Electronic package

Abstract

An electronic packaging part is mainly characterized in that a thermoelectric circuit structure and a heat conduction structure are arranged on a wiring structure connected with an electronic element, the heat conduction structure comprises a heat conduction plate and a heat conduction column, the heat conduction plate and the heat conduction column form hollow cavities which are communicated with each other so that working fluid can be injected, one end of the heat conduction column is connected with the heat conduction plate, and the other end of the heat conduction column is connected with the heat conduction plate. And the other end is connected with the thermoelectric circuit structure so as to generate voltage through the temperature difference and further drive the working fluid in the heat conduction structure to flow, so that the heat dissipation effect of the electronic packaging part is achieved.

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