Integrated circuit polishing device

By designing the adjustment mechanism and power mechanism of the integrated circuit grinding device, adaptability to chips without standard size or special shapes is achieved, the problem of displacement during grinding in the prior art is solved, and the practicality and fixing effect of the equipment are improved.

CN222627229UActive Publication Date: 2025-03-18SHENYANG XINSHUO TECH CO LTD
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Patent Information

Application Number
CN202421370355.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-17
Publication Date
2025-03-18
Estimated Expiration
2034-06-17

AI Technical Summary

Technical Problem

Existing integrated circuit grinding devices are difficult to adapt to chips of non-standard sizes or special shapes, resulting in possible displacement during grinding, increasing engineering complexity and cost.

Method used

An integrated circuit grinding device is designed, including an adjustment mechanism and a power mechanism. The power mechanism pushes the installation column to move, so that the telescopic column is close to the side of the integrated circuit, the clamp is close to the side of the integrated circuit, and one-button control and fixation of different chips are achieved through threaded rods and worm gears.

Benefits of technology

It realizes uniform fixing and polishing of integrated circuits of different models and shapes, improving the adaptability and practicality of the equipment, and reducing engineering complexity and cost.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of polishing devices, and discloses an integrated circuit polishing device which comprises an equipment body and further comprises an adjusting mechanism and a power mechanism, the inner wall of the side face of the equipment body is movably connected with the side face of the power mechanism in a sleeved mode, and the bottom end of the adjusting mechanism is fixedly connected with the top end of the equipment body; the power mechanism pushes the installation column to move along the inner wall of the side face of the installation sleeve to enable the telescopic column to approach the side face of the integrated circuit, when the clamping block approaches the integrated circuit, the corresponding adjusting mechanism is adjusted, the threaded rod rotates to drive the telescopic column to move along the inner wall of the side face of the installation column through the thread, and the clamping block is tightly attached to the side face of the integrated circuit. And then the power mechanism drives the mounting columns of the six adjusting mechanisms to move along the inner wall of the side face of the mounting sleeve to be close to or away from the side faces of the integrated circuits, the integrated circuits of different models are fixed, and the practicability of the device is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of polishing devices, and more specifically to an integrated circuit polishing device. Background Art

[0002] An integrated circuit is a tiny chip that integrates multiple electronic devices and their interconnected circuits. It can realize complex functions and is a core component of modern electronic equipment and computer technology. It is widely used in communications, consumer electronics, automotive electronics, medical equipment and industrial control. In the production process of integrated circuits, in order to ensure the surface flatness and quality of the integrated circuit, it is necessary to use a grinding device to grind and polish the surface of the integrated circuit to remove uneven surfaces, defects or contaminants.

[0003] Deficiencies of existing technology: In order to prevent the integrated circuit from shifting during polishing, it needs to be fixed. However, existing integrated circuit polishing devices are usually designed to process chips of standard sizes. For chips of non-standard sizes or special shapes, the polishing device may not provide good adaptability, which may require additional customization or adjustment, increasing engineering complexity and cost. Utility Model Content

[0004] In order to overcome the above-mentioned defects of the prior art, the utility model provides an integrated circuit polishing device to solve the problems existing in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an integrated circuit polishing device, comprising an equipment main body, and also comprising: an adjusting mechanism and a power mechanism, the side inner wall of the equipment main body is movably sleeved with the side of the power mechanism, the bottom end of the adjusting mechanism is fixedly connected to the top of the equipment main body, the equipment main body comprises a base, the top of the base is provided with a recovery groove, the side of the recovery groove is fixedly connected with a support frame, the side of the support frame is fixedly connected with a processing table, the adjusting mechanism comprises a mounting sleeve, the bottom end of the mounting sleeve is fixedly connected with the top of the processing table, the side inner wall of the mounting sleeve is movably connected with a mounting column, the side of the power mechanism is movably connected with the side of the mounting column through a pin, the side inner wall of the side of the mounting column is movably sleeved with a threaded rod, the side of the threaded rod is threadedly connected with a telescopic column, the side of the telescopic column is movably connected with the side inner wall of the mounting column, and the adjusting mechanism is evenly distributed at the top of the support frame.

[0006] Furthermore, a mounting block is movably connected to a side surface of the telescopic column, a clamping block is fixedly connected to a side surface of the mounting block, and the clamping block is a semi-cylindrical structure.

[0007] Furthermore, a mounting groove is provided on a side surface of the telescopic column, a pressure spring is fixedly connected to the side surface of the mounting groove, and a side surface of the pressure spring is fixedly connected to an inner wall of a side surface of the mounting block.

[0008] Furthermore, an indicator light is fixedly connected to the top of the telescopic column, a slide groove spring is fixedly connected to the side of the mounting groove, and a touch switch is fixedly connected to the side of the slide groove spring.

[0009] Furthermore, a transmission rod is movably sleeved on the inner wall of the bottom end of the mounting column, a worm is fixedly sleeved on the side of the transmission rod, a worm gear is fixedly sleeved on the side of the threaded rod, the side of the worm gear is meshed with the side of the worm, and a hexagonal slot is provided on the top of the transmission rod.

[0010] Furthermore, the power mechanism includes an annular turntable, the side of which is movably connected to the side of the recovery groove, the inner wall of the side of the annular turntable is provided with a storage groove, the side of the storage groove is movably connected to a support rod through a pin, and the side of the support rod is movably connected to the side of the mounting column through a pin.

[0011] Furthermore, the top end of the base is movably connected to a pneumatic telescopic rod via a pin, and the bottom end of the pneumatic telescopic rod is movably connected to the top end of the annular turntable via a pin.

[0012] Technical effects and advantages of the utility model:

[0013] 1. The utility model uses a power mechanism to push the mounting column to move along the side inner wall of the mounting sleeve so that the telescopic column approaches the side of the integrated circuit. When the clamping block approaches the integrated circuit, the power mechanism is stopped, and the corresponding adjusting mechanism is adjusted according to the contact between the clamping block on each adjusting mechanism and the integrated circuit. The threaded rod rotates to drive the telescopic column to move along the side inner wall of the mounting column through the thread, so that the clamping block is close to the side of the integrated circuit, so that the clamping blocks on the sides of the six adjusting mechanisms are evenly integrated and contact the side of the electric saw. After that, the mounting columns of the six adjusting mechanisms are driven by the power mechanism to move along the side inner wall of the mounting sleeve to approach or move away from the side of the integrated circuit, thereby realizing one-button control and fixing integrated circuits of different models, which is conducive to improving the practicality of the equipment.

[0014] 2. The utility model presses the clamping block against the side of the integrated circuit, so that the pressure spring contracts until the inner wall of the side of the mounting block contacts the side of the telescopic column. At this time, the touch switch contacts the inner wall of the side of the mounting block, so that the touch switch control indicator emits green light, indicating that the clamping block on the corresponding adjustment mechanism has been pressed against the side of the integrated circuit to complete the adjustment of the corresponding adjustment mechanism, which is convenient for operators to understand the adjustment status and is conducive to improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the power mechanism structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the adjustment mechanism of the utility model;

[0018] Figure 4 This is a schematic diagram of the internal structure of the installation column of the utility model;

[0019] Figure 5 It is a schematic diagram of the cross-sectional structure of the installation block of the utility model.

[0020] The accompanying drawings are marked as follows: 1. Equipment body; 101. Base; 102. Support frame; 103. Recovery tank; 104. Processing table; 2. Adjustment mechanism; 201. Mounting column; 202. Mounting sleeve; 203. Transmission rod; 204. Telescopic column; 205. Indicator light; 206. Mounting block; 207. Clamp block; 208. Threaded rod; 209. Hexagonal slot; 210. Worm; 211. Worm gear; 212. Slide spring; 213. Mounting slot; 214. Touch switch; 215. Pressure spring; 3. Power mechanism; 301. Ring turntable; 302. Pneumatic telescopic rod; 303. Support rod; 304. Storage slot. DETAILED DESCRIPTION

[0021] The technical solution of the present invention will be clearly and completely described below in conjunction with the drawings in the present invention. In addition, the forms of the various structures recorded in the following embodiments are merely illustrative. The integrated circuit polishing device involved in the present invention is not limited to the various structures recorded in the following embodiments. All other implementations obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention.

[0022] Reference Figures 1 to 5The utility model provides an integrated circuit polishing device, comprising an equipment body 1, and also comprising: an adjusting mechanism 2 and a power mechanism 3, the side inner wall of the equipment body 1 is movably sleeved with the side of the power mechanism 3, the bottom end of the adjusting mechanism 2 is fixedly connected with the top of the equipment body 1, the equipment body 1 comprises a base 101, a recovery groove 103 is provided at the top of the base 101, a support frame 102 is fixedly connected to the side of the recovery groove 103, a processing table 104 is fixedly connected to the side of the support frame 102, the adjusting mechanism 2 comprises a mounting sleeve 202, the bottom end of the mounting sleeve 202 is fixedly connected to the top of the processing table 104, a mounting column 201 is movably connected to the side inner wall of the mounting sleeve 202, the side of the power mechanism 3 is movably connected to the side of the mounting column 201 through a pin, a threaded rod 208 is movably sleeved on the side inner wall of the mounting column 201, a telescopic column 204 is threadedly connected to the side of the threaded rod 208, the side of the telescopic column 204 is movably connected to the side inner wall of the mounting column 201, the adjusting mechanism 2 are evenly distributed on the top of the support frame 102, and the adjustment mechanisms 2 all point to the center of the processing table 104. The integrated circuit to be polished is placed at the center of the top of the processing table 104. The power mechanism 3 pushes the mounting column 201 to move along the side inner wall of the mounting sleeve 202 to make the telescopic column 204 close to the side of the integrated circuit. When the clamping block 207 is close to the integrated circuit, the power mechanism 3 is stopped. According to the contact between the clamping block 207 on each adjustment mechanism 2 and the integrated circuit, the corresponding adjustment mechanism 2 is adjusted. The threaded rod 208 rotates and drives the telescopic column 204 to move along the side inner wall of the mounting column 201 through the thread, so that the clamping block 207 is close to the side of the integrated circuit, so that the clamping blocks 207 on the sides of the six adjustment mechanisms 2 are evenly integrated and contact the side of the electric saw. After that, the mounting columns 201 of the six adjustment mechanisms 2 are driven by the power mechanism 3 to move along the side inner wall of the mounting sleeve 202 to approach or move away from the side of the integrated circuit, so as to realize one-key control and fix integrated circuits of different models.

[0023] Among them, the side of the telescopic column 204 is movably connected to the mounting block 206, and the side of the mounting block 206 is fixedly connected to the clamping block 207. The clamping block 207 is a semi-cylindrical structure. The curved surface of the clamping block 207 facilitates the six adjustment mechanisms 2 to be fixed tightly to the side of the integrated circuit.

[0024] Among them, a mounting groove 213 is opened on the side of the telescopic column 204, and a pressure spring 215 is fixedly connected to the side of the mounting groove 213. The side of the pressure spring 215 is fixedly connected to the inner wall of the side of the mounting block 206. When the clamping block 207 contacts the side of the integrated circuit, the pressure spring 215 contracts until the inner wall of the side of the mounting block 206 contacts the side of the telescopic column 204, thereby limiting the mounting block 206 and preventing the integrated circuit from shaking.

[0025] Among them, the top of the telescopic column 204 is fixedly connected with an indicator light 205, the side of the mounting groove 213 is fixedly connected with a slide groove spring 212, and the side of the slide groove spring 212 is fixedly connected with a touch switch 214. When the inner wall of the side of the mounting block 206 is in contact with the side of the telescopic column 204, the touch switch 214 contacts the inner wall of the side of the mounting block 206, so that the touch switch 214 controls the indicator light 205 to emit green light, indicating that the clamping block 207 on the corresponding adjustment mechanism 2 has been tightly attached to the side of the integrated circuit to complete the adjustment of the corresponding adjustment mechanism 2.

[0026] Among them, a transmission rod 203 is movably sleeved on the inner wall of the bottom end of the mounting column 201, a worm 210 is fixedly sleeved on the side of the transmission rod 203, a worm gear 211 is fixedly sleeved on the side of the threaded rod 208, the side of the worm gear 211 is meshed with the side of the worm 210, a hexagonal slot 209 is provided on the top of the transmission rod 203, a hexagonal wrench is inserted into the hexagonal slot 209, and the transmission rod 203 is rotated by turning the wrench, and the threaded rod 208 is rotated through the meshing of the worm 210 and the worm gear 211.

[0027] Among them, the power mechanism 3 includes an annular turntable 301, the side of the annular turntable 301 is movably connected to the side of the recovery groove 103, and a storage groove 304 is opened on the inner wall of the side of the annular turntable 301. The side of the storage groove 304 is movably connected with a support rod 303 through a pin, and the side of the support rod 303 is movably connected to the side of the mounting column 201 through a pin. The annular turntable 301 rotates along the side of the recovery groove 103 so that one end of the support rod 303 rotates along the pin on the side of the storage groove 304, and the other end rotates along the pin on the side of the mounting column 201, thereby pushing the mounting column 201 to move along the inner wall of the side of the mounting sleeve 202.

[0028] Among them, the top of the base 101 is movably connected to the pneumatic telescopic rod 302 through a pin, and the bottom end of the pneumatic telescopic rod 302 is movably connected to the top of the annular turntable 301 through a pin. The pneumatic telescopic rod 302 is provided with constant air pressure through the charging device, so that the pneumatic telescopic rod 302 pushes the annular turntable 301 to rotate, thereby avoiding damage caused by excessive pressure when the adjustment mechanism 2 clamps the integrated circuit.

[0029] The working principle of the utility model is as follows: the integrated circuit to be polished is placed at the center of the top of the processing table 104, and the pneumatic telescopic rod 302 is started to push the annular turntable 301 to rotate along the side of the recovery groove 103, so that one end of the support rod 303 rotates along the pin on the side of the storage groove 304, and the other end rotates along the pin on the side of the mounting column 201, pushing the mounting column 201 to move along the inner wall of the side of the mounting sleeve 202, so that the clamping block 207 approaches the side of the integrated circuit. When the clamping block 207 approaches the integrated circuit, the hexagonal wrench is inserted into the hexagonal slot 209, and the wrench is rotated to drive the transmission rod 203 to rotate, and the threaded rod 208 is driven to rotate through the mutual engagement of the worm 210 and the worm gear 211, and the telescopic rod 208 is driven to rotate through the thread. The column 204 moves along the side inner wall of the mounting column 201, so that the clamping block 207 is close to the side of the integrated circuit, and the pressure spring 215 is contracted until the side inner wall of the mounting block 206 contacts the side of the telescopic column 204. At this time, the touch switch 214 contacts the side inner wall of the mounting block 206, so that the touch switch 214 controls the indicator light 205 to emit green light, indicating that the clamping block 207 on the corresponding adjustment mechanism 2 has been closely attached to the side of the integrated circuit to complete the adjustment of the corresponding adjustment mechanism 2. When the adjustment of the six adjustment mechanisms 2 is completed, the annular turntable 301 is driven to rotate forward and reverse by controlling the pneumatic telescopic rod 302 to fix the integrated circuit with the same signal. During polishing, the polishing liquid falls into the recovery tank 103 for recycling.

[0030] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated circuit polishing device, comprising a device body (1), characterized in that: Also includes: The device body (1) comprises an adjusting mechanism (2) and a power mechanism (3), wherein the inner wall of the side surface of the device body (1) is movably connected to the side surface of the power mechanism (3), the bottom end of the adjusting mechanism (2) is fixedly connected to the top end of the device body (1), the device body (1) comprises a base (101), the top end of the base (101) is provided with a recovery groove (103), the side surface of the recovery groove (103) is fixedly connected to a support frame (102), the side surface of the support frame (102) is fixedly connected to a processing table (104), the adjusting mechanism (2) comprises a mounting sleeve (202), the mounting sleeve (203) is fixedly connected to the processing table (104), and the adjusting mechanism (2) comprises a mounting sleeve (202). 02) is fixedly connected to the top of the processing table (104); the inner wall of the side of the mounting sleeve (202) is movably connected to the mounting column (201); the side of the power mechanism (3) is movably connected to the side of the mounting column (201) through a pin; the inner wall of the side of the mounting column (201) is movably sleeved with a threaded rod (208); the side of the threaded rod (208) is threadedly connected to a telescopic column (204); the side of the telescopic column (204) is movably connected to the inner wall of the side of the mounting column (201); and the adjustment mechanism (2) is evenly distributed on the top of the support frame (102).

2. The integrated circuit polishing device according to claim 1, characterized in that: The side of the telescopic column (204) is movably connected to a mounting block (206), and the side of the mounting block (206) is fixedly connected to a clamping block (207), and the clamping block (207) is a semi-cylindrical structure.

3. The integrated circuit polishing device according to claim 2, characterized in that: A mounting groove (213) is provided on the side of the telescopic column (204), a pressure spring (215) is fixedly connected to the side of the mounting groove (213), and a side of the pressure spring (215) is fixedly connected to the inner wall of the side of the mounting block (206).

4. The integrated circuit polishing device according to claim 3, characterized in that: An indicator light (205) is fixedly connected to the top of the telescopic column (204), a slide groove spring (212) is fixedly connected to the side of the installation groove (213), and a touch switch (214) is fixedly connected to the side of the slide groove spring (212).

5. The integrated circuit polishing device according to claim 1, characterized in that: A transmission rod (203) is movably sleeved on the inner wall of the bottom end of the mounting column (201); a worm (210) is fixedly sleeved on the side of the transmission rod (203); a worm gear (211) is fixedly sleeved on the side of the threaded rod (208); the side of the worm gear (211) is meshed with the side of the worm (210); and a hexagonal slot (209) is provided at the top end of the transmission rod (203).

6. The integrated circuit polishing device according to claim 1, characterized in that: The power mechanism (3) comprises an annular turntable (301), the side of the annular turntable (301) is movably connected to the side of the recovery groove (103), the inner wall of the side of the annular turntable (301) is provided with a storage groove (304), the side of the storage groove (304) is movably connected to a support rod (303) through a pin, and the side of the support rod (303) is movably connected to the side of the mounting column (201) through a pin.

7. The integrated circuit polishing device according to claim 6, characterized in that: The top end of the base (101) is movably connected to a pneumatic telescopic rod (302) via a pin, and the bottom end of the pneumatic telescopic rod (302) is movably connected to the top end of the annular turntable (301) via a pin.