Mobile phone mainboard support heat dissipation assembly

Abstract

The utility model relates to the technical field of mobile phone mainboard supports, and discloses a mobile phone mainboard supporting heat dissipation assembly which comprises a steel sheet body, fixing holes are formed in the four corners of the steel sheet body, a plug-in port is fixedly connected to one side of the upper end of the steel sheet body, mainboard mounting holes are formed in the two sides of the steel sheet body, and the mainboard mounting holes are fixedly connected to the other side of the steel sheet body. A through rectangular groove is formed in the steel sheet body, a placement groove is formed in the through rectangular groove, a stabilizing piece is placed in the placement groove, the upper end of the stabilizing piece abuts against the lower end of a mainboard, and a heat dissipation assembly is arranged on the inner wall of the through rectangular groove; according to the novel supporting steel sheet applied to the mobile phone mainboard, by arranging the stabilizing part and the heat dissipation assembly, the mainboard can be installed more stably through the stabilizing part and the heat dissipation assembly which are arranged in the containing groove and the penetrating rectangular groove correspondingly, heat can be transmitted to the heat dissipation assembly in the running process, the heat is dissipated through the heat dissipation assembly, and the heat dissipation efficiency is improved. And the heat dissipation assembly does not affect signal transmission between the mainboard shielding cases.

Description

Technical Field

[0001] The utility model relates to the technical field of mobile phone mainboard brackets, in particular to a mobile phone mainboard supporting heat dissipation component. Background Art

[0002] In the current existing technology, announcement number: CN217240719U, discloses a steel sheet assembly for a mobile phone motherboard bracket; in the existing technology, they all have a shielding cover fixed on the back of the motherboard, and the shielding cover is provided with perforations, and the perforations are used to increase the effect of signal transmission. In the existing technology, the shielding cover is in contact with the supporting steel sheet, which will weaken the signal transmission effect of the mobile phone, and the air in the internal space of the abutment is not circulated, and the heat dissipation effect is poor. Such a design is not good for heat transfer and will also affect the signal. In order to solve the above problems, this application proposes a mobile phone motherboard support heat dissipation assembly. Utility Model Content

[0003] In view of the deficiencies of the prior art, the utility model provides a mobile phone mainboard support heat dissipation component to at least solve one of the problems raised by the background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a mobile phone motherboard supporting heat dissipation component, comprising a steel sheet body, fixing holes are provided at the four corners of the steel sheet body, a plug interface is fixedly connected to one side of the upper end of the steel sheet body, motherboard mounting holes are provided on both sides of the steel sheet body, a through rectangular groove is provided on the steel sheet body, a placement groove is provided on the through rectangular groove, a stabilizing member is placed in the placement groove, the upper end of the stabilizing member is arranged to abut against the lower end of the motherboard, a heat dissipation component is provided on the inner wall of the through rectangular groove, and the heat dissipation component is arranged to abut against the lower end of the motherboard.

[0005] A further technical improvement of the utility model is that the heat dissipation component includes a fixed frame, a heat sink is fixedly connected to the fixed frame, the number of the heat sinks is multiple and the spacing is equal, the upper end of the heat sink is fixedly connected to a heat conductive sheet, and the upper end of the heat conductive sheet is set against the lower end of the mainboard.

[0006] A further technical improvement of the utility model is that the stabilizing member includes buffer pads fixed at the four corners of the placement groove, and spring sheets are fixedly connected between the buffer pads on the placement groove, and the upper end of the spring sheet is fixedly connected to a connecting frame, and the upper end of the connecting frame is arranged to abut against the lower end of the mainboard.

[0007] A further technical improvement of the utility model is that a groove is provided at the lower end of the heat sink, the number of the grooves is multiple, and the intervals between the grooves are equal.

[0008] A further technical improvement of the utility model is that the outer side area of ​​the connection frame is not less than the inner side area of ​​the rectangular groove.

[0009] A further technical improvement of the present invention is that the installation hole is provided within the frame of the connection frame.

[0010] The embodiment of the utility model provides a mobile phone mainboard support heat dissipation component, which has the following beneficial effects:

[0011] This new type is applied to the mobile phone motherboard supporting steel sheet. By setting a stabilizing part and a heat dissipation component, the stabilizing part and the heat dissipation component are respectively set in the placement groove and the through rectangular groove, the motherboard can be installed more stably, and the heat can be transferred to the heat dissipation component during operation, and the heat is dissipated through the heat dissipation component, and the heat dissipation component will not affect the signal transmission between the motherboard shielding cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention.

[0013] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0014] Figure 2 This is a schematic diagram of the utility model's penetrating rectangular groove and connecting frame structure;

[0015] Figure 3 This is a schematic diagram of the structure of the spring piece and the buffer pad of the utility model;

[0016] Figure 4 This is a schematic diagram of the structure of the heat dissipation component of the utility model.

[0017] In the figure: 1. Steel sheet body; 2. Plug interface; 3. Mounting hole; 4. Fixing hole; 5. Through rectangular groove; 6. Placement groove; 7. Buffer pad; 8. Spring clip; 9. Connection frame; 10. Fixing frame; 11. Heat sink; 12. Heat conducting sheet; 13. Groove. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figure 1-4A mobile phone motherboard supporting heat dissipation component comprises a steel sheet body 1, fixing holes 4 are provided at the four corners of the steel sheet body 1, a plug interface 2 is fixedly connected to one side of the upper end of the steel sheet body 1, motherboard mounting holes 3 are provided on both sides of the steel sheet body 1, a through rectangular groove 5 is provided on the steel sheet body 1, a placement groove 6 is provided on the through rectangular groove 5, a stabilizing member is placed in the placement groove 6, the upper end of the stabilizing member is arranged to abut against the lower end of the motherboard, a heat dissipation component is arranged on the inner wall of the through rectangular groove 5, and the heat dissipation component is arranged to abut against the lower end of the motherboard.

[0020] The specific working principle and implementation method are as follows: the steel sheet body 1 is placed on the back cover of the mobile phone, and is connected and fixed to the back cover of the mobile phone by screws passing through the fixing holes 4. After the steel sheet body 1 is fixed, the main board is placed on the steel sheet body 1, and is also threadedly connected to the main board mounting hole 3 by screws passing through the main board. After the main board is installed, it contacts the stabilizing part in the placement groove 6. The main board can be stably placed in the placement groove 6, and a heat dissipation component is arranged inside the rectangular groove 5. The heat generated by the operation of the main board can be dissipated through the heat dissipation component, and the signal of the shielding cover on the back side of the main board can be connected to the outside world through the heat dissipation component. The advantage of such a design is that the stabilizing parts and heat dissipation components respectively arranged in the placement groove 6 and the rectangular groove 5 can make the main board installation more stable, and can transfer heat to the heat dissipation component during operation, and dissipate heat through the heat dissipation component, and the heat dissipation component will not affect the signal transmission between the mainboard shielding covers.

[0021] like Figure 4 As shown, the heat dissipation component includes a fixed frame 10, to which a heat sink 11 is fixedly connected. The number of heat sinks 11 is set in multiples and the spacing is equal. The upper end of the heat sink 11 is fixedly connected with a heat conductive sheet 12, and the upper end of the heat conductive sheet 12 is set against the lower end of the mainboard. The fixed frame 10 is fixed to the inner wall of the rectangular groove 5 by welding. The welding connection can be more stable. The heat sink 11 is fixedly connected to the fixed frame 10. The heat conductive sheet 12 at the upper end of the heat sink 11 contacts the lower end of the mainboard. The heat on the mainboard can be dissipated through the heat conductive sheet 12. The number of heat sinks 11 is set in multiples and the spacing is equal. The spacing can facilitate the signal transmission of the mainboard, that is, it can dissipate heat and transmit signals.

[0022] like Figure 3As shown, the stabilizing member includes buffer pads 7 fixed at the four corners of the placement slot 6, and spring sheets 8 are fixedly connected between the buffer pads 7 on the placement slot 6. The upper ends of the spring sheets 8 are fixedly connected to the connecting frame 9, and the upper ends of the connecting frame 9 are set to abut against the lower end of the mainboard. When the mainboard is installed, the lower end of the mainboard contacts the upper end surface of the connecting frame 9, and the connecting frame 9 is squeezed to squeeze the spring sheet 8. The folding elasticity of the spring sheet 8 can squeeze the connecting frame 9 upward, so that the connecting frame 9 can abut against the mainboard. When the screws on both sides of the mainboard are continuously rotated and fixed, the buffer pads 7 fixed inside the placement slot 6 can support the ends of the spring sheet 8, so that the elastic force of the spring sheet 8 is more balanced, and also the connection between the mainboard and the heat conducting plate 12 is more stably abutted.

[0023] like Figure 4 As shown, a groove 13 is provided at the lower end of the heat sink 11. There are multiple grooves 13, and the grooves 13 are arranged at equal intervals. The groove 13 is arranged at the lower end of the heat sink 11. When transferring heat, the heat sink 11 collects the heat inside the lower end of the rectangular groove 5. The groove 13 can increase the contact area between the heat sink 11 and the air, thereby increasing the heat dissipation efficiency.

[0024] like Figure 2 As shown, the outer area of ​​the connecting frame 9 is not less than the inner area of ​​the rectangular groove 5, and the connecting frame 9 is located between the main board and the steel sheet body 1. After the main board is installed, there is a gap of the thickness of the connecting frame 9. The main board is not in direct contact with the steel sheet body 1, which can increase the heat dissipation effect.

[0025] like Figure 2 As shown, the opening position of the mounting hole 3 is set within the border range of the connecting frame 9. The mounting hole 3 is located within the border range of the connecting frame 9 and can be fixed in position to match the connecting frame 9 when fixing the mainboard. In this way, the fixed position of the mainboard is supported by the connecting frame 9, thereby achieving a stable effect. The connecting frame 9 occupies a small area at the lower end of the mainboard, and the heat at the lower end of the mainboard is dissipated faster.

[0026] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A mobile phone motherboard support heat dissipation component, comprising a steel sheet body (1), wherein fixing holes (4) are provided at four corners of the steel sheet body (1), and a plug interface (2) is fixedly connected to one side of the upper end of the steel sheet body (1), characterized in that: Mainboard mounting holes (3) are provided on both sides of the steel sheet body (1); a through rectangular groove (5) is provided on the steel sheet body (1); a placement groove (6) is provided on the through rectangular groove (5); a stabilizing member is placed in the placement groove (6); the upper end of the stabilizing member is arranged to abut against the lower end of the mainboard; a heat dissipation component is provided on the inner wall of the through rectangular groove (5); the heat dissipation component is arranged to abut against the lower end of the mainboard.

2. A mobile phone mainboard support heat dissipation assembly according to claim 1, characterized in that: The heat dissipation component comprises a fixed frame (10), a heat sink (11) is fixedly connected to the fixed frame (10), a plurality of heat sinks (11) are provided with equal spacing, a heat conducting sheet (12) is fixedly connected to the upper end of the heat sink (11), and the upper end of the heat conducting sheet (12) is arranged to abut against the lower end of the mainboard.

3. A mobile phone mainboard support heat dissipation assembly according to claim 1, characterized in that: The stabilizing member comprises buffer pads (7) fixed at four corners of the placement groove (6), spring plates (8) are fixedly connected between the buffer pads (7) on the placement groove (6), the upper ends of the spring plates (8) are fixedly connected to a connection frame (9), and the upper end of the connection frame (9) is arranged to abut against the lower end of the mainboard.

4. A mobile phone mainboard support heat dissipation assembly according to claim 2, characterized in that: A groove (13) is provided at the lower end of the heat sink (11), the grooves (13) are multiple in number, and the grooves (13) are arranged at equal intervals.

5. A mobile phone mainboard support heat dissipation assembly according to claim 3, characterized in that: The outer side area of ​​the connection frame (9) is set to be no less than the inner side area of ​​the penetrating rectangular groove (5).

6. A mobile phone mainboard support heat dissipation assembly according to claim 1, characterized in that: The opening position of the mounting hole (3) is arranged within the frame range of the connection frame (9).

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