Circuit board with high-flexibility heat dissipation structure

Abstract

The utility model discloses a circuit board with a high-flexibility heat dissipation structure, which comprises a circuit board main body, and two heat dissipation mechanisms are symmetrically and fixedly connected onto the circuit board main body. The heat dissipation mechanism comprises a heat collection plate fixedly connected to the circuit board body, a plurality of fixed heat dissipation fins are evenly and fixedly connected to the vertical side wall of the heat collection plate, a slot is formed in the side, away from the circuit board body, of the heat collection plate, and an adjustable heat dissipation plate is movably inserted into the slot. The adjustable heat dissipation plate is tightly attached to the groove wall of the inserting groove, a plurality of mounting grooves are evenly formed in the vertical side wall of the adjustable heat dissipation plate, detachable heat dissipation fins are movably inserted into the mounting grooves, and a locking mechanism is connected to the vertical side wall of the heat collection plate. According to the utility model, the size of the circuit board heat dissipation structure can be flexibly adjusted according to actual installation requirements, the use flexibility of the circuit board heat dissipation structure is effectively improved, and the installation flexibility of the circuit board is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board with a high-flexibility heat dissipation structure. Background Art

[0002] Circuit board, also known as printed circuit board, is an important component of electronic equipment. Circuit board is mainly used to install various electrical components, connect multiple electrical components, and can also be used as a supporting structure.

[0003] During the use of the circuit board, heat is generated, which will reduce the performance stability of the circuit board, so a heat dissipation structure needs to be installed for heat dissipation. The size of the existing heat dissipation structure of the circuit board is fixed and cannot be flexibly adjusted. For installation environments with larger spaces, the fixed and smaller heat dissipation structure size will lead to reduced heat dissipation effect. For installation environments with smaller spaces, the fixed heat dissipation structure size will affect the installation of the circuit board. The heat dissipation structure is not convenient for circuit board structures in different situations, and the installation flexibility of the heat dissipation structure is poor. Utility Model Content

[0004] The purpose of the utility model is to provide a circuit board with a highly flexible heat dissipation structure to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] The utility model provides a circuit board with a highly flexible heat dissipation structure, comprising a circuit board body, on which two heat dissipation mechanisms are symmetrically fixedly connected;

[0007] The heat dissipation mechanism includes a heat collecting plate fixedly connected to a circuit board body, a plurality of fixed heat sinks are evenly and fixedly connected to the vertical side walls of the heat collecting plate, a slot is provided on a side of the heat collecting plate away from the circuit board body, an adjustable heat sink is movably inserted in the slot, the adjustable heat sink is tightly fitted with the slot wall of the slot, a plurality of mounting slots are evenly provided on the vertical side walls of the adjustable heat sink, a detachable heat sink is movably inserted in the mounting slot, and a locking mechanism is connected to the vertical side walls of the heat collecting plate.

[0008] Furthermore, an extension plate is fixedly connected to the side wall on the upper side of the adjustable heat dissipation plate, and a separation gasket is fixedly connected to the side wall on the upper side of the extension plate.

[0009] Furthermore, four corners of the lower surface of the circuit board body are fixedly connected with suspended pads, and the side walls on the lower sides of the suspended pads are fixedly connected with shock-absorbing pads.

[0010] Furthermore, the locking mechanism comprises a threaded hole formed on the heat collecting plate, the threaded hole is communicated with the slot, and a locking bolt is threadedly sleeved in the threaded hole.

[0011] Furthermore, a plurality of air holes are formed on the vertical side wall of the heat collecting plate, and the air holes are located below the slots.

[0012] Furthermore, a plurality of semicircular protrusions are fixedly connected to the vertical side walls of the circuit board body, and the semicircular protrusions are integrally formed with the circuit board body.

[0013] Furthermore, two sliding blocks are symmetrically fixedly connected in the slot, and two sliding grooves matching the sliding blocks are symmetrically provided on the vertical side wall of the adjustable heat dissipation plate.

[0014] Furthermore, the specific material of the separation gasket is rubber.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] The heat dissipation mechanism provided by the utility model can be adjusted according to the actual installation space size when the circuit board is installed. When the installation space size is small, the locking mechanism for limiting the position of the adjustable heat dissipation plate is released, the detachable heat dissipation fins located at the bottom are drawn out of the mounting grooves, and the adjustable heat dissipation plate is pressed downwards to reduce the overall height of the heat collecting plate and the adjustable heat dissipation plate, thereby being able to adapt to installation environments with small installation space. When the installation space is large, the adjustable heat dissipation plate is pulled upwards to increase the height of the heat dissipation mechanism, and detachable heat dissipation fins are added to the exposed mounting grooves, thereby increasing the heat dissipation area of ​​the heat dissipation mechanism, thereby increasing the heat dissipation efficiency of the heat dissipation mechanism, thereby being able to flexibly adjust the size of the heat dissipation structure of the circuit board according to actual installation requirements, effectively improving the flexibility of using the heat dissipation structure of the circuit board, and effectively improving the flexibility of circuit board installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 It is the front view of the utility model;

[0019] Figure 3 for Figure 1 A schematic diagram of the structure of the heat dissipation mechanism;

[0020] Figure 4 for Figure 1 Schematic diagram of the structure of the central collector plate;

[0021] Figure 5 for Figure 1 Schematic diagram of the structure of the adjustable heat sink.

[0022] In the figure: 1. Circuit board body; 2. Heat collecting plate; 3. Fixed heat sink; 4. Slot; 5. Adjustable heat sink; 6. Mounting slot; 7. Removable heat sink; 8. Extension plate; 9. Separation gasket; 10. Suspended pad; 11. Shock-absorbing pad; 12. Threaded hole; 13. Locking bolt; 14. Air hole; 15. Semicircular protrusion; 16. Slider; 17. Slide groove. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-5 The utility model provides a circuit board with a highly flexible heat dissipation structure, comprising a circuit board body 1, on which two heat dissipation mechanisms are symmetrically fixedly connected;

[0025] The heat dissipation mechanism includes a heat collecting plate 2 fixedly connected to a circuit board body 1, a plurality of fixed heat sinks 3 are evenly and fixedly connected to the vertical side walls of the heat collecting plate 2, a slot 4 is provided on the side of the heat collecting plate 2 away from the circuit board body 1, an adjustable heat sink 5 is movably inserted in the slot 4, the adjustable heat sink 5 is tightly fitted with the slot wall of the slot 4, a plurality of mounting slots 6 are evenly provided on the vertical side walls of the adjustable heat sink 5, a detachable heat sink 7 is movably inserted in the mounting slot 6, and a locking mechanism is connected to the vertical side walls of the heat collecting plate 2.

[0026] In this embodiment, when installing the circuit board, the heat dissipation mechanism is adjusted according to the actual size of the installation space. When the installation space is small, the locking mechanism is released to limit the fixing of the adjustable heat dissipation plate 5, and the removable heat sink 7 located at the bottom is pulled out from the installation slot 6, and the adjustable heat sink 5 is pressed downward to reduce the overall height of the heat collecting plate 2 and the adjustable heat sink 5, so that it can adapt to the installation environment with a small installation space. When the installation space is large, the adjustable heat sink 5 is pulled upward to increase the height of the heat dissipation mechanism, and the removable heat sink 7 is added to the exposed installation slot 6, so that the heat dissipation area of ​​the heat dissipation mechanism can be increased, thereby improving the heat dissipation efficiency of the heat dissipation mechanism, so that the size of the circuit board heat dissipation structure can be flexibly adjusted according to actual installation requirements, effectively improving the flexibility of the use of the circuit board heat dissipation structure, and effectively improving the flexibility of circuit board installation.

[0027] The upper side wall of the adjustable heat sink 5 is fixedly connected with an extension plate 8, and the upper side wall of the extension plate 8 is fixedly connected with a partition gasket 9. The extension plate 8 can increase the heat dissipation area of ​​the heat dissipation mechanism, thereby improving the heat dissipation efficiency of the heat dissipation mechanism. The partition gasket 9 can create a gap above the extension plate 8, thereby facilitating ventilation and heat dissipation.

[0028] The four corners of the lower surface of the circuit board body 1 are fixedly connected with suspended pads 10, and the side walls of the lower sides of the suspended pads 10 are fixedly connected with shock-absorbing pads 11, which can make the bottom of the circuit board suspended, thereby facilitating ventilation and improving heat dissipation efficiency.

[0029] The locking mechanism includes a threaded hole 12 opened on the heat collecting plate 2, the threaded hole 12 is connected to the slot 4, and a locking bolt 13 is threadedly sleeved in the threaded hole 12. When in use, the locking bolt 13 is turned, and the position of the locking bolt 13 can be adjusted through the threaded cooperation between the locking bolt 13 and the threaded hole 12, so that the adjustable heat sink 5 can be locked.

[0030] The vertical side wall of the heat collecting plate 2 is provided with a plurality of air holes 14 , and the air holes 14 are located below the slots 4 . The plurality of air holes 14 can facilitate airflow through the heat collecting plate 2 , thereby improving heat dissipation efficiency.

[0031] The vertical side walls of the circuit board body 1 are fixedly connected with a plurality of semicircular protrusions 15, which are integrally formed with the circuit board body 1. The plurality of semicircular protrusions 15 can provide gaps at the edge of the circuit board, thereby facilitating ventilation and improving the heat dissipation efficiency of the circuit board.

[0032] Two sliders 16 are symmetrically fixedly connected in the slot 4, and the vertical side wall of the adjustable heat sink 5 is symmetrically provided with two slide grooves 17 matching the sliders 16. The sliders 16 cooperate with the slide grooves 17 to limit and guide the adjustable heat sink 5, thereby improving the sliding stability of the adjustable heat sink 5.

[0033] The specific material of the separation gasket 9 is rubber. The separation gasket 9 made of rubber can be elastically deformed, thereby improving the use effect of the separation gasket 9.

[0034] Working principle: When installing the circuit board, the heat dissipation mechanism is adjusted according to the actual size of the installation space. When the installation space is small, the locking mechanism is released to limit the fixing of the adjustable heat sink 5, and the removable heat sink 7 at the bottom is pulled out from the installation slot 6. The adjustable heat sink 5 is pressed downward to reduce the overall height of the heat collecting plate 2 and the adjustable heat sink 5, so that it can adapt to the installation environment with a small installation space. When the installation space is large, the adjustable heat sink 5 is pulled upward to increase the height of the heat dissipation mechanism, and the removable heat sink 7 is added to the exposed installation slot 6, so that the heat dissipation area of ​​the heat dissipation mechanism can be increased, thereby improving the heat dissipation efficiency of the heat dissipation mechanism, so that the size of the circuit board heat dissipation structure can be flexibly adjusted according to the actual installation requirements, effectively improving the flexibility of the use of the circuit board heat dissipation structure, and effectively improving the flexibility of circuit board installation.

[0035] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board with a highly flexible heat dissipation structure, comprising a circuit board body (1), characterized in that: Two heat dissipation mechanisms are symmetrically fixedly connected to the circuit board body (1); The heat dissipation mechanism comprises a heat collecting plate (2) fixedly connected to a circuit board body (1); a plurality of fixed heat sinks (3) are evenly and fixedly connected to the vertical side wall of the heat collecting plate (2); a slot (4) is provided on a side of the heat collecting plate (2) away from the circuit board body (1); an adjustable heat sink (5) is movably inserted into the slot (4); the adjustable heat sink (5) is tightly fitted with the slot wall of the slot (4); a plurality of mounting slots (6) are evenly provided on the vertical side wall of the adjustable heat sink (5); a detachable heat sink (7) is movably inserted into the mounting slot (6); and a locking mechanism is connected to the vertical side wall of the heat collecting plate (2).

2. A circuit board with a highly flexible heat dissipation structure according to claim 1, characterized in that: The side wall on the upper side of the adjustable heat dissipation plate (5) is fixedly connected to an extension plate (8), and the side wall on the upper side of the extension plate (8) is fixedly connected to a separation gasket (9).

3. The circuit board with a highly flexible heat dissipation structure according to claim 1, characterized in that: The four corners of the lower surface of the circuit board body (1) are all fixedly connected with suspended pads (10), and the side walls on the lower sides of the suspended pads (10) are fixedly connected with shock-absorbing pads (11).

4. The circuit board with a highly flexible heat dissipation structure according to claim 1, characterized in that: The locking mechanism comprises a threaded hole (12) formed on the heat collecting plate (2), the threaded hole (12) being in communication with the slot (4), and a locking bolt (13) being threadedly sleeved within the threaded hole (12).

5. The circuit board with a highly flexible heat dissipation structure according to claim 1, characterized in that: The vertical side wall of the heat collecting plate (2) is provided with a plurality of air holes (14), and the air holes (14) are located below the slots (4).

6. The circuit board with a highly flexible heat dissipation structure according to claim 3, characterized in that: A plurality of semicircular protrusions (15) are fixedly connected to the vertical side walls of the circuit board body (1), and the semicircular protrusions (15) are integrally formed with the circuit board body (1).

7. The circuit board with a highly flexible heat dissipation structure according to claim 1, characterized in that: Two sliding blocks (16) are symmetrically fixedly connected in the slot (4), and two sliding grooves (17) matching the sliding blocks (16) are symmetrically provided on the vertical side wall of the adjustable heat dissipation plate (5).

8. The circuit board with a highly flexible heat dissipation structure according to claim 2, characterized in that: The specific material of the separation gasket (9) is rubber.

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