Light-emitting unit and display module

By setting a through hole on the pins of the light emitting unit, the problem of poor ink color consistency in the LED display screen is solved, and a higher display effect is achieved.

CN222621537UActive Publication Date: 2025-03-14UNILUMIN GRP
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Patent Information

Application Number
CN202420288104.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-02-06
Publication Date
2025-03-14
Estimated Expiration
2034-02-06

AI Technical Summary

Technical Problem

The existing LED display has the problem of poor ink consistency, which affects the display effect.

Method used

A light emitting unit is designed, with a pin including a connecting portion and a base portion, and a through hole is provided on the base portion, and the through hole is located on the periphery of the connecting portion. This design can effectively discharge gas in the solder paste during the welding process, reduce the chance of side shift of the light emitting unit, and improve the high consistency after welding fixation.

Benefits of technology

By improving the height consistency of welding fixation of the light emitting unit, the ink color consistency of the display module is improved, thereby improving the display effect of the display module.

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Abstract

The utility model relates to a light-emitting unit and a display module. The light-emitting unit comprises a light-emitting main body and a pin arranged on the light-emitting main body; the pin comprises a connecting part and a base part, and the connecting part is connected to the light-emitting main body; the base part is connected to one end of the connecting part away from the luminous body; a through hole is formed in the base part and located in the periphery of the connecting part. Therefore, the probability that the light-emitting unit laterally moves in the solder paste backflow process can be reduced, the height consistency of the light-emitting unit after being welded and fixed is improved, and therefore the ink color consistency of the display module is improved, and the display effect of the display module is improved.
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Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a light-emitting unit and a display module. Background Art

[0002] Light Emitting Diode (LED) is widely used due to its many advantages such as high efficiency, high brightness, high reliability, energy saving and fast response speed. With the continuous development of display technology, the pixel density of LED display screens continues to increase, the resolution continues to improve, and the spacing between lamp beads continues to decrease. Due to the constraints of process capabilities, the traditional mask process is gradually replaced by the printing ink process to ensure the consistency of the ink color of the LED display screen. However, the LED display screen of the related technology still has the problem of poor ink color consistency, which affects the display effect of the LED display screen. Utility Model Content

[0003] Based on this, the present application provides a light-emitting unit and a display module to improve the consistency of ink color, thereby improving the display effect of the display module.

[0004] An embodiment of the first aspect of the present application provides a light-emitting unit, comprising a light-emitting body and a pin arranged on the light-emitting body; the pin comprises a connecting part and a base, the connecting part is connected to the light-emitting body; the base is connected to an end of the connecting part away from the light-emitting body; a through hole is arranged on the base, and the through hole is located at the periphery of the connecting part.

[0005] In one of the embodiments, an orthographic projection of the connecting portion on the base is located inside the base.

[0006] In one embodiment, there are multiple through holes, and the multiple through holes are arranged at intervals around the connecting portion.

[0007] In one of the embodiments, the light emitting unit further includes a bracket, and the bracket is connected to the center of a side of the light emitting body close to the pin.

[0008] In one embodiment, there are multiple pins, and the multiple pins are arranged at intervals around the bracket.

[0009] In one embodiment, the light-emitting body includes a light-emitting element.

[0010] In one embodiment, the light-emitting body further includes a packaging structure, and the light-emitting element is disposed in the packaging structure.

[0011] In one embodiment, the connecting portion is configured as a columnar structure; and the base portion is configured as an elliptical structure.

[0012] In one embodiment, the support is constructed as a columnar structure.

[0013] An embodiment of a second aspect of the present application provides a display module, comprising the light-emitting unit described in any one of the first aspects.

[0014] The above-mentioned light-emitting unit includes a light-emitting body and a pin arranged on the light-emitting body; the pin includes a connecting part and a base, the connecting part is connected to the light-emitting body; the base is connected to one end of the connecting part away from the light-emitting body; a through hole is arranged on the base, and the through hole is located at the periphery of the connecting part. In this way, when the light-emitting unit is connected to the circuit board by solder, during the solder paste heating and reflow process, the through hole on the base can timely discharge the gas generated by the evaporation of the flux in the solder paste, thereby reducing the probability of the light-emitting unit shifting sideways during the solder paste reflow process, improving the height consistency of the light-emitting unit after welding and fixing, thereby improving the ink color consistency of the display module and improving the display effect of the display module. In addition, the light-emitting body is supported by the pin including the connecting part and the base, so that the light-emitting body and the pin are designed as a lighthouse as a whole, so that the area between the light-emitting unit and the light-emitting unit is small, so that after the display module is lit up with white light, the ink color consistency of the circuit board is better, thereby improving the ink color consistency of the display module and improving the display effect of the display module. In summary, the present application can improve the ink color consistency of the display module and improve the display effect of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the structure of a light-emitting unit provided in some embodiments of the present application.

[0016] Figure 2 A schematic structural diagram of the pins of a light-emitting unit provided in some embodiments of the present application.

[0017] Figure 3 for Figure 2 A schematic diagram of the top view structure of the pins shown.

[0018] Description of reference numerals:

[0019] 10. Light-emitting unit;

[0020] 110, light-emitting body; 111, packaging structure; 120, pin; 121, connecting part; 122, base; 123, through hole; 130, bracket. DETAILED DESCRIPTION

[0021] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0022] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0023] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0024] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0025] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0026] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0027] Light Emitting Diode (LED) is widely used due to its many advantages such as high efficiency, high brightness, high reliability, energy saving and fast response speed. With the continuous development of display technology, the pixel density of LED display screens continues to increase, the resolution continues to improve, and the spacing between lamp beads continues to decrease. Due to the constraints of process capabilities, the traditional mask process is gradually replaced by the printing ink process to ensure the consistency of the ink color of the LED display screen. However, the LED display screen of the related technology still has the problem of poor ink color consistency, which affects the display effect of the LED display screen.

[0028] After research, the inventors found that the cause of the above problem is that the consistency of multiple lamp beads in the display screen is poor. For example, there are differences in the heights of multiple lamp beads after being welded and fixed, which will cause low consistency in the ink color of the display screen and affect the display effect of the display screen.

[0029] Based on the above problems, the present application provides a light-emitting unit and a display module to improve the consistency of ink color, thereby improving the display effect of the display module.

[0030] Figure 1 A schematic diagram of the structure of a light-emitting unit in some embodiments of the present application is shown; Figure 2 A schematic structural diagram of the pins of the light-emitting unit provided in some embodiments of the present application is shown.

[0031] First, see Figure 1 and Figure 2As shown, an embodiment of the present application provides a light-emitting unit 10, including a light-emitting body 110 and a pin 120 arranged on the light-emitting body 110; the pin 120 includes a connecting portion 121 and a base 122, the connecting portion 121 is connected to the light-emitting body 110; the base 122 is connected to an end of the connecting portion 121 away from the light-emitting body 110; a through hole 123 is arranged on the base 122, and the through hole 123 is located at the periphery of the connecting portion 121.

[0032] The light-emitting unit 10 provided in the embodiment of the present application includes a light-emitting body 110 and a pin 120 disposed on the light-emitting body 110; the pin 120 includes a connecting portion 121 and a base 122, the connecting portion 121 is connected to the light-emitting body 110; the base 122 is connected to one end of the connecting portion 121 away from the light-emitting body 110; a through hole 123 is disposed on the base 122, and the through hole 123 is located at the periphery of the connecting portion 121. In this way, when the light-emitting unit 10 is connected to the circuit board by soldering, during the process of heating and reflowing the solder paste, the through hole 123 on the base 122 can timely discharge the gas generated by the evaporation of the flux in the solder paste, thereby reducing the probability of the light-emitting unit 10 shifting sideways during the solder paste reflow process, improving the height consistency of the light-emitting unit 10 after soldering and fixing, thereby improving the ink color consistency of the display module and improving the display effect of the display module. In addition, the light-emitting body 110 is supported by the pin 120 including the connection part 121 and the base part 122, so that the light-emitting body 110 and the pin 120 are designed as a lighthouse as a whole, so that the area between the light-emitting units 10 and the light-emitting units 10 is small, so that after the display module is lit with white light, the ink color consistency of the circuit board is better, thereby improving the ink color consistency of the display module and improving the display effect of the display module. In summary, the present application can improve the ink color consistency of the display module and improve the display effect of the display module.

[0033] It should be noted that the light-emitting unit 10 can specifically be a single lamp bead, or a combination of several lamp beads, and of course it can also be an LED light-emitting chip; if the light-emitting unit 10 is a lamp bead or a combination of several lamp beads, a light-emitting element is provided in the lamp bead, and the light-emitting element can be an LED light-emitting chip, or it can be other types of light-emitting chips, without specific limitation.

[0034] like Figure 3 As shown, in one embodiment, the orthographic projection of the connecting portion 121 on the base 122 is located inside the base 122 .

[0035] Therefore, by making the positive projection of the connecting portion 121 on the base 122 located within the base 122, the area of ​​the end of the pin 120 away from the light-emitting body 110 can be increased, thereby increasing the contact area between the pin 120 and the circuit board, improving the reliability of the connection between the light-emitting unit 10 and the circuit board, and further improving the reliability of the display module.

[0036] like Figure 2 As shown, in a specific example, the connection portion 121 is configured as a columnar structure; the height of the connection portion 121 may be 0.4 mm.

[0037] like Figure 3 As shown, in a specific example, the base 122 is configured as an elliptical structure; the long side of the elliptical structure may be 0.2 mm, the short side may be 0.15 mm, and the thickness of the base 122 may be 0.1 mm.

[0038] like Figures 1 to 3 As shown, in one embodiment, there are multiple through holes 123 , and the multiple through holes 123 are arranged at intervals around the connecting portion 121 .

[0039] Therefore, when the pins 120 on the light-emitting unit 10 are connected to the circuit board using solder paste, during the solder paste heating and reflow process, the multiple through holes 123 on the base 122 can promptly and evenly discharge the gas generated by the evaporation of the flux in the solder paste, thereby reducing the probability of the chip shifting sideways during the solder paste reflow process, further improving the height consistency of the chip after welding, and then improving the ink color consistency of the display module, thereby improving the display effect of the display module.

[0040] like Figure 3 As shown, in a specific example, the through hole 123 may be a circular hole, and the diameter of the circular hole may be 0.05 mm.

[0041] like Figure 1 As shown, in one embodiment, the light emitting unit 10 further includes a bracket 130 , and the bracket 130 is connected to the center of the light emitting body 110 close to the pin 120 .

[0042] Therefore, by providing the bracket 130, support can be provided for the light emitting unit 10, and the light emitting unit 10 can be prevented from being concave, thereby ensuring normal light emission of the light emitting unit 10, thereby improving the display effect of the display module.

[0043] In a specific example, the bracket 130 may be configured as a columnar structure, such as a cylindrical structure, and the height of the cylindrical structure is 0.5 mm and the diameter may be 0.3 mm.

[0044] In one embodiment, there are multiple pins 120 , and the multiple pins 120 are arranged at intervals around the bracket 130 .

[0045] Thus, the gas generated during the solder paste reflow process can be discharged in time through the through holes 123 on the multiple pins 120, thereby improving the height consistency of the light-emitting unit 10 after soldering and fixing, thereby improving the ink color consistency of the display module and improving the display effect of the display module. In addition, by connecting the light-emitting unit 10 to the circuit board through the multiple pins 120, the reliability of the connection between the two can be improved, thereby improving the reliability of the display module. In addition, the multiple pins 120 and the bracket 130 provide support for the light-emitting body 110, thereby improving the stability of the structure of the light-emitting unit 10, ensuring the normal light emission of the light-emitting unit 10, and improving the display effect of the display module.

[0046] In one embodiment, the light-emitting body 110 includes a light-emitting element (not shown). The light-emitting element may be an LED light-emitting chip or other types of light-emitting chips, which are not specifically limited.

[0047] like Figure 1 As shown, in one embodiment, the light-emitting body 110 further includes a packaging structure 111 , and the light-emitting element is disposed in the packaging structure 111 .

[0048] Therefore, the chip can be isolated from the outside world by the packaging structure 111 to prevent the chip from being corroded by impurities in the air, thereby extending the life of the chip and further improving the display effect of the display module.

[0049] In a specific example, the packaging structure 111 may be constructed as a rectangular parallelepiped structure. Of course, the packaging structure 111 may also be constructed as other structures, which is not particularly limited in the present application.

[0050] Specifically, the length of the rectangular parallelepiped structure is 1.2 mm, the width is 0.8 mm, and the height is 0.5 mm.

[0051] In one embodiment, the packaging structure 111 includes a packaging bracket (not shown) and a packaging layer (not shown), the light-emitting element is disposed on the packaging bracket and electrically connected to the packaging bracket; the packaging layer is disposed on the packaging bracket and covers the light-emitting element.

[0052] This can facilitate the installation and sealing of the light-emitting element, reduce the probability of aging and damage of the light-emitting element due to corrosion by external water vapor, improve the packaging reliability of the light-emitting unit, and extend the service life of the light-emitting unit.

[0053] An embodiment of the second aspect of the present application provides a display module, comprising the light-emitting unit 10 of any one of the first aspects.

[0054] It should be noted that the display module also includes a circuit board, a driving chip, etc. The light emitting unit 10 is arranged on one side of the circuit board, and the driving chip is arranged on the other side of the circuit board.

[0055] The display module provided in the embodiment of the present application comprises the light-emitting unit 10 described in any one of the first aspects, the light-emitting unit 10 comprises a light-emitting body 110 and a pin 120 disposed on the light-emitting body 110; the pin 120 comprises a connecting portion 121 and a base 122, the connecting portion 121 is connected to the light-emitting body 110; the base 122 is connected to one end of the connecting portion 121 away from the light-emitting body 110; a through hole 123 is disposed on the base 122, and the through hole 123 is located at the periphery of the connecting portion 121. In this way, when the light-emitting unit 10 is connected to the circuit board by soldering, during the process of heating and reflowing the solder paste, the through hole 123 on the base 122 can timely discharge the gas generated by the evaporation of the flux in the solder paste, thereby reducing the probability of the light-emitting unit 10 shifting sideways during the solder paste reflow process, improving the height consistency of the light-emitting unit 10 after soldering and fixing, thereby improving the ink color consistency of the display module and improving the display effect of the display module. In addition, the light-emitting body 110 is supported by the pin 120 including the connection part 121 and the base part 122, so that the light-emitting body 110 and the pin 120 are designed as a lighthouse as a whole, so that the area between the light-emitting units 10 and the light-emitting units 10 is small, so that after the display module is lit with white light, the ink color consistency of the circuit board is better, thereby improving the ink color consistency of the display module and improving the display effect of the display module. In summary, the present application can improve the ink color consistency of the display module and improve the display effect of the display module.

[0056] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0057] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A light emitting unit, characterized in that: It includes a light-emitting body and pins arranged on the light-emitting body; the pins include: A connecting portion connected to the light-emitting body; The base is connected to one end of the connecting portion away from the light-emitting body; a through hole is arranged on the base, and the through hole is located at the periphery of the connecting portion.

2. The light emitting unit according to claim 1, characterized in that: An orthographic projection of the connecting portion on the base is located within the base.

3. The light emitting unit according to claim 1, characterized in that: There are multiple through holes, and the multiple through holes are arranged at intervals around the connecting portion.

4. The light emitting unit according to any one of claims 1 to 3, characterized in that: The light emitting unit further comprises a bracket, and the bracket is connected to the center of one side of the light emitting body close to the pin.

5. The light emitting unit according to claim 4, characterized in that: There are multiple pins, and the multiple pins are arranged around the bracket at intervals.

6. The light emitting unit according to claim 1, characterized in that: The light-emitting body includes a light-emitting element.

7. The light emitting unit according to claim 6, characterized in that: The light-emitting body further includes a packaging structure, and the light-emitting element is arranged in the packaging structure.

8. The light emitting unit according to claim 1, characterized in that: The connecting portion is configured as a columnar structure; and the base portion is configured as an elliptical structure.

9. The light emitting unit according to claim 4, characterized in that: The support is configured as a columnar structure.

10. A display module, characterized in that: The invention comprises a light emitting unit according to any one of claims 1 to 9.