Power adapter and electronic equipment

Abstract

The utility model provides a power adapter and an electronic device, and the power adapter comprises a circuit board which is provided with a first surface and a second surface which are arranged oppositely; the first electronic component group and the second electronic component group are arranged on the first surface side by side in the first direction, the first electronic component group comprises a transformer and an electrolytic capacitor, and the transformer is arranged away from the second electronic component group; the second electronic component group comprises a bridge rectifier, an X capacitor and an input common mode inductor which are arranged side by side along a second direction, and an included angle is formed between the first direction and the second direction; and the third electronic component group is arranged on the second surface, and the third electronic component group comprises a first MOS (Metal Oxide Semiconductor) unit and a second MOS unit. The electronic components on the circuit board can be arranged more compactly and reasonably, so that the size occupied by the electronic components is reduced, the size of the power adapter is further reduced, and meanwhile heat dissipation is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of power supply, in particular to a power adapter and electronic equipment. Background Art

[0002] As the performance requirements of laptops are getting higher and higher, the power they require is also getting higher and higher. As the power requirements increase, the size of the power adapter also increases, and at the same time, the heat dissipation requirements also increase, which further leads to an increase in the size of the power adapter. The increase in the size of the power adapter makes it inconvenient to carry. Utility Model Content

[0003] The embodiments of the utility model provide a power adapter and an electronic device, which can improve the technical problem of large volume of the existing power adapter.

[0004] In a first aspect, an embodiment of the present utility model provides a power adapter, comprising:

[0005] A circuit board having a first surface and a second surface disposed opposite to each other;

[0006] A first electronic component group and a second electronic component group are arranged side by side on the first surface along a first direction, the first electronic component group includes a transformer and an electrolytic capacitor, the transformer is arranged away from the second electronic component group, the second electronic component group includes a rectifier bridge stack, an X capacitor and an input common-mode inductor arranged side by side along a second direction, and an angle is formed between the first direction and the second direction;

[0007] The third electronic component group is disposed on the second surface, and the third electronic component group includes a first MOS unit and a second MOS unit.

[0008] In the embodiment of the utility model, by arranging the rectifier bridge stack, X capacitor and input common mode inductor of similar volume side by side, arranging the electrolytic capacitor and transformer of similar volume side by side, and then arranging the rectifier bridge stack, X capacitor and input common mode inductor arranged side by side with the electrolytic capacitor and transformer, the layout of the electronic components on the circuit board can be made more compact and reasonable, thereby reducing the volume occupied by the electronic components, and further reducing the volume of the power adapter; by arranging the first MOS unit and the second MOS unit on the second surface of the circuit board, the number of components on the first surface of the circuit board can be reduced, so that the components on the first surface occupy a smaller overall space, and further saving space. At the same time, the electrolytic capacitor is separated between the rectifier bridge stack of the heating element and the transformer, so that the rectifier bridge stack can be kept as far away from the transformer as possible, avoiding heat superposition and facilitating heat dissipation.

[0009] In one embodiment, the power adapter also includes an L-shaped heat sink, which has a first extension portion and a second extension portion connected to each other, the first extension portion is arranged on a side of the first electronic component group away from the circuit board, and the second extension portion is arranged on a side of the second electronic component group.

[0010] In the embodiment of the utility model, an L-shaped heat sink is used to cover the first electronic component group and the second electronic component group, thereby improving the heat dissipation efficiency and making full use of the space.

[0011] In one embodiment, the first extension portion covers a side of the electrolytic capacitor, the transformer, and the X capacitor that is away from the circuit board; and / or

[0012] The rectifier bridge stack, the X capacitor and the input common-mode inductor are arranged side by side in sequence, or the rectifier bridge stack, the input common-mode inductor and the X capacitor are arranged side by side in sequence, and the second extension portion covers a side of the rectifier bridge stack away from the X capacitor.

[0013] In the embodiment of the utility model, the first extension portion covers the side of the electrolytic capacitor, the transformer and the X capacitor away from the circuit board, so that the heat dissipation effect can be improved. The second extension portion covers the side of the rectifier bridge stack away from the X capacitor, so that the rectifier bridge stack can fully dissipate heat, thereby improving the heat dissipation effect. By locating the rectifier bridge stack outside the second electronic component group, the processing and installation of the L-shaped heat sink can be facilitated.

[0014] In one embodiment, the first MOS unit is a primary-side Cool MOS, the second MOS unit is a synchronous rectification MOS, and a chip optocoupler is disposed on the second surface.

[0015] In the embodiment of the utility model, by arranging the primary Cool MOS, synchronous rectification MOS, and chip optocoupler on the second surface, their installation can be facilitated, and automated operation can be realized, saving labor; furthermore, the primary Cool MOS is not on the same surface as the transformer and the inductor, so the primary Cool MOS can be kept as far away from the transformer and the inductor as possible to avoid being affected by the thermal field of the transformer and the inductor.

[0016] In one embodiment, the distance between the primary Cool MOS and the synchronous rectification MOS is 10 mm-30 mm.

[0017] In the embodiment of the present invention, by controlling the distance between the primary Cool MOS and the synchronous rectification MOS, the safety regulations are met and the heat dissipation uniformity of the second surface can be improved.

[0018] In one embodiment, the distance between the electrolytic capacitor and the transformer is 0.5 mm-2 mm.

[0019] In the embodiment of the utility model, by controlling the distance between the electrolytic capacitor and the transformer, the volume occupied by the electrolytic capacitor and the transformer can be made smaller while meeting the installation requirements.

[0020] In one embodiment, the minimum distance between the second electronic component group and the electrolytic capacitor is 0.5 mm.

[0021] In the embodiment of the utility model, by controlling the distance between the second electronic component group and the electrolytic capacitor, the volume occupied by the electrolytic capacitor and the second electronic component group can be made smaller while meeting the installation requirements.

[0022] In one embodiment, the first direction is perpendicular to the second direction.

[0023] In an embodiment of the utility model, by arranging the side-by-side direction of each electronic component (rectifier bridge stack, X capacitor and input common-mode inductor) in the second electronic component group perpendicularly to the side-by-side direction of the second electronic component group and the transformer and electrolytic capacitor, the transformer, electrolytic capacitor, rectifier bridge stack, X capacitor and input common-mode inductor can be arranged more neatly and compactly, thereby reducing the volume occupied by the electronic components, and further reducing the volume of the power adapter.

[0024] In one embodiment, the power adapter also includes a shell, an insulating sheet and a heat sink, the shell includes an upper shell arranged opposite to the first surface and a lower shell arranged opposite to the second surface, the insulating sheet and the heat sink are arranged between the circuit board and the lower shell, and the insulating sheet is arranged between the heat sink and the circuit board.

[0025] In the embodiment of the utility model, the heat sink can fully dissipate heat from the electronic components on the second surface, thereby improving heat dissipation efficiency and effectively utilizing space. In a second aspect, the embodiment of the utility model provides an electronic device, including the above-mentioned power adapter. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 is an exploded view of a power adapter provided in an embodiment of the utility model;

[0028] Figure 2is a top view of a power adapter provided by an embodiment of the utility model (the L-shaped heat sink and the housing are not shown);

[0029] Figure 3 It is a bottom view of the power adapter provided by an embodiment of the utility model (the insulating sheet, heat sink and housing are not shown).

[0030] Description of the drawings: circuit board -10; first surface -11; second surface -12; first electronic component group -20; transformer -21; electrolytic capacitor -22; second electronic component group -30; rectifier bridge stack -31; X capacitor -32; input common mode inductor -33; third electronic component group -40, primary side Cool MOS -41; synchronous rectifier MOS -42; L-shaped heat sink -50; first extension part -51; second extension part -52; SMD optical coupler -60; insulating sheet -70; heat sink -80; shell -90; upper shell -91; lower shell -92. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the utility model, and are not used to limit the utility model. In the utility model, unless otherwise stated, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0032] First, see Figures 1 to 3 , an embodiment of the utility model provides a power adapter, comprising:

[0033] The circuit board 10 has a first surface 11 and a second surface 12 disposed opposite to each other;

[0034] A first electronic component group 20 and a second electronic component group 30 are arranged side by side on the first surface 11 along a first direction, the first electronic component group 20 includes a transformer 21 and an electrolytic capacitor 22, the transformer 21 is arranged away from the second electronic component group 30, the second electronic component group 30 includes a rectifier bridge stack 31, an X capacitor 32 and an input common mode inductor 33 arranged side by side along a second direction, and there is an angle between the first direction and the second direction;

[0035] The third electronic component group 40 is disposed on the second surface 12 , and the third electronic component group 40 includes a first MOS unit and a second MOS unit.

[0036] It can be understood that the rectifier bridge stack 31, X capacitor 32 and input common mode inductor 33 arranged side by side along the second direction can be rectifier bridge stack 31, X capacitor 32, input common mode inductor 33 arranged side by side in sequence, or X capacitor 32, rectifier bridge stack 31, input common mode inductor 33 arranged side by side in sequence, or rectifier bridge stack 31, input common mode inductor 33, X capacitor 32 arranged side by side in sequence, wherein rectifier bridge stack 31, X capacitor 32, input common mode inductor 33 arranged side by side in sequence can make the heating element and input common mode inductor 33 farther away. The angle between the first direction and the second direction can be 45° to 90°, which can make the overall space occupied by transformer 21, electrolytic capacitor 22, rectifier bridge stack 31, X capacitor 32 and input common mode inductor 33 relatively small. The side-by-side arrangement can be that the electronic components are arranged side by side adjacent to each other, that is, there are no other electronic components between the side-by-side electronic components, or can be arranged side by side with intervals, that is, there are other electronic components between the side-by-side electronic components. The size of other components to be arranged on the circuit board 10 can be selected, and it is only necessary to make the overall space occupied by the electronic components on the circuit board 10 as small as possible. The circuit board 10 can adopt a 1.2mm thick single-layer PCB board, which can save cost and space. In addition, the input voltage range of the power adapter of the present application is wide, up to 100-240Vac, which is suitable for the input voltage of most countries in the world, and the output power can reach up to 65W, which is suitable for working in a harsh environment of 45 degrees.

[0037] It can be understood that the length direction of the electrolytic capacitor, the length direction of the transformer and the second direction can be parallel to each other, or there is an angle less than 45°. It can be selected according to the size of other components that need to be set on the circuit board 10. It is only necessary to make the overall space occupied by the electronic components on the circuit board 10 as small as possible.

[0038] In one embodiment, the length direction of the electrolytic capacitor 22 , the length direction of the transformer 21 , and the second direction are parallel to each other.

[0039] It can be understood that when the length direction of the electrolytic capacitor 22 and the length direction of the transformer 21 are parallel to each other, the overall space occupied by the transformer 21, the electrolytic capacitor 22, the rectifier bridge 31, the X capacitor 32 and the input common-mode inductor 33 can be reduced.

[0040] In one embodiment, the first direction is perpendicular to the second direction.

[0041] In one embodiment, the distance between the electrolytic capacitor 22 and the transformer 21 is 0.5 mm-2 mm.

[0042] It can be understood that, since the outer surfaces of the electrolytic capacitor 22 and the transformer 21 are irregular in shape, the distance between the two is defined as the distance between the two closest points on them. The distance between the electrolytic capacitor 22 and the transformer 21 refers to the distance between the two closest points on the outer surfaces of the electrolytic capacitor 22 and the transformer 21.

[0043] In one embodiment, the minimum distance between the second electronic component group 30 and the electrolytic capacitor 22 is 0.5 mm.

[0044] In one embodiment, the power adapter also includes an L-shaped heat sink 50, which has a first extension portion 51 and a second extension portion 52 connected to each other, wherein the first extension portion 51 is arranged on a side of the first electronic component group 20 away from the circuit board 10, and the second extension portion 52 is arranged on a side of the second electronic component group 30.

[0045] It can be understood that the L-shaped heat sink 50 can be fixedly arranged on the circuit board 10. The first extension portion 51 and the second extension portion 52 of the L-shaped heat sink 50 can be perpendicular to each other or at an angle, and can be arranged according to the shape of the electronic component contacted by the L-shaped heat sink 50, so as to reduce the space occupied by the entire circuit board 10 covering the L-shaped heat sink 50. The first extension portion 51 and the second extension portion 52 of the L-shaped heat sink 50 can be planar or non-planar, and can be arranged according to the shape of the electronic component contacted by the L-shaped heat sink 50, so as to reduce the space occupied by the entire circuit board 10 covering the L-shaped heat sink 50. The first extension portion 51 is arranged on the side of the first electronic component group 20 away from the circuit board 10, and the first extension portion 51 can be in direct contact with the side of the first electronic component group 20 away from the circuit board 10, or other components can be arranged between the first extension portion 51 and the side of the first electronic component group 20 away from the circuit board 10. The second extension portion 52 is disposed on one side of the second electronic component group 30 . The second extension portion 52 may be in direct contact with the one side of the second electronic component group 30 , or other components may be disposed between the second extension portion 52 and the one side of the second electronic component group 30 .

[0046] In one embodiment, the first extension portion 51 covers a side of the electrolytic capacitor 22 , the transformer 21 , and the X capacitor 32 that is away from the circuit board 10 .

[0047] It can be understood that the first extension portion 51 covers the side of the electrolytic capacitor 22, the transformer 21 and the X capacitor 32 away from the circuit board 10. The first extension portion 51 may cover a part of the surface of the side of the electrolytic capacitor 22, the transformer 21 and the X capacitor 32 away from the circuit board 10, or the first extension portion 51 may cover the entire surface of the side of the electrolytic capacitor 22, the transformer 21 and the X capacitor 32 away from the circuit board 10. Covering the entire surface can improve the heat dissipation effect. At the same time, the first extension portion 51 does not cover the input common-mode inductor 33, so that the input common-mode inductor 33 can keep a distance from the heat sink, thereby avoiding the input common-mode inductor 33 contacting the heat sink to cause a short circuit.

[0048] In one embodiment, the rectifier bridge stack 31 , the X capacitor 32 and the input common-mode inductor 33 are arranged side by side in sequence, or the rectifier bridge stack 31 , the input common-mode inductor 33 and the X capacitor 32 are arranged side by side in sequence, and the second extension portion 52 covers a side of the rectifier bridge stack 31 away from the X capacitor 32 .

[0049] It can be understood that the second extension portion 52 covers the side of the rectifier bridge stack 31 away from the X capacitor 32. The second extension portion 52 can cover part of the side of the rectifier bridge stack 31 away from the X capacitor 32, or the second extension portion 52 can cover the entire side of the rectifier bridge stack 31 away from the X capacitor 32. Covering the entire side can improve the heat dissipation effect.

[0050] In one embodiment, the first MOS unit is a primary Cool MOS 41 , the second MOS unit is a synchronous rectification MOS 42 , and a chip optocoupler 60 is disposed on the second surface 12 .

[0051] It can be understood that the primary-side Cool MOS 41 can be a surface-mount Cool MOS.

[0052] In one embodiment, the distance between the primary Cool MOS 41 and the synchronous rectification MOS 42 is 10 mm-30 mm.

[0053] It can be understood that the distance between the primary Cool MOS 41 and the synchronous rectification MOS 42 refers to the distance between the two nearest points on the surface of the primary Cool MOS 41 and the surface of the synchronous rectification MOS 42 .

[0054] In one embodiment, the power adapter also includes a shell, an insulating sheet 70 and a heat sink 80, the shell includes an upper shell 91 arranged opposite to the first surface 11 and a lower shell 92 arranged opposite to the second surface 12, the insulating sheet 70 and the heat sink 80 are arranged between the circuit board 10 and the lower shell 92, and the insulating sheet 70 is arranged between the heat sink 80 and the circuit board 10.

[0055] It can be understood that, since the heights of the primary Cool MOS 41, the synchronous rectification MOS 42, and the patch optocoupler 60 on the second surface 12 are similar, the heat sink 80 can be arranged in a flat manner, thereby improving the heat dissipation efficiency, making more efficient use of space, and having more cost advantages. The heat sink 80 and the L-shaped heat sink 50 are also arranged in the shell 90, and the heat sink 80 and the L-shaped heat sink 50 are arranged adjacent to the shell 90, so that the heat sink 80 and the L-shaped heat sink 50 can conduct heat through the shell 90. The shape of the shell 90 can be set according to the shape and size of the components inside it, so that the external volume of the power adapter can be smaller. The heat sink 80 and the L-shaped heat sink 50 can be made of aluminum, copper and other materials. The layout of the electronic components in the present application allows the electronic components to be arranged as close to the middle of the circuit board 10 as possible, so the shell 90 can adopt an arc-shaped shell, which helps to reduce the volume of the power adapter.

[0056] In a second aspect, an embodiment of the present utility model provides an electronic device, comprising the above-mentioned power adapter.

[0057] The above is a detailed introduction to the embodiments of the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for technicians in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A power adapter, characterized in that: include: A circuit board having a first surface and a second surface disposed opposite to each other; A first electronic component group and a second electronic component group are arranged side by side on the first surface along a first direction, the first electronic component group includes a transformer and an electrolytic capacitor, the transformer is arranged away from the second electronic component group, the second electronic component group includes a rectifier bridge stack, an X capacitor and an input common-mode inductor arranged side by side along a second direction, and an angle is formed between the first direction and the second direction; The third electronic component group is disposed on the second surface, and the third electronic component group includes a first MOS unit and a second MOS unit.

2. The power adapter according to claim 1, characterized in that: The power adapter also includes an L-shaped heat sink having a first extension portion and a second extension portion connected to each other, the first extension portion being arranged on a side of the first electronic component group away from the circuit board, and the second extension portion being arranged on a side of the second electronic component group.

3. The power adapter according to claim 2, characterized in that: The first extension portion covers a side of the electrolytic capacitor, the transformer, and the X capacitor that is away from the circuit board; and / or The rectifier bridge stack, the X capacitor and the input common-mode inductor are arranged side by side in sequence, or the rectifier bridge stack, the input common-mode inductor and the X capacitor are arranged side by side in sequence, and the second extension portion covers a side of the rectifier bridge stack away from the X capacitor.

4. The power adapter according to claim 1, characterized in that: The first MOS unit is a primary-side Cool MOS, the second MOS unit is a synchronous rectification MOS, and a chip optocoupler is arranged on the second surface.

5. The power adapter according to claim 4, characterized in that: The distance between the primary CoolMOS and the synchronous rectification MOS is 10 mm-30 mm.

6. The power adapter according to claim 1, characterized in that: The distance between the electrolytic capacitor and the transformer is 0.5 mm-2 mm.

7. The power adapter according to claim 1, characterized in that: The minimum distance between the second electronic component group and the electrolytic capacitor is 0.5 mm.

8. The power adapter according to claim 1, characterized in that: The first direction is perpendicular to the second direction.

9. The power adapter according to claim 1, characterized in that: The power adapter also includes a shell, an insulating sheet and a heat sink, the shell includes an upper shell arranged opposite to the first surface and a lower shell arranged opposite to the second surface, the insulating sheet and the heat sink are arranged between the circuit board and the lower shell, and the insulating sheet is arranged between the heat sink and the circuit board.

10. An electronic device, characterized in that: Comprising a power adapter as described in any one of claims 1-9.

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