Novel chamfering device

Abstract

The utility model discloses a novel chamfering device which comprises a base, two dust suppression supporting plates and a wafer rotating assembly are fixed on the base, and an angle adjusting driving assembly is installed between the two dust suppression supporting plates. Compared with traditional grinding wheel chamfering, the wafer chamfering device has the advantages that the high-energy laser receiver and the high-energy laser transmitter are used in a matched mode to generate high-energy laser, and the wafer chamfering process is completed through the high-energy laser; in the laser chamfering process, a crystal is locally fused by a high-energy laser beam (the laser coupling power is adjustable in the range of 10-1000 W) and is subjected to plasma gasification, mechanical damage is not prone to being generated on the surface of the crystal, meanwhile, the sliding base slides on the arc-shaped sliding frame, various chamfering contours can be achieved, the chamfering installation base of the device can be directly installed on universal five-axis CNC equipment to be used, and the machining efficiency is greatly improved. And a programming program is used for accurately controlling the chamfering outline, so that the device is convenient to chamfer the wafer, high in efficiency and low in cost.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer chamfering, in particular to a novel chamfering device. Background Art

[0002] In the chamfering process of various crystal wafers and other semiconductor device wafers used as substrates for integrated circuits, and other disc-shaped thin plates composed of hard materials including metal materials, such as silicon (Si) single crystals, gallium arsenide (GaAs), crystal, quartz, sapphire, ferrite, silicon carbide (SiC), etc. (all of which are simply collectively referred to as wafers), a rough processing grinding wheel obtained by consolidating industrial diamond mixed with abrasive grains with a resin-based adhesive is used for grinding, and in the subsequent finishing process, a grinding wheel made of industrial diamond abrasives with finer grain size is used for grinding to form a peripheral portion with a specified shape and a specified surface roughness.

[0003] The conventional grinding wheel chamfering process has the following disadvantages:

[0004] 1. The chamfering grinding wheel needs to be specially customized (according to different specifications, such as R type, RT type, 11 degrees, 22 degrees, etc.). Each time a chamfer is replaced, a grinding wheel can only correspond to one specification. To process products of multiple specifications, the following measures are generally required:

[0005] 1.1. Equipped with multiple chamfering equipment, resulting in high equipment configuration costs;

[0006] 1.2. Every time the model is switched, the machine needs to be stopped to replace the grinding wheel, which results in low efficiency;

[0007] 2. Grinding wheel chamfering is a pure mechanical process, and the grinding wheel is grooved (corresponding to the convex shape after the wafer is chamfered). The wafer debris generated during the chamfering process is easy to get stuck on the grinding wheel, resulting in a linear runway on the chamfered surface (linear mechanical damage in the circumferential direction);

[0008] 2.1. If it is a silicon wafer, this type of chamfer damage needs to be removed by subsequent chemical etching and edge polishing processes, which leads to higher costs;

[0009] 2.2. If it is a super-hard wafer such as silicon carbide or diamond, it is difficult to etch and polish the edge due to the material characteristics; the standard process of the later stage does not have corrosion and edge polishing; because there is a mechanical damage layer on the chamfered surface, SLIP is easy to occur in the edge area of ​​the wafer during epitaxy.

[0010] 3. To avoid debris, a large amount of special cutting fluid is required during the chamfering process of the grinding wheel to remove the crystal debris generated during the chamfering process. The cutting fluid contains a large amount of COD and needs to be treated for environmental protection before it can be discharged, which is not in line with the concept of green production.

[0011] Therefore, we need to propose a new chamfering device to solve the above problems. Utility Model Content

[0012] The purpose of the utility model is to provide a new chamfering device. Compared with the traditional grinding wheel chamfering, the device is designed with a set of special wafer clamping and laser (transmitter receiving) devices, which completes the wafer chamfering process through high-energy laser to solve the problems raised in the above background technology.

[0013] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a novel chamfering device, comprising a base, on which two dust suppression support plates and a wafer rotating assembly are fixed, an angle adjustment drive assembly is installed between the two dust suppression support plates, and a wafer chamfering assembly is installed between the angle adjustment drive assembly and the wafer rotating assembly;

[0014] The wafer chamfering assembly includes an arc-shaped slide, a slide seat is slidably connected to the arc-shaped slide, a chamfering connecting block is fixed to the lower end of the slide, a chamfering mounting seat is fixed to the lower end of the chamfering connecting block, two groups of mounting brackets are slidably connected to the lower surface of the chamfering mounting seat, a high-energy laser receiver is installed on one group of the mounting brackets, and a high-energy laser transmitter is installed on the other group of the mounting brackets, and the high-energy laser receiver is used in conjunction with the high-energy laser transmitter.

[0015] Preferably, the wafer rotation assembly comprises two groups of support frames and a rotating rod, the two ends of the arc-shaped slide are respectively fixed to the upper ends of the two groups of support frames, and the rotating rod is rotatably connected to one group of support frames through support frame bearings.

[0016] Preferably, one end of the rotating rod extends out of a support frame and is connected to a rotating motor, a base of the rotating motor is fixed on the outside of a group of support frames, the other end of the rotating rod is fixed with a suction cup fixing seat, and a chip suction cup is fixed on the side of the suction cup fixing seat away from the rotating rod.

[0017] Preferably, the wafer rotation assembly further comprises a limiting cylinder, wherein the limiting cylinder is located between a group of support frames and a suction cup fixing seat, and one end of the limiting cylinder is fixed to the inner side of a group of support frames, and the rotating rod is rotatably connected to the limiting cylinder.

[0018] Preferably, a limiting ring is sleeved on the limiting cylinder, and the limiting ring is located on the outer wall of one end of the limiting cylinder away from a group of support frames. A limiting support column is fixed to the lower end of the outer wall of the limiting ring, and the lower end of the limiting support column is fixed to the upper surface of the base.

[0019] Preferably, support plate bearings are embedded in the two dust suppression support plates, and a rubber anti-collision ring is fixed on the opposite side of the two dust suppression support plates.

[0020] Preferably, a dust suppression back plate is fixed to the rear side of the two dust suppression support plates, the lower end of the dust suppression back plate is fixed to the upper surface of the base, and a dust suppression top plate is fixed to the upper end of the two dust suppression support plates.

[0021] Preferably, the angle adjustment drive assembly includes an angle adjustment threaded rod, which is rotatably connected between two dust suppression support plates through a support plate bearing, one end of the angle adjustment threaded rod is connected to an angle adjustment motor, and the base of the angle adjustment motor is fixed on the outside of a dust suppression support plate.

[0022] Preferably, the angle adjustment drive assembly also includes a drive block, a screw sleeve is embedded in the drive block, the drive block is threadedly connected to the angle adjustment threaded rod through the screw sleeve, two groups of telescopic mother rods are provided at the lower end of the drive block, telescopic sub-rods are slidably connected between the two groups of telescopic mother rods, and one group of telescopic mother rods is fixed to the lower end of the drive block.

[0023] Preferably, the angle adjustment drive assembly also includes an angle adjustment U-shaped seat, which is fixed to the upper end of the sliding seat. The angle adjustment U-shaped seat is rotatably connected to a rotating shaft via a U-shaped seat bearing, and a connecting wheel is fixed to the rotating shaft. Another group of the telescopic mother rods is fixed to the upper end of the connecting wheel.

[0024] Compared with the prior art, the beneficial effects of the utility model are:

[0025] 1. The utility model adds a design of a wafer chamfering component. Compared with traditional grinding wheel chamfering, the device generates high-energy laser by using a high-energy laser receiver and a high-energy laser transmitter in combination, and completes the wafer chamfering process by high-energy laser. During the laser chamfering process, the crystal is partially melted and plasma-gasified by a high-energy laser beam (the laser coupling power is adjustable in the range of 10W-1000W), and it is not easy to cause mechanical damage on the crystal surface. At the same time, the slide slides on the arc slide, and a variety of chamfering profiles can be achieved. The chamfering mounting seat of the device can be directly installed on a general 5-axis CNC device for use, and the chamfering profile is accurately controlled by a programming program, so that the device is convenient to operate for wafer chamfering, efficient, and low in cost.

[0026] 2. The utility model adds a design of a wafer rotating assembly. When in use, the wafer is adsorbed on the wafer suction cup so that the wafer and the base are kept vertical. Through the continuous operation of the rotating motor, the edges and corners of the wafer are continuously melted by the high-energy laser beam, and the wafer chamfering operation is finally completed, making it easier to load and unload the wafer during chamfering and enhancing the degree of automation of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of the utility model;

[0028] Figure 2This is a structural schematic diagram of the angle adjustment drive assembly of the utility model;

[0029] Figure 3 This is a schematic diagram of the structure of the wafer chamfering assembly of the utility model;

[0030] Figure 4 It is a schematic diagram of the exploded structure of the wafer rotating assembly of the utility model.

[0031] In the figure: 100, base; 110, dust suppression support plate; 111, support plate bearing; 112, rubber anti-collision ring; 120, dust suppression top plate; 130, dust suppression back plate; 200, angle adjustment drive assembly; 201, angle adjustment motor; 202, angle adjustment threaded rod; 203, drive block; 204, screw sleeve; 211, angle adjustment U-shaped seat; 212, U-shaped seat bearing; 213, rotating shaft; 214, connecting wheel; 215, telescopic mother rod; 216, telescopic sub-rod; 300, wafer inverted Corner assembly; 301, arc-shaped slide; 302, slide seat; 303, chamfered connecting block; 304, chamfered mounting seat; 305, mounting bracket; 306, high-energy laser receiver; 307, high-energy laser transmitter; 400, wafer rotation assembly; 401, support frame; 402, support frame bearing; 411, rotating motor; 412, rotating rod; 413, wafer suction cup; 414, suction cup fixing seat; 421, limiting cylinder; 422, limiting ring; 423, limiting support column. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] See also Figure 1-4 The utility model provides a technical solution: a novel chamfering device, comprising a base 100, on which two dust suppression support plates 110 and a wafer rotating assembly 400 are fixed, an angle adjustment drive assembly 200 is installed between the two dust suppression support plates 110, and a wafer chamfering assembly 300 is installed between the angle adjustment drive assembly 200 and the wafer rotating assembly 400;

[0034] The wafer chamfering assembly 300 includes an arc-shaped slide 301, a slide seat 302 is slidably connected to the arc-shaped slide 301, a chamfering connection block 303 is fixed to the lower end of the slide seat 302, a chamfering mounting seat 304 is fixed to the lower end of the chamfering connection block 303, two groups of mounting brackets 305 are slidably connected to the lower surface of the chamfering mounting seat 304, a high-energy laser receiver 306 is installed on one group of mounting brackets 305, and a high-energy laser transmitter 307 is installed on the other group of mounting brackets 305, and the high-energy laser receiver 306 is used in conjunction with the high-energy laser transmitter 307;

[0035] Compared with the traditional grinding wheel chamfering, the device generates high-energy laser by using a high-energy laser receiver 306 and a high-energy laser transmitter 307 in combination, and completes the wafer chamfering process by high-energy laser. During the laser chamfering process, the crystal is partially melted and plasma-gasified by the high-energy laser beam (the laser coupling power is adjustable in the range of 10W-1000W), and it is not easy to cause mechanical damage on the crystal surface. At the same time, the slide 302 slides on the arc slide 301, and various chamfering profiles can be achieved;

[0036] At the same time, the chamfering mounting seat 304 of the device can be directly mounted on a general 5-axis CNC type device, and the wafer chamfering process is completed by high-energy laser. Through online programming of the laser chamfering machine, a variety of chamfering profiles can be achieved, which is convenient to operate, high in efficiency and low in cost;

[0037] And the multi-step chamfering is controlled by the program (① Rough chamfering: using high-power excitation laser to make the chip contour meet the requirements after chamfering; ② Fine chamfering: using low-power excitation laser to trim the roughness of the chamfered surface). Especially for super-hard crystals such as silicon carbide or diamond wafers, due to the material characteristics, it is difficult to corrode and polish. Although the standard process of the later stage has no corrosion and edge polishing, there is almost no mechanical damage layer on the chamfered surface, and almost no SLIP is generated in the edge area of ​​the chip during epitaxy.

[0038] The wafer rotating assembly 400 includes two sets of support frames 401 and a rotating rod 412. The two ends of the arc-shaped slide 301 are respectively fixed to the upper ends of the two sets of support frames 401. The rotating rod 412 is rotatably connected to one set of support frames 401 through a support frame bearing 402.

[0039] One end of the rotating rod 412 extends out of the support frame 401 and is connected to a rotating motor 411. The base of the rotating motor 411 is fixed to the outside of a group of supporting frames 401. The other end of the rotating rod 412 is fixed to a suction cup fixing seat 414. A wafer suction cup 413 is fixed to the side of the suction cup fixing seat 414 away from the rotating rod 412.

[0040] When in use, the wafer is adsorbed on the wafer suction cup 413 so that the wafer and the base 100 remain vertical. Through the continuous operation of the rotating motor 411, the edges and corners of the wafer are continuously melted by the high-energy laser beam, and finally the wafer chamfering operation is completed, making it easy to load and unload the wafer during chamfering and enhancing the degree of automation of the device.

[0041] The wafer rotating assembly 400 further includes a limiting cylinder 421, which is located between a group of supporting frames 401 and a suction cup fixing seat 414, and one end of the limiting cylinder 421 is fixed to the inner side of a group of supporting frames 401, and the rotating rod 412 is rotatably connected to the limiting cylinder 421;

[0042] A limiting ring 422 is sleeved on the limiting cylinder 421, and the limiting ring 422 is located on the outer wall of one end of the limiting cylinder 421 away from a group of support frames 401. A limiting support column 423 is fixed to the lower end of the outer wall of the limiting ring 422, and the lower end of the limiting support column 423 is fixed to the upper surface of the base 100, so as to limit the angle of the rotating rod 412 and prevent it from being displaced during rotation, thereby preventing the chip from being offset and damaged by the high-energy laser beam.

[0043] Support plate bearings 111 are embedded on the two dust suppression support plates 110 , and a rubber anti-collision ring 112 is fixed on the opposite side of the two dust suppression support plates 110 to prevent the driving block 203 from colliding with the dust suppression support plate 110 during movement.

[0044] A dust suppression back plate 130 is fixed to the rear side of the two dust suppression support plates 110, the lower end of the dust suppression back plate 130 is fixed to the upper surface of the base 100, and a dust suppression top plate 120 is fixed to the upper end of the two dust suppression support plates 110 to prevent chip debris from splashing around due to the rotation of the chip when leaving the chip.

[0045] The angle adjustment drive assembly 200 includes an angle adjustment threaded rod 202, which is rotatably connected between two dust suppression support plates 110 through a support plate bearing 111, and one end of the angle adjustment threaded rod 202 is connected to an angle adjustment motor 201, and the base of the angle adjustment motor 201 is fixed to the outside of one dust suppression support plate 110;

[0046] The angle adjustment drive assembly 200 also includes a drive block 203, a screw sleeve 204 is embedded in the drive block 203, the drive block 203 is threadedly connected to the angle adjustment threaded rod 202 through the screw sleeve 204, and two groups of telescopic mother rods 215 are provided at the lower end of the drive block 203, and a telescopic sub-rod 216 is slidably connected between the two groups of telescopic mother rods 215, and one group of telescopic mother rods 215 is fixed to the lower end of the drive block 203;

[0047] The angle adjustment drive assembly 200 further includes an angle adjustment U-shaped seat 211, which is fixed to the upper end of the slide seat 302, and a rotating shaft 213 is rotatably connected to the angle adjustment U-shaped seat 211 through a U-shaped seat bearing 212, and a connecting wheel 214 is fixed to the rotating shaft 213, and another set of telescopic mother rods 215 is fixed to the upper end of the connecting wheel 214;

[0048] The driving block 203 is displaced by operating the angle adjustment motor 201, thereby driving the slide 302 to slide on the arc slide 301, thereby changing the angles of the high-energy laser receiver 306 and the high-energy laser transmitter 307, thereby changing the angle of the high-energy laser beam.

[0049] In actual use, the laser chamfering process only requires the use of ice water to cool the contact area between the laser and the wafer (the ice water can be recycled, filtered and cooled for continued use), and no special cutting fluid is required. The only emission is crystal debris (with trace amounts of water), which does not contain COD and is easy to handle for environmental protection.

[0050] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A novel chamfering device, comprising a base (100), characterized in that: Two dust suppression support plates (110) and a wafer rotation assembly (400) are fixed on the base (100); an angle adjustment drive assembly (200) is installed between the two dust suppression support plates (110); and a wafer chamfering assembly (300) is installed between the angle adjustment drive assembly (200) and the wafer rotation assembly (400); The wafer chamfering assembly (300) comprises an arc-shaped slide (301), a slide seat (302) is slidably connected to the arc-shaped slide (301), a chamfering connection block (303) is fixed at the lower end of the slide seat (302), a chamfering mounting seat (304) is fixed at the lower end of the chamfering connection block (303), two groups of mounting brackets (305) are slidably connected to the lower surface of the chamfering mounting seat (304), a high-energy laser receiver (306) is mounted on one group of the mounting brackets (305), and a high-energy laser transmitter (307) is mounted on the other group of the mounting brackets (305), and the high-energy laser receiver (306) is used in conjunction with the high-energy laser transmitter (307).

2. A novel chamfering device according to claim 1, characterized in that: The wafer rotating assembly (400) comprises two groups of support frames (401) and a rotating rod (412), the two ends of the arc-shaped slide (301) are respectively fixed to the upper ends of the two groups of support frames (401), and the rotating rod (412) is rotatably connected to one group of support frames (401) through a support frame bearing (402).

3. A novel chamfering device according to claim 2, characterized in that: One end of the rotating rod (412) extends out of the support frame (401) and is connected to a rotating motor (411); a base of the rotating motor (411) is fixed on the outside of a group of supporting frames (401); a suction cup fixing seat (414) is fixed on the other end of the rotating rod (412); a wafer suction cup (413) is fixed on the side of the suction cup fixing seat (414) away from the rotating rod (412).

4. A novel chamfering device according to claim 3, characterized in that: The wafer rotation assembly (400) further comprises a limiting cylinder (421), wherein the limiting cylinder (421) is located between a group of support frames (401) and a suction cup fixing seat (414), and one end of the limiting cylinder (421) is fixed to the inner side of a group of support frames (401), and the rotating rod (412) is rotatably connected to the limiting cylinder (421).

5. A novel chamfering device according to claim 4, characterized in that: A limiting ring (422) is sleeved on the limiting cylinder (421), and the limiting ring (422) is located on the outer wall of one end of the limiting cylinder (421) away from a group of support frames (401). A limiting support column (423) is fixed to the lower end of the outer wall of the limiting ring (422), and the lower end of the limiting support column (423) is fixed to the upper surface of the base (100).

6. A novel chamfering device according to claim 1, characterized in that: A support plate bearing (111) is embedded on the two dust suppression support plates (110), and a rubber anti-collision ring (112) is fixed on the opposite side of the two dust suppression support plates (110).

7. A novel chamfering device according to claim 6, characterized in that: A dust suppression back plate (130) is fixed to the rear side of the two dust suppression support plates (110), the lower end of the dust suppression back plate (130) is fixed to the upper surface of the base (100), and a dust suppression top plate (120) is fixed to the upper end of the two dust suppression support plates (110).

8. A novel chamfering device according to claim 6, characterized in that: The angle adjustment drive assembly (200) comprises an angle adjustment threaded rod (202), the angle adjustment threaded rod (202) being rotatably connected between two dust suppression support plates (110) via a support plate bearing (111), one end of the angle adjustment threaded rod (202) being connected to an angle adjustment motor (201), and a base of the angle adjustment motor (201) being fixed on the outside of one dust suppression support plate (110).

9. A novel chamfering device according to claim 8, characterized in that: The angle adjustment drive assembly (200) further comprises a drive block (203), a screw sleeve (204) is embedded in the drive block (203), the drive block (203) is threadedly connected to the angle adjustment threaded rod (202) through the screw sleeve (204), two groups of telescopic mother rods (215) are arranged at the lower end of the drive block (203), a telescopic sub-rod (216) is slidably connected between the two groups of telescopic mother rods (215), and one group of the telescopic mother rods (215) is fixed to the lower end of the drive block (203).

10. A novel chamfering device according to claim 9, characterized in that: The angle adjustment drive assembly (200) further comprises an angle adjustment U-shaped seat (211), wherein the angle adjustment U-shaped seat (211) is fixed to the upper end of the sliding seat (302), a rotating shaft (213) is rotatably connected to the angle adjustment U-shaped seat (211) via a U-shaped seat bearing (212), a connecting wheel (214) is fixed to the rotating shaft (213), and another group of telescopic mother rods (215) is fixed to the upper end of the connecting wheel (214).

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