Circuit board structure based on eMMC device lead-out wiring

Abstract

The utility model discloses a circuit board structure based on eMMC device lead-out wiring, which comprises a circuit board, device bonding pads and through holes, the device bonding pads are arranged on the circuit board in a ring shape and are connected with pins of an eMMC device, the device bonding pads comprise signal bonding pads and empty grid bonding pads, and the signal bonding pads and the empty grid bonding pads are arranged on the circuit board. And the signal bonding pad is adjacent to the empty grid bonding pad, so that a signal line of the signal bonding pad positioned on the inner ring is led out through the empty grid bonding pad and is connected with the through hole. According to the eMMC device, the empty network bonding pad is utilized, so that the signal line of the signal bonding pad located at the inner ring can be smoothly led out and connected with the through hole, high-efficiency signal transmission of the eMMC device is realized, the signal can be quickly and accurately transmitted to other parts of the circuit board from the eMMC device, the signal transmission efficiency of the eMMC device is optimized, and the reliability of the eMMC device is improved. And the production cost and the production time are obviously reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and more specifically to a circuit board structure based on eMMC device lead-out wiring. Background Art

[0002] Printed Circuit Board (PCB), also known as PCB, is an important part of the physical support and signal transmission of electronic products. As electronic devices become increasingly complex and powerful, the importance of PCB is self-evident. It not only carries electronic components, but also realizes the connection of circuits and the transmission of signals, so that electronic products can operate normally and stably.

[0003] With the continuous development of electronic technology, storage devices are increasingly used, especially eMMC storage devices. eMMC (Embedded Multi Media Card) devices are short for embedded multimedia controllers, which integrate embedded storage solutions, including MMC (Multimedia Card) interfaces, flash memory devices, and host controllers. This highly integrated storage device has won wide recognition in the market for its excellent performance and stability.

[0004] However, the adoption of eMMC storage devices also brings considerable challenges to circuit board design. Due to the use of small BGA packages, the chip's device pads are only 0.2mm away from the edge of the pad. This tiny distance makes wiring on the circuit board extremely difficult. According to the current market processing capabilities, it is impossible to route between the two chip pins, which exceeds the processing capabilities of the circuit board factory.

[0005] In order to solve the problem that two chip pins cannot be routed, the current design usually adopts the design of drilling holes on the device plate or using blind buried hole design. Although these two technologies can solve the problem to a certain extent, the process is difficult and requires special processing technology during production. This will not only increase production time, but also increase production costs, which is not conducive to the competitiveness of products. Utility Model Content

[0006] In order to overcome the problem that wiring cannot be routed between two pins of an eMMC storage device, the existing method is to punch a hole in the device disk or use a blind buried via design to achieve wiring. However, the hole in the disk or the blind buried via design has a relatively difficult process, a long production time, and a high production cost. The utility model provides a circuit board structure based on the eMMC device lead-out wiring.

[0007] The technical solution of the utility model is as follows:

[0008] A circuit board structure based on eMMC device lead-out routing comprises a circuit board, a device pad located on the circuit board, and a through hole, wherein the device pad is arranged in a circle on the circuit board and the device pad is connected to the pin of the eMMC device, the device pad comprises a signal pad and an empty grid pad, the signal pad is adjacent to the empty grid pad, so that the signal line of the signal pad located in the inner circle is led out through the empty grid pad and connected to the through hole.

[0009] According to the above-mentioned solution of the utility model, a through-hole pad is arranged outside the through-hole, and a signal line of the signal pad is led out from the empty grid pad and then connected to the through-hole pad.

[0010] According to the above solution of the utility model, the distance between the device pad and the through-hole pad is greater than 0.15 mm.

[0011] According to the above-mentioned solution of the utility model, the distance between the through-hole pads is greater than 0.2 mm.

[0012] According to the above solution of the utility model, the diameter of the through hole is 0.3 mm.

[0013] According to the above solution of the utility model, the spacing between the signal line and the adjacent through-hole pad is greater than 0.1 mm.

[0014] According to the above solution of the utility model, the line width of the signal line is 0.15 mm.

[0015] According to the above solution of the utility model, the spacing between the signal line and the adjacent device pad is greater than 0.1 mm.

[0016] According to the above scheme of the utility model, the device pad also includes a power pad, which is adjacent to the empty grid pad so that the power line of the power pad located in the inner circle is led out through the empty grid pad and connected to the through hole, and the line width of the power line is 0.3mm.

[0017] According to the above scheme of the utility model, the device pad also includes a GND pad, which is adjacent to the empty grid pad so that the GND line of the GND pad located in the inner circle is led out through the empty grid pad and connected to the through hole, and the line width of the GND line is 0.3mm.

[0018] The utility model according to the above scheme has the beneficial effect that the utility model utilizes empty network pads, so that the signal lines of the signal pads located in the inner circle can be smoothly led out and connected to the through holes, thereby realizing efficient signal transmission of the eMMC device. The signal can be quickly and accurately transmitted from the eMMC device to other parts of the circuit board, which not only optimizes the signal transmission efficiency of the eMMC device, but also significantly reduces the production cost and production time. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of the utility model;

[0020] Figure 2 for Figure 1 Schematic diagram of the enlarged structure of part A.

[0021] In the figure, the various reference numerals are as follows: 1, circuit board; 11, device pad; 111, signal pad; 112, empty grid pad; 113, signal line; 12, through hole; 13, through hole pad. DETAILED DESCRIPTION

[0022] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0023] It should be noted that the terms "including" and "having" and any variations thereof in the specification and claims of the present utility model are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices. Terms such as "setting" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral body; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "back", "bottom", etc. are based on the directions or positions shown in the drawings, which are only for the convenience of description and cannot be understood as limitations on the present technical solution.

[0024] It should be noted that in order to solve the problem that two chip pins cannot be routed, the current design usually adopts the design of drilling holes on the device plate or using blind buried hole design. Although these two technologies can solve the problem to a certain extent, the process is difficult and requires special processing technology during production. Not only does it increase the difficulty and cost of production, it may also affect the overall performance and stability of the circuit board, which is not conducive to the competitiveness of the product.

[0025] like Figure 1-Figure 2 As shown, a circuit board 1 structure based on the lead-out routing of the eMMC device utilizes an empty network pad so that the signal line 113 of the signal pad 111 located in the inner circle can be smoothly led out and connected to the through hole 12, thereby realizing efficient signal transmission of the eMMC device. This not only optimizes the signal transmission efficiency of the eMMC device, but also significantly reduces the production cost and improves the market competitiveness of the product.

[0026] Specifically, a circuit board 1 structure based on eMMC device lead-out routing includes a circuit board 1, a device pad 11 located on the circuit board 1, and a through hole 12. The device pad 11 is arranged in a circle on the circuit board 1 and the device pad 11 is connected to the pin of the eMMC device. The device pad 11 includes a signal pad 111 and an empty grid pad 112. The signal pad 111 is adjacent to the empty grid pad 112, so that the signal line 113 of the signal pad 111 located in the inner circle is led out through the empty grid pad 112 and connected to the through hole 12.

[0027] The signal pad 111 of the inner circle can lead out the signal line 113 by using the empty network pad, and the signal line 113 is connected to the through hole 12 after being led out to realize the signal transmission of the eMMC device. In this way, the signal can be quickly and accurately transmitted from the eMMC device to other parts of the circuit board 1, ensuring the stability and reliability of the entire system. At the same time, since there is no need to use the via in the plate and blind buried via technology, the production process is simplified, the production time is greatly shortened, and the processing cost is significantly reduced.

[0028] In addition, the circuit board 1 structure based on the eMMC device is also highly flexible and scalable. By adjusting the pad layout and the position of the through hole 12, it can adapt to eMMC devices of different models and specifications and meet the needs of different application scenarios.

[0029] In one embodiment, a through hole 12 pad is provided outside the through hole 12, and the signal line 113 of the signal pad 111 is connected to the through hole 12 pad after being led out from the empty grid pad 112. The signal line 113 of the signal pad 111 can be more stably connected to the through hole 12 pad after being led out. The presence of the through hole 12 pad not only enhances the stability of signal transmission, but also improves the reliability of the entire circuit board 1 structure.

[0030] The spacing between the device pad 11 and the through hole pad 12 is greater than 0.15 mm. Such a design not only ensures the reliability of welding, but also avoids the short circuit problem that may be caused by too small a spacing.

[0031] The spacing between the through hole 12 pads is greater than 0.2 mm, and the spacing greater than 0.2 mm ensures the independence between the through hole 12 pads and prevents signal interference and crossover. Such a design makes the entire circuit board 1 structure clearer and more accurate in signal transmission.

[0032] The diameter of the through hole 12 is 0.3 mm, which not only ensures the efficiency of signal transmission, but also takes into account the difficulty and cost of processing. Such a diameter of the through hole 12 can simplify the manufacturing process as much as possible and reduce costs without sacrificing signal transmission performance.

[0033] In order to ensure stable transmission of the signal line 113 on the circuit board 1 and avoid potential interference and short circuit problems, the spacing between the signal line 113 and the adjacent through-hole 12 pad is greater than 0.1 mm, thereby ensuring the independence and stability of the signal line 113 during transmission, so that the signal can reach the target position accurately and quickly.

[0034] The signal line 113 has a line width of 0.15 mm, which can ensure sufficient stability and clarity of the signal during transmission and reduce signal attenuation and distortion. On the other hand, such a line width can also minimize the space occupied by the circuit board 1 while ensuring signal quality, thereby improving the compactness of the layout.

[0035] The spacing between the signal line 113 and the adjacent device pad 11 is greater than 0.1 mm. This spacing setting can avoid accidental contact or short circuit between the signal line 113 and the device pad 11. When the spacing is too small, a slight error in the welding process or a slight deformation of the circuit board 1 during use may cause contact between the signal line 113 and the pad, thereby affecting the transmission of the signal and the normal operation of the circuit board 1. Therefore, by setting a spacing greater than 0.1 mm, this problem can be effectively avoided and the reliability and stability of the circuit board 1 can be improved.

[0036] In one embodiment, the device pad 11 also includes a power pad, which is adjacent to the empty grid pad 112, so that the power line of the power pad located in the inner circle is led out through the empty grid pad 112 and connected to the through hole 12, and the line width of the power line is 0.3mm. This layout not only optimizes the routing of the power line, but also improves the reliability of the power connection, ensuring that the circuit board 1 can stably obtain the required operating voltage. The line width of 0.3mm can ensure that the power line has sufficient capacity when transmitting current, reduce resistance and voltage drop, and ensure a stable supply of power.

[0037] In one embodiment, the device pad 11 also includes a GND pad, and the GND pad is adjacent to the empty grid pad 112, so that the GND line of the GND pad located in the inner circle is led out through the empty grid pad 112 and connected to the through hole 12, and the line width of the GND line is 0.3mm. Not only does it optimize the layout of the ground line, but it also improves the efficiency of the ground line connection, helps to reduce the ground line impedance, and improves the stability of the circuit. The line width of 0.3mm can ensure that the ground line has sufficient carrying capacity when transmitting large currents, reduce resistance and voltage drop, and thus ensure the stability and reliability of the circuit.

[0038] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

[0039] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A circuit board structure based on eMMC device lead-out wiring, characterized in that: It includes a circuit board, device pads located on the circuit board, and through holes, wherein the device pads are arranged in a circle on the circuit board and the device pads are connected to the pins of the eMMC device, the device pads include signal pads and empty grid pads, and the signal pads are adjacent to the empty grid pads, so that the signal lines of the signal pads located in the inner circle are led out through the empty grid pads and connected to the through holes.

2. A circuit board structure based on eMMC device lead-out wiring according to claim 1, characterized in that, A through hole pad is arranged outside the through hole, and a signal line of the signal pad is led out from the empty grid pad and then connected to the through hole pad.

3. A circuit board structure based on eMMC device lead-out wiring according to claim 2, characterized in that, The spacing between the device pad and the through-hole pad is greater than 0.15 mm.

4. A circuit board structure based on eMMC device lead-out wiring according to claim 3, characterized in that, The spacing between the through hole pads is greater than 0.2 mm.

5. A circuit board structure based on eMMC device lead-out wiring according to any one of claims 2 to 4, characterized in that: The diameter of the through hole is 0.3 mm.

6. A circuit board structure based on eMMC device lead-out wiring according to claim 5, characterized in that: The spacing between the signal line and the adjacent through-hole pad is greater than 0.1 mm.

7. A circuit board structure based on eMMC device lead-out wiring according to claim 1, characterized in that: The signal line has a line width of 0.15 mm.

8. A circuit board structure based on eMMC device lead-out wiring according to claim 7, characterized in that: The spacing between the signal line and the adjacent device pad is greater than 0.1 mm.

9. A circuit board structure based on eMMC device lead-out wiring according to claim 1, characterized in that: The device pads also include a power pad, which is adjacent to the empty grid pad so that a power line of the power pad located in the inner circle is led out through the empty grid pad and connected to the through hole, and the line width of the power line is 0.3 mm.

10. A circuit board structure based on eMMC device lead-out wiring according to claim 1 or 9, characterized in that: The device pads also include a GND pad, which is adjacent to the empty grid pad so that a GND line of the GND pad located in the inner circle is led out through the empty grid pad and connected to the through hole, and the line width of the GND line is 0.3 mm.

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