High-efficiency heat dissipation circuit board

Abstract

The utility model discloses an efficient heat dissipation circuit board, which comprises a circuit board body, two heat dissipation pieces are symmetrically and fixedly connected to the side wall of the upper side of the circuit board body, a mounting plate is fixedly connected to the circuit board body, a heat dissipation fan is fixedly connected to the mounting plate, and the heat dissipation fan is fixedly connected to the circuit board body. The side, close to the heat dissipation piece, of the heat dissipation fan is fixedly connected with an air guide frame, the inner wall of the air guide frame is fixedly connected with an air partition plate, the air partition plate is fixedly connected with an air guide plate, the air guide plate inclines towards the side close to the heat dissipation piece, and the side, away from the air partition plate, of the air guide plate is fixedly connected with a guide plate. The guide plate and the heat dissipation piece are arranged in parallel. According to the utility model, the heat dissipation pieces and the heat dissipation fan can be matched with each other, and air blown by the heat dissipation fan can cover the two heat dissipation pieces, so that the use effect of the heat dissipation fan is effectively improved, the heat dissipation efficiency of the circuit board is effectively improved, and the operation stability of the circuit board is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board with high-efficiency heat dissipation. Background Art

[0002] Circuit boards are an important part of electronic equipment. They miniaturize and visualize circuits, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Circuit boards are mainly used to connect various electronic components in electronic equipment and serve as structural supports.

[0003] When an existing circuit board is in use, heat is generated due to the passage of electric current. This heat will cause the overall temperature of the circuit board to rise, thereby reducing the stability of the circuit board's operation. Therefore, a heat dissipation structure needs to be installed to assist in heat dissipation. In the prior art, a fan is generally configured to dissipate heat for the circuit board. However, fans on the market generally have fixed size specifications. For some circuit board structures, one fan cannot cover the overall heat dissipation. Using two fans is costly and also causes the size and volume of the entire structure to be larger. Utility Model Content

[0004] The purpose of the utility model is to provide a circuit board with high efficiency in heat dissipation, so as to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] The utility model provides a circuit board with high efficiency in heat dissipation, comprising a circuit board body, wherein two heat dissipating elements are symmetrically fixedly connected to the side walls on the upper side of the circuit board body, a mounting plate is fixedly connected to the circuit board body, a heat dissipating fan is fixedly connected to the mounting plate, an air guide frame is fixedly connected to a side of the heat dissipating fan close to the heat dissipating element, an air baffle plate is fixedly connected to the inner wall of the air guide frame, an air guide plate is fixedly connected to the air baffle plate, the air guide plate is inclined toward a side close to the heat dissipating element, a guide plate is fixedly connected to a side of the air guide plate away from the air baffle plate, and the guide plate is arranged parallel to the heat dissipating element.

[0007] Furthermore, the heat sink includes a heat collecting plate fixedly connected to the circuit board body, a plurality of heat dissipating fins are fixedly connected to the vertical side wall of the heat collecting plate, and the plurality of heat dissipating fins are evenly distributed on the heat collecting plate. The specific materials of the heat collecting plate and the heat dissipating fins are both aluminum.

[0008] Furthermore, two heat-conducting plates are symmetrically fixedly connected to the vertical side wall of the heat collecting plate close to the lower side, and a thermally conductive silicone grease layer is coated between the heat-conducting plates and the circuit board body.

[0009] Furthermore, a shock-absorbing gasket is fixedly connected to the side wall of the lower side of the heat dissipation fan. The specific material of the shock-absorbing gasket is insulating rubber. The thickness of the shock-absorbing gasket is greater than the distance between the lower side of the heat dissipation fan and the circuit board body.

[0010] Furthermore, ventilation holes are formed on the plurality of heat dissipation fins, and the plurality of ventilation holes are evenly distributed on the heat dissipation fins.

[0011] Furthermore, two rubber strips are symmetrically fixedly connected to one side of the air guide frame close to the heat collecting plate, and the rubber strips are tightly fitted to the heat sink.

[0012] Furthermore, a first wind shield is fixedly connected to the side wall on the upper side of the wind guide plate, and a second wind shield is fixedly connected between the wind guide frame and the cooling fan.

[0013] Furthermore, two screw holes are provided on the mounting plate and the heat dissipation fan, and the inner threads of the screw holes are sleeved with hexagon socket screws.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] The utility model provides the heat sink, mounting plate, cooling fan, air guide frame, air partition, air guide plate and guide plate, when in use, the heat on the circuit board body is transferred to the two heat sinks, the two heat sinks can assist the circuit board body in dissipating the heat, the cooling fan is powered on and runs, the cooling fan blows cold air in the direction of the heat sink, the cold air blows directly toward one of the heat sinks and electrical components on a part of the circuit board body, thereby assisting in the heat dissipation of one heat sink and electrical components on a part of the circuit board body, the airflow blown out by the cooling fan can be blown toward the other heat sink through the air partition, air guide plate and guide plate which cooperate with each other, thereby enabling the air blown out by the cooling fan to cover the two heat sinks, effectively improving the use effect of the cooling fan, thereby effectively improving the heat dissipation efficiency of the circuit board, and improving the stability of the circuit board operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is the front view of the utility model;

[0018] Figure 3 for Figure 1 Schematic diagram of the connection structure between the cooling fan and the air guide plate;

[0019] Figure 4 for Figure 1 Schematic diagram of the structure of the heat sink.

[0020] In the figure: 1. circuit board body; 2. heat sink; 3. mounting plate; 4. cooling fan; 5. air guide frame; 6. air baffle; 7. air guide plate; 8. guide plate; 9. heat collecting plate; 10. heat dissipation fins; 11. heat conducting plate; 12. thermal grease layer; 13. shock absorbing gasket; 14. ventilation hole; 15. rubber strip; 16. first wind shield; 17. second wind shield; 18. hexagon socket screw. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4 The utility model provides a circuit board with high efficiency in heat dissipation, comprising a circuit board body 1, wherein two heat sinks 2 are symmetrically fixedly connected to the side walls on the upper side of the circuit board body 1, a mounting plate 3 is fixedly connected to the circuit board body 1, a heat dissipation fan 4 is fixedly connected to the mounting plate 3, a wind guide frame 5 is fixedly connected to the side of the heat dissipation fan 4 close to the heat sink 2, a wind baffle plate 6 is fixedly connected to the inner wall of the wind guide frame 5, a wind baffle plate 6 is fixedly connected to the wind baffle plate 6, a wind guide plate 7 is fixedly connected to the wind baffle plate 6, the wind guide plate 7 is inclined toward the side close to the heat sink 2, a guide plate 8 is fixedly connected to the side of the wind guide plate 7 away from the wind baffle plate 6, and the guide plate 8 is arranged parallel to the heat sink 2.

[0023] In the above embodiment, when in use, the heat on the circuit board body 1 is transferred to the two heat sinks 2, and the two heat sinks 2 can assist the circuit board body 1 in dissipating heat. The cooling fan 4 is powered on and runs, and the cooling fan 4 blows cold air in the direction of the heat sink 2. The cold air blows directly toward one of the heat sinks 2 and some electrical components on the circuit board body 1, thereby assisting in dissipating heat for one heat sink 2 and some electrical components on the circuit board body 1. The airflow blown out by the cooling fan 4 can be blown toward the other heat sink 2 through the wind baffle 6, the wind guide plate 7 and the guide plate 8, thereby enabling the wind blown out by the cooling fan 4 to cover the two heat sinks 2, thereby effectively improving the use effect of the cooling fan 4, thereby effectively improving the heat dissipation efficiency of the circuit board, and improving the stability of the circuit board operation.

[0024] The heat sink 2 includes a heat collecting plate 9 fixedly connected to the circuit board body 1, and a plurality of heat dissipating fins 10 are fixedly connected to the vertical side walls of the heat collecting plate 9. The plurality of heat dissipating fins 10 are evenly distributed on the heat collecting plate 9. The specific materials of the heat collecting plate 9 and the heat dissipating fins 10 are both aluminum. The heat collecting plate 9 can collect heat on the circuit board body 1, and the plurality of aluminum heat dissipating fins 10 can increase the heat dissipation area, thereby improving the heat dissipation efficiency.

[0025] The heat collecting plate 9 has two heat conducting plates 11 symmetrically and fixedly connected to the vertical side wall near the lower side, and a thermal grease layer 12 is coated between the heat conducting plate 11 and the circuit board body 1. The provided heat conducting plate 11 and thermal grease layer 12 can improve the heat collection efficiency of the heat collecting plate 9 and improve the snare efficiency of the heat sink 2.

[0026] A shock-absorbing gasket 13 is fixedly connected to the side wall on the lower side of the cooling fan 4. The specific material of the shock-absorbing gasket 13 is insulating rubber. The thickness of the shock-absorbing gasket 13 is greater than the distance between the lower side of the cooling fan 4 and the circuit board body 1. The provided shock-absorbing gasket 13 can avoid noise generated by collision between the cooling fan 4 and the circuit board body 1.

[0027] Ventilation holes 14 are formed on the plurality of heat dissipation fins 10 . The plurality of ventilation holes 14 are evenly distributed on the heat dissipation fins 10 . The provided ventilation holes 14 can improve the heat dissipation efficiency of the heat dissipation fins 10 .

[0028] Two rubber strips 15 are symmetrically fixedly connected to one side of the air guide frame 5 close to the heat collecting plate 9 . The rubber strips 15 are tightly fitted to the heat sink 2 . The provided rubber strips 15 can reduce the noise generated by the mutual vibration between the air guide frame 5 and the heat sink 2 .

[0029] A first wind shield 16 is fixedly connected to the side wall on the upper side of the wind guide plate 7, and a second wind shield 17 is fixedly connected between the wind guide frame 5 and the cooling fan 4. The first wind shield 16 and the second wind shield 17 can reduce the loss of airflow blown out by the cooling fan 4, thereby improving the wind guiding effect of the wind guide plate 7.

[0030] The mounting plate 3 and the cooling fan 4 are both provided with two screw holes, and the inner threads of the screw holes are sleeved with hexagon socket screws 18 . The provision of the hexagon socket screws 18 can improve the convenience and stability of the installation of the cooling fan 4 .

[0031] Working principle: When in use, the heat on the circuit board body 1 is transferred to the two heat sinks 2, and the two heat sinks 2 can assist the circuit board body 1 in dissipating heat. The cooling fan 4 is powered on and runs, and the cooling fan 4 blows cold air in the direction of the heat sink 2. The cold air blows directly toward one of the heat sinks 2 and some electrical components on the circuit board body 1, thereby assisting in dissipating heat for one heat sink 2 and some electrical components on the circuit board body 1. The airflow blown out by the cooling fan 4 can be blown toward the other heat sink 2 through the wind baffle 6, the wind guide plate 7 and the guide plate 8, so that the wind blown out by the cooling fan 4 can cover the two heat sinks 2, effectively improving the use effect of the cooling fan 4, thereby effectively improving the heat dissipation efficiency of the circuit board, and improving the stability of the circuit board operation.

[0032] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board with high heat dissipation efficiency, comprising a circuit board body (1), characterized in that: Two heat sinks (2) are symmetrically fixedly connected to the side walls on the upper side of the circuit board body (1); a mounting plate (3) is fixedly connected to the circuit board body (1); a heat dissipation fan (4) is fixedly connected to the mounting plate (3); a wind guide frame (5) is fixedly connected to the side of the heat dissipation fan (4) close to the heat sink (2); a wind baffle (6) is fixedly connected to the inner wall of the wind guide frame (5); a wind guide plate (7) is fixedly connected to the wind baffle (6); the wind guide plate (7) is inclined toward the side close to the heat sink (2); a guide plate (8) is fixedly connected to the side of the wind guide plate (7) away from the wind baffle (6); and the guide plate (8) is arranged parallel to the heat sink (2).

2. The circuit board with high heat dissipation efficiency according to claim 1, characterized in that: The heat sink (2) comprises a heat collecting plate (9) fixedly connected to the circuit board body (1); a plurality of heat dissipation fins (10) are fixedly connected to the vertical side wall of the heat collecting plate (9); the plurality of heat dissipation fins (10) are evenly distributed on the heat collecting plate (9); and the specific material of the heat collecting plate (9) and the heat dissipation fins (10) is aluminum.

3. The circuit board with high heat dissipation efficiency according to claim 2, characterized in that: Two heat-conducting plates (11) are symmetrically and fixedly connected to the vertical side wall of the heat collecting plate (9) close to the lower side, and a heat-conducting silicone grease layer (12) is coated between the heat-conducting plates (11) and the circuit board body (1).

4. The circuit board with high heat dissipation efficiency according to claim 1, characterized in that: A shock-absorbing gasket (13) is fixedly connected to the side wall at the lower side of the heat dissipation fan (4); the specific material of the shock-absorbing gasket (13) is insulating rubber; the thickness of the shock-absorbing gasket (13) is greater than the distance between the lower side of the heat dissipation fan (4) and the circuit board body (1).

5. The circuit board with high heat dissipation efficiency according to claim 2, characterized in that: The plurality of heat dissipation fins (10) are each provided with ventilation holes (14), and the plurality of ventilation holes (14) are evenly distributed on the heat dissipation fins (10).

6. The circuit board with high heat dissipation efficiency according to claim 2, characterized in that: Two adhesive strips (15) are symmetrically fixedly connected to one side of the air guide frame (5) close to the heat collecting plate (9), and the adhesive strips (15) are tightly fitted to the heat sink (2).

7. The circuit board with high heat dissipation efficiency according to claim 1, characterized in that: A first wind shield (16) is fixedly connected to the side wall on the upper side of the wind guide plate (7), and a second wind shield (17) is fixedly connected between the wind guide frame (5) and the heat dissipation fan (4).

8. The circuit board with high heat dissipation efficiency according to claim 1, characterized in that: The mounting plate (3) and the cooling fan (4) are both provided with two screw holes, and the inner threads of the screw holes are sleeved with hexagon socket screws (18).

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