Information acquisition device and battery pack

Abstract

The utility model relates to the technical field of batteries, and provides an information acquisition device and a battery pack. The information acquisition device comprises a circuit board and an information acquisition module. The circuit board is provided with a main circuit and a standby circuit. The information acquisition module is installed on the circuit board. One end of the main circuit is electrically connected with the information acquisition module, the other end of the main circuit is configured to be electrically connected with the battery management system, one end of the standby circuit is provided with an electric connection part, the electric connection part is configured to be electrically connected with the information acquisition module under the action of a foreign object, and the other end of the standby circuit is configured to be electrically connected with the battery management system. When the main circuit breaks down, the electric connection part can be electrically connected with the information acquisition module under the action of a foreign object, so that the standby circuit sends a parameter signal to the battery management system. Therefore, the maintenance difficulty of the circuit board can be greatly reduced, the circuit board does not need to be replaced, and the maintenance cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of batteries, in particular to an information collection device and a battery pack. Background Art

[0002] In the related technology, the battery pack parameters are collected by using FPC (Flexible Printed Circuit Board) instead of wiring harness, so that the collection module can be fully integrated into the FPC, which can improve the assembly efficiency. However, if the FPC has a short circuit, open circuit or other faults, the FPC needs to be replaced as a whole, which makes maintenance difficult and costly. Utility Model Content

[0003] The embodiments of the utility model provide an information collection device and a battery pack, which can improve the technical problems of difficulty and high cost in repairing circuit boards.

[0004] In a first aspect, an embodiment of the present utility model provides an information collection device, comprising:

[0005] A circuit board having a main circuit and a backup circuit;

[0006] An information acquisition module is installed on the circuit board;

[0007] Among them, one end of the main circuit is electrically connected to the information acquisition module, and the other end of the main circuit is configured to be electrically connected to the battery management system. One end of the backup circuit is constructed with an electrical connection part, and the electrical connection part is configured to be electrically connected to the information acquisition module under the action of external objects, and the other end of the backup circuit is configured to be electrically connected to the battery management system.

[0008] In one embodiment, the information collection module includes:

[0009] A voltage collection sheet has one end connected to the circuit board and the other end extending toward the bus of the battery cell and welded to the bus, wherein the main circuit is electrically connected to the voltage collection sheet, and the electrical connection portion is configured to be electrically connected to the voltage collection sheet under the action of an external object.

[0010] In one embodiment, the voltage collection sheet has a length of L1, a width of D1, and a thickness of H1, satisfying the following conditions: 20 mm ≤ L1 ≤ 30 mm, 5 mm ≤ D1 ≤ 8 mm, and 0.2 mm ≤ H1 ≤ 1 mm.

[0011] In one embodiment, a bendable temperature measuring area is constructed on the circuit board, and the main circuit and the backup circuit both extend to the temperature measuring area. The temperature measuring area is suitable for bending toward the bus of the battery cell and bonding to the bus. The information acquisition module also includes a temperature acquisition sheet, which is connected to the temperature measuring area, the main circuit is electrically connected to the temperature acquisition sheet, and the electrical connection portion is configured to be electrically connected to the temperature acquisition sheet under the action of an external object.

[0012] In one embodiment, the circuit board has a flexible area, and at least two notches arranged at an angle are constructed on the flexible area. At least two notches are connected in sequence to form a non-closed bending section to form the temperature measurement area on the circuit board.

[0013] In one embodiment, a connection terminal is constructed on the circuit board, and the information acquisition module is electrically connected to the connection terminal, wherein the main circuit is electrically connected to the connection terminal, and the electrical connection part is configured to be electrically connected to the connection terminal under the action of an external object.

[0014] In one embodiment, the electrical connection portion and the connection terminal are both solder balls, wherein the electrical connection portion and the connection terminal are spaced apart, and the electrical connection portion and the connection terminal are suitable for electrical connection after melting and deformation.

[0015] In one embodiment, the radius of the solder ball is R, and the distance between the electrical connection portion and the connection terminal is D2, which satisfies: 1 mm ≤ R ≤ 2 mm, 1 mm ≤ D2 ≤ 2 mm.

[0016] In one embodiment, at least two main circuits are arranged on the circuit board, one end of each of the main circuits is electrically connected to one of the connection terminals, and the other end of each of the main circuits is configured to be electrically connected to the battery management system; wherein,

[0017] The number of the backup circuits is the same as the number of the main circuits, and each of the backup circuits serves as a backup for each of the main circuits;

[0018] Alternatively, the number of the backup circuits is less than the number of the main circuits, and each of the backup circuits serves as a backup for at least part of the main circuits.

[0019] In a second aspect, an embodiment of the present utility model provides a battery pack, comprising the information collection device as described above.

[0020] Beneficial effects of the embodiments of the utility model:

[0021] In an embodiment of the utility model, by arranging a main circuit and a backup circuit on a circuit board, when the main circuit works normally, the main circuit electrically connects the information acquisition module and the battery management system to send the collected parameter signal to the battery management system. When the main circuit fails, the electrical connection part can be electrically connected to the information acquisition module through the action of an external object. At this time, the backup circuit can be used to send the parameter signal to the battery management system. In this way, the difficulty of repairing the circuit board can be greatly reduced, and there is no need to replace the circuit board, thereby reducing the maintenance cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 It is one of the three-dimensional schematic diagrams of the information collection device provided by the embodiment of the utility model;

[0024] Figure 2 This is the second stereoscopic schematic diagram of the information collection device provided by the embodiment of the utility model;

[0025] Figure 3 This is the third stereoscopic schematic diagram of the information collection device provided by the embodiment of the utility model;

[0026] Figure 4 It is a three-dimensional schematic diagram of a circuit board provided in an embodiment of the utility model;

[0027] Figure 5 This is one of the distribution diagrams of the main circuit and the standby circuit on the circuit board provided by the embodiment of the utility model;

[0028] Figure 6 This is the second schematic diagram of the distribution of the main circuit and the standby circuit on the circuit board provided by the embodiment of the utility model;

[0029] Figure 7 This is the third schematic diagram of the distribution of the main circuit and the standby circuit on the circuit board provided by the embodiment of the utility model.

[0030] Reference numerals:

[0031] 10-circuit board, 110-main circuit, 120-backup circuit, 130-temperature measurement area, 140-gap, 20-information acquisition module, 210-voltage acquisition sheet, 220-temperature acquisition sheet, 30-electrical connection part, 40-connection terminal. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the utility model, and are not used to limit the utility model. In the utility model, unless otherwise stated, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0033] For details, please refer to Figures 1 to 7 , an embodiment of the present application provides an information collection device. The information collection device includes a circuit board 10 and an information collection module 20. The circuit board 10 has a main circuit 110 and a backup circuit 120. The information collection module 20 is installed on the circuit board 10. One end of the main circuit 110 is electrically connected to the information collection module 20, and the other end of the main circuit 110 is configured to be electrically connected to the battery management system. One end of the backup circuit 120 is constructed with an electrical connection part 30, and the electrical connection part 30 is configured to be electrically connected to the information collection module 20 under the action of an external object, and the other end of the backup circuit 120 is configured to be electrically connected to the battery management system.

[0034] In some embodiments, by arranging the main circuit 110 and the backup circuit 120 on the circuit board 10, when the main circuit 110 works normally, the main circuit 110 is electrically connected to the information acquisition module 20 and the battery management system to send the collected parameter signal to the battery management system. When the main circuit 110 fails, the electrical connection part 30 can be electrically connected to the information acquisition module 20 through the action of an external object. At this time, the backup circuit 120 can be used to send the parameter signal to the battery management system. In this way, the difficulty of repairing the circuit board 10 can be greatly reduced, and there is no need to replace the circuit board 10, thereby reducing the maintenance cost.

[0035] It is understandable that, when the backup circuit 120 replaces the main circuit 110 , the main circuit 110 directly short-circuit fails, and the parameter signal is directly sent to the battery management system through the backup circuit 120 .

[0036] Among them, the circuit board 10 can be an FPC, so it is used in the battery pack to replace the wiring harness to realize the collection of parameters such as voltage, current, and temperature.

[0037] The information acquisition module 20 includes but is not limited to a voltage acquisition module, a current acquisition module and a temperature acquisition module, so as to collect the voltage parameters, current parameters and temperature parameters of the battery cells in the battery pack, and send the voltage parameters, current parameters and temperature parameters to the battery management system through the circuit board 10 to realize real-time monitoring of the battery cell parameters.

[0038] Both the main circuit 110 and the standby circuit 120 are printed circuits disposed on the circuit board 10 .

[0039] The electrical connection part 30 may be a solder ball. In some embodiments, the external object may be to melt the electrical connection part 30 using an electric soldering iron. After the electrical connection part 30 is melted, it is electrically connected to the information acquisition module 20, so as to realize the connection between the information acquisition module 20 and the battery management system through the backup circuit 120. In this way, the circuit board 10 can be quickly repaired, the maintenance efficiency of the circuit board 10 can be improved, and the maintenance cost of the circuit board 10 can be reduced.

[0040] When the main circuit 110 on the circuit board 10 fails, for example, when the main circuit 110 is disconnected, the electric soldering iron melts the electrical connection part 30 and electrically connects it to the information acquisition module 20, and then the backup circuit 120 can be used to send the detected battery parameter information to the battery management system to achieve parameter acquisition and transmission.

[0041] In other embodiments of the present application, the external object may also be used to electrically connect the electrical connection portion 30 and the information acquisition module 20 using a conductive wire bundle such as a copper wire, so as to realize the connection between the information acquisition module 20 and the battery management system through the backup circuit 120 .

[0042] In some embodiments, the information acquisition module 20 includes a voltage acquisition sheet 210. One end of the voltage acquisition sheet 210 is connected to the circuit board 10, and the other end extends toward the bus of the battery cell and is welded to the bus, wherein the main circuit 110 is electrically connected to the voltage acquisition sheet 210, and the electrical connection portion 30 is configured to be electrically connected to the voltage acquisition sheet 210 under the action of an external object.

[0043] It is understandable that when the main circuit 110 is working normally, the main circuit 110 is electrically connected to the voltage collection piece 210 and the battery management system to send the voltage signal to the battery management system. When the main circuit 110 fails, the electrical connection portion 30 can be electrically connected to the voltage collection piece 210 through the action of an external object. At this time, the backup circuit 120 can be used to send the voltage signal to the battery management system. As a result, the difficulty of repairing the circuit board 10 can be greatly reduced, and there is no need to replace the circuit board 10, thereby reducing the maintenance cost.

[0044] The information acquisition module 20 is based on a voltage acquisition chip 210 to collect the voltage parameters of the battery cell. After the voltage acquisition chip 210 is connected to the bus, it can receive the electrical signal on the bus. The voltage acquisition chip 210 can only play a conductive role, which transmits the electrical signal to the battery management system, so that the battery management system can determine the voltage of the battery cell.

[0045] The voltage collection sheet 210 can be specifically overlapped on the busbar and then welded to the busbar. Specifically, the voltage collection sheet 210 and the busbar can be laser welded. The welding of the two takes a short time and improves production efficiency. It is understandable that by connecting the voltage collection sheet 210 and the busbar by laser welding, the size of the voltage collection sheet 210 can be made small enough to prevent the voltage collection sheet 210 from occupying a large welding area.

[0046] The voltage collection sheet 210 may be a nickel sheet. Since the busbar is usually made of aluminum and the potential difference between nickel and aluminum is small, using a nickel sheet as the voltage collection sheet 210 can improve the collection accuracy and alleviate the electrochemical corrosion caused by the potential difference.

[0047] In other embodiments of the present application, the voltage collection sheet 210 may also be a collection sheet made of conductive materials such as aluminum sheets, copper sheets, etc., as long as it can transmit electrical signals.

[0048] like Figure 1 As shown, in some embodiments, the voltage collection sheet 210 has a length of L1, a width of D1, and a thickness of H1, satisfying: 20 mm ≤ L1 ≤ 30 mm, 5 mm ≤ D1 ≤ 8 mm, and 0.2 mm ≤ H1 ≤ 1 mm.

[0049] It is understandable that based on the size design of the voltage collection sheet 210, the size of the voltage collection sheet 210 can be made smaller. Based on the fact that there is also an area on the busbar that is connected to other components such as the battery cell, the welding area of ​​the voltage collection sheet 210 is smaller and the space occupied is more compact. As a result, the size of the voltage collection sheet 210 is made smaller, so that the voltage collection sheet 210 and the busbar can be connected within a limited space. In addition, based on the limited space at the connection, the aforementioned laser welding method can also ensure the connection quality and efficiency when the two are connected.

[0050] The voltage collection piece 210 may be configured to be a rectangle, or may be configured to be other shapes such as a sole shape, an ellipse, etc.

[0051] In some embodiments, the length L1 of the voltage collection sheet 210 is set to 20 mm, 25 mm, 30 mm, or any value therebetween. The width D1 of the voltage collection sheet 210 is set to 5 mm, 6 mm, 7 mm, 8 mm, or any value therebetween. The height H1 of the voltage collection sheet 210 is set to 0.2 mm, 0.6 mm, 1 mm, or any value therebetween.

[0052] It is understandable that if the length L1 of the voltage collection piece 210 is too large, exceeding 30 mm, the voltage collection piece 210 may occupy the installation position of the busbar and other components, thereby interfering with the installation of other components.

[0053] If the length L1 of the voltage collection piece 210 is too small, less than 20 mm, the reliability of the connection between the voltage collection piece 210 and the busbar may be affected, resulting in an unstable connection, which affects the acquisition of voltage parameters.

[0054] If the width D1 of the voltage collection piece 210 is too large, exceeding 8 mm, the voltage collection piece 210 will extend out of the bus after overlapping the bus, which will occupy some extra space and be unfavorable for welding the voltage collection piece 210 and the bus.

[0055] If the width D1 of the voltage collection piece 210 is too small, less than 5 mm, the reliability of the connection between the voltage collection piece 210 and the busbar may be affected, resulting in an unstable connection, which affects the acquisition of voltage parameters.

[0056] If the thickness of the voltage collection sheet 210 is too large, exceeding 1 mm, it may be difficult for the laser to melt the voltage collection sheet 210 or the busbar during laser welding, increasing the difficulty of welding and being detrimental to the connection between the voltage collection sheet 210 and the busbar.

[0057] If the thickness of the voltage collection sheet 210 is too small, less than 0.2 mm, it may be difficult to control the laser power during the laser welding process, resulting in defects such as welding through of the voltage collection sheet 210 .

[0058] like Figures 2 to 4 As shown, in some embodiments, a bendable temperature measuring area 130 is constructed on the circuit board 10, and the main circuit 110 and the backup circuit 120 both extend to the temperature measuring area 130. The temperature measuring area 130 is suitable for bending in the direction of the bus and bonding to the bus. The information acquisition module 20 also includes a temperature acquisition sheet 220, which is connected to the temperature measuring area 130, the main circuit 110 is electrically connected to the temperature acquisition sheet 220, and the electrical connection portion 30 is configured to be electrically connected to the temperature acquisition sheet 220 under the action of an external object.

[0059] It is understandable that when the main circuit 110 is working normally, the main circuit 110 is electrically connected to the temperature acquisition sheet 220 and the battery management system to send the temperature signal to the battery management system. When the main circuit 110 fails, the electrical connection portion 30 can be electrically connected to the temperature acquisition sheet 220 through the action of an external object. At this time, the backup circuit 120 can be used to send the temperature signal to the battery management system. In this way, the difficulty of repairing the circuit board 10 can be greatly reduced, and there is no need to replace the circuit board 10, thereby reducing the maintenance cost.

[0060] The temperature measurement area 130 of the circuit board 10 is used to connect to the temperature acquisition sheet 220 so as to obtain the temperature parameters on the bus through the temperature acquisition sheet 220, thereby monitoring the temperature of the battery cell in real time.

[0061] The temperature acquisition sheet 220 may be a platinum sheet or a platinum resistor. The temperature sensitivity of metal platinum is high, the linear response is fast and the precision is high, and the temperature range that can be acquired during operation is large. At the same time, metal platinum also has good corrosion resistance and oxidation resistance, which makes its service life longer.

[0062] like Figure 2 As shown, the temperature collection sheet 220 can be disposed on the lower surface of the temperature measurement area 130. Figure 3 As shown, the temperature measuring area 130 can be moved toward the bus by bending downward, and the temperature collection sheet 220 located on the lower surface can be directly connected to the bus. It can be understood that the temperature collection sheet 220 can be directly pressed down to contact the bus, and then the reliable bonding of the temperature collection sheet 220 and the bus can be ensured by dispensing glue to maintain stable and effective contact between the temperature collection sheet 220 and the bus, thereby achieving temperature collection. In this way, the connection between the temperature collection sheet 220 and the bus is facilitated, and the bonding efficiency between the two is improved.

[0063] In other embodiments of the present application, the temperature acquisition sheet 220 may also be configured as other temperature sensors such as a nickel resistor or a thermistor so as to acquire the temperature parameters of the bus.

[0064] In which, since the circuit board 10 is an FPC, the temperature measuring area 130 integrally formed on the circuit board 10 can be bent.

[0065] In some embodiments, the temperature measurement area 130 may be bonded to the busbar by thermally conductive adhesive. In addition, the thermally conductive adhesive also bonds the temperature acquisition sheet 220 to the busbar, so that the temperature parameters of the busbar can be directly obtained through the temperature acquisition sheet 220.

[0066] Among them, the temperature acquisition chip 220 can be set as a square. For example, the temperature acquisition chip 220 is set as a square chip with a size of 5 mm × 5 mm, and its thickness can be set as 0.5 mm.

[0067] In other embodiments of the present application, the temperature acquisition chip 220 can also be set as other shapes such as a rectangle or an ellipse, as long as it can obtain the temperature parameters of the bus bar. For example, the temperature acquisition chip 220 is set as a rectangle, with its length being L3, width being D3, and height being H3, satisfying 1 mm ≤ L3 ≤ 10 mm, 1 mm ≤ D3 ≤ 10 mm, and 0.2 mm ≤ H3 ≤ 1 mm. For example, the length L3 of the temperature acquisition chip 220 is set as 1 mm, 5 mm, 10 mm, or any value between any two of them; the width D3 of the temperature acquisition chip 220 is set as 1 mm, 5 mm, 10 mm, or any value between any two of them; the thickness H3 of the temperature acquisition chip 220 is set as 0.1 mm, 0.5 mm, 1 mm, or any value between any two of them. Among them, within the process range and on the premise of ensuring reliable bonding between the temperature acquisition chip 220 and the bus bar, the smaller the size of the temperature acquisition chip 220, the better, so as to reduce the space occupied by the temperature acquisition chip 220 and prevent interference between the temperature acquisition chip 220 and other components on the bus bar.

[0068] As Figure 4 shown, in some embodiments, the circuit board 10 has a flexible area, and at least two angled notches 140 are formed on the flexible area. The at least two notches 140 are connected in sequence to form a non-closed bending section, so as to form a temperature measurement area 130 on the circuit board 10.

[0069] Based on the angled notches 140, a temperature measurement area 130 can be formed on the circuit board 10.

[0070] The circuit board 10 can be an FPC, then the entire circuit board 10 is a flexible area. The circuit board 10 can also be a circuit board with a combination of rigid and flexible parts. In this case, the position of the flexible circuit board is the flexible area, and the transition area between the rigid and flexible parts can be bent.

[0071] For example, if two acutely angled notches 140 are formed on the circuit board 10, a V-shaped bending area can be formed after the two notches 140 are connected. Thus, a triangular temperature measurement area 130 is formed.

[0072] For example, if three notches 140 that are vertically connected in sequence are formed on the circuit board 10, a U-shaped bending area can be formed after the three notches 140 are connected. Thus, a rectangular temperature measurement area 130 is formed.

[0073] For example, two parallel gaps 140 are constructed on the circuit board 10, and the two gaps 140 are connected through an arc-shaped gap 140, so that the three gaps 140 can be connected to form a U-shaped bending area, thereby forming a temperature measurement area 130 that combines a rectangle and a semicircle.

[0074] In some embodiments, the notch 140 passes through the circuit board 10 so that the temperature measuring area 130 can be bent downward under the action of an external force.

[0075] In other embodiments of the present application, the notch 140 may not penetrate the circuit board 10. For example, the depth of the notch 140 is equal to half the thickness of the circuit board 10, or the depth of the notch 140 is equal to two-thirds the thickness of the circuit board 10. Under the action of external force, the circuit board 10 can be directly broken at the position corresponding to the notch 140, so that the temperature measurement area 130 can be bent downward under the action of the external force.

[0076] In other embodiments of the present application, each notch 140 may also include a plurality of through holes arranged at intervals. Under the action of external force, the circuit board 10 corresponding to the rest between two adjacent through holes can be directly broken, so that the temperature measuring area 130 can be bent downward under the action of external force.

[0077] In some embodiments, a connection terminal 40 is constructed on the circuit board 10, and the information acquisition module 20 is electrically connected to the connection terminal 40, wherein the main circuit 110 is electrically connected to the connection terminal 40, and the electrical connection part 30 is configured to be electrically connected to the connection terminal 40 under the action of external objects.

[0078] Based on the connection terminal 40 constructed on the circuit board 10, the connection terminal 40 is directly electrically connected to the main circuit 110. The connection terminal 40 is connected to the electrical connection part 30 after the electrical connection part 30 is melted, or is connected to the electrical connection part 30 through a wire. In this way, the electrical connection between the information acquisition module 20 and the main circuit 110 or the backup circuit 120 is achieved.

[0079] In some embodiments, the electrical connection part 30 and the connection terminal 40 are both solder balls, wherein the electrical connection part 30 and the connection terminal 40 are arranged at intervals, and the electrical connection part 30 and the connection terminal 40 are suitable for electrical connection after melting and deformation.

[0080] Since both the electrical connection part 30 and the connection terminal 40 are solder balls, the electrical connection part 30 and the connection terminal 40 can be melted and deformed under the action of the electric soldering iron and then diffused. The two solder balls are in contact after diffusion, thereby achieving electrical connection between the two.

[0081] It is understandable that when the main circuit 110 is used normally, the electrical connection portion 30 is spaced from the connection terminal 40. At this time, the voltage parameter and the temperature parameter are fed back to the battery management system through the main circuit 110. When the main circuit 110 fails, the two solder balls are melted and deformed by the electric soldering iron to form a connection. At this time, the voltage parameter and the temperature parameter are fed back to the battery management system through the backup circuit 120.

[0082] like Figure 6 As shown, in some embodiments, the radius of the solder ball is R, and the distance between the electrical connection portion 30 and the connection terminal 40 is D2, satisfying: 1 mm ≤ R ≤ 2 mm, 1 mm ≤ D2 ≤ 2 mm.

[0083] Since both the connection terminal 40 and the electrical connection portion 30 are solder balls, and both are disposed on the circuit board 10, the radius R of the solder ball is controlled within a range of 1 mm to 2 mm to prevent the solder balls from occupying too large an area of ​​the circuit board 10 and affecting the layout of the circuit board 10. In order to prevent the two solder balls from being unable to form an electrical connection after melting, the distance D2 between the two solder balls is maintained within a range of 1 mm to 2 mm.

[0084] For example, the radius R of the solder ball is set to 1 mm, 1.5 mm, 2 mm, or any value therebetween. The distance D2 between the two solder balls is set to 1 mm, 1.5 mm, 2 mm, or any value therebetween. It is ensured that the solder ball does not affect the layout of other components of the circuit board 10, and that the two solder balls can form an electrical connection after melting.

[0085] The solder ball is hemispherical. In other embodiments of the present application, the solder ball can also be set to other shapes such as a hemispherical shape, a cuboid shape, etc., so that two solder balls are spaced apart in an unmelted state and can be electrically connected after melting.

[0086] In other embodiments of the present application, the connection terminal 40 and the electrical connection portion 30 may also be made of other fusible conductive materials, so that the two can be melted and deformed under the action of an electric soldering iron or other electric heating element to form an electrical connection.

[0087] In some embodiments, at least two main circuits 110 are disposed on the circuit board 10 , one end of each main circuit 110 is electrically connected to a connection terminal 40 , and the other end of each main circuit 110 is configured to be electrically connected to a battery management system.

[0088] It is understandable that the temperature acquisition module includes at least one voltage acquisition chip 210 and one temperature acquisition chip 220. Among them, the voltage signal and the temperature signal need to be transmitted separately using different circuits. In addition, when the voltage acquisition chip 210 and the temperature acquisition chip 220 are set to multiple, the voltage signal corresponding to each voltage acquisition chip 210 and the temperature signal corresponding to each temperature acquisition chip 220 need different circuits to be transmitted separately. Therefore, the main circuit 110 is set to at least two, and a reasonable selection is made based on the number of temperature acquisition modules, so that one end of each main circuit 110 is electrically connected to a temperature acquisition module, and the other end is electrically connected to the battery management system.

[0089] In some embodiments, the number of backup circuits 120 is the same as the number of active circuits 110 , and each backup circuit 120 serves as a backup for each active circuit 110 .

[0090] By setting the number of backup circuits 120 in a redundant manner, when only one main circuit 110 is damaged and fails, only one backup circuit 120 is used to transmit the parameter signal of the damaged main circuit 110. When multiple main circuits 110 fail at the same time, multiple backup circuits 120 are enabled to transmit the parameter signals of the multiple damaged main circuits 110 respectively.

[0091] The backup circuit 120 can be arranged in a one-to-one correspondence with the main circuit 110. For example, at least two main circuits 110 and at least two backup circuits 120 can be arranged in pairs. It can be understood that for each pair of main circuits 110 and backup circuits 120, the backup circuit 120 is only used as a backup for the main circuit 110, and cannot be used as a backup for other main circuits 110. Each main circuit 110 has a backup circuit 120, and when the main circuit 110 fails, the backup circuit 120 corresponding to the main circuit 110 is enabled. If multiple main circuits 110 fail, the backup circuits 120 corresponding to the multiple main circuits 110 are enabled respectively. This improves maintenance efficiency and ensures the accuracy of parameter signal transmission.

[0092] Each backup circuit 120 may also be used as a backup for any main circuit 110. For example, when one of the main circuits 110 is damaged and fails, any backup circuit 120 may be selected to transmit the parameter signal of the damaged main circuit 110.

[0093] like Figure 5As shown, for example, if four main circuits 110 are provided, four backup circuits 120 are also provided. One end of each main circuit 110 is electrically connected to a connection terminal 40, and the other end of each main circuit 110 is electrically connected to the battery management system. One end of each backup circuit 120 is formed with an electrical connection portion 30, and the other end of each backup circuit 120 is electrically connected to the battery management system.

[0094] In some embodiments, the number of backup circuits 120 is less than the number of active circuits 110 , and each backup circuit 120 serves as a backup for at least part of the active circuits 110 .

[0095] Since each backup circuit 120 serves as a backup for at least a portion of the main circuit 110 , the number of backup circuits 120 can be reduced, thereby reducing the manufacturing cost of the circuit board 10 .

[0096] like Figure 6 and Figure 7 As shown, for example, four main circuits 110 are provided, and one backup circuit 120 is provided. One end of each main circuit 110 is electrically connected to a connection terminal 40, and the other end of each main circuit 110 is electrically connected to a battery management system. The backup circuit 120 may be electrically connected to four electrical connection parts 30, and each electrical connection part 30 is respectively arranged at intervals at each connection terminal 40. When one of the main circuits 110 is damaged, the connection terminal 40 and the electrical connector corresponding to the main circuit 110 may be connected, so that the parameter signal of the main circuit 110 is transmitted through the backup circuit 120.

[0097] like Figure 7 As shown, the four electrical connection parts 30 to which the backup circuit 120 is electrically connected can be electrically connected on the surface layer of the circuit board 10. Figure 6 As shown, the four electrical connection parts 30 electrically connected to the backup circuit 120 can form an electrical connection in the middle layer of the circuit board 10. At this time, the circuit board 10 can be a multi-layer circuit board 10.

[0098] In some embodiments, the number of main circuits 110 may be 4 and the number of backup circuits 120 may be 2. Then each backup circuit 120 serves as a backup for two main circuits 110. Alternatively, each backup circuit 120 serves as a backup for four main circuits 110, and the backup circuits 120 are designed to be redundant, so as to ensure that there are sufficient backup circuits 120 for repair when multiple main circuits 110 are damaged.

[0099] On the other hand, an embodiment of the present application further provides a battery pack, which includes the information collection device in the above embodiment.

[0100] In some embodiments, by arranging the main circuit 110 and the backup circuit 120 on the circuit board 10, when the main circuit 110 works normally, the main circuit 110 is electrically connected to the information acquisition module 20 and the battery management system to send the collected parameter signal to the battery management system. When the main circuit 110 fails, the electrical connection part 30 can be electrically connected to the information acquisition module 20 through the action of an external object. At this time, the backup circuit 120 can be used to send the parameter signal to the battery management system. In this way, the difficulty of repairing the circuit board 10 can be greatly reduced, and there is no need to replace the circuit board 10, thereby reducing the maintenance cost.

[0101] The above is a detailed introduction to the embodiments of the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for technicians in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. An information collection device, characterized in that: include: A circuit board having a main circuit and a backup circuit; An information acquisition module is installed on the circuit board; Among them, one end of the main circuit is electrically connected to the information acquisition module, and the other end of the main circuit is configured to be electrically connected to the battery management system. One end of the backup circuit is constructed with an electrical connection part, and the electrical connection part is configured to be electrically connected to the information acquisition module under the action of external objects, and the other end of the backup circuit is configured to be electrically connected to the battery management system.

2. The information collection device according to claim 1, characterized in that: The information collection module includes: A voltage collection sheet has one end connected to the circuit board and the other end extending toward the bus of the battery cell and welded to the bus, wherein the main circuit is electrically connected to the voltage collection sheet, and the electrical connection portion is configured to be electrically connected to the voltage collection sheet under the action of an external object.

3. The information collection device according to claim 2, characterized in that: The voltage collection sheet has a length of L1, a width of D1, and a thickness of H1, which satisfies the following conditions: 20 mm ≤ L1 ≤ 30 mm, 5 mm ≤ D1 ≤ 8 mm, and 0.2 mm ≤ H1 ≤ 1 mm.

4. The information collection device according to claim 1, characterized in that: A bendable temperature measuring area is constructed on the circuit board, and the main circuit and the backup circuit both extend to the temperature measuring area. The temperature measuring area is suitable for bending toward the bus of the battery cell and bonding to the bus. The information acquisition module also includes a temperature acquisition sheet, which is connected to the temperature measuring area, the main circuit is electrically connected to the temperature acquisition sheet, and the electrical connection portion is configured to be electrically connected to the temperature acquisition sheet under the action of an external object.

5. The information collection device according to claim 4, characterized in that: The circuit board has a flexible area, and at least two notches arranged at an angle are constructed on the flexible area. The at least two notches are connected in sequence to form a non-closed bending section to form the temperature measurement area on the circuit board.

6. The information collection device according to any one of claims 1 to 5, characterized in that: The circuit board is provided with a connection terminal, the information acquisition module is electrically connected to the connection terminal, wherein the main circuit is electrically connected to the connection terminal, and the electrical connection portion is configured to be electrically connected to the connection terminal under the action of an external object.

7. The information collection device according to claim 6, characterized in that: The electrical connection portion and the connection terminal are both solder balls, wherein the electrical connection portion and the connection terminal are arranged at intervals, and the electrical connection portion and the connection terminal are suitable for electrical connection after melting and deformation.

8. The information collection device according to claim 7, characterized in that: The radius of the solder ball is R, and the distance between the electrical connection portion and the connection terminal is D2, which satisfies: 1 mm ≤ R ≤ 2 mm, 1 mm ≤ D2 ≤ 2 mm.

9. The information collection device according to claim 6, characterized in that: At least two main circuits are arranged on the circuit board, one end of each main circuit is electrically connected to one of the connection terminals, and the other end of each main circuit is configured to be electrically connected to the battery management system; wherein, The number of the backup circuits is the same as the number of the main circuits, and each of the backup circuits serves as a backup for each of the main circuits; Alternatively, the number of the backup circuits is less than the number of the main circuits, and each of the backup circuits serves as a backup for at least part of the main circuits.

10. A battery pack, characterized in that: It comprises the information collection device as described in any one of claims 1-9.

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