Motor structure for wafer glue uniformizing

Abstract

The utility model relates to the technical field of motors, in particular to a wafer glue uniformizing motor structure which comprises a motor, a micro air pump and an air guide pipe, the motor comprises a shell, a stator, a rotor and a main shaft, the main shaft is arranged in a center hole of the rotor in a penetrating mode and fixedly connected with the rotor, the stator is fixed in the shell, and the rotor is rotationally installed in a center hole of the stator. The two ends of the spindle extend out of the shell, a through hole penetrating through a body of the spindle is formed in the end of the spindle, the miniature air pump is fixed to the spindle, the air guide pipe penetrates into the through hole, one port of the air guide pipe is communicated with the through hole, the air guide pipe is connected with the miniature air pump, and an output port of the miniature air pump is communicated with the other port of the air guide pipe. The micro air pump vacuumizes the interior of the through hole through the air guide pipe, so that the through hole of the main shaft is in a negative pressure environment, the main shaft adsorbs and fixes the wafer, the wafer is not prone to being scratched, the contact surface of the main shaft and the wafer is small, photoresist is not prone to being diffused to the main shaft, and the situation that the wafer is polluted due to the fact that the photoresist adheres to the wafer after being reduced is facilitated.

Description

Technical Field

[0001] The present application relates to the technical field of motors, and more specifically, to a motor structure for wafer glue application. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. In the wafer lithography technology, photoresist needs to be coated on the surface of the wafer. In the related technology, the wafer is coated with photoresist by placing the wafer on the top surface of a turntable. A clamping block is provided on the top surface of the turntable to limit the movement of the wafer. The bottom surface of the turntable is connected to a rotating drive member, which drives the disk to rotate and drives the wafer to rotate, and photoresist is dripped onto the surface of the wafer. The centrifugal force brought by the rotation is used to diffuse and thin the photoresist outward, and finally completely cover the surface of the wafer to obtain a wafer evenly covered with a photoresist layer. Using this method, on the one hand, the photoresist is easy to diffuse onto the turntable and the clamping block, making the turntable and the clamping block sticky, which is more troublesome to clean, and the photoresist stuck on the turntable and the clamping block is easy to stick back to the wafer, causing contamination of the wafer. On the second hand, the clamping block is easy to scratch the surface of the wafer when clamping the wafer, causing damage to the wafer. Utility Model Content

[0003] In order to solve the problem that photoresist is easily diffused onto the turntable and the clamping block and the clamping block is easily scratched on the wafer surface when the wafer is clamped by a clamping block on a turntable and the turntable is driven by a rotating driving member to rotate for photoresist coating, the present application provides a motor structure for wafer coating.

[0004] A motor structure for wafer glue spreading includes a motor, a micro air pump, and an air duct. The motor includes a shell, a stator, a rotor, and a main shaft. The main shaft is inserted into the center hole of the rotor and fixedly connected to the rotor. The stator is fixed in the shell. The rotor is rotatably installed in the center hole of the stator. Both ends of the main shaft extend out of the shell. A through hole is opened at the end of the main shaft and passes through its body. The micro air pump is fixed on the main shaft. The air duct penetrates into the through hole and one port is connected to the through hole. The air duct is connected to the micro air pump and the output port of the micro air pump is connected to the other port of the air duct. The micro air pump vacuums the through hole through the air duct.

[0005] By adopting the above technical solution, a micro air pump is used to evacuate the through hole of the spindle, so that the through hole of the spindle is in a negative pressure environment to enable the spindle to adsorb and fix the wafer. The rotor drives the spindle to rotate, and the wafer is rotated to expand the photoresist dripping onto the surface of the wafer by the centrifugal force brought by the rotation to cover the surface of the wafer. The spindle uses negative pressure to adsorb and fix the wafer, and the wafer is not easily scratched. In addition, the contact area between the spindle and the wafer is small, and the photoresist is not easy to diffuse onto the spindle, which is beneficial to reduce the situation where the photoresist sticks back to the wafer and causes wafer contamination.

[0006] Preferably, the shell includes a first end cover, a second end cover, an intermediate shell, a first ball bearing, and a second ball bearing, the stator is fixed on the intermediate shell, the first end cover and the second end cover are respectively fixed on both ends of the intermediate shell and cover the openings at both ends of the intermediate shell, the first end cover and the second end cover are both provided with a groove on one side close to the stator, and openings are provided at the bottom of the groove for the main shaft to extend, the first ball bearing is installed in the groove recessed in the first end cover and is sleeved on the main shaft, the second ball bearing is installed in the groove recessed in the second end cover and is sleeved on the main shaft, a first support platform is convexly provided on the outer wall of the main shaft, the first support platform abuts against the inner ring of the first ball bearing to support the first ball bearing, and a second support platform is also convexly provided on the outer wall of the main shaft, the second support platform abuts against the inner ring of the second ball bearing to support the second ball bearing.

[0007] By adopting the above solution, the first ball bearing and the second ball bearing support the rotation of the main shaft, reducing the friction coefficient of the main shaft rotation, making the main shaft rotation stable, and it is not easy to jitter when the main shaft drives the wafer to rotate, so that the photoresist is more uniform when it is expanded outward through rotation and centrifugation to cover the wafer surface.

[0008] Preferably, the housing also includes a groove cover and a wave spring, the groove cover is fixedly connected to the first end cover and covers the groove recessed in the first end cover and abuts against the outer ring of the first ball bearing, and the wave spring is installed between the second ball bearing and the bottom of the groove recessed in the first end cover and abuts against the outer ring of the second ball bearing and the bottom of the groove.

[0009] By adopting the above technical solution, the slot cover presses the first ball bearing against the first end cover, and the first ball bearing is not easily displaced due to the vibration of the main shaft. The wave spring axially pre-tightens the second ball bearing to suppress the axial runout of the main shaft, making the main shaft rotation more stable, improving the uniformity of photoresist coverage, and reducing the running clearance of the ball bearing, thereby reducing noise.

[0010] Preferably, the motor also includes a rotary encoder, which includes a rotary code disk and a converter. The rotary code disk is installed at the position where the main shaft extends out of the second end cover, and the converter is fixed on the second end cover to cooperate with the rotary code disk to detect the geometric displacement of the main shaft.

[0011] By adopting the above technical solution, the rotary encoder detects the geometric displacement of the spindle and outputs the geometric displacement to the external control system through a pulse signal, thereby controlling the rotation speed of the spindle, facilitating the control of the centrifugal force of the wafer rotation, and adapting to different sizes of wafers for glue spreading.

[0012] Preferably, the motor further comprises a top shell, which is mounted and fixed to an end surface of the second end cover away from the stator to cover the rotary encoder, and the top shell is provided with a through hole for the main shaft to pass through.

[0013] By adopting the above technical solution, the top shell is used to protect the rotary encoder, reducing the situation where the rotary encoder is damaged by external forces or becomes dirty due to environmental pollution.

[0014] In summary, the present application includes at least one of the following beneficial technical effects:

[0015] 1. A micro air pump is used to evacuate the through hole of the spindle, so that the through hole of the spindle is in a negative pressure environment to enable the spindle to absorb the fixed wafer. The rotor drives the spindle to rotate, and the wafer rotates. The photoresist dripping onto the surface of the wafer is covered with the surface of the wafer by the centrifugal force brought by the rotation. The spindle absorbs the wafer by negative pressure, and the wafer is not easily scratched. In addition, the contact area between the spindle and the wafer is small, and the photoresist is not easy to spread to the spindle, which is beneficial to reduce the situation where the photoresist sticks back to the wafer and causes wafer contamination.

[0016] 2. The first ball bearing and the second ball bearing support the rotation of the main shaft, reduce the friction coefficient of the main shaft rotation, make the main shaft rotation stable, and when the main shaft drives the wafer to rotate, it is not easy to shake, so that the photoresist is more evenly expanded through rotation and centrifugation to cover the wafer surface.

[0017] 3. The slot cover presses the first ball bearing against the first end cover. The first ball bearing is not easily displaced due to the axial vibration of the spindle. The wave spring axially pre-tightens the second ball bearing to suppress the axial runout of the spindle, making the spindle rotation more stable, improving the uniformity of photoresist coverage, and reducing the running clearance of the ball bearing, which is convenient for reducing noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of a motor for wafer coating in this embodiment.

[0019] Figure 2 is a cross-sectional view of the motor of this embodiment.

[0020] Figure numerals: 1. motor; 11. casing; 111. first end cover; 112. second end cover; 113. intermediate casing; 114. first ball bearing; 115. second ball bearing; 116. slot cover; 117. wave spring; 118. sealing ring; 12. stator; 13. rotor; 14. main shaft; 141. first support platform; 142. second support platform; 143. through hole; 144. threaded hole; 15. rotary encoder; 151. rotary code disk; 152. converter; 16. top casing; 2. micro air pump; 3. air duct. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] Reference Figure 1 and Figure 2 A structure of a motor 1 for wafer glue application includes a motor 1, a micro air pump 2, and an air guide tube 3. The motor 1 includes a housing 11, a stator 12, a rotor 13, and a spindle 14. The housing 11 includes a first end cover 111, a second end cover 112, an intermediate housing 113, a first ball bearing 114, and a second ball bearing 115. The stator 12 is fixed to the intermediate housing 113. The spindle 14 is passed through the center hole of the rotor 13 and is fixedly connected to the rotor 13. The rotor 13 is rotatably installed in the center hole of the stator 12. The first end cover 111 and the second end cover 112 are respectively locked and fixed to the two ends of the intermediate housing 113 by bolts and cover the two end openings of the intermediate housing 113. The first end cover 111 and the second end cover 112 are both concavely provided with grooves on one side close to the stator 12. The bottom of the groove is provided with an opening for the main shaft 14 to extend out, the first ball bearing 114 is installed in the groove recessed in the first end cover 111 and is sleeved on the main shaft 14, the second ball bearing 115 is installed in the groove recessed in the second end cover 112 and is sleeved on the main shaft 14, the outer wall of the main shaft 14 is convexly provided with a first support platform 141, the first support platform 141 and the inner ring of the first ball bearing 114 are in contact with each other to support the first ball bearing 114, the outer wall of the main shaft 14 is also convexly provided with a second support platform 142, the second support platform 142 and the inner ring of the second ball bearing 115 are in contact with each other to support the second ball bearing 115, the first ball bearing 114 and the second ball bearing 115 support the rotation of the main shaft 14, reduce the friction coefficient of the rotation of the main shaft 14, so that the rotation of the main shaft 14 is stable.

[0023] Reference Figure 1 and Figure 2The outer wall of the part of the spindle 14 extending out of the first end cover 111 is provided with a threaded hole 144, and a bolt is screwed into the threaded hole 144 to tightly lock the micro air pump 2 to the spindle 14, and the end of the air guide tube 3 extending from the through hole 143 of the second end cover 112 of the spindle 14 is inserted into the through hole 143 and one port is connected with the through hole 143, the air guide tube 3 is connected and fixed to the micro air pump 2 and the output port of the micro air pump 2 is connected with the other port of the air guide tube 3, and the micro air pump 2 is vacuumed in the through hole 143 of the spindle 14, and a wafer is placed on the end face of the part of the spindle 14 extending out of the first end cover 111. Due to the pressure difference between the outside and the through hole 143, the spindle 14 absorbs and fixes the wafer, and the spindle 14 is driven to rotate by the rotor 13. The rotation of the wafer will expand the photoresist dripped onto the surface of the wafer outward by the centrifugal force brought by the rotation to cover the surface of the wafer, thereby completing the glue spreading.

[0024] Reference Figure 2 The housing 11 also includes a groove cover 116 and a wave spring 117. The groove cover 116 is fixedly connected to the first end cover 111 and covers the groove recessed in the first end cover 111 and abuts against the outer ring of the first ball bearing 114, so that the first ball bearing 114 is pressed tightly against the first end cover 111. The first ball bearing 114 is not easily displaced with the vibration of the main shaft 14. The wave spring 117 is installed between the second ball bearing 115 and the bottom of the groove recessed in the first end cover 111 and abuts against the outer ring of the second ball bearing 115 and the bottom of the groove. The wave spring 117 axially pre-tightens the second ball bearing 115 to suppress the axial runout of the main shaft 14, so that the rotation of the main shaft 14 is stable, the uniformity of the photoresist coverage is improved, the running clearance of the ball bearing is reduced, and the noise of the ball bearing operation is reduced.

[0025] Reference Figure 2 A sealing ring 118 is provided between the first end cover 111 and the second end cover 112 and the intermediate shell 113 , and the sealing ring 118 is used to seal and ensure the sealing of the inner space of the intermediate shell 113 .

[0026] Reference Figure 2The motor 1 also includes a rotary encoder 15 and a top shell 16. The rotary encoder 15 includes a rotary code disk 151 and a converter 152. The rotary code disk 151 is installed at the position where the main shaft 14 extends out of the second end cover 112 and rotates coaxially with the main shaft 14. The converter 152 is fixed on the second end cover 112 and cooperates with the rotary code disk 151 to detect the geometric displacement of the main shaft 14. The rotary encoder 15 detects the geometric displacement of the main shaft 14 and outputs the geometric displacement to the external control system through a pulse signal to control the rotation speed of the main shaft 14, which is convenient for controlling the size of the centrifugal force of the wafer rotation and adapting to different sizes of wafers for glue spreading. The top shell 16 is installed and fixed to the end surface of the second end cover 112 away from the stator 12 to cover the rotary encoder 15. The top shell 16 is provided with a perforation for the main shaft 14 to pass through. The top shell 16 is used to protect the rotary encoder 15 and reduce the situation where the rotary encoder 15 is damaged by external force or dirty by environmental pollution.

[0027] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A motor structure for wafer coating, characterized in that: It includes a motor, a micro air pump and an air duct. The motor includes a shell, a stator, a rotor and a main shaft. The main shaft is inserted into the central hole of the rotor and is fixedly connected to the rotor. The stator is fixed in the shell. The rotor is rotatably installed in the central hole of the stator. Both ends of the main shaft extend out of the shell. A through hole penetrating the main shaft body is provided at the end of the main shaft. The micro air pump is fixed on the main shaft. The air duct penetrates into the through hole and one port is connected to the through hole. The air duct is connected to the micro air pump and the output port of the micro air pump is connected to the other port of the air duct. The micro air pump performs vacuum in the through hole through the air duct.

2. The motor structure for wafer coating according to claim 1, characterized in that: The shell includes a first end cover, a second end cover, an intermediate shell, a first ball bearing, and a second ball bearing. The stator is fixed on the intermediate shell. The first end cover and the second end cover are respectively fixed on both ends of the intermediate shell and cover the openings at both ends of the intermediate shell. The first end cover and the second end cover are both concavely provided with a groove on one side close to the stator, and openings are opened at the bottom of the groove for the main shaft to extend. The first ball bearing is installed in the concave groove of the first end cover and is sleeved on the main shaft. The second ball bearing is installed in the concave groove of the second end cover and is sleeved on the main shaft. A first support platform is convexly provided on the outer wall of the main shaft. The first support platform abuts against the inner ring of the first ball bearing to support the first ball bearing. A second support platform is also convexly provided on the outer wall of the main shaft. The second support platform abuts against the inner ring of the second ball bearing to support the second ball bearing.

3. The motor structure for wafer coating according to claim 2, characterized in that: The housing also includes a groove cover and a wave spring. The groove cover is fixedly connected to the first end cover and covers the groove recessed in the first end cover and abuts against the outer ring of the first ball bearing. The wave spring is installed between the second ball bearing and the bottom of the groove recessed in the first end cover and abuts against the outer ring of the second ball bearing and the bottom of the groove.

4. The motor structure for wafer coating according to claim 2, characterized in that: The motor also includes a rotary encoder, which includes a rotary code disk and a converter. The rotary code disk is installed at the position where the main shaft extends out of the second end cover. The converter is fixed on the second end cover and cooperates with the rotary code disk to detect the geometric displacement of the main shaft.

5. The motor structure for wafer coating according to claim 4, characterized in that: The motor further comprises a top shell, which is mounted and fixed to an end surface of the second end cover away from the stator to cover the rotary encoder, and the top shell is provided with a through hole for the main shaft to pass through.

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