Novel base of epitaxial machine table

Abstract

The utility model belongs to the technical field of wafer epitaxy, in particular to a novel base of an epitaxy machine table, which comprises a base body, a wafer and an air blowing structure, the wafer is arranged in the base body, the surface height of the base body is lower than that of the wafer, the air blowing structure comprises a rotating shaft, the rotating shaft is arranged on the surface of the base body, and the rotating shaft is arranged on the surface of the base body. The depth of the groove of the base body is shallower, so that the edge of a wafer has more reaction gas, the epitaxial thickness of the edge of the wafer is increased, the SFQR of the edge is improved, and meanwhile, by means of an upper blowing mode, the phenomenon that the edge of the wafer is damaged during lateral blowing can be avoided. The wafer higher than the base body disperses the gas so as to influence the epitaxial smoothness of the wafer, and the wafer higher than the base body is matched with upper blowing, so that the high-temperature gas can be more uniformly blown to the wafer, and the condition of non-uniform temperature does not occur.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer epitaxy, in particular to a novel base for an epitaxy machine. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor integrated circuits and is the basic material for manufacturing semiconductor chips.

[0003] Epitaxial machine is a device used to perform epitaxial growth technology. Epitaxial growth technology is a technology that grows one or more layers of thin films on a substrate. These thin films can be the same material as the substrate or different materials. The epitaxial machine ensures the uniformity and quality of the epitaxial layer by precisely controlling growth conditions such as temperature, pressure, gas flow, etc.

[0004] The variation range of the highest point and the lowest point of the local area of ​​the wafer to the reference surface is correlated with the uniformity of the epitaxial thickness. The groove depth of the base supporting the wafer in the currently commonly used chamber is relatively deep. When the airflow passes through, less reactive gas passes through the edge of the wafer. Therefore, the cumulative film thickness of the edge after epitaxy is relatively thin. At the same time, due to the different thermal expansion coefficients of the substrate and the back seal, the edge will also bend downward after the high temperature of epitaxy. Under the dual influence, the thickness of the epitaxial edge is thinner, which leads to poor SFQR at the edge. In addition, the traditional blowing method is lateral blowing, which causes the high-temperature gas passing over the surface of the wafer to change, which also causes uneven wafer epitaxy. Therefore, a new base for an epitaxial machine is proposed to address the above problems. Utility Model Content

[0005] In order to make up for the deficiencies of the prior art and solve at least one technical problem raised in the background technology, the utility model proposes a new type of base for an epitaxial machine.

[0006] The technical solution adopted by the utility model to solve the technical problem is: the utility model discloses a novel epitaxial machine base, comprising a base body, a wafer and a blowing structure, wherein the wafer is installed in the base body, and the surface height of the base body is lower than the height of the wafer;

[0007] The blowing structure comprises a rotating shaft, which is arranged on the surface of the base body, an air box is fixedly connected to the surface of the rotating shaft, an air pipe is connected to the surface of the air box, and an end of the air pipe away from the air box is connected to an external air source;

[0008] Gas nozzles, of which there are several, all of which are connected to the surface of the gas box away from the air pipe;

[0009] The surface of the air box is fixedly connected with a clamping shaft, and the surface of the clamping shaft is provided with a fixing structure.

[0010] Preferably, a mounting groove is provided on the surface of the air box, a filter plate is installed in the mounting groove, and a baffle is fixedly connected to the surface of the filter plate.

[0011] Preferably, a plurality of through holes are provided on the surface of the air box, a ball head is fixedly connected to the end of the air nozzle, the ball head is rotatably connected in the through hole, an expansion angle is provided on the side of the through hole close to the air nozzle, a through hole is also provided on the surface of the ball head, and the through hole on the surface of the ball head is connected to the air nozzle.

[0012] Preferably, an elastic membrane is fixedly connected inside the ball head, a plurality of shrinkage holes are opened on the surface of the elastic membrane, and a sealing gasket is fixedly connected to the surface of the ball head and the baffle.

[0013] Preferably, the rotating shaft is rotatably connected to the surface of the base body, and the fixed structure includes a card table, a slot is provided on the surface of the card table, a card block is rotatably connected to the slot surface via a hinge, a spring sheet is fixedly connected in the slot, one end of the spring sheet is a free end, and a card slot is provided on the surface of the rotating shaft relative to the position of the card block, two card blocks are provided, and a pair of the card blocks are symmetrically distributed around the center axis of the card table.

[0014] Preferably, a through groove is provided on the surface of the card table, a shift block is slidably connected in the through groove, an extrusion plate is fixedly connected to the end of the shift block, the extrusion plate is fitted with the card block, a limiting shaft is fixedly connected to the surface of the shift block, and the end of the limiting shaft away from the shift block is slidably connected to the card table through a spring.

[0015] Preferably, the surface of the gas box is connected with an air outlet, the air outlet is a one-way valve, and a whistle is arranged in the air outlet, and the gas in the gas box makes a sound through the whistle.

[0016] The utility model is beneficial in that:

[0017] 1. The utility model reduces the depth of the groove of the base body to make the edge of the wafer have more reaction gas, increases the epitaxial thickness of the wafer edge, and improves the edge SFQR. At the same time, by blowing from above, it can be avoided that when blowing from the side, the wafer higher than the base body will disperse the gas, thereby affecting the flatness of the wafer epitaxy. Moreover, by blowing from above with the wafer higher than the base body, the high-temperature gas can be blown to the wafer more evenly, and there will be no uneven temperature.

[0018] 2. The utility model rotates the rotating shaft, and at the same time the rotating shaft drives the card shaft to rotate, so that the card shaft is stuck in the card platform. At the same time, the card shaft will squeeze the card block, so that the card block rotates in the slot and squeezes the spring piece to generate elastic force. When the card shaft moves to the extreme position, the spring piece resets, drives the card block to be stuck in the card slot, and fixes the card shaft. Through the rotatable air box, it is more convenient to disassemble and assemble the wafer when it is needed, thereby improving the installation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0020] Figure 1 This is a schematic diagram of the base body structure of Example 1;

[0021] Figure 2 It is a schematic diagram of a partial cross-sectional structure of the gas box of the first embodiment;

[0022] Figure 3 For Example 1 Figure 2 Schematic diagram of the structure at A in the middle;

[0023] Figure 4 It is a schematic diagram of a partial cross-sectional structure of the rotating shaft of the first embodiment;

[0024] Figure 5 For Example 1 Figure 4 Schematic diagram of the structure at B in the middle;

[0025] Figure 6 It is a schematic diagram of the structure of the air outlet of the second embodiment.

[0026] In the figure: 1. base body; 2. rotating shaft; 3. baffle; 4. air pipe; 5. air box; 51. mounting slot; 6. clamping shaft; 7. clamping table; 8. wafer; 9. filter plate; 10. air nozzle; 11. ball head; 12. through hole; 13. elastic membrane; 14. expansion angle; 16. clamping slot; 17. clamping block; 18. spring piece; 19. notch; 20. limit shaft; 21. shift block; 22. through slot; 23. squeeze plate; 24. air outlet. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Embodiment 1

[0029] See also Figure 1-5As shown, a novel base for an epitaxial machine includes a base body 1, a wafer 8 and a blowing structure. The wafer 8 is installed in the base body 1, and the surface height of the base body 1 is lower than the height of the wafer 8;

[0030] The blowing structure comprises a rotating shaft 2, which is arranged on the surface of the base body 1, and a gas box 5 is fixedly connected to the surface of the rotating shaft 2, and a gas pipe 4 is connected to the surface of the gas box 5, and one end of the gas pipe 4 away from the gas box 5 is connected to an external gas source;

[0031] A plurality of air nozzles 10 are provided, all of which are connected to the surface of the air box 5 away from the air pipe 4;

[0032] The surface of the gas box 5 is fixedly connected with a clamping shaft 6, and the surface of the clamping shaft 6 is provided with a fixed structure; when working, the wafer 8 is placed on the surface of the base body 1, and then the high-temperature gas is blown to the wafer 8 through the blowing structure, and at the same time, by shallowing the groove depth of the base body 1, there is more reaction gas at the edge of the wafer, thereby increasing the epitaxial thickness of the wafer edge and improving the edge SFQR, and at the same time, by blowing from above, it can be avoided that when blowing from the side, the wafer 8 higher than the base body 1 will not disperse the gas, thereby affecting the flatness of the epitaxy of the wafer 8, and by blowing from above with the wafer 8 higher than the base body 1, the high-temperature gas can be blown to the wafer 8 more evenly, and there will be no temperature unevenness.

[0033] The surface of the air box 5 is provided with an installation groove 51, and a filter plate 9 is installed in the installation groove 51. The surface of the filter plate 9 is fixedly connected with a baffle 3. When working, impurities contained in the external air source can be filtered through the filter plate 9 to avoid contamination of the wafer 8 when blowing to the wafer 8, thereby affecting the yield rate. At the same time, the filter plate 9 can be conveniently pulled out and replaced through the baffle 3.

[0034] The surface of the air box 5 is provided with a plurality of through holes 12, and the end of the air nozzle 10 is fixedly connected with a ball head 11, and the ball head 11 is rotatably connected in the through hole 12. A flared angle 14 is provided on the side of the through hole 12 close to the air nozzle 10, and a through hole 12 is also provided on the surface of the ball head 11, and the through hole 12 on the surface of the ball head 11 is connected with the air nozzle 10; when working, the air nozzle 10 can be rotated in the through hole 12 through the ball head 11, and then the blowing angle of the air nozzle 10 can be changed. For wafers 8 with smaller diameters, the direction of the air nozzle 10 can be changed, so that the workmanship of the air nozzle 10 will not be wasted. At the same time, the rotation angle of the air nozzle 10 can be increased through the flared angle 14.

[0035] An elastic membrane 13 is fixedly connected inside the ball head 11, and a plurality of shrinkage holes are opened on the surface of the elastic membrane 13. A sealing gasket 15 is fixedly connected to the surfaces of the ball head 11 and the baffle 3. During operation, after the gas enters the gas box 5, it will first stay briefly in the gas box 5 through the action of the elastic membrane 13. At this time, the gas continues to be transmitted into the gas box 5, and the elastic shrinkage holes on the surface of the elastic membrane 13 are simultaneously opened by the higher air pressure, thereby ensuring that all the air nozzles 10 blow air at the same time, avoiding the wafer 8 from being heated unevenly and warping. The sealing gasket 15 can improve the sealing effect of the ball head 11 and the filter plate 9 to avoid air leakage.

[0036] The rotating shaft 2 is rotatably connected to the surface of the base body 1, and the fixed structure includes a card table 7, a notch 19 is provided on the surface of the card table 7, and a card block 17 is rotatably connected to the surface of the notch 19 through a hinge, and a spring piece 18 is fixedly connected in the notch 19, and one end of the spring piece 18 is a free end. A card slot 16 is provided on the surface of the rotating shaft 2 relative to the card block 17, and two of the card blocks 17 are provided, and a pair of the card blocks 17 are symmetrically distributed with respect to the central axis of the card table 7;

[0037] During operation, the rotating shaft 2 is rotated, and the rotating shaft 2 drives the air box 5 to rotate, and the air box 5 drives the clamping shaft 6 to rotate, so that the clamping shaft 6 is clamped into the clamping platform 7, and the clamping shaft 6 will squeeze the clamping block 17, so that the clamping block 17 rotates in the slot 19, and squeezes the spring piece 18 to generate elastic force. When the clamping shaft 6 moves to the extreme position, the spring piece 18 resets, drives the clamping block 17 to be clamped into the clamping slot 16, and fixes the clamping shaft 6. Through the rotatable air box 5, it is more convenient to disassemble and assemble the wafer 8 when it is needed, and the installation efficiency is improved. The design of the two clamping blocks 17 can improve the stability of the fixation of the clamping shaft 6.

[0038] A through slot 22 is provided on the surface of the card table 7, a shift block 21 is slidably connected in the through slot 22, a squeeze plate 23 is fixedly connected to the end of the shift block 21, the squeeze plate 23 is fitted with the card block 17, a limit shaft 20 is fixedly connected to the surface of the shift block 21, and one end of the limit shaft 20 away from the shift block 21 is slidably connected to the card table 7 through a spring;

[0039] During operation, the shift block 21 is shifted toward the direction close to the card block 17, and at the same time, the squeezing plate 23 is driven to move, so that the squeezing plate 23 squeezes the card block 17, and the card block 17 rotates into the slot 19. The squeezing plate 23 can improve the disassembly efficiency of the card shaft 6. When the shift block 21 moves, the limit shaft 20 is driven to move. The shift block 21 can be limited by the limit shaft 20 to prevent the shift block 21 from tilting when sliding and getting stuck in the through slot 22.

[0040] Embodiment 2

[0041] See also Figure 6As shown, compared with Example 1, as another implementation mode of the utility model, the surface of the gas box 5 is connected with an air outlet 24, and the air outlet 24 is a one-way valve, and a whistle is arranged in the air outlet 24, and the gas in the gas box 5 makes a sound through the whistle; during operation, the filter plate 9 becomes blocked over time, and the gas pressure in the gas box 5 increases. At this time, the gas flows out through the one-way valve, and the whistle in the one-way valve makes a sound during the gas flow, thereby reminding the staff to replace and clean the filter plate 9, thereby ensuring that the gas can be blown out normally through the air nozzle 10, avoiding long-term blockage of the filter plate 9 and affecting the epitaxial efficiency of the wafer 8.

[0042] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0043] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. A novel base for an epitaxial machine, characterized in that: It comprises a base body (1), a wafer (8) and an air blowing structure, wherein the wafer (8) is installed in the base body (1), and the surface height of the base body (1) is lower than the height of the wafer (8); The blowing structure comprises a rotating shaft (2), the rotating shaft (2) being arranged on the surface of the base body (1), an air box (5) being fixedly connected to the surface of the rotating shaft (2), an air pipe (4) being connected through the surface of the air box (5), and an end of the air pipe (4) away from the air box (5) being connected to an external air source; A plurality of air nozzles (10) are provided, all of which are connected to the surface of the air box (5) on the side away from the air pipe (4); A clamping shaft (6) is fixedly connected to the surface of the air box (5), and a fixing structure is provided on the surface of the clamping shaft (6).

2. The novel epitaxial machine base according to claim 1, characterized in that: The surface of the air box (5) is provided with a mounting groove (51), a filter plate (9) is mounted in the mounting groove (51), and a baffle (3) is fixedly connected to the surface of the filter plate (9).

3. The novel epitaxial machine base according to claim 2, characterized in that: The surface of the air box (5) is provided with a plurality of through holes (12); the end of the air nozzle (10) is fixedly connected with a ball head (11); the ball head (11) is rotatably connected in the through hole (12); a flared angle (14) is provided on a side of the through hole (12) close to the air nozzle (10); a through hole (12) is also provided on the surface of the ball head (11); and the through hole (12) on the surface of the ball head (11) is in communication with the air nozzle (10).

4. The novel epitaxial machine base according to claim 3, characterized in that: An elastic membrane (13) is fixedly connected inside the ball head (11), a plurality of shrinkage holes are opened on the surface of the elastic membrane (13), and sealing gaskets are fixedly connected to the surfaces of the ball head (11) and the baffle (3).

5. The novel epitaxial machine base according to claim 4, characterized in that: The rotating shaft (2) is rotatably connected to the surface of the base body (1); the fixed structure comprises a card platform (7); a notch (19) is provided on the surface of the card platform (7); a card block (17) is rotatably connected to the surface of the notch (19) via a hinge; a spring sheet (18) is fixedly connected inside the notch (19); one end of the spring sheet (18) is a free end; a card slot (16) is provided on the surface of the rotating shaft (2) at a position relative to the card block (17); two card blocks (17) are provided, and a pair of the card blocks (17) are symmetrically distributed around the central axis of the card platform (7).

6. The novel epitaxial machine base according to claim 5, characterized in that: A through groove (22) is provided on the surface of the card table (7), a shift block (21) is slidably connected in the through groove (22), an extrusion plate (23) is fixedly connected to the end of the shift block (21), the extrusion plate (23) is fitted with the card block (17), a limiting shaft (20) is fixedly connected to the surface of the shift block (21), and one end of the limiting shaft (20) away from the shift block (21) is slidably connected to the card table (7) via a spring.

7. The novel epitaxial machine base according to claim 6, characterized in that: The surface of the gas box (5) is connected through an air outlet (24), the air outlet (24) is a one-way valve, and a whistle is arranged inside the air outlet (24), so that the gas in the gas box (5) makes a sound through the whistle.

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