Circuit board with good anti-bending performance

Abstract

The utility model relates to the technical field of circuit boards, and discloses a circuit board with good anti-bending performance, which comprises a first solder mask layer and a second solder mask layer, the adjacent end faces of the first solder mask layer and the second solder mask layer are respectively provided with a first copper-clad foil pressing plate and a second copper-clad foil pressing plate; the surfaces of the first copper-clad foil pressing plate and the second copper-clad foil pressing plate are respectively and fixedly provided with a pressing plate reinforcing frame for resisting bending, the adjacent end surfaces of the first copper-clad foil pressing plate and the second copper-clad foil pressing plate are respectively provided with a first curing plate and a second curing plate for insulation, and the adjacent end surfaces of the first curing plate and the second curing plate are provided with a central substrate. According to the utility model, the crisscross distributed pressing plate reinforcing frames are arranged inside the central substrate, so that when the first copper-clad foil pressing plate and the second copper-clad foil pressing plate are transversely or longitudinally bent, the pressing plate reinforcing frames on the surface of the first copper-clad foil pressing plate or the second copper-clad foil pressing plate can be in contact with each other, thereby enhancing the strength of the central substrate and the whole body; and the anti-bending effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board with good anti-bending performance. Background Art

[0002] The circuit board is mainly composed of wires, pads, vias, corresponding insulating layers, etc. The types of circuit boards include: ceramic circuit boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, ultra-thin circuit boards, etc. The circuit board centralizes the circuit functions, facilitates mass production, and plays an important role in optimizing the layout of electrical devices.

[0003] The existing circuit boards basically do not have the performance of anti-bending. However, during the installation process of the existing circuit boards, some of them need to be pushed. When the circuit boards are inserted into the predetermined slots, the circuit boards are shaken and pushed horizontally or vertically. Since the circuit boards are repeatedly squeezed horizontally or vertically, the internal substrate of the circuit boards may be damaged. At this time, when the circuit boards are squeezed, they may bend. The existing circuit boards are prone to bending when subjected to horizontal or vertical forces. Utility Model Content

[0004] The purpose of the utility model is to provide a circuit board with good anti-bending performance to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a circuit board with good anti-bending performance, comprising a first solder resist layer and a second solder resist layer, the adjacent end surfaces of the first solder resist layer and the second solder resist layer are respectively provided with a first copper-clad foil pressing plate and a second copper-clad foil pressing plate, the surfaces of the first copper-clad foil pressing plate and the second copper-clad foil pressing plate are fixed with a pressing plate reinforcement frame for anti-bending, the adjacent end surfaces of the first copper-clad foil pressing plate and the second copper-clad foil pressing plate are respectively provided with a first curing plate and a second curing plate for insulation, and the adjacent end surfaces of the first curing plate and the second curing plate are provided with a central substrate.

[0006] Preferably, corresponding through holes are opened on the outside of the first solder resist layer, the first copper foil pressing plate, the central substrate, the second copper foil pressing plate, the first curing plate, the second curing plate and the second solder resist layer, through holes are arranged in the through holes, and buried holes are opened on the outside of the first copper foil pressing plate, the central substrate, the second copper foil pressing plate, the first curing plate and the second curing plate, and buried hole welding tubes are arranged in the buried holes.

[0007] Preferably, outer copper foil circuits are provided on the surfaces of the first solder resist layer and the second solder resist layer.

[0008] Preferably, the outer portion of the pressing plate reinforcement frame is rectangular, and the center of the pressing plate reinforcement frame is a through hole.

[0009] Preferably, the press plate reinforcement frames are arranged in parallel on the surface of the first copper-clad press plate or the second copper-clad press plate, and the press plate reinforcement frames on the first copper-clad press plate and the press plate reinforcement frames on the second copper-clad press plate form a "cross" shape.

[0010] Preferably, the outer wall of the press plate reinforcement frame is provided with uniformly distributed cuts, and a first inner copper foil circuit is arranged in the cuts of the press plate reinforcement frame, and the first inner copper foil circuit is attached to the surface of the first copper-clad press plate.

[0011] Preferably, uniformly distributed semi-cured particles are arranged on the adjacent end faces of the first copper-clad press plate and the second copper-clad press plate. The outer part of the semi-cured particles is hemispherical, and the semi-cured particles are made of resin.

[0012] Preferably, it further includes a third copper-clad press plate. There are two third copper-clad press plates in total. The central substrate, the first curing plate and the second curing plate are arranged between the two third copper-clad press plates. A first solder mask layer and a second solder mask layer are respectively arranged outside the two third copper-clad press plates. Uniformly distributed "C"-shaped cuts are formed on the surface of the third copper-clad press plate, and rectangular reinforcement pieces are formed in the "C"-shaped cuts.

[0013] Preferably, triangular prism-shaped reinforcement seats are respectively arranged on the first curing plate and the second curing plate. The reinforcement seats correspond to the positions of the reinforcement pieces on the third copper-clad press plate. The reinforcement seats are used to change the shape of the reinforcement pieces so that the reinforcement pieces form a bent shape, increasing the anti-bending strength.

[0014] Preferably, the reinforcement pieces on the side close to the second curing plate and the reinforcement pieces on the side close to the first curing plate form a "cross" shape.

[0015] Compared with the prior art, the beneficial effects of the present utility model are:

[0016] Firstly, the present utility model is internally provided with press plate reinforcement frames distributed in a "cross" shape. The overall anti-bending effect in the horizontal and vertical directions is improved through the press plate reinforcement frames. When the first copper-clad press plate and the second copper-clad press plate are bent horizontally or vertically, the press plate reinforcement frames on the surface of the first copper-clad press plate or the second copper-clad press plate will be in contact with each other, so as to increase the strength of the central substrate and the whole, and improve the anti-bending effect.

[0017] Second, in the present utility model, by providing uniformly distributed "C"-shaped cuts on the surface of the third copper-clad press plate and forming rectangular reinforcement pieces within the cuts, the overall rigidity and stability of the press plate can be effectively improved, bending deformation caused by factors such as temperature changes and mechanical vibrations can be reduced, thereby improving the quality and reliability of the product. At the same time, since the reinforcement pieces are of rectangular structure, they can better adapt to press plates of different sizes and shapes, having a wider scope of application. In addition, by arranging a central substrate, a first curing plate, and a second curing plate between two third copper-clad press plates, the overall strength and stability of the press plate can be further improved, enhancing the load-bearing capacity and service life of the press plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic view of the overall structure of the present utility model Figure 1 ;

[0019] Figure 2 is a schematic view of the overall structure of the present utility model Figure 2 ;

[0020] Figure 3 is Figure 1 the enlarged schematic view of part A in

[0021] Figure 4 is the side view of the third copper-clad press plate;

[0022] Figure 5 is the schematic view of the reinforcement piece structure;

[0023] Figure 6 is the schematic view of the reinforcement seat structure.

[0024] In the figure: 1, the first solder mask layer; 2, the outer copper foil circuit; 3, the via welding tube; 4, the first copper-clad press plate; 5, the press plate reinforcement frame; 6, the buried via welding tube; 7, the central substrate; 8, the second copper-clad press plate; 9, the first inner copper foil circuit; 10, the second solder mask layer; 11, the second inner copper foil circuit; 12, the semi-cured pellet; 13, the first curing plate; 14, the second curing plate; 15, the third copper-clad press plate; 16, the reinforcement piece; 17, the reinforcement seat. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0026] Please refer to Figure 1 - Figure 3, which shows the first embodiment of the utility model, a circuit board with good anti-bending performance, in this embodiment, including a first solder resist layer 1 and a second solder resist layer 10, the first solder resist layer 1 and the second solder resist layer 10 mainly function to protect the circuit to prevent it from being damaged during welding or normal use, the adjacent end surfaces of the first solder resist layer 1 and the second solder resist layer 10 are respectively provided with a first copper-clad pressure plate 4 and a second copper-clad pressure plate 8, the first copper-clad pressure plate 4 and the second copper-clad pressure plate 8 are mainly used to connect the circuit so that the current can flow smoothly, the surfaces of the first copper-clad pressure plate 4 and the second copper-clad pressure plate 8 are fixed with a pressure plate reinforcement frame 5 for anti-bending, and the pressure plate reinforcement frame 5 is fixed on the surfaces of the first copper-clad pressure plate 4 and the second copper-clad pressure plate 8. The main function of the plate reinforcement frame 5 is to enhance the anti-bending ability of the circuit board to prevent damage due to bending during use. The adjacent end faces of the first copper-clad plate 4 and the second copper-clad plate 8 are respectively provided with the first curing plate 13 and the second curing plate 14 for insulation. The adjacent end faces of the first curing plate 13 and the second curing plate 14 are provided with the central substrate 7. The adjacent end faces of the first copper-clad plate 4 and the second copper-clad plate 8 are respectively provided with the first curing plate 13 and the second curing plate 14 for insulation. Prevent short circuits between circuits and ensure the normal operation of the circuits.

[0027] As a further improvement of this embodiment, the first solder resist layer 1, the first copper clad foil pressing plate 4, the central substrate 7, the second copper clad foil pressing plate 8, the first curing plate 13, the second curing plate 14 and the second solder resist layer 10 are provided with through holes corresponding to the positions on the outside, and a through-hole welding tube 3 is arranged in the through hole, and the first copper clad foil pressing plate 4, the central substrate 7, the second copper clad foil pressing plate 8, the first curing plate 13 and the second curing plate 14 are provided with buried holes corresponding to the positions on the outside, and a buried hole welding tube 6 is arranged in the buried hole.

[0028] Through-hole welding tubes are arranged at corresponding positions of the first solder resist layer 1, the first copper-clad platen 4, the central substrate 7, the second copper-clad platen 8, the first curing plate 13, the second curing plate 14 and the second solder resist layer 10. These through holes can realize electrical connection between the layers and enhance the conductive performance of the circuit board. At the same time, the arrangement of through holes is also conducive to heat dissipation, which can improve the heat dissipation performance and service life of the circuit board.

[0029] The buried hole welding tube 6 is arranged in the corresponding buried holes of the first copper-clad platen 4, the central substrate 7, the second copper-clad platen 8, the first curing plate 13, and the second curing plate 14. These buried holes can enhance the mechanical strength and stability of the circuit board, and improve the durability and reliability of the circuit board. At the same time, the arrangement of the buried holes can also reduce the volume and weight of the circuit board, which is conducive to the thinness and miniaturization design of the circuit board.

[0030] As a further improvement of the present embodiment, the surfaces of the first solder resist layer 1 and the second solder resist layer 10 are both provided with an outer copper foil circuit 2, and the outer copper foil circuit 2 is used for current transmission.

[0031] As a further improvement of this embodiment, the outer shape of the plate reinforcement frame 5 is rectangular, and the center of the plate reinforcement frame 5 is a through hole. The outer shape of the plate reinforcement frame 5 is rectangular. This design not only increases the stability of the structure, but also makes it easier to process and install. In addition, a through hole is provided in the center of the plate reinforcement frame 5, which not only reduces the overall weight, but also allows the circuit to pass through conveniently, thereby further improving its practicality.

[0032] As a further improvement of the present embodiment, the platen reinforcement frame 5 is arranged in parallel and distributed on the surface of the first copper-clad platen 4 or the second copper-clad platen 8, and the platen reinforcement frame 5 on the first copper-clad platen 4 and the platen reinforcement frame 5 on the second copper-clad platen 8 form a "cross" shape. The platen reinforcement frame 5 on the first copper-clad platen 4 and the platen reinforcement frame 5 on the second copper-clad platen 8 form a "cross" shape, which increases the anti-bending effect in the horizontal or vertical direction.

[0033] As a further improvement of the present embodiment, the outer wall of the platen reinforcement frame 5 is provided with evenly distributed cutouts, and the first inner copper foil circuit 9 and the second inner copper foil circuit 11 are arranged in the cutouts of the platen reinforcement frame 5, the first inner copper foil circuit 9 is attached to the surface of the first copper foil clad platen 4, and the second inner copper foil circuit 11 is attached to the surface of the second copper foil clad platen 8, and the platen reinforcement frame 5 has evenly distributed cutouts, and the first inner copper foil circuit 9 is arranged in the cutouts. This design can enhance the structural strength of the platen reinforcement frame 5 and improve its conductive performance. At the same time, the first inner copper foil circuit 9 is attached to the surface of the first copper foil clad platen 4, which can further enhance the stability of the circuit and improve the reliability and service life of the product. It is very beneficial for electronic equipment that requires high strength and conductive performance, and can improve the working efficiency and stability of the equipment and reduce failures and maintenance costs.

[0034] As a further improvement of the present embodiment, the adjacent end surfaces of the first copper-clad platen 4 and the second copper-clad platen 8 are provided with uniformly distributed semi-cured particles 12, the outer surface of the semi-cured particles 12 is hemispherical, and the semi-cured particles 12 are made of resin. The addition of semi-cured particles between the first copper-clad platen 4 and the second copper-clad platen 8 can enhance their structural stability. Such semi-cured particles are made of resin material, so that the outer surface is hemispherical and uniformly distributed on the adjacent end surfaces, which can effectively disperse the pressure and improve the bending resistance and impact resistance of the platen.

[0035] See also Figure 4 - Figure 6, which shows the second embodiment of a circuit board with good anti-bending performance of the present utility model. This embodiment has a similar structure to the first embodiment, including two third copper-clad pressing plates 15. The central substrate 7, the first curing plate 13, and the second curing plate 14 are arranged between the two third copper-clad pressing plates 15. A first solder mask layer 1 and a second solder mask layer 10 are respectively arranged outside the two third copper-clad pressing plates 15. The surface of the third copper-clad pressing plate 15 is provided with evenly distributed "匚"-shaped cuts, and rectangular reinforcing pieces 16 are formed within the "匚"-shaped cuts. By providing evenly distributed "匚"-shaped cuts on the surface of the third copper-clad pressing plate 15 and forming rectangular reinforcing pieces 16 within the "匚"-shaped cuts, the overall rigidity and stability of the pressing plate can be effectively improved, reducing bending deformation caused by factors such as temperature changes and mechanical vibrations, thereby improving the quality and reliability of the product. At the same time, since the reinforcing piece 16 is a rectangular structure, it can better adapt to pressing plates of different sizes and shapes, having a wider range of applications.

[0036] In addition, by arranging the central substrate 7, the first curing plate 13, and the second curing plate 14 between the two third copper-clad pressing plates 15, the overall strength and stability of the pressing plate can be further improved, enhancing the load-bearing capacity and service life of the pressing plate. At the same time, the setting of the first solder mask layer 1 and the second solder mask layer 10 can effectively prevent problems such as solder overflow and short circuits during welding, improving the reliability and safety of the product.

[0037] This embodiment has the advantages of simple structure, good rigidity, high stability, wide range of applications, etc., and can be widely applied to various electronic devices and components that require high strength and stability.

[0038] As a further improvement of this embodiment, triangular prism-shaped reinforcing seats 17 are respectively arranged on the first curing plate 13 and the second curing plate 14. The reinforcing seats 17 correspond to the positions of the reinforcing pieces 16 on the third copper-clad pressing plate 15. The reinforcing seats 17 are used to change the shape of the reinforcing pieces 16 so that the reinforcing pieces 16 form a bent shape, increasing the anti-bending strength;

[0039] By arranging the reinforcing seats 17 on the first curing plate 13 and the second curing plate 14 and making the reinforcing seats 17 correspond to the positions of the reinforcing pieces 16 on the third copper-clad pressing plate 15, the reinforcing seats 17 are used to change the shape of the reinforcing pieces 16 to increase the anti-bending strength. This improvement measure can enhance the strength and stability of the circuit board, improving its service life and reliability.

[0040] As a further improvement of this embodiment, the reinforcing sheet 16 near the second curing plate 14 forms a "cross" shape with the reinforcing sheet 16 near the first curing plate 13. By using the reinforcing sheet 16 in a "cross" shape, the load can be effectively dispersed, stress concentration can be reduced, and the fatigue life of the device can be improved, while the lateral and longitudinal anti-bending effects can be improved.

[0041] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A circuit board with good anti-bending performance, characterized in that: It includes a first solder mask layer (1) and a second solder mask layer (10). Adjacent end faces of the first solder mask layer (1) and the second solder mask layer (10) are respectively provided with a first copper-clad pressing plate (4) and a second copper-clad pressing plate (8). Pressing plate reinforcement frames (5) for anti-bending are fixed on the surfaces of the first copper-clad pressing plate (4) and the second copper-clad pressing plate (8). Adjacent end faces of the first copper-clad pressing plate (4) and the second copper-clad pressing plate (8) are respectively provided with a first curing plate (13) and a second curing plate (14) for insulation. A central substrate (7) is arranged at the adjacent end faces of the first curing plate (13) and the second curing plate (14).

2. A circuit board with good bending resistance according to claim 1, characterized in that: Through holes corresponding in position are formed outside the first solder mask layer (1), the first copper-clad pressing plate (4), the central substrate (7), the second copper-clad pressing plate (8), the first curing plate (13), the second curing plate (14) and the second solder mask layer (10). A via welding tube (3) is arranged in the through holes. Buried holes corresponding in position are formed outside the first copper-clad pressing plate (4), the central substrate (7), the second copper-clad pressing plate (8), the first curing plate (13) and the second curing plate (14). A buried hole welding tube (6) is arranged in the buried holes.

3. A circuit board with good bending resistance according to claim 2, characterized in that: Outer copper foil lines (2) are arranged on the surfaces of the first solder mask layer (1) and the second solder mask layer (10).

4. A circuit board with good bending resistance according to claim 1, characterized in that: The outside of the pressing plate reinforcement frame (5) is rectangular, and the center of the pressing plate reinforcement frame (5) is a through hole.

5. A circuit board with good bending resistance according to claim 3, characterized in that: The pressing plate reinforcement frames (5) are arranged in parallel on the surface of the first copper-clad pressing plate (4) or the second copper-clad pressing plate (8). The pressing plate reinforcement frames (5) on the first copper-clad pressing plate (4) and the pressing plate reinforcement frames (5) on the second copper-clad pressing plate (8) form a "cross" shape.

6. A circuit board with good bending resistance according to claim 1, characterized in that: Uniformly distributed cuts are formed on the outer wall of the pressing plate reinforcement frame (5). A first inner copper foil line (9) is arranged in the cuts of the pressing plate reinforcement frame (5). The first inner copper foil line (9) is attached to the surface of the first copper-clad pressing plate (4).

7. A circuit board with good bending resistance according to claim 1, characterized in that: Uniformly distributed semi-cured particles (12) are arranged at the adjacent end faces of the first copper-clad pressing plate (4) and the second copper-clad pressing plate (8). The outside of the semi-cured particles (12) is hemispherical, and the semi-cured particles (12) are made of resin.

8. A circuit board with good bending resistance according to claim 1, characterized in that: It further includes two third copper-clad pressing plates (15). The central substrate (7), the first curing plate (13) and the second curing plate (14) are arranged between the two third copper-clad pressing plates (15). The first solder mask layer (1) and the second solder mask layer (10) are respectively arranged outside the two third copper-clad pressing plates (15). Uniformly distributed "C"-shaped cuts are formed on the surfaces of the third copper-clad pressing plates (15). Reinforcement pieces (16) in a rectangular shape are formed in the "C"-shaped cuts.

9. A circuit board with good bending resistance according to claim 8, characterized in that: A triangular prism-shaped reinforcement seat (17) is provided on the first curing plate (13) and the second curing plate (14), respectively. The reinforcement seat (17) corresponds to the position of the reinforcement sheet (16) on the third copper-clad foil pressing plate (15). The reinforcement seat (17) is used to change the shape of the reinforcement sheet (16) so that the reinforcement sheet (16) forms a bent shape, thereby increasing the bending strength.

10. A circuit board with good bending resistance according to claim 9, characterized in that: The reinforcing sheet (16) on the side close to the second curing plate (14) and the reinforcing sheet (16) on the side close to the first curing plate (13) form a "cross" shape.

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