Metal shell of integrated circuit device

Abstract

The utility model relates to the technical field of integrated circuits, and discloses a metal shell of an integrated circuit device, which comprises a bottom shell and a top shell, the integrated circuit device is arranged in the bottom shell, two ends of the inner side of the bottom shell are provided with through holes, pins of the integrated circuit device penetrate through the through holes, the lower end of the inner side of the bottom shell is provided with a groove, and the bottom shell is provided with a through hole. The inner side of the bottom shell is fixedly connected with heat conduction plates, and the side walls, corresponding to the grooves, between the heat conduction plates are fixedly connected with guide blocks. According to the novel metal shell applied to the integrated circuit device, by arranging the clamping plates, when the top shell is disassembled upwards, the top shell drives the clamping plates to move upwards, the clamping plates are clamped on the two sides of the lower end of the integrated circuit device through the grooves, and after the top shell continuously moves upwards, the clamping plates drive the integrated circuit device to stably move upwards to pull out pins from the penetrating holes; the effect of conveniently disassembling the integrated circuit device is achieved, and the pins are prevented from being damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to a metal shell of an integrated circuit device. Background Art

[0002] Integrated circuit devices are made by interconnecting the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit on a small piece or several small pieces of semiconductor chips or dielectric substrates. The outside of the integrated circuit device needs to be protected by a metal casing.

[0003] After checking the public announcement number: CN217768348U, a metal packaging shell of an integrated circuit device is disclosed; the top shell and the bottom shell are sleeved together, and the top shell is fixed horizontally from the outside with bolts to achieve the connection effect.

[0004] However, the integrated circuit device is installed in the bottom shell and the top shell, and the pins of the integrated circuit device are inserted into the bottom shell. When the integrated circuit device needs to be repaired, it is difficult to pull the integrated circuit device out of the bottom shell smoothly because the pins are straight up and down and it is difficult to pull it out upward in a balanced manner when taking it out, which can easily damage the pins.

[0005] In order to solve the above problems, the present application proposes a metal housing for an integrated circuit device. Utility Model Content

[0006] In view of the deficiencies of the prior art, the utility model provides a metal housing for an integrated circuit device to at least solve one of the problems raised by the background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a metal shell of an integrated circuit device, comprising a bottom shell and a top shell, wherein an integrated circuit device is placed in the bottom shell, through holes are provided at both ends of the inner side of the bottom shell, and pins of the integrated circuit device are arranged through the through holes, a groove is provided at the lower end of the inner side of the bottom shell, and the grooves are symmetrically arranged, a heat conducting plate is fixedly connected to the inner side of the bottom shell, and guide blocks are fixedly connected to the side walls of the grooves corresponding to the heat conducting plates, a card board is fixedly connected to the inner side of the lower end of the top shell, and the lower end of the card board is arranged in the groove and matched with the lower end of the integrated circuit device, and a fixing piece is arranged between the bottom shell and the top shell.

[0008] A further technical improvement of the utility model is that the fixing part includes a fixing seat fixed at the lower end of the bottom shell, the upper end of the fixing seat is fixedly connected to a fixing rod, both sides of the top shell are fixedly connected to a clamping plate, the clamping plate is matched with the fixing rod, and a fixing button is threadedly connected to the fixing rod located at the upper end of the clamping plate.

[0009] A further technical improvement of the utility model is that the inner side of the heat conducting plate is matched with the peripheral side of the integrated circuit device, and a heat dissipation plate is fixed to the heat conducting plate, and the heat dissipation plate passes through the peripheral side of the bottom shell and is arranged on the outer side of the bottom shell.

[0010] A further technical improvement of the utility model is that a sealing strip is fixedly connected to the upper end surface of the bottom shell, and the interior of the sealing strip is hollow.

[0011] A further technical improvement of the utility model is that an inclined opening is provided at the inner side end of the upper end of the heat conducting plate.

[0012] A further technical improvement of the utility model is that the through holes provided on the integrated circuit device and the heat conducting plate are arranged in a staggered distribution.

[0013] The present invention provides a metal housing for an integrated circuit device, which has the following beneficial effects:

[0014] This new type of metal shell used for integrated circuit devices is provided with a card plate. When the top shell is disassembled upward, the card plate is driven upward by the top shell, and the card plate is clamped on both sides of the lower end of the integrated circuit device through the groove. After the top shell continues to move upward, the card plate drives the integrated circuit device to move upward smoothly to pull the pins out of the perforations, thereby achieving the effect of facilitating the disassembly of the integrated circuit device and avoiding damage to the pins. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention.

[0016] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the structure of the bottom shell, integrated circuit device and top shell of the utility model;

[0018] Figure 3 This is a schematic diagram of the guide block and the card plate structure of the utility model;

[0019] Figure 4 This is a schematic diagram of the structure of the heat conducting plate and the heat dissipating plate of the utility model.

[0020] In the figure: 1, bottom shell; 2, top shell; 3, integrated circuit device; 4, fixing seat; 5, clamping plate; 6, fixing rod; 7, fixing button; 8, groove; 9, heat conduction plate; 10, heat sink; 11, sealing strip; 12, perforation; 13, guide block; 14, clamping plate. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4 A metal shell of an integrated circuit device comprises a bottom shell 1 and a top shell 2, wherein an integrated circuit device 3 is placed in the bottom shell 1, through holes 12 are provided at both ends of the inner side of the bottom shell 1, and pins of the integrated circuit device 3 are arranged through the through holes 12, a groove 8 is provided at the lower end of the inner side of the bottom shell 1, and the grooves 8 are symmetrically arranged, a heat conducting plate 9 is fixedly connected to the inner side of the bottom shell 1, and a guide block 13 is fixedly connected to the side wall of the groove 8 corresponding to the heat conducting plate 9, a card plate 14 is fixedly connected to the inner side of the lower end of the top shell 2, the lower end of the card plate 14 is located in the groove 8 and is matched with the lower end of the integrated circuit device 3, and a fixing member is arranged between the bottom shell 1 and the top shell 2.

[0023] Specific working principle and implementation method: The pins at the lower end of the integrated circuit device 3 are passed through the perforation 12, and then the peripheral side of the integrated circuit device 3 is located inside the heat conducting plate 9, and the heat conducting plate 9 limits the integrated circuit device 3 in the bottom shell 1, and then the top shell 2 is installed from the upper end of the bottom shell 1. After installation, the bottom shell 1 and the top shell 2 are fixed together by the fixing parts on both sides. The grooves 8 are symmetrically arranged at the lower end of the inner side of the bottom shell 1. When the top shell 2 is installed from the upper end of the bottom shell 1, the card plate 14 is inserted between the two heat conducting plates 9, and contacts with the guide block 13 when inserted. The guide block 13 clamps the card plate 14 at the lower end of the integrated circuit device 3, so that when the top shell 2 is disassembled upward When picking up, the integrated circuit device 3 will be brought upward from the inside of the bottom shell 1 through the card plate 14. The card plates 14 are distributed around the integrated circuit device 3, and can stably pull the integrated circuit device 3 upward, so that the integrated circuit device 3 can be easily disassembled and taken out; the advantage of such a design is that when the top shell 2 is disassembled upward, the card plate 14 is driven upward by the top shell 2, and the card plate 14 is stuck on both sides of the lower end of the integrated circuit device 3 through the groove 8. After the top shell 2 continues to move upward, the card plate 14 drives the integrated circuit device 3 to move upward smoothly to pull the pins out of the through holes 12, so as to achieve the effect of facilitating the disassembly of the integrated circuit device 3 and avoiding damage to the pins.

[0024] like Figure 2As shown, the fixing member includes a fixing seat 4 fixed to the lower end of the bottom shell 1, the upper end of the fixing seat 4 is fixedly connected to a fixing rod 6, and the two sides of the top shell 2 are fixedly connected to a clamping plate 5, the clamping plate 5 is matched with the fixing rod 6, and the fixing rod 6 at the upper end of the clamping plate 5 is threadedly connected with a fixing button 7; the fixing seat 4 is fixed to the two sides of the lower end of the bottom shell 1, and a fixing rod 6 is fixed to the upper end of the fixing seat 4, and the upper end of the fixing rod 6 is threadedly connected with a fixing button 7, when the top shell 2 is covered, the clamping plate 5 is sleeved from the upper end of the fixing rod 6, and then the fixing button 7 is threadedly connected to the upper end of the fixing rod 6 from the upper end of the clamping plate 5.

[0025] like Figure 4 As shown, the inner side of the heat conducting plate 9 is matched with the peripheral side of the integrated circuit device 3, and the heat conducting plate 9 is fixed with a heat sink 10, which passes through the peripheral side of the bottom shell 1 and is arranged on the outer side of the bottom shell 1; the heat conducting plate 9 is fixedly connected to the heat sink 10, and the heat sink 10 is arranged outside the bottom shell 1, and the heat generated by the integrated circuit device 3 is heat-conducted through the heat conducting plate 9, and the heat is conducted to the heat sink 10 through the heat conducting plate 9, and the heat is transferred to the outside through the heat sink 10.

[0026] like Figure 4 As shown, a sealing strip 11 is fixedly connected to the upper end surface of the bottom shell 1. The interior of the sealing strip 11 is hollow. The cross-section of the sealing strip 11 is circular. The sealing strip 11 is hollow. The sealing strip 11 is fixed to the upper end surface of the bottom shell 1 and deforms when pressed downward by the top shell 2, thereby achieving a sealing effect.

[0027] like Figure 4 As shown, an inclined opening is provided at the inner end of the upper end of the heat conducting plate 9. The inclined opening at the upper end of the heat conducting plate 9 is provided to center the position of the integrated circuit device 3 when placing the integrated circuit device 3, thereby making it more convenient to place the integrated circuit device 3.

[0028] like Figure 4 As shown, the pins at the lower end of the integrated circuit device 3 are staggered and distributed with the heat conducting plate 9, the pins are inserted into the through holes 12, and the pins are separated by the heat conducting plate 9. After separation, the temperature transfer between the pins can be reduced, and the temperature accumulation inside the bottom shell 1 can be reduced, and the heat can fully contact the surface of the heat conducting plate 9 to achieve temperature transfer and heat dissipation.

[0029] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A metal shell of an integrated circuit device, comprising a bottom shell (1) and a top shell (2), wherein an integrated circuit device (3) is placed in the bottom shell (1), through holes (12) are provided at both ends of the inner side of the bottom shell (1), and pins of the integrated circuit device (3) are arranged through the through holes (12), characterized in that: A groove (8) is provided at the lower inner end of the bottom shell (1), and the grooves (8) are symmetrically arranged. A heat conducting plate (9) is fixedly connected to the inner side of the bottom shell (1), and a guide block (13) is fixedly connected to the side wall of the groove (8) between the heat conducting plates (9). A card plate (14) is fixedly connected to the inner side of the lower end of the top shell (2), and the lower end of the card plate (14) is arranged in the groove (8) and matches the lower end of the integrated circuit device (3). A fixing member is arranged between the bottom shell (1) and the top shell (2).

2. The metal housing of an integrated circuit device according to claim 1, characterized in that: The fixing member comprises a fixing seat (4) fixed to the lower end of the bottom shell (1), the upper end of the fixing seat (4) is fixedly connected to a fixing rod (6), and the two sides of the top shell (2) are fixedly connected to a clamping plate (5), the clamping plate (5) and the fixing rod (6) are matched, and a fixing button (7) is threadedly connected to the fixing rod (6) located at the upper end of the clamping plate (5).

3. The metal housing of an integrated circuit device according to claim 1, characterized in that: The inner side of the heat conducting plate (9) is matched with the peripheral side of the integrated circuit device (3), and the heat conducting plate (9) is fixed with a heat dissipation plate (10). The heat dissipation plate (10) penetrates the peripheral side of the bottom shell (1) and is arranged on the outer side of the bottom shell (1).

4. The metal housing of an integrated circuit device according to claim 1, characterized in that: The upper end surface of the bottom shell (1) is fixedly connected with a sealing strip (11), and the interior of the sealing strip (11) is hollow.

5. The metal housing of an integrated circuit device according to claim 1, characterized in that: The inner end of the upper end of the heat conducting plate (9) is provided with an inclined opening.

6. The metal housing of an integrated circuit device according to claim 1, characterized in that: The through holes (12) provided on the integrated circuit device (3) and the heat conducting plate (9) are arranged in a staggered distribution.

Images