Electronic device

Abstract

The utility model relates to the technical field of equipment, and provides electronic equipment which comprises a shell, an air duct is arranged in the shell, and an air duct opening for communicating the air duct with the outside of the electronic equipment is formed in the shell; the fan is arranged in the air duct of the shell; and the air door can move relative to the shell so as to open or close the air duct opening. According to the electronic equipment, the air door used for opening and closing the air duct opening is arranged, so that the problem of dust accumulation in the electronic equipment can be solved while a good heat dissipation effect is ensured.

Description

Technical Field

[0001] The present application relates to the field of equipment, and in particular to an electronic device. Background Art

[0002] Electronic devices are developing very rapidly, and their performance is constantly improving. For example, in order to improve the image quality of electronic devices in games, videos, and other usage scenarios, the performance of components such as system on chip (SOC) and camera modules in electronic devices is constantly being enhanced. However, this is accompanied by problems such as heating of electronic device components and hot shells.

[0003] In some solutions, passive heat dissipation methods such as vapor chamber (VC) are used to dissipate heat from electronic devices. However, as the performance of electronic devices continues to improve, the heat dissipation effect of passive heat dissipation methods is becoming increasingly weak.

[0004] In other solutions, active heat dissipation is used to dissipate heat from electronic devices. For example, a fan is set in the electronic device to accelerate the flow of air inside the electronic device to promote heat dissipation of the electronic device. However, the circulation of air will also introduce dust. Over time, the problem of dust accumulation inside the electronic device gradually becomes prominent, which not only affects the heat dissipation capacity of the electronic device, but also affects the normal operation of the electronic device. Utility Model Content

[0005] The present application provides an electronic device for improving the dustproof capability of the electronic device.

[0006] In a first aspect, the present application provides an electronic device, comprising: a shell, an air duct is provided inside the shell, and an air duct opening is opened on the shell to connect the air duct with the outside of the electronic device; a fan is arranged in the air duct of the shell; and a damper can move relative to the shell to open or close the air duct opening.

[0007] According to the embodiments of the present application, when the electronic device is to dissipate heat, the air duct opening can be opened by the damper to allow external air to enter the air duct from the air duct opening; when the electronic device is not to dissipate heat, the air duct opening can be closed by the damper to prevent external air and dust in the air from entering the air duct. Thus, the embodiments of the present application can not only realize active heat dissipation of the electronic device, but also improve the dustproof capability of the electronic device.

[0008] In some embodiments, the housing includes: a rear shell, the rear shell is located at one end of the electronic device along the thickness direction of the electronic device, and an opening is provided on the rear shell; and a cover, the cover covers the opening along the thickness direction; wherein the air duct opening is provided on the cover. The embodiments of the present application can reduce the impact on the main structure of the electronic device.

[0009] In some embodiments, the cover includes a panel disposed opposite to the opening in the thickness direction and a side wall surrounding the panel, and the air duct opening is formed on the side wall. According to the embodiment of the present application, when a user faces the back of the electronic device, the air duct opening can be invisible, so as to improve the integrity of the appearance of the electronic device.

[0010] In some embodiments, the damper can move between a first position and a second position relative to the cover in the thickness direction, and when the damper moves to the first position, the damper opens the air duct opening, and when the damper moves to the second position, the damper closes the air duct opening; or, the damper can rotate between a third position and a fourth position relative to the cover around an axis extending in the thickness direction, and when the damper rotates to the third position, the damper opens the air duct opening, and when the damper rotates to the fourth position, the damper closes the air duct opening.

[0011] In some embodiments, a plurality of holes are provided on the outer surface of the side wall, some of the holes are blind holes, and the other part are through holes, and the through holes form air duct openings. The embodiments of the present application can improve the aesthetics of the electronic device and reduce the impact on the industrial design of the electronic device.

[0012] In some embodiments, the plurality of holes are arranged at equal intervals along the circumference of the side wall.

[0013] In some embodiments, the air duct opening includes an air inlet and an air outlet, one end of the air duct is connected to the air inlet, and the other end of the air duct is connected to the air outlet; wherein, there are multiple through holes, a portion of the multiple through holes form the air inlet, and another portion of the multiple through holes form the air outlet.

[0014] In some embodiments, the cover is a protective cover of a camera assembly of an electronic device.

[0015] In some embodiments, the projection of the cover along the thickness direction covers the projection of the air duct along the thickness direction. The embodiment of the present application can fully utilize the accommodation space under the cover, so that the air duct 21 does not need to occupy the space of other devices in the accommodation cavity.

[0016] In some embodiments, the extended shape of the air duct is V-shaped.

[0017] In some embodiments, the fan is located at the center of the air duct along the extension direction of the air duct.

[0018] In some embodiments, the electronic device further comprises an electromagnetic drive device, and the electromagnetic drive device is used to drive the damper to move relative to the housing. The embodiments of the present application are conducive to miniaturization of the drive device.

[0019] In some embodiments, the electromagnetic drive device includes an electromagnetic drive unit and a transmission rod, the transmission rod is connected to the damper, and the electromagnetic drive unit is used to drive the transmission rod to move, so that the transmission rod drives the damper to move relative to the housing.

[0020] In some embodiments, the electronic device further includes a control device, which is used to control the fan and the electromagnetic drive device so that the fan and the air duct opening are opened or closed synchronously.

[0021] In some embodiments, the electronic device further comprises a dustproof net, and the dustproof net covers the air duct opening. The embodiments of the present application can further improve the dustproof capability of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1A A schematic diagram of an active heat dissipation structure of an electronic device in some embodiments;

[0023] Figure 1B for Figure 1A A view of the electronic device shown;

[0024] Figure 1C Schematic diagrams of active heat dissipation structures of electronic devices in other embodiments;

[0025] Figure 1D for Figure 1C A schematic diagram of the internal structure of the electronic device shown;

[0026] Figure 2A A structural diagram of an electronic device provided in an embodiment of the present application;

[0027] Figure 2B A cross-sectional view of an electronic device provided in an embodiment of the present application ( Figure 2A BB cross-section diagram);

[0028] Figure 3A Figure 2 of the structure of the electronic device provided in the embodiment of the present application;

[0029] Figure 3B An exploded view 1 of an electronic device provided in an embodiment of the present application;

[0030] Figure 3C A cross-sectional view of an electronic device provided in an embodiment of the present application ( Figure 3A CC cross-section diagram);

[0031] Figure 3D A cross-sectional view of an electronic device provided in an embodiment of the present application ( Figure 3A DD cross-section diagram);

[0032] Figure 4A Schematic diagram 1 of the damper opening position provided in the embodiment of the present application;

[0033] Figure 4B Schematic diagram 1 of the damper closed position provided in the embodiment of the present application;

[0034] Figure 5A A structural schematic diagram 1 of the electromagnetic drive device provided in an embodiment of the present application;

[0035] Figure 5B A second structural diagram of the electromagnetic drive device provided in an embodiment of the present application;

[0036] Figure 6 A second exploded view of an electronic device provided in an embodiment of the present application;

[0037] Fig. 7A Schematic diagram 2 of the damper opening position provided in the embodiment of the present application;

[0038] Figure 7B Schematic diagram 2 of the damper closed position provided in the embodiment of the present application;

[0039] Fig. 8A A third structural diagram of the electromagnetic drive device provided in an embodiment of the present application;

[0040] Figure 8B A fourth structural diagram of the electromagnetic drive device provided in an embodiment of the present application;

[0041] Fig. 9 A schematic diagram of the system structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0042] The specific implementation of the present application will be described in detail below with reference to the accompanying drawings.

[0043] As mentioned above, active heat dissipation means can be used to dissipate heat in electronic equipment. Figure 1A and Figure 1B The active heat dissipation structure of the electronic device 100a in some embodiments is shown. Figure 1A shows a front view of the electronic device 100a, Figure 1B for Figure 1A In order to facilitate observation of the internal structure of the electronic device 100a, a part of the housing of the electronic device 100a is made transparent.

[0044] refer to Figure 1A and Figure 1B The electronic device 100a may include a housing 10a, an air duct 24a is provided inside the housing 10a, and a fan 22a is provided in the air duct 24a. The rotation of the fan 22a can make air flow along the extension direction of the air duct 24a ( Figure 1A The air flows in the direction of the arrow shown in the figure to actively dissipate heat for the electronic device 100a.

[0045] The electronic device 100a further includes a dustproof net 25a, which covers the air duct opening of the air duct opening 24a. The dustproof net 25a is a porous mesh structure, and can intercept dust outside the electronic device 100a to prevent dust from entering the inside of the electronic device 100a.

[0046] Figure 1A and Figure 1B In the example shown, by setting a dustproof net 25a, the dust accumulation problem of the electronic device 100a can be improved to a certain extent. However, the dustproof ability of the dustproof net 25a is affected by the aperture size of the mesh. When the aperture is large, the dustproof ability is poor and it is impossible to effectively intercept dust entering from the outside. When the aperture is small, although the dustproof ability is improved, the dustproof net 25a will produce a large flow resistance at the air duct opening, reducing the air flow rate, thereby reducing the heat dissipation capacity of the electronic device 100a. In addition, the dustproof net 25a itself will also accumulate dust, further weakening the heat dissipation capacity of the electronic device 100a.

[0047] Figure 1C and Figure 1D FIG. 1 shows an active heat dissipation structure in an electronic device 100b in another embodiment. Figure 1C is a front view of the electronic device 100b, Figure 1D FIG. 1 is a diagram showing the internal structure of the electronic device 100 b .

[0048] refer to Figure 1C and Figure 1D The housing 10b of the electronic device 100b is provided with an air inlet 241b and an air outlet 242b, which are connected to the air duct 21b inside the electronic device 100b. A fan 22b is provided in the air duct 21b, and the fan 22b is connected to the vibrating member 201b. The vibrating member 201b can drive the fan 22b to vibrate at an overfrequency, so as to shake off the dust on the fan 22b, so as to realize the self-cleaning of the fan 22b.

[0049] Figure 1C and Figure 1D In the example shown, the self-cleaning of the fan 22b can be achieved by the vibrating member 201b. However, this solution does not solve the dust accumulation problem in other areas inside the electronic device 100b (for example, inside the air duct 21b).

[0050] To this end, the present embodiment provides an electronic device, including an air duct, a fan disposed in the air duct, and an air door that can be opened and closed. When the electronic device is to dissipate heat, the air duct opening can be opened by the air door so that external air can enter the air duct from the air duct opening; when the electronic device is not to dissipate heat, the air duct opening can be closed by the air door to prevent external air and dust in the air from entering the air duct. Thus, the present embodiment of the application can not only realize active heat dissipation of the electronic device, but also improve the dustproof ability of the electronic device.

[0051] This application does not limit the specific form of the electronic device. For example, the electronic device can be a mobile phone, a tablet computer, a camera, a vehicle-mounted device, a wearable device, an augmented reality (AR) glasses, an AR helmet, a virtual reality (VR) glasses or a VR helmet, and any other device with heat dissipation requirements, which is not specifically limited here.

[0052] In the following, a mobile phone is taken as an example of an electronic device to introduce the technical solution of the embodiment of the present application.

[0053] Figure 2A and Figure 2B FIG. 1 shows an exemplary structural diagram of an electronic device 100A provided in the first embodiment of the present application. Figure 2A is a three-dimensional diagram of an electronic device 100A. Figure 2B for Figure 2A BB cross-section diagram.

[0054] In this article, the X-axis direction is the length direction of the electronic device, and the positive direction of the X-axis is the direction from the bottom wall of the electronic device to the top wall. The Y-axis direction is the width direction of the electronic device, and the positive direction of the Y-axis is the direction from the left side of the electronic device to the right side. The Z-axis direction is the thickness direction of the electronic device, and the positive direction of the Z-axis is the direction from the back side of the electronic device to the front side. The X-axis direction, the Y-axis direction, and the Z-axis direction can be perpendicular to each other.

[0055] In addition, herein, the length, width and thickness of each component are the dimensions of the component along the length direction, width direction and thickness direction, respectively.

[0056] In addition, it should be noted that the directional terms such as "up", "down", "left", "right", "front", "back", "top" and "bottom" in this document refer to the orientation of the electronic device in normal use (for example, in normal use, the display screen of the electronic device is located on the front side of the electronic device), rather than indicating or implying that the referred to component must have a specific orientation, which may change accordingly according to actual use and should not be understood as a limitation on the present application.

[0057] refer to Figure 2A and Figure 2BThe electronic device 100A includes a display screen 12 and a rear shell assembly 11, and the display screen 12 and the rear shell assembly 11 are arranged opposite to each other along the thickness direction of the electronic device 100A. The display screen 12 and the rear shell assembly 11 can be connected to each other (for example, adhesively bonded, snap-fitted, etc.) to form a housing 10 of the electronic device 100A. The housing 10 has a receiving cavity 13 in it, and the receiving cavity 13 can accommodate functional components of the electronic device 100A, such as a mainboard 61, a battery 62, a camera module 63, etc.

[0058] In other embodiments, the housing 10 may also be formed in other ways. For example, the electronic device 100A may not include the display screen 12, but the display screen 12 may be replaced by a panel. The panel and the rear shell assembly 11 may together form the housing 10 of the electronic device 100A.

[0059] The camera module 63 of the electronic device 100A may include a front camera module 631 and a rear camera module 632. It is understood that the shooting direction of the front camera module 631 is toward the front side of the electronic device 100A (i.e., the positive direction of the Z axis), and the shooting direction of the rear camera module 632 is toward the back side of the electronic device 100A (i.e., the negative direction of the Z axis). By setting the rear camera module 632, the user can take pictures of the scenery on the back of the electronic device 100A. Exemplarily, the rear camera module 632 may include multiple lens modules, for example, a main lens module, a telephoto lens module, a wide-angle lens module, a macro lens module, etc.

[0060] The rear shell assembly 11 of the electronic device 100A may include a rear shell 111 and a cover 112. In the thickness direction, the display screen 12 and the rear shell 111 are respectively located at opposite ends of the electronic device 100A. Among them, the rear shell 111 is provided with an opening 1111 facing the back side of the electronic device 100A, and the cover 112 can cover the opening 1111 along the thickness direction of the electronic device 100A. The rear shell 111 and the cover 112 can be connected by snapping, bonding, fastener connection, etc., which is not limited in this application.

[0061] refer to Figure 2B The cover 112 and other parts of the housing 10 (eg, the display screen 12) can enclose a portion of the accommodating cavity 13 ( Figure 2BThe space shown in gray in the accommodating cavity 13 is referred to as the accommodation space 132 in this embodiment. The rear camera module 63 can be located in the accommodation space 132, so that the cover 112 can provide protection for the rear camera module 63. It can be understood that the cover 112 can protrude from the rear shell 111 in the thickness direction, so that the accommodation space 132 has a greater thickness than other spaces in the accommodating cavity 13, so that the rear camera module 63 can be set to have a larger size, so as to realize the focusing, wide-angle and other functions of the rear camera module 63.

[0062] Exemplarily, the outer shape of the cover 112 may be cylindrical to improve the aesthetics of the electronic device 100A. In addition, along the width direction of the electronic device 100A, the cover 112 and the opening 1111 are located in the middle of the electronic device 100A. In other embodiments, the cover 112 and the opening 1111 may also be arranged at other positions of the electronic device 100A, such as at the upper left, upper right, etc. of the electronic device 100A, without specific limitation.

[0063] In other embodiments, the cover 112 may also be used to protect other components besides the rear camera module 63, such as a flash, a SIM card, etc., without specific limitation.

[0064] In the embodiment of the present application, the electronic device 100A may further include an active heat dissipation structure 20A. FIG. 3A to FIG. 3D The following describes an exemplary configuration of the active heat dissipation structure 20A provided in this embodiment. Figure 3A 1 shows a perspective view (back side view) of the electronic device 100A. Figure 3B An exploded view of the electronic device 100A is shown. Figure 3C Shows Figure 3A CC cross-section diagram, Figure 3D Shows Figure 3A DD cross-sectional view. In addition, to facilitate the description of the key points, FIG. 3A to FIG. 3D Devices that are not closely related to the active heat dissipation structure 20A, such as the camera module 63, are removed.

[0065] refer to FIG. 3A to FIG. 3DThe active heat dissipation structure 20A of the electronic device 100A includes an air duct 21, a fan 22 and an air duct opening 24. Among them, the air duct 21 is arranged in the accommodating cavity 13 of the electronic device 100A. The air duct opening 24 is arranged on the housing 10 of the electronic device 100A, and the air duct opening 24 is used to connect the air duct 21 and the outside of the electronic device 100A. Specifically, the air duct opening 24 includes an air inlet 241 and an air outlet 242. One end of the air duct 21 is connected to the air inlet 241, and the other end is connected to the air outlet 242. The external air of the electronic device 100A can enter the air duct 21 through the air inlet 241, and the air in the air duct 21 can be discharged to the outside of the electronic device 100A through the air outlet 242.

[0066] refer to Figure 3D The housing cavity 13 of the electronic device 100A may include an area (hereinafter referred to as "device housing area 131") for arranging heat generating devices (e.g., battery 62, mainboard 61, etc.). The heat in the device housing area 131 may be transferred to the duct wall of the duct 21 through heat conducting materials or natural heat transfer, and then transferred to the duct 21 through the duct wall.

[0067] The fan 22 is disposed in the air duct 21. Through the action of the fan 22, the air can flow in the air duct 21. Figure 3C and Figure 3D When the fan 22 is running, the cold air outside the electronic device 100A can be drawn into the air duct 21 from the air inlet 241. The cold air entering the air duct 21 absorbs the heat in the air duct 21 and forms flowing hot air. Afterwards, under the action of the fan 22, the hot air in the air duct 21 can be discharged through the air outlet 242. That is, by providing the active heat dissipation structure 20A formed by the air duct opening 24, the air duct 21 and the fan 22 on the electronic device 100A, the internal components of the electronic device 100A can be actively cooled.

[0068] Continue to refer Figure 3B and Figure 3C In the embodiment of the present application, the air duct opening 24 may be provided on the cover 112 of the electronic device 100A. Specifically, the cover 112 may include a panel 1121 and a side wall 1122 surrounding the panel 1121. In the thickness direction, the panel 1121 is arranged opposite to the opening 1111. As described above, in the thickness direction, the panel 1121 and the side wall 1122 may protrude from the rear housing 111, so that the rear camera module 63 may be arranged to have a larger size.

[0069] The air duct opening 24 is provided on the cover 112 to reduce the impact on the main structure of the electronic device 100A (for example, the rear shell 111). In some embodiments, the air duct opening 24 can be formed on the side wall 1122. In this way, when the user faces the back of the electronic device 100A, the air duct opening 24 can not be seen, which is conducive to improving the integrity of the appearance of the electronic device 100A.

[0070] In the embodiment of the present application, the outer surface of the side wall 1122 includes a circumferential direction of the side wall 1122 (such as Figure 3B As shown in the E direction, a plurality of holes 50 are arranged at equal intervals, a portion of the plurality of holes 50 are blind holes 51, and another portion are through holes 52, and the through holes 52 form the air duct opening 24. Since the plurality of holes 50 arranged at equal intervals can form a regular pattern on the outer surface of the side wall 1122, the side wall 1122 has good consistency in visual effect. Therefore, the embodiment of the present application can realize the air duct opening 24 while taking into account the aesthetics of the electronic device 100A and reducing the impact on the industrial design (ID) of the electronic device 100A.

[0071] In other embodiments, the plurality of holes 50 on the side wall 1122 may also be arranged at unequal intervals. Alternatively, the side wall 1122 may not be provided with blind holes 51, but only with through holes 52 for forming the air duct opening 24, which is not specifically limited. In addition, in other embodiments, the air duct opening 24 may also be formed on the panel 1121 of the cover 112.

[0072] Furthermore, the air inlet 241 and the air outlet 242 may be arranged opposite to each other along the width direction of the electronic device 100A, so that the air duct 21 may extend a certain length along the width direction of the electronic device 100A to facilitate the flow of air.

[0073] In some embodiments, the air inlet 241 may be formed by one or more through holes 52, and the multiple through holes 52 serving as the air inlet 241 may be adjacent or non-adjacent. The air outlet 242 may also be formed by one or more through holes 52, and the multiple through holes 52 serving as the air outlet 242 may be adjacent or non-adjacent, and may be adjusted according to actual heat dissipation requirements. It can be understood that the shape, size, etc. of the through holes 52 are not specifically limited. In this embodiment, the through holes 52 serving as the air inlet 241 and the air outlet 242 are both set to multiple. The number of through holes 52 serving as the air inlet 241 may be the same as the number of through holes 52 serving as the air outlet 242, for example, they are all set to be 3 through holes 52, 5 through holes 52, 7 through holes 52, etc., which are equally spaced and adjacent to each other.

[0074] It is understood that during the heat dissipation process of the electronic device 100A, dust in the outside air may also enter the electronic device 100A due to the suction effect of the fan 22. Figure 3B and Figure 3C , the active heat dissipation structure 20A of the electronic device 100A of the embodiment of the present application also includes a damper 23A. The damper 23A can move between a first position M1 and a second position M2 relative to the cover 112 in the thickness direction. When the electronic device 100A is dissipated (for example, when the fan 22 is running), the damper 23A can be moved to the first position M1 so that the damper 23A opens the air duct opening 24. When the electronic device 100A is not dissipated (for example, when the fan 22 is turned off), the damper 23A can be moved to the second position M2 so that the damper 23A closes the air duct opening 24. Thus, by setting the damper 23A, when the electronic device 100A is not dissipated, the dust outside the electronic device 100A can be effectively intercepted, thereby improving the dust accumulation problem of the electronic device 100A.

[0075] Figure 4A and Figure 4B The states of the air duct opening 24 being opened and closed are shown respectively. Figure 4A and Figure 4B Both Figure 3C F-direction view, in Figure 4A , the damper 23A is located at the first position M1 (also called the "open position M1"); Figure 4B , the damper 23A is located in the second position M2 (also called the "closed position M2").

[0076] refer to Figure 4A , Figure 4B Combined with Figure 3B and Figure 3C When the damper 23A moves to the first position M1, the damper 23A will not shield the air duct opening 24. For example, along the thick bottom direction, the damper 23A is located on the side of the rear shell 111 facing away from the cover 112. At this time, the damper 23A opens the air duct opening 24, and the outside air can enter the air duct 21 through the air duct opening 24 to dissipate heat for the electronic device 100A. When the damper 23A moves to the second position M2, the damper 23A shields the air duct opening 24. At this time, the damper 23A closes the air duct opening 24, and the outside air and dust in the air cannot enter the air duct 21 through the air duct opening 24 to reduce dust accumulation inside the electronic device 100A.

[0077] Exemplarily, the damper 23A is configured to be a structure that matches the shape of the side wall 1122 of the cover 112. For example, when the side wall 1122 is in an arc shape, the damper 23A is in an arc shape that matches the side wall 1122. When the damper 23A closes the air duct opening 24, the outer surface of the damper 23A (the surface of the damper 23A facing away from the accommodating cavity 13) can be fitted with the inner surface of the side wall 1122 (the surface of the side wall 1122 facing the accommodating cavity 13) to improve the sealing effect of the air duct opening 24.

[0078] In this embodiment, the damper 23A is an integrated structure. Therefore, when the damper 23A is moved, the air inlet 241 and the air outlet 242 can be opened and closed at the same time. In other examples, the damper 23A can be set to two or more, for example, the damper 23A is set to two, one damper 23A corresponds to the air inlet 241, and the other damper 23A corresponds to the air outlet 242. In this example, by controlling different dampers 23A, the air inlet 241 and the air outlet 242 can be controlled separately.

[0079] refer to Figure 3B and Figure 3C The active heat dissipation structure 20A may further include a driving device 26A. The driving device 26A is used to drive the damper 23A to move between the open position M1 and the closed position M2.

[0080] Exemplarily, the driving device 26A may be an electromagnetic driving device 26A. The driving device 26A may include an electromagnetic driving part 261 and a transmission rod 262, wherein the transmission rod 262 is respectively connected to the damper 23A and the electromagnetic driving part 261, and the electromagnetic driving part 261 can drive the transmission rod 262 to reciprocate along the thickness direction, so that the transmission rod 262 drives the damper 23A to move between the open position M1 and the closed position M2.

[0081] Figure 5A and Figure 5B FIG. 2 shows an exemplary structural diagram of the drive device 26A. Figure 5A and Figure 5B The electromagnetic drive unit 261 of the drive device 26A includes a coil 2611, a magnet 2612 and a magnet 2613. The magnet 2612 and the magnet 2613 can be magnets of the same polarity, for example, both are S-pole magnets. When currents of different directions are passed through the coil 2611, the coil 2611 can generate magnetic fields of different directions, thereby driving the magnet to move in different directions. For example, referring to Figure 5A When a clockwise current is passed through the coil 2611, the coil 2611 generates a magnetic field with S at the top and N at the bottom. At this time, the coil 2611 can drive the magnet to move in the positive direction of the Z axis; refer to Figure 5BWhen a counterclockwise current is passed through the coil 2611, the coil 2611 generates a magnetic field of N at the top and S at the bottom. At this time, the coil 2611 can drive the magnet to move toward the negative direction of the Z axis.

[0082] The magnet is connected to the transmission rod 262. Figure 5A When the magnet moves toward the positive direction of the Z axis, the transmission rod 262 can be driven to move toward the positive direction of the Z axis, so that the transmission rod 262 drives the damper 23A to move to the open position M1 ( Figure 4A shown); reference Figure 5B When the magnet moves toward the negative direction of the Z axis, the transmission rod 262 can be driven to move toward the negative direction of the Z axis, so that the transmission rod 262 drives the damper 23A to move to the closed position M2 ( Figure 4B shown).

[0083] Exemplarily, an iron block may be further provided on the coil 2611. When the damper 23A moves to position M1, the magnet 2612 may be attracted to the iron block to stabilize the damper 23A at position M1; when the damper 23A moves to position M2, the magnet 2613 may be attracted to the iron block to stabilize the damper 23A at position M2. In this example, when the damper 26A is moved to a predetermined position (position M1 or position M2), the current in the coil 2611 may be cut off to save energy.

[0084] In this embodiment, the drive device 26A is set as an electromagnetic drive device 26A, which is conducive to miniaturization of the drive device 26A. However, the present application is not limited thereto. In other embodiments, the drive device 26A may also be a servo motor drive, a gear drive or other types of drive devices.

[0085] In some embodiments, the electronic device 100A may further include a control device, which is used to control the fan 22 and the driving device 26A so that the fan 22 and the air duct opening 24 are opened or closed synchronously to further improve the dustproof effect of the electronic device 100A. Exemplarily, the control device may be the mainboard 61 of the electronic device 100A. In other examples, the fan 22 and the air duct opening 24 may also be opened or closed asynchronously, without specific limitation.

[0086] Continue to refer Figure 3B and Figure 3C , the projection of the cover 112 along the thickness direction can cover the projection of the air duct 21 along the thickness direction. That is to say, along the thickness direction, the air duct 21 can be located in the accommodation space 132 below the cover 112, so that the accommodation space 132 can be fully utilized to form the air duct 21, so that the air duct 21 does not need to occupy the space of other devices in the accommodation cavity 13. In other embodiments, the air duct 21 can also be located at other positions. For example, the air duct 21 can extend outside the accommodation space 132.

[0087] The following describes an exemplary method of forming the air duct 21. Figure 3B and Figure 3C The accommodation space 132 below the cover 112 is provided with a side plate 211 and a side plate 212 spaced apart from each other, and the side plate 211 and the side plate 212 can together form the air duct 21. In addition, along the thickness direction, one end of the side plate 211 and the side plate 212 can be connected to the panel 1121 of the cover 112.

[0088] In some embodiments, the air duct 21 is V-shaped. The V-shaped air duct 21 encloses a space for accommodating the drive device 26A, so as to facilitate the compactness of the active heat dissipation structure 20A. In addition, the V-shaped air duct 21 can also increase the extension length of the air duct 21 in the accommodating space 132, so that the air flows more fully in the electronic device 100A, thereby improving the heat dissipation effect. It can be understood that in other embodiments, the air duct 21 can also be set to other shapes, such as a straight line, an arc, etc.

[0089] In some embodiments, along the extension direction of the air duct 21, the fan 22 is located at the center of the air duct 21. Exemplarily, the air duct 21 and the cover 112 are both symmetrical structures, and both have the same symmetry axis. Figure 3C , the air duct 21 and the cover 112 can be symmetrical about the axis S1, and the axis S1 can be parallel to the length direction of the fan. In the thickness direction, the fan 22 is aligned with the axis S1. In this embodiment, the projection of the cover 112 in the thickness direction is a circle. In other embodiments, the projection of the cover 112 in the thickness direction can also be a square, an equilateral triangle, etc., without specific limitation.

[0090] Exemplarily, the fan 22 may be fixedly connected to the inner surface of the panel 1121 of the cover 112 , or may be fixedly connected to other positions of the electronic device 100A, without specific limitation.

[0091] Continue to refer Figure 3B and Figure 3C The active heat dissipation structure 20A may further include a dustproof net 25, which covers the air duct opening 24. There may be two dustproof nets 25, one of which covers the air inlet 241, and the other covers the air outlet 242. Exemplarily, the dustproof net 25 may be located between the side wall 1122 of the cover 112 and the damper 23A, and may be fitted with the inner surface of the side wall 1122 of the cover 112. By providing the dustproof net 25, the dust accumulation problem inside the electronic device 100A may be further improved. For example, when the damper 23A opens the air duct opening 24, the dustproof net 25 may intercept dust outside the electronic device 100A.

[0092] In summary, the embodiment of the present application provides an electronic device 100A, including an air duct 21, a fan 22 arranged in the air duct 21, and a damper 23A that can be opened and closed. When the electronic device 100A is to dissipate heat, the air duct opening 24 can be opened by the damper 23A so that external air can enter the air duct 21 from the air duct opening 24; when the electronic device 100A is not to dissipate heat, the air duct opening 24 can be closed by the damper 23A to prevent external air and dust in the air from entering the air duct 21. Thus, the embodiment of the present application can not only realize active heat dissipation of the electronic device 100A, but also improve the dustproof ability of the electronic device 100A. In particular, when the electronic device 100A is a device that is not easy to disassemble and clean, such as a mobile phone, the embodiment of the present application can have better practicality.

[0093] The electronic device provided by the second embodiment of the present application is introduced below. The second embodiment of the present application can be based on the first embodiment. The difference is that in the first embodiment, the movement of the damper is a translational movement; in the second embodiment, the movement of the damper is a rotational movement. That is, when the damper rotates to different positions relative to the housing, the air duct opening can be opened or closed.

[0094] Figure 6 An exemplary structural diagram (exploded view) of an electronic device 100B provided in the second embodiment of the present application is shown. Referring to FIG7 , the electronic device 100B includes a housing 10 and an air duct 21 disposed in the housing 10. The housing 10 is provided with an air duct opening 24 for connecting the outside of the electronic device 100B and the air duct 21. A fan 22 is also provided in the air duct 21, and when the fan 22 is running, air can be driven to flow in the air duct 21. The arrangement and deformation of the housing 10, the air duct 21, the air duct opening 24, the fan 22, etc. can refer to the description in the first embodiment, and will not be repeated.

[0095] The electronic device 100B may further include a damper 23B. The damper 23B can rotate between a third position M3 and a fourth position M4 relative to the cover 112 around an axis extending in the thickness direction. When the electronic device 100B is cooled, the damper 23B can be rotated to the third position M3 so that the damper 23B opens the air duct opening 24. When the electronic device 100B is not cooled, the damper 23B can be rotated to the fourth position M4 so that the damper 23B closes the air duct opening 24.

[0096] Fig. 7A and Figure 7B The state where the air duct opening 24 is opened and closed is shown. Fig. 7A , the damper 23B is located at the third position M3 (also called the "open position M3"); Figure 7B , the damper 23B is located at the fourth position M4 (also called the "closed position M4").

[0097] refer to Fig. 7A , Figure 7B Combined with Figure 6 , the damper 23B is provided with a plurality of air holes 231 along its circumference. When the damper 23B rotates to the third position M3, the air holes 231 on the damper 23B are connected to the air duct opening 24. At this time, the damper 23B will not shield the air duct opening 24, that is, the damper 23B opens the air duct opening 24, and the outside air can enter the air duct 21 through the air duct opening 24 to dissipate heat for the electronic device 100B. When the damper 23B rotates to the fourth position M4, the air holes 231 on the damper 23B are staggered with the air duct opening 24, and the damper 23B shields the air duct opening 24. At this time, the damper 23B closes the air duct opening 24, and the outside air and the dust in the air cannot enter the air duct 21 through the air duct opening 24 to reduce the dust accumulation inside the electronic device 100B.

[0098] For example, reference Figure 6 The electronic device 100B may further include a ball mechanism 15, which may be disposed on the housing 10 of the electronic device 100B, for example, on the rear housing 111 or the cover 112. The ball mechanism 15 may include a guide groove 151 and a plurality of balls 152 disposed in the guide groove 151. The bottom surface of the damper 23B (the surface of the damper 23B facing the positive direction of the Z axis) may contact the balls 152, so that a rolling connection between the damper 23B and the housing 10 may be achieved through the action of the ball mechanism 15. Thus, when the damper 24B rotates between the third position M3 and the fourth position M4 relative to the housing 10, the rotation resistance of the damper 24B may be reduced, and the wear of the damper 24B may be alleviated.

[0099] Other configurations of the damper 23B (for example, the shape of the damper 23B, etc.) may refer to the description of the damper 23A in the first embodiment, and will not be described in detail.

[0100] The active heat dissipation structure 20A may further include a driving device 26B. The driving device 26B is used to drive the damper 23B to move between an open position M3 and a closed position M4.

[0101] Exemplarily, the driving device 26B may also be an electromagnetic driving device 26B. The driving device 26B may include an electromagnetic driving part 263 and a transmission rod 264, wherein the transmission rod 264 is connected to the damper 23B and the electromagnetic driving part 263, respectively, and the electromagnetic driving part 263 can drive the transmission rod 264 to rotate, so that the transmission rod 264 drives the damper 23B to rotate between the open position M3 and the closed position M4.

[0102] Fig. 8A and Figure 8B FIG. 2 shows an exemplary structural diagram of the driving device 26B. Fig. 8A and Figure 8BThe electromagnetic driving part 263 of the driving device 26B includes a coil pair 2631, a coil pair 2632 and a magnet 2633. The coil pair 2631 includes a coil 2631-1 and a coil 2631-2. The coil 2631-1 and the coil 2631-2 can be located at two ends of the same diameter line d1 of the reference circle C1. Fig. 8A and Figure 8B From the perspective of the reference circle C1, the center of the reference circle C1 overlaps with the rotation axis S2 of the damper 23B. The coil pair 2632 includes a coil 2632-1 and a coil 2632-2, and the coil 2632-1 and the coil 2632-2 can be respectively located at two ends of another diameter line d2 of the reference circle C1. The magnet 2633 can rotate around the axis S2.

[0103] When the coil is energized, the coil can generate a magnetic field in a predetermined direction, for example, a magnetic field with the N pole facing inward and the S pole facing outward. In this way, by controlling the power supply of different coils, the magnet can be controlled to rotate to different angles. For example, refer to Fig. 8A When current is passed through the coil pair 2631, the N pole of the magnet 2633 is attracted by the coil 2631-1, and the S pole of the magnet 2633 is attracted by the coil 2631-2. In this way, the magnet 2633 rotates to Fig. 8A Angle shown; reference Figure 8B When current is passed through the coil pair 2632, the N pole of the magnet 2633 is attracted by the coil 2632-1, and the S pole of the magnet 2633 is attracted by the coil 2632-2. Figure 8B Angle shown.

[0104] The magnet 2633 is connected to the transmission rod 264. Fig. 8A and Figure 8B When the energized coil pair is switched from coil pair 2632 to coil pair 2631, magnet 2633 rotates counterclockwise, which can drive transmission rod 264 to rotate counterclockwise, so that transmission rod 264 drives damper 23B from closed position M4 ( Figure 7B shown position) to the open position M3 ( Fig. 7A conversely, when the energized coil pair is switched from coil pair 2631 to coil pair 2632, the magnet 2633 rotates clockwise, which can drive the transmission rod 264 to rotate clockwise, so that the transmission rod 264 drives the damper 23B to rotate from the open position M3 to the closed position M4.

[0105] For example, an iron block may be provided on the coil. When the damper 23B rotates to a predetermined position (e.g., position M3 or position M4), the magnet 2633 may be attracted to the iron block to stabilize the damper 23B at the predetermined position. At this time, the current in the coil may be cut off to save energy.

[0106] in addition, Fig. 8A and Figure 8B In the example shown, the electromagnetic drive unit 263 includes a magnet and two pairs of coils. In other examples, the electromagnetic drive unit 263 may include a larger number of magnets and coils. For example, if it includes two magnets and four pairs of coils, the second magnet may cooperate with the third and fourth pairs of coils to drive the damper 23B to rotate.

[0107] In this embodiment, the drive device 26B is set as an electromagnetic drive device, which is conducive to miniaturization of the drive device 26B. However, the present application is not limited thereto. In other embodiments, the drive device 26B may also be a servo motor drive, a gear drive or other types of drive devices.

[0108] For other details not described in this embodiment, for example, the arrangement of the accommodating cavity 13, electronic components, dustproof net 25, etc. of the electronic device 100B, reference may be made to the description of the electronic device 100A in the first embodiment, and no further description is given.

[0109] Fig. 9 An exemplary system diagram of an electronic device 100 provided in an embodiment of the present application is shown. Fig. 9 , the electronic device 100 may include a display screen 12, a camera module 63, and an active heat dissipation structure 20, etc. Among them, the active heat dissipation structure 20A may include a fan 22, an air duct 21, and a dustproof device. The fan 22 may be arranged in the air duct 21, and the fan 22 may include a frame, a stator, a rotor, and blades. Through the cooperation of the stator and the rotor, the blades can be driven to rotate, thereby driving the air to flow in the air duct 21.

[0110] The dustproof device may include a damper 23 and a driving device 26. The driving device 26 can drive the damper 23 to move so that the damper 23 moves between a closed position and an open position. When it is necessary to dissipate heat for the electronics, the fan 22 can be turned on and the damper 23 can be controlled to open the air duct opening 24 so that outside air enters the air duct 21 and takes away the heat inside the electronic device 100. When it is not necessary to dissipate heat for the electronic device 100, the fan 22 can be turned off and the damper 23 can be controlled to close the air duct opening 24 to prevent external dust from entering the air duct 21. Therefore, the electronic device 100 provided in the embodiment of the present application can improve the internal dust accumulation problem of the electronic device 100 while realizing active heat dissipation.

[0111] In the above description of this embodiment, unless otherwise specified, “ / ” means or, for example, A / B can identify A or B; “and / or” in this article is merely a way to describe the association relationship of associated objects, indicating that three relationships may exist, for example, A and / or B can represent the existence of A alone, B alone, and A and B at the same time.

Claims

1. An electronic device, characterized in that: include: A housing, wherein an air duct is provided inside the housing, and an air duct opening is opened on the housing to connect the air duct with the outside of the electronic device; a fan, disposed in the air duct of the housing; The damper is movable relative to the housing to open or close the air duct opening.

2. The electronic device according to claim 1, characterized in that: The housing comprises: A rear shell, the rear shell is located at one end of the electronic device along the thickness direction of the electronic device, and the rear shell is provided with an opening; A cover, the cover covers the opening along the thickness direction; wherein the air duct opening is arranged on the cover.

3. The electronic device according to claim 2, characterized in that: The cover comprises a panel arranged opposite to the opening along the thickness direction and a side wall surrounding the panel, and the air duct opening is formed on the side wall.

4. The electronic device according to claim 3, characterized in that: The damper can move relative to the cover between a first position and a second position along the thickness direction. When the damper moves to the first position, the damper opens the air duct opening. When the damper moves to the second position, the damper closes the air duct opening. or, The damper can rotate relative to the cover between a third position and a fourth position around an axis extending along the thickness direction. When the damper rotates to the third position, the damper opens the air duct opening. When the damper rotates to the fourth position, the damper closes the air duct opening.

5. The electronic device according to claim 3, characterized in that: A plurality of holes are formed on the outer surface of the side wall, a portion of the plurality of holes are blind holes, and another portion are through holes, and the through holes form the air duct openings.

6. The electronic device according to claim 5, characterized in that: The plurality of holes are arranged at equal intervals along the circumference of the side wall.

7. The electronic device according to claim 5 or 6, characterized in that: The air duct opening includes an air inlet and an air outlet, one end of the air duct is connected to the air inlet, and the other end of the air duct is connected to the air outlet; There are multiple through holes, a portion of the through holes form the air inlet, and another portion of the through holes form the air outlet.

8. The electronic device according to claim 3, characterized in that: The cover is a protective cover of the camera assembly of the electronic device.

9. The electronic device according to claim 2, characterized in that: A projection of the cover along the thickness direction covers a projection of the air duct along the thickness direction.

10. The electronic device according to claim 9, characterized in that: The extended shape of the air duct is V-shaped.

11. The electronic device according to claim 1, characterized in that: Along the extension direction of the air duct, the fan is located at the center of the air duct.

12. The electronic device according to claim 1, characterized in that: The electronic device further comprises an electromagnetic driving device, and the electromagnetic driving device is used for driving the damper to move relative to the housing.

13. The electronic device according to claim 12, characterized in that: The electromagnetic driving device comprises an electromagnetic driving part and a transmission rod, wherein the transmission rod is connected to the damper, and the electromagnetic driving part is used to drive the transmission rod to move, so that the transmission rod drives the damper to move relative to the housing.

14. The electronic device according to claim 12 or 13, characterized in that: The electronic device further comprises a control device, and the control device is used to control the fan and the electromagnetic driving device so that the fan and the air duct opening are opened or closed synchronously.

15. The electronic device according to claim 1, characterized in that: The electronic device further comprises a dustproof net, and the dustproof net covers the air duct opening.

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