Mobile phone mainboard capable of preventing short circuit damage

Abstract

The utility model relates to the technical field of mobile phone main boards, in particular to a mobile phone main board capable of preventing short circuit damage, which comprises a mobile phone packaging shell, a mobile phone main board body, an internal component protection component, a main board moisture-proof buffer component and an integrated chip, a mobile phone mainboard body is arranged in the mobile phone packaging shell; an internal component protection assembly is arranged at the side end part of the mobile phone mainboard body; the side end part of the mobile phone mainboard body is provided with a mainboard moisture-proof buffer assembly. And an integrated chip is arranged at the side end part of the mobile phone mainboard body. According to the utility model, the internal component protection assembly is arranged to prevent dust and other impurities from directly intruding into the chip, and the cover plate can assist in isolating high-temperature, low-temperature and other extreme environments to prevent the normal operation of the chip from being influenced, and plays a role in supporting the chip after being extruded during the use of the mobile phone, thereby prolonging the service life of the mobile phone, and improving the safety of the mobile phone. And the main board moisture-proof buffer assembly can prevent moisture outside the mobile phone from invading the main board, so that internal circuit short circuit caused by the moisture is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of mobile phone mainboards, in particular to a mobile phone mainboard which is protected from short-circuit damage. Background Art

[0002] The motherboard is one of the most important parts in a mobile phone. It carries all the core functions and computing power of the mobile phone. The motherboard integrates important components and interfaces such as the processor, memory, storage chip, wireless communication chip, and display control chip, and plays the role of integrating, scheduling, and connecting various components to ensure the normal operation of the mobile phone. However, when the existing mobile phone motherboard is in use, its structure is relatively fragile. When it is squeezed by the outside world or the use environment is humid, the components on the motherboard are easily damaged, causing an internal short circuit, which affects the overall service life of the mobile phone. Therefore, it is urgent to provide a mobile phone motherboard with an anti-short circuit structure, which can improve the durability of the mobile phone motherboard, avoid the situation where the mobile phone motherboard is short-circuited due to external squeezing and environmental humidity, effectively protect the motherboard components from damage, and improve the service life of the motherboard. Utility Model Content

[0003] In order to overcome the problem that the structure of the mobile phone motherboard is relatively fragile during use, when it is squeezed by the outside world or the use environment is humid, the components on the motherboard are easily damaged, causing internal short circuits and affecting the overall service life of the mobile phone.

[0004] The technical solution of the utility model is: a mobile phone motherboard that can prevent short-circuit damage, comprising a mobile phone packaging shell, a mobile phone motherboard body, an internal component protection component, a motherboard moisture-proof buffer component, and an integrated chip; the mobile phone motherboard body is arranged inside the mobile phone packaging shell; the internal component protection component is arranged at the side end of the mobile phone motherboard body; the motherboard moisture-proof buffer component is arranged at the side end of the mobile phone motherboard body; and the integrated chip is installed at the side end of the mobile phone motherboard body.

[0005] Preferably, the internal component protection assembly can prevent dust and other impurities from directly invading the chip. At the same time, the cover plate can assist in isolating extreme environments such as high temperature and low temperature to prevent affecting the normal operation of the chip. It can also support the chip after being squeezed during use of the mobile phone, thereby reducing the damage rate of the chip and increasing the service life of the mobile phone. The motherboard moisture-proof buffer assembly can block moisture from the outside of the mobile phone from invading the motherboard to avoid internal circuit short circuits due to moisture. At the same time, the shock-absorbing structure can provide a support for the motherboard, and play a buffering role for the motherboard when the mobile phone falls. It can absorb vibrations and reduce damage to the motherboard when the mobile phone falls or collides, thereby avoiding short circuits.

[0006] Preferably, the internal component protection assembly includes a plug-in sleeve, an elastic protective cover, an elastic telescopic block, a fixed socket, a pressure rod, a torsion spring, a fixed pressure plate, a heat dissipation copper sheet and a thermistor; a plug-in sleeve is installed on the side end of the mobile phone motherboard; an elastic protective cover is slidably connected to the inside of the plug-in sleeve, and one end of the elastic protective cover can be fixed in the plug-in sleeve to cooperate with the elastic telescopic block to stabilize it.

[0007] Preferably, an elastic telescopic block is provided at the side end of the elastic protective cover plate; and a slot for cooperating with the elastic telescopic block is opened at the side end of the plug-in sleeve; a fixed socket is installed at the side end of the mobile phone motherboard body, and the other end of the elastic protective cover plate is fixed in the fixed socket.

[0008] Preferably, a pressure rod is connected to the internal hinge of the fixed base; a torsion spring is installed on the side end of the pressure rod; the side end of the torsion spring is elastically connected to a fixed pressure plate for fixing the elastic protective cover plate, and the pressure rod is pressed downward. Under the action of the torsion spring, the fixed pressure plate applies pressure to the elastic protective cover plate to stabilize it in the fixed base.

[0009] Preferably, a heat dissipation copper sheet is installed at the side end of the mobile phone motherboard body; the side end of the heat dissipation copper sheet is electrically connected to a thermistor; and the side end of the thermistor is electrically connected to the integrated chip. The heat dissipation copper sheet can timely dissipate the heat of the motherboard when the mobile phone is in use, and when the temperature of the motherboard is too high, the power can be automatically cut off in conjunction with the thermistor to prevent a short circuit caused by overheating.

[0010] Preferably, the mainboard moisture-proof buffer assembly includes a supporting rubber pad, an antistatic protective layer, a waterproof breathable membrane, an extended protrusion, a movable connecting plate, an arc pressure plate and a shock-absorbing spring; a supporting rubber pad is arranged at the outer end of the mobile phone mainboard body; an antistatic protective layer is arranged at the outer end of the supporting rubber pad; a waterproof breathable membrane is installed at the outer end of the antistatic protective layer, the antistatic protective layer can reduce the damage of static electricity to the mainboard, avoid static electricity breaking through components and causing short circuits, the waterproof breathable membrane can prevent moisture from entering, while allowing gas exchange to prevent water accumulation and corrosion.

[0011] Preferably, an extension protrusion is fixedly connected to the side end of the mobile phone main body; a movable connecting plate is hingedly connected to the side end of the extension protrusion; an arc-shaped pressure plate is installed at the upper end of the movable connecting plate; a shock-absorbing spring is arranged at the lower end of the arc-shaped pressure plate, and the arc-shaped pressure plate can provide a support effect for the mobile phone main body, and together with the shock-absorbing spring, it can provide a buffering protection for the mobile phone main body when the mobile phone falls.

[0012] Beneficial effects of the utility model:

[0013] 1. During the use of the mobile phone motherboard, its structure is relatively fragile. When it is squeezed by the outside world or the use environment is humid, the components on the motherboard are easily damaged, causing internal short circuits and affecting the overall service life of the mobile phone. Therefore, the internal component protection component can prevent dust and other impurities from directly invading the chip. At the same time, the cover can assist in isolating extreme environments such as high temperature and low temperature to prevent the normal operation of the chip from being affected. After the mobile phone is squeezed during use, it can support the chip, reduce the damage rate of the chip, and increase the service life of the mobile phone. The motherboard moisture-proof buffer component can block the moisture outside the mobile phone from invading the motherboard to avoid internal circuit short circuits caused by moisture. At the same time, the shock-absorbing structure can provide a support for the motherboard, and play a buffering role for the motherboard when the mobile phone falls, which can absorb vibrations and reduce damage to the motherboard when the mobile phone falls or hits, thereby avoiding short circuits;

[0014] 2. One end of the elastic protective cover can be fixed in the plug-in sleeve, and the elastic telescopic block is used to stabilize it. The other end of the elastic protective cover is fixed in the fixed card seat. The pressure rod is pressed downward. Under the action of the torsion spring, the fixed pressure plate presses the elastic protective cover to stabilize it in the fixed card seat. The heat dissipation copper sheet can timely guide the heat of the motherboard when the mobile phone is in use. When the temperature of the motherboard is too high, it can automatically cut off the power supply in cooperation with the thermistor to prevent short circuit caused by overheating;

[0015] 3. The antistatic protective layer can reduce the damage of static electricity to the motherboard and prevent static electricity from breaking through components and causing short circuits. The waterproof and breathable membrane can prevent moisture from entering while allowing gas exchange to prevent water accumulation and corrosion. The arc-shaped pressure plate can provide support for the main body of the mobile phone motherboard, and with the shock-absorbing spring, it can provide buffering protection for the main body of the mobile phone motherboard when the mobile phone falls. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Shown is a three-dimensional structural schematic diagram of the mobile phone motherboard of the utility model;

[0017] Figure 2 Shown is a three-dimensional structural diagram of the internal component protection assembly of the mobile phone motherboard of the utility model;

[0018] Figure 3 Shown is a schematic diagram of the three-dimensional structure of the antistatic protection layer of the mobile phone motherboard of the utility model;

[0019] Figure 4 Shown is a schematic diagram of the three-dimensional structure of the arc-shaped pressing plate of the mobile phone mainboard of the utility model.

[0020] Explanation of the reference numerals in the accompanying drawings: 1. Mobile phone packaging shell; 2. Mobile phone motherboard body; 3. Internal component protection assembly; 4. Mainboard moisture-proof buffer assembly; 5. Integrated chip; 301. Plug-in sleeve; 302. Elastic protective cover plate; 303. Elastic telescopic block; 304. Fixed socket; 305. Pressure rod; 306. Torsion spring; 307. Fixed pressure plate; 308. Heat dissipation copper sheet; 309. Thermistor; 401. Support rubber pad; 402. Antistatic protective layer; 403. Waterproof and breathable membrane; 404. Extended protrusion; 405. Movable connecting plate; 406. Arc pressure plate; 407. Shock-absorbing spring. DETAILED DESCRIPTION

[0021] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0022] Embodiment 1

[0023] See also Figure 1-2The utility model provides an embodiment: a mobile phone motherboard that can be protected from short circuit damage, comprising a mobile phone packaging shell 1, a mobile phone motherboard body 2, an internal component protection component 3, a motherboard moisture-proof buffer component 4, and an integrated chip 5; the mobile phone packaging shell 1 is provided with a mobile phone motherboard body 2; the side end of the mobile phone motherboard body 2 is provided with an internal component protection component 3; the side end of the mobile phone motherboard body 2 is provided with a motherboard moisture-proof buffer component 4; the side end of the mobile phone motherboard body 2 is installed with an integrated chip 5, and the internal component protection component 3 includes a plug-in Sleeve 301, elastic protective cover plate 302, elastic telescopic block 303, fixed card seat 304, pressure rod 305, torsion spring 306, fixed pressure plate 307, heat dissipation copper sheet 308 and thermistor 309; the end of the side of the mobile phone motherboard body 2 is installed with a plug-in sleeve 301; the elastic protective cover plate 302 is slidably connected inside the plug-in sleeve 301, one end of the elastic protective cover plate 302 can be fixed in the plug-in sleeve 301, and the elastic telescopic block 303 is used to stabilize it. The side end of the elastic protective cover plate 302 is provided with an elastic The elastic expansion block 303 is provided at the side end of the plug sleeve 301, and a slot for matching the elastic expansion block 303 is provided; a fixed card seat 304 is installed at the side end of the mobile phone motherboard body 2, and the other end of the elastic protective cover plate 302 is fixed in the fixed card seat 304, and a pressure rod 305 is connected to the internal hinge of the fixed card seat 304; a torsion spring 306 is installed at the side end of the pressure rod 305; a fixed pressure plate 307 for fixing the elastic protective cover plate 302 is elastically connected to the side end of the torsion spring 306, and the pressure rod 305 is pressed downward to Under the action of the rotating spring 306, the fixed pressure plate 307 applies pressure to the elastic protective cover 302 to make it stable in the fixed card seat 304, and a heat dissipation copper sheet 308 is installed on the side end of the mobile phone motherboard body 2; the side end of the heat dissipation copper sheet 308 is electrically connected to the thermistor 309; and the side end of the thermistor 309 is electrically connected to the integrated chip 5. The heat dissipation copper sheet 308 can timely discharge the heat of the motherboard when the mobile phone is in use, and cooperate with the thermistor 309 when the temperature of the motherboard is too high, it can automatically cut off the power to prevent a short circuit caused by overheating.

[0024] Embodiment 2

[0025] See also Figure 3-4In this embodiment, the mainboard moisture-proof buffer component 4 includes a supporting rubber pad 401, an antistatic protective layer 402, a waterproof breathable membrane 403, an extended protrusion 404, a movable connecting plate 405, an arc-shaped pressure plate 406 and a shock-absorbing spring 407; the outer end of the mobile phone mainboard body 2 is provided with a supporting rubber pad 401; the outer end of the supporting rubber pad 401 is provided with an antistatic protective layer 402; the outer end of the antistatic protective layer 402 is installed with a waterproof breathable membrane 403, and the antistatic protective layer 402 can reduce the damage of static electricity to the mainboard and avoid static electricity breakdown of components to cause short circuits The waterproof and breathable membrane 403 can prevent moisture from entering while allowing gas exchange to prevent water accumulation and corrosion. An extension protrusion 404 is fixedly connected to the side end of the mobile phone motherboard body 2; the side end of the extension protrusion 404 is hingedly connected to a movable connecting plate 405; an arc-shaped pressure plate 406 is installed on the upper end of the movable connecting plate 405; a shock-absorbing spring 407 is provided on the lower end of the arc-shaped pressure plate 406, and the arc-shaped pressure plate 406 can support the mobile phone motherboard body 2, and cooperate with the shock-absorbing spring 407 to provide buffering protection for the mobile phone motherboard body 2 when the mobile phone falls.

[0026] When working, first, one end of the elastic protective cover plate 302 can be fixed in the plug-in sleeve 301, and the elastic telescopic block 303 is used to stabilize it. The other end of the elastic protective cover plate 302 is fixed in the fixed card seat 304, and the pressure rod 305 is pressed downward. Under the action of the torsion spring 306, the fixed pressure plate 307 presses the elastic protective cover plate 302 to stabilize it in the fixed card seat 304. The heat dissipation copper sheet 308 can timely guide the heat of the motherboard when the mobile phone is used. When the temperature of the motherboard is too high, it can be automatically powered off in cooperation with the thermistor 309 to prevent a short circuit caused by overheating;

[0027] Finally, the antistatic protective layer 402 can reduce the damage of static electricity to the motherboard and prevent static electricity from breaking through components and causing short circuits. The waterproof and breathable membrane 403 can prevent moisture from entering while allowing gas exchange to prevent water accumulation and corrosion. The arc pressure plate 406 can support the mobile phone motherboard body 2, and cooperate with the shock-absorbing spring 407 to provide buffering protection for the mobile phone motherboard body 2 when the mobile phone falls.

[0028] Through the above steps, the internal component protection component 3 can prevent dust and other impurities from directly invading the chip. At the same time, the cover plate can assist in isolating extreme environments such as high temperature and low temperature to prevent affecting the normal operation of the chip. After being squeezed during use of the mobile phone, it can support the chip, reduce the damage rate of the chip, and increase the service life of the mobile phone. The mainboard moisture-proof buffer component 4 can block the moisture outside the mobile phone from invading the mainboard to avoid internal circuit short circuit due to moisture. At the same time, the shock-absorbing structure can provide a support for the mainboard, and play a buffering role for the mainboard when the mobile phone falls, which can absorb vibrations and reduce damage to the mainboard when the mobile phone falls or collides, thereby avoiding short circuits.

[0029] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. A mobile phone mainboard that prevents short circuit damage, comprising a mobile phone packaging shell (1); characterized in that: The mobile phone also comprises a mobile phone mainboard body (2), an internal component protection assembly (3), a mainboard moisture-proof buffer assembly (4), and an integrated chip (5); the mobile phone mainboard body (2) is arranged inside the mobile phone packaging shell (1); the internal component protection assembly (3) is arranged at the side end of the mobile phone mainboard body (2); the mainboard moisture-proof buffer assembly (4) is arranged at the side end of the mobile phone mainboard body (2); and the integrated chip (5) is installed at the side end of the mobile phone mainboard body (2).

2. A mobile phone motherboard that prevents short circuit damage according to claim 1, characterized in that: The internal component protection assembly (3) comprises a plug-in sleeve (301), an elastic protective cover plate (302), an elastic telescopic block (303), a fixed card seat (304), a pressure rod (305), a torsion spring (306), a fixed pressure plate (307), a heat dissipation copper sheet (308) and a thermistor (309); the plug-in sleeve (301) is installed at the side end of the mobile phone motherboard body (2); and the elastic protective cover plate (302) is slidably connected inside the plug-in sleeve (301).

3. A mobile phone motherboard that prevents short circuit damage according to claim 2, characterized in that: An elastic telescopic block (303) is arranged at the side end of the elastic protective cover plate (302); a slot for matching the elastic telescopic block (303) is provided at the side end of the plug sleeve (301); and a fixed card seat (304) is installed at the side end of the mobile phone motherboard body (2).

4. A mobile phone motherboard that prevents short circuit damage according to claim 3, characterized in that: The fixed card seat (304) is hingedly connected to a pressure rod (305); a torsion spring (306) is installed at the side end of the pressure rod (305); and a fixed pressure plate (307) for fixing the elastic protective cover plate (302) is elastically connected to the side end of the torsion spring (306).

5. A mobile phone motherboard that prevents short circuit damage according to claim 1, characterized in that: A heat dissipation copper sheet (308) is installed at the side end of the mobile phone mainboard body (2); the side end of the heat dissipation copper sheet (308) is electrically connected to a thermistor (309); and the side end of the thermistor (309) is electrically connected to the integrated chip (5).

6. A mobile phone motherboard that prevents short circuit damage according to claim 1, characterized in that: The mainboard moisture-proof buffer component (4) comprises a supporting rubber pad (401), an antistatic protective layer (402), a waterproof breathable membrane (403), an extended protrusion (404), a movable connecting plate (405), an arc-shaped pressure plate (406) and a shock-absorbing spring (407); the outer end of the mobile phone mainboard body (2) is provided with a supporting rubber pad (401); the outer end of the supporting rubber pad (401) is provided with an antistatic protective layer (402); and the outer end of the antistatic protective layer (402) is installed with a waterproof breathable membrane (403).

7. A mobile phone motherboard that prevents short circuit damage according to claim 1, characterized in that: An extension protrusion (404) is fixedly connected to the side end of the mobile phone mainboard body (2); a movable connecting plate (405) is hingedly connected to the side end of the extension protrusion (404); and an arc-shaped pressing plate (406) is installed on the upper end of the movable connecting plate (405); A shock absorbing spring (407) is provided at the lower end of the arc-shaped pressing plate (406).

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