Positioning jig
By designing a positioning fixture including a base, a moving component and a fastening component, the problem that existing fixtures cannot adapt to the plastic sealing structure of semiconductor modules in different sizes is solved, and a general adaptation and cost reduction for different sizes is achieved.
Patent Information
- Application Number
- CN202420832400.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-22
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-04-22
AI Technical Summary
Existing fixtures can only support a single fixed-size semiconductor module sealing structure, resulting in different sizes of semiconductor module sealing structures required by different customers. The corresponding fixtures need to be customized, which increases management and production costs.
A positioning fixture is designed, including a base, a moving assembly and a fastening assembly. The first moving member in the moving assembly moves in the guide with the slider, and the fastening assembly defines the relative position between the moving member and the base and the semiconductor module sealing structure through the first and second fasteners, thereby realizing the position definition of the semiconductor module sealing structure of different sizes.
The positioning fixture can adapt to the plastic sealing structure of semiconductor modules of different sizes, avoiding the need for individual custom fixtures for each size, improving the versatility of fixtures, and reducing production and management costs.
Smart Images
Figure CN222627464U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to a positioning fixture. Background Art
[0002] Semiconductor product plastic packaging The plastic packaging structure of semiconductor modules is widely used in various industries. The structure of the semiconductor module plastic packaging structure is complex. During transportation, the semiconductor module plastic packaging structure needs to be fixed in place using a jig to avoid damage during transportation.
[0003] At present, the jig can only support the use of a single fixed-size semiconductor module plastic packaging structure. However, different customers have different requirements for the sizes of semiconductor module plastic packaging structures. Each size of semiconductor module plastic packaging structure requires a corresponding customized jig, so the management and production of jigs of multiple sizes requires a lot of cost. Utility Model Content
[0004] In view of this, an embodiment of the present application provides a positioning fixture to solve at least one problem existing in the background technology.
[0005] In a first aspect, an embodiment of the present application provides a positioning jig, which is used to define the position of a plastic package structure of a semiconductor module, and the positioning jig includes:
[0006] The positioning fixture includes:
[0007] A base provided with a guide member;
[0008] A moving assembly, comprising a first moving member and a sliding member, wherein the sliding member is connected to the first moving member, the sliding member is slidably connected to the guide member, and the first moving member moves in the guide member following the sliding member;
[0009] A fastening assembly, comprising a second fastener and a first fastener, wherein the first fastener is used to define a relative position between the first moving member and the base, and the second fastener is used to define a relative position between the first moving member and the semiconductor module plastic package structure;
[0010] Among them, when the positioning fixture limits the position of the semiconductor module plastic packaging structure, one end of the semiconductor module plastic packaging structure is connected to the base, and the first movable member moves in the guide member so that the first movable member is connected to the other end of the semiconductor module plastic packaging structure of different sizes.
[0011] In combination with the first aspect of the present application, in an optional implementation, the sliding member is a slider or a screw, the guiding member is a slide groove, and the slide groove is slidably connected to the slider or the screw.
[0012] In combination with the first aspect of the present application, in an optional embodiment, when the sliding member is a slider, a first locking hole is provided on the first movable member or the base, and the first fastener matches the first locking hole, and makes the first fastener abut against the first movable member or the base to limit the relative position between the first movable member and the base.
[0013] In combination with the first aspect of the present application, in an optional implementation, when the sliding member is a screw, the first fastener is a first nut matching the screw.
[0014] In combination with the first aspect of the present application, in an optional implementation, when the positioning fixture limits the position of the semiconductor module plastic packaging structure, the first moving member is used to connect the position of the semiconductor module plastic packaging structure to move along a straight line trajectory.
[0015] In combination with the first aspect of the present application, in an optional implementation, when the positioning fixture limits the position of the semiconductor module plastic packaging structure, the first moving member is used to connect the position of the semiconductor module plastic packaging structure and move along an arc trajectory.
[0016] In combination with the first aspect of the present application, in an optional implementation manner, the slide groove includes a first slide groove and a second slide groove, and the first slide groove intersects and is perpendicular to the second slide groove;
[0017] The sliding member comprises a first sliding member and a second sliding member, the first sliding member is slidably connected to the first sliding groove, and the second sliding member is slidably connected to the second sliding groove;
[0018] The first fastener includes a first sub-fastener and a second sub-fastener, the first sub-fastener is used to define the relative position of the first sliding member and the first sliding groove, and the second sub-fastener is used to define the relative position of the second sliding member and the second sliding groove.
[0019] In combination with the first aspect of the present application, in an optional implementation manner, the first moving member is provided with a third sliding groove, the sliding member further comprises a third sliding member, and the third sliding member is slidably connected to the third sliding groove;
[0020] The moving assembly further includes a second moving member, the second moving member is connected to the third sliding member, and the second moving member follows the third sliding member to move in the third sliding groove;
[0021] The fastening assembly further includes a third fastening member, and the third fastening member is used to define a relative position between the second moving member and the first moving member.
[0022] In combination with the first aspect of the present application, in an optional implementation manner, the base is further provided with a first groove, the guide member is located at the bottom of the first groove, and the moving assembly is located in the first groove;
[0023] When the positioning fixture limits the position of the semiconductor module plastic packaging structure, a side surface of the semiconductor module plastic packaging structure contacts the first surface of the base, and the contact surface between the first moving part and the semiconductor module plastic packaging structure is coplanar with the first surface.
[0024] In combination with the first aspect of the present application, in an optional implementation manner, the base is further provided with a limiting protrusion, and the limiting protrusion protrudes from the first surface of the base;
[0025] When the positioning fixture limits the position of the semiconductor module plastic packaging structure, at least one edge of the semiconductor module plastic packaging structure approaches or contacts the limiting protrusion.
[0026] In conjunction with the first aspect of the present application, in an optional implementation manner, the first moving member is further provided with a fifth sliding groove;
[0027] When the positioning fixture limits the position of the semiconductor module plastic packaging structure, one end of the semiconductor module plastic packaging structure is connected to the base, and the other end is slidably connected to the fifth sliding groove.
[0028] The positioning jig provided in the embodiment of the present application utilizes a first movable member to follow the sliding member to move within a guide member, so that the first movable member can be connected to the plastic packaging structures of semiconductor modules of different sizes, thereby achieving the positioning jig being able to limit the positions of the plastic packaging structures of semiconductor modules of different sizes, avoiding the need to separately customize a jig for the plastic packaging structures of semiconductor modules of each size, thereby improving the versatility of the positioning jig and further reducing the manufacturing and management costs of the jig.
[0029] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:
[0031] Figure 1 A top view of a semiconductor module plastic package structure being positioned using a positioning fixture provided in an embodiment of the present application;
[0032] Figure 2A side view of a semiconductor module plastic package structure being positioned using a positioning fixture provided in an embodiment of the present application;
[0033] Figure 3 A side view of another embodiment of the present application showing a semiconductor module plastic package structure being positioned using a positioning fixture;
[0034] Figure 4 A top view of another embodiment of the present application showing a semiconductor module plastic package structure being positioned using a positioning fixture;
[0035] Figure 5 A top view of another embodiment of the present application showing a semiconductor module plastic package structure being positioned using a positioning fixture;
[0036] Figure 6 A top view of another embodiment of the present application showing a semiconductor module plastic package structure being positioned using a positioning fixture.
[0037] Reference numerals;
[0038] a. Plastic packaging structure of semiconductor module;
[0039] 10, base; 101, first surface; 110, guide member; 11a, slide groove; 111, first slide groove; 112, second slide groove; 113, fourth slide groove; 120, first groove; 121, bottom of first groove; 130, limiting protrusion;
[0040] 20, moving assembly; 210, first moving member; 211, third slide slot; 212, fifth slide slot; 221, slider; 222, screw; 230, second moving member;
[0041] 30. Fastening assembly; 310. First fastener; 311. First sub-fastener; 312. Second sub-fastener; 31a. Screw; 31b. Second nut; 31c. First nut; 320. Second fastener; 330. Third fastener. DETAILED DESCRIPTION
[0042] The exemplary embodiments disclosed in the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the specific embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present application and to fully convey the scope disclosed in the present application to those skilled in the art.
[0043] In the following description, a large number of specific details are given to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features known in the art are not described; that is, all features of the actual embodiments are not described here, and well-known functions and structures are not described in detail.
[0044] In the drawings, the sizes of layers, regions, elements and their relative sizes may be exaggerated for clarity. Like reference numerals denote like elements throughout.
[0045] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there is no intervening element or layer. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as the second element, component, region, layer or part. And when the second element, component, region, layer or part is discussed, it does not indicate that the present application necessarily has the first element, component, region, layer or part.
[0046] Spatially relative terms such as "under", "beneath", "below", "under", "above", "above", etc., may be used here for convenience of description to describe the relationship between an element or feature shown in the figure and other elements or features. It should be understood that in addition to the orientation shown in the figure, the spatial relationship terms are intended to also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, then the elements or features described as "under other elements" or "under it" or "under it" will be oriented as "on" other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.
[0047] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present application. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.
[0048] In order to thoroughly understand the present application, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present application. The preferred embodiments of the present application are described in detail below, but in addition to these detailed descriptions, the present application may also have other implementation methods.
[0049] The structure of the semiconductor module plastic package structure is complex. The pins of the semiconductor module plastic package structure are signal terminals, which have high requirements for their position accuracy. The semiconductor module plastic package structure also has protruding terminals on the side, which not only have high requirements for their position accuracy but also have requirements for their appearance and cleanliness. Therefore, the semiconductor module plastic package structure needs to use customized fixtures to limit its position to avoid damage or contamination of the semiconductor module plastic package structure during transportation.
[0050] In the prior art, due to different needs of different customers, the sizes of semiconductor module plastic packaging structures are also different, and each size of semiconductor module plastic packaging structure requires customized corresponding fixtures. There are many types of fixture sizes, which increases the management and production costs of the fixtures.
[0051] In response to the above technical problems, an embodiment of the present application provides a positioning jig, which utilizes a first movable member 210 to follow a sliding member to move within a guide member 110, so that the first movable member 210 can be connected to the plastic packaging structure a of semiconductor modules of different sizes, thereby achieving the positioning jig being able to limit the positions of the plastic packaging structures a of semiconductor modules of different sizes, avoiding the need to customize a jig separately for the plastic packaging structure a of semiconductor modules of each size, thereby improving the versatility of the positioning jig and further reducing the manufacturing and management costs of the plastic packaging structure a of the semiconductor modules.
[0052] The positioning fixture provided in the embodiment of the present application is described in detail below with reference to the accompanying drawings.
[0053] Specifically, Figure 1 As shown, the positioning fixture provided in the embodiment of the present application is used to define the position of the plastic packaging structure of the semiconductor module, and the positioning fixture includes a base 10, a moving component 20 and a fastening component 30.
[0054] The base 10 is provided with a guide member 110. The moving assembly 20 includes a first moving member 210 and a sliding member, the sliding member is connected to the first moving member 210, the sliding member is slidably connected to the guide member 110, and the first moving member 210 moves in the guide member 110 following the sliding member.
[0055] The fastening assembly 30 includes a second fastener 320 and a first fastener 310 . The second fastener 320 is used to define the relative position between the first moving member 210 and the semiconductor module plastic package structure. The first fastener 310 is used to define the relative position between the first moving member 210 and the base 10 .
[0056] When the positioning fixture defines the position of the semiconductor module plastic packaging structure a, one end of the semiconductor module plastic packaging structure a is connected to the base 10, and the first moving member 210 moves in the guide member 110 to connect with the other end of the semiconductor module plastic packaging structure a of different sizes.
[0057] Figure 1 1 shows a top view of the first moving member 210 connected to the other end of the semiconductor module plastic packaging structure a. The first moving member 210 is driven to move on the base 10 to adjust the distance between the first moving member 210 and the semiconductor module plastic packaging structure a. When the first moving member 210 can be connected to the semiconductor module plastic packaging structure a, the second fastener 320 is used to define the relative position between the first moving member 210 and the semiconductor module plastic packaging structure a, and the first fastener 310 is used to define the relative position between the first moving member 210 and the base 10.
[0058] When the positioning fixture needs to define the position of the semiconductor module plastic packaging structure a of another size, the first moving member 210 is driven to follow the sliding member to move in the guide member 110, and the first moving member 210 can be connected to the semiconductor module plastic packaging structure a.
[0059] In an alternative embodiment, if Figure 2 and Figure 3 As shown, the sliding member is a slider 221 or a screw 222, the guide member 110 is a slide groove 11a, the slider 221 is slidably connected to the slide groove 11a, and the screw 222 is slidably connected to the slide groove 11a. The first moving member 210 follows the slider 221 to move in the slide groove 11a, and the first moving member 210 follows the screw 222 to move in the slide groove 11a to adjust the distance between the first moving member 210 and the semiconductor module plastic package structure a.
[0060] In an alternative embodiment, if Figure 2As shown, when the sliding member is a slider 221, a first locking hole (not shown in the figure) is provided on the first moving member 210 or the base 10, and the first fastener 310 matches the first locking hole, and makes the first fastener 310 abut against the first moving member 210 or the base 10 to limit the relative position between the first moving member 210 and the base 10.
[0061] Specifically, the first fastener 310 includes a screw rod 31a and a second nut 31b. The screw rod 31a matches the first locking hole and abuts against the first movable member 210 or the base 10 under the action of the second nut 31b to limit the relative position between the first movable member 210 and the base 10.
[0062] In an alternative embodiment, if Figure 3 As shown, when the sliding member is a screw 222, the first fastener 310 is a first nut 31c that matches the screw 222. The nail head of the screw 222 is equivalent to the slider 221 in the above embodiment, the screw 222 penetrates the first moving member 210, and the other end of the screw 222 can match the first nut 31c. Under the action of the first nut 31c, the relative position between the first moving member 210 and the base 10 can be limited.
[0063] In an optional embodiment, when the positioning fixture defines the position of the semiconductor module plastic package structure a, the first moving member 210 is used to connect the semiconductor module plastic package structure a and moves along a straight line. The first moving member 210 is used to connect the semiconductor module plastic package structure a, which is also the position of the second fastener.
[0064] In the embodiment of the present application, the first movable member 210 is used to connect the position of the semiconductor module plastic packaging structure a. The position between the first movable member 210 and the semiconductor module plastic packaging structure a can be adjusted along a straight line trajectory, so that the first movable member 210 can be connected to semiconductor module plastic packaging structures a of different sizes.
[0065] Specifically, Figure 4 As shown, a fourth slide groove 113 is provided on the base 10 , and the position of the first moving member 210 for connecting the semiconductor module plastic package structure a moves along a straight line in the fourth slide groove 113 following the sliding member.
[0066] In an optional embodiment, when the positioning fixture defines the position of the semiconductor module plastic packaging structure a, the first moving member 210 is used to connect the position of the semiconductor module plastic packaging structure a and move along an arc trajectory.
[0067] Compared with the above-mentioned embodiment in which the first moving member 210 is used to connect the position of the semiconductor module plastic package structure a along a straight line, the embodiment of the present application moves along an arc trajectory, which can increase the movement range and improve the adaptability of the positioning fixture.
[0068] Specifically, Figure 1 and Figure 5 As shown, the slide groove 11a includes a first slide groove 111 and a second slide groove 112 , and the first slide groove 111 and the second slide groove 112 intersect and are perpendicular to each other.
[0069] The sliding member includes a first sliding member and a second sliding member. The first sliding member is slidably connected to the first sliding groove 112 , and the second sliding member is slidably connected to the second sliding groove 112 .
[0070] The first fastener 310 includes a first sub-fastener 311 and a second sub-fastener 312 . The first sub-fastener 311 is used to define the relative position of the first sliding member and the first sliding groove 111 , and the second sub-fastener 312 is used to define the relative position of the second sliding member and the second sliding groove 112 .
[0071] The moving principle of the moving component 20 in the embodiment of the present application is similar to the principle of drawing an ellipse by Leonardo da Vinci's ellipsometer. The first sliding member slides in the first sliding groove 111, and the second sliding member slides in the second sliding groove 112. The first sliding grooves 111 intersect and are perpendicular to the second sliding grooves 112, so that the first moving member 210 can form different distances with the semiconductor module plastic packaging structure a during the movement, and further enable the first moving member 210 to connect semiconductor module plastic packaging structures a of different sizes.
[0072] In the embodiment of the present application, the moving track of the first moving member 210 is an ellipse or a part of an ellipse, but the moving track of the first moving member 210 is not limited to an ellipse or a part of an ellipse. The moving track of the first moving member 210 can also be an arc of other shapes, and the moving track of the first moving member 210 is determined by the shape of the guide member 110.
[0073] In an alternative embodiment, if Figure 1 , Figure 5 and Figure 6 As shown, the lengths of the first slide groove 111 and the second slide groove 112 are set according to requirements and are not limited in the embodiment of the present application. Figure 1 1 shows that the first slide groove 111 and the second slide groove 112 are located at a vertex of the base 10 . Figure 5 It is shown that the first slide groove 111 and the second slide groove 112 extend in the first groove 120 , and the connection between the first slide groove 111 and the second slide groove 112 is located at the center of the base 10 . Figure 6 It is shown that the first slide groove 111 and the second slide groove 112 extend in the first groove 120 , and the connection between the first slide groove 111 and the second slide groove 112 is located at a position of the base 10 away from the semiconductor module plastic packaging structure a.
[0074] The first slide groove 111 and the second slide groove 112 extend in the first groove 120 , and the connection between the first slide groove 111 and the second slide groove 112 is located at the center of the base 10 , which can increase the moving range of the first moving member 210 .
[0075] Based on the needs, some semiconductor module plastic packaging structures a are provided with pins for signal transmission. Setting the connection between the first slide groove 111 and the second slide groove 112 at a position of the base 10 away from the semiconductor module plastic packaging structure a can avoid the first moving part 210 from damaging the pins on the semiconductor module plastic packaging structure a during movement, thereby further ensuring the safety of the semiconductor module plastic packaging structure a during transportation.
[0076] In an alternative embodiment, if Figure 6 As shown, the first moving member 210 is provided with a third sliding groove 211 , and the sliding member includes a third sliding member, and the third sliding member is slidably connected to the third sliding groove 211 .
[0077] The moving assembly 20 further includes a second moving member 230 , which is connected to the third sliding member. The second moving member 230 moves in the third sliding groove 211 following the third sliding member to connect with the other end of the semiconductor module plastic package structure a of different sizes.
[0078] The fastening assembly 30 further includes a third fastening member 330 , and the third fastening member 330 is used to define the relative position between the second moving member 230 and the first moving member 210 .
[0079] The second movable member 230 can move relative to the first movable member 210 and can extend the first movable member 210, thereby increasing the size types of the positioning fixture for defining the position of the semiconductor module plastic package structure a and further improving the applicability of the positioning fixture.
[0080] Based on the demand, the moving assembly 20 may further include a third moving member, which can move relative to the second moving member 230 to increase the moving range.
[0081] In an optional embodiment, a first mounting hole is set at the end of the second movable member 230, and when the positioning fixture limits the position of the semiconductor module plastic packaging structure a, the third fastener 330 matches the first mounting hole and the second mounting hole set on the semiconductor module plastic packaging structure a.
[0082] One end of the semiconductor module plastic package structure a is provided with a third mounting hole, and one end of the semiconductor module plastic package structure a is connected to the base 10 by a third fastener 330. The specific connection method between the semiconductor module plastic package structure a and the base 10 is not limited in this embodiment of the application.
[0083] In an alternative embodiment, if Figure 5As shown, the first moving member 210 is also provided with a fifth slide groove 212. When the position of the semiconductor module plastic packaging structure a is limited by the positioning fixture, one end of the semiconductor module plastic packaging structure a is connected to the base 10, and the other end is slidably connected to the fifth slide groove 212. The embodiment of the present application not only adjusts the relative position of the first moving member 210 and the base 10, but also adjusts the relative position of the semiconductor module plastic packaging structure a and the base 10 so that the first moving member 210 can be connected to the semiconductor module plastic packaging structure a, thereby limiting the position of the semiconductor module plastic packaging structure a by the positioning fixture. The embodiment of the present application can further increase the adaptation range of the positioning fixture.
[0084] In an alternative embodiment, if Figure 2 , Figure 5 and Figure 6 As shown, the base 10 is provided with a first groove 120, the moving component 20 is located in the first groove 120, and the guide member 110 is provided at the bottom 121 of the first groove. When the positioning fixture limits the position of the semiconductor module plastic package structure a, a side surface of the semiconductor module plastic package structure a contacts the first surface 101 of the base 10, and the connection surface of the first moving member 210 and the semiconductor module plastic package structure a is coplanar with the first surface 101 of the base 10.
[0085] The embodiment of the present application can place the semiconductor module plastic packaging structure a on the base 10, and the upper surface of the first movable member 210 in contact with the semiconductor module plastic packaging structure a is coplanar with the first surface 101, so that the semiconductor module plastic packaging structure a is evenly stressed during transportation and avoids damage due to uneven stress.
[0086] In an alternative embodiment, if Figure 5 As shown, the base 10 is further provided with a limiting protrusion 130 , and the limiting protrusion 130 protrudes from the first surface 101 of the base 10 .
[0087] When the positioning fixture limits the position of the semiconductor module plastic package structure a, at least one edge of the semiconductor module plastic package structure a approaches or contacts the limiting protrusion 130 .
[0088] The limiting protrusion 130 can limit the edge of the semiconductor module plastic packaging structure a, thereby ensuring the stability and safety of the semiconductor module plastic packaging structure a during transportation.
[0089] It should be understood that the above embodiments are exemplary and are not intended to include all possible implementations included in the claims. Various modifications and changes may be made on the basis of the above embodiments without departing from the scope of the present disclosure. Similarly, the various technical features of the above embodiments may be arbitrarily combined to form other embodiments of the present application that may not be explicitly described. Therefore, the above embodiments only express several implementations of the present application and do not limit the scope of protection of the patent of this application.
Claims
1. A positioning fixture, characterized in that: The positioning fixture is used to define the position of the semiconductor module plastic packaging structure, and the positioning fixture includes: A base provided with a guide member; A moving assembly, comprising a first moving member and a sliding member, wherein the sliding member is connected to the first moving member, the sliding member is slidably connected to the guide member, and the first moving member moves in the guide member following the sliding member; A fastening assembly, comprising a second fastener and a first fastener, wherein the first fastener is used to define a relative position between the first moving member and the base, and the second fastener is used to define a relative position between the first moving member and the semiconductor module plastic package structure; Among them, when the positioning fixture limits the position of the semiconductor module plastic packaging structure, one end of the semiconductor module plastic packaging structure is connected to the base, and the first movable member moves in the guide member so that the first movable member is connected to the other end of the semiconductor module plastic packaging structure of different sizes.
2. The positioning fixture according to claim 1, characterized in that: The sliding member is a slider or a screw, and the guiding member is a sliding groove, and the sliding groove is slidably connected to the slider or the screw.
3. The positioning fixture according to claim 2, characterized in that: When the sliding member is a slider, a first locking hole is provided on the first moving member or the base, the first fastener matches the first locking hole, and the first fastener abuts against the first moving member or the base to limit the relative position between the first moving member and the base.
4. The positioning fixture according to claim 2, characterized in that: When the sliding member is a screw, the first fastener is a first nut matching the screw.
5. The positioning jig according to any one of claims 2 to 4, characterized in that: When the positioning fixture defines the position of the semiconductor module plastic packaging structure, the first moving member is used to connect the position of the semiconductor module plastic packaging structure and move along a straight line track.
6. The positioning jig according to any one of claims 2 to 4, characterized in that: When the positioning fixture defines the position of the semiconductor module plastic packaging structure, the first moving member is used to connect the position of the semiconductor module plastic packaging structure and move along an arc trajectory.
7. The positioning fixture according to claim 6, characterized in that: The slide groove comprises a first slide groove and a second slide groove, wherein the first slide groove intersects and is perpendicular to the second slide groove; The sliding member comprises a first sliding member and a second sliding member, the first sliding member is slidably connected to the first sliding groove, and the second sliding member is slidably connected to the second sliding groove; The first fastener includes a first sub-fastener and a second sub-fastener, the first sub-fastener is used to define the relative position of the first sliding member and the first sliding groove, and the second sub-fastener is used to define the relative position of the second sliding member and the second sliding groove.
8. The positioning fixture according to claim 1, characterized in that: The first moving member is provided with a third sliding groove, and the sliding member further comprises a third sliding member, and the third sliding member is slidably connected with the third sliding groove; The moving assembly further includes a second moving member, the second moving member is connected to the third sliding member, and the second moving member follows the third sliding member to move in the third sliding groove; The fastening assembly further includes a third fastening member, and the third fastening member is used to define a relative position between the second moving member and the first moving member.
9. The positioning fixture according to claim 1, characterized in that: The base is further provided with a first groove, the guide member is located at the bottom of the first groove, and the moving assembly is located in the first groove; When the positioning fixture limits the position of the semiconductor module plastic packaging structure, a side surface of the semiconductor module plastic packaging structure contacts the first surface of the base, and the contact surface between the first moving part and the semiconductor module plastic packaging structure is coplanar with the first surface.
10. The positioning fixture according to claim 9, characterized in that: The base is further provided with a limiting protrusion, and the limiting protrusion protrudes from the first surface of the base; When the positioning fixture limits the position of the semiconductor module plastic packaging structure, at least one edge of the semiconductor module plastic packaging structure approaches or contacts the limiting protrusion.
11. The positioning fixture according to claim 1, characterized in that: The first moving member is further provided with a fifth sliding groove; When the positioning fixture limits the position of the semiconductor module plastic packaging structure, one end of the semiconductor module plastic packaging structure is connected to the base, and the other end is slidably connected to the fifth sliding groove.