Wafer carrying mechanical clamping device
By designing a wafer conveying mechanical clamping device combining cylinders and sliding strips, the position offset problem caused by vacuum suction is solved, and equipment corrosion is prevented in the medical liquid environment, stable and efficient wafer handling and equipment protection are achieved.
Patent Information
- Application Number
- CN202421307548.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-11
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-06-11
AI Technical Summary
When the existing wafer conveying device transmits the wafer through vacuum suction, it is easy to cause the flat plate position to shift, resulting in improper wafer placement or drop, increasing error rate and cost, and in the drug liquid environment, the vacuum tube is prone to corrosion, increasing equipment pollution and safety risks.
A wafer conveying mechanical clamping device is designed, which adopts a combined structure of support rod, cylinder, connecting plate, sliding plate and clamping plate. The cylinder drive slider slides on the sliding plate, driving the clamping plate to carry the stable handling of the wafer and prevent the liquid from entering the equipment.
It effectively increases the stability during wafer handling, prevents the drug liquid from damaging the equipment, reduces error rates and costs, and improves operational safety.
Smart Images
Figure CN222637272U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of tooling, in particular to a wafer transport mechanical clamping device. Background Art
[0002] When the commonly used wafer handling device robot transfers the wafer, it will use vacuum suction to adsorb the wafer on the flat plate for wafer handling. Therefore, there will be a phenomenon that the vacuum suction is abnormal, causing the flat plate to shift in position during the process of taking and placing the wafer, which will cause the wafer to be placed in the wrong place or fall and cause the wafer to be damaged. The error rate of this wafer handling device also increases the cost of processing operations;
[0003] In addition, the original robot has relatively high environmental requirements during use. If it is used in a liquid medicine environment, there is a risk of corrosion to the vacuum tube used by the robot, which will cause corrosion and leakage of the vacuum pipeline, which will not only cause equipment pollution, but also increase the risk of operators being exposed to liquid medicine. Utility Model Content
[0004] The utility model provides a wafer conveying mechanical clamping device, which solves the technical problem of position deviation caused by wafer conveying through vacuum suction in the prior art.
[0005] In order to solve the above problems, the utility model provides a wafer handling mechanical clamping device, including a support rod, characterized in that: a cylinder is provided on the surface of the support rod, a connecting plate is provided on the end face, sliding strips are symmetrically provided on the end face of the connecting plate, and a clamping strip is provided on the surface of the sliding strip. The slider is a "Z"-shaped structure as a whole, one end of which is interconnected with the cylinder, and the other end is fixedly connected to the clamping strip, and is slidably connected to the sliding strip.
[0006] Furthermore, 1-2 cylinders are provided on the surface of the support rod.
[0007] Furthermore, the end surface of the connection plate is symmetrically provided with 1-2 groups of sliding strips.
[0008] Furthermore, the length of the sliding slat is smaller than the length of the clamping slat.
[0009] Furthermore, the width between the clamping strips is equal to the width of the clamping strips.
[0010] The beneficial effects of the utility model are:
[0011] 1. The present application drives the slider to slide on the sliding strip through the cylinder, thereby driving the clamping strip to transport the wafer, thereby effectively increasing the stability during the transportation process.
[0012] 2. Transporting the wafer while it is being treated with liquid medicine can prevent the liquid medicine from entering the equipment and causing damage to it. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a schematic diagram of a three-dimensional structure according to an embodiment of the utility model;
[0014] Figure 2 It is a schematic diagram of the top structure according to an embodiment of the utility model.
[0015] Reference numerals: support rod 1 , cylinder 2 , connecting plate 11 , sliding strip 12 , slider 21 , clamping strip 22 . DETAILED DESCRIPTION
[0016] In order to make the technical solution of the utility model more clear, the utility model is further described below in conjunction with the specific embodiments of the drawings.
[0017] like Figure 1-2 As shown, a wafer handling mechanical clamping device according to an embodiment of the utility model includes a support rod 1, a cylinder 2 is provided on the surface of the support rod 1, a connecting plate 11 is provided on the end face, a sliding strip 12 is symmetrically provided on the end face of the connecting plate 11, a clamping strip 22 is provided on the surface of the sliding strip 12, and the slider 21 is a "Z"-shaped structure as a whole, one end of which is interconnected with the cylinder 2, and the other end is fixedly connected to the clamping strip 22, and is slidably connected to the sliding strip 12.
[0018] Among them, the surface of the support rod 1 is provided with 1-2 cylinders 2. When working, the cylinder 2 drives the slider 21 to drive the clamping strip 22 to perform displacement movement.
[0019] Among them, the end surface of the connecting plate 11 is symmetrically provided with 1-2 groups of sliding strips 12. When working, the slider 21 and the sliding strips 12 are slidably connected to each other, which can effectively increase the stability during the displacement movement.
[0020] The length of the sliding slat 12 is smaller than the length of the clamping slat 22. When working, the slider 21 drives the clamping slat 22 to perform displacement movement on the surface of the sliding slat 12, which can increase the stability during the displacement movement.
[0021] The width between the clamping strips 22 is equal to the width of the clamping strips 22 .
[0022] Working principle: first install the application on the corresponding operating equipment, then start the operating equipment to drive the application down, then start the cylinder 2 to drive the slider 21 to drive the clamping strip 22 to move to the bottom of the wafer, and finally drive the application up through the operating equipment, so that the clamping strip 22 holds the wafer, and then transports it through the operating equipment.
[0023] The above embodiments can be combined with each other and further implemented if they are not contradictory to each other.
[0024] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A wafer handling mechanical clamping device, comprising a support rod (1), characterized in that: The support rod (1) is provided with a cylinder (2) on its surface and a connecting plate (11) on its end surface. The connecting plate (11) is symmetrically provided with a sliding strip (12) on its end surface. The sliding strip (12) is provided with a clamping strip (22) on its surface. The slider (21) is a "Z"-shaped structure as a whole. One end of the slider is interconnected with the cylinder (2), and the other end is fixedly connected to the clamping strip (22) and is slidably connected to the sliding strip (12).
2. The wafer handling mechanical clamping device according to claim 1, characterized in that: The surface of the support rod (1) is provided with 1-2 cylinders (2).
3. The wafer handling mechanical clamping device according to claim 1, characterized in that: The end surface of the connecting plate (11) is symmetrically provided with 1-2 groups of sliding strips (12).
4. The wafer handling mechanical clamping device according to claim 1, characterized in that: The length of the sliding strip (12) is smaller than the length of the clamping strip (22).
5. The wafer handling mechanical clamping device according to claim 1, characterized in that: The width between the clamping strips (22) is equal to the width of the clamping strips (22).