to the same suction cup (100) and vacuum gauge (200).

8. The suction cup system according to claim 7, characterized in that: A vacuum logic valve one-way valve (340) is provided between the connection point between each of the first negative pressure branches and the main negative pressure pipeline and the vacuum control valve (320).

9. Semiconductor device processing equipment, characterized in that: Comprising a suction cup system as described in any one of claims 1-8.

Images