Packaging board capable of reducing rejection rate
By setting the main pad and the secondary pad on the packaging board and making the solder joints conductively connected one by one, the existing packaging board is solved, and the effect of reducing scrap rate and saving costs is achieved.
Patent Information
- Application Number
- CN202420234861.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-30
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-01-30
AI Technical Summary
The sensor components in existing COB packages are prone to damage to the pads during welding, resulting in scrapping of boards and components, and the scrapping costs are high and resource waste is serious.
A packaging board is designed, including conductive parts, packaging board body, main pad and sub-pad. The solder joints of the main pad and sub-pad are electrically connected one by one. The components are electrically connected to the main pad and sub-pad respectively through conductive parts. When the main pad and the solder joints of the components fail, the solder joints of the sub-pad are soldered.
Through this design, the scrap rate of the packaging board is reduced, material and production costs are saved, while resource waste is avoided.
Smart Images
Figure CN222638885U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of electronic device packaging, in particular to a packaging plate capable of reducing the scrap rate. Background Art
[0002] In the prior art, COB packaged sensor components are first fixed on the board with glue, and then the interface solder joints on the sensor are connected to the pads of the corresponding interfaces on the board through gold wires, thereby achieving electrical connection and conduction. The connection between the gold wires and the pads on the board is made by high-temperature needle welding, which can easily lead to damage to the pads. At this time, the board and the electronic components that have been soldered on the board need to be scrapped, which has a high scrapping cost and causes a waste of resources.
[0003] Therefore, it is urgent to propose a packaging board that can reduce the scrap rate. Utility Model Content
[0004] The utility model aims to overcome the shortcomings of the prior art and provide a packaging board which can reduce the scrap rate.
[0005] The purpose of this utility model is achieved through the following technical solutions:
[0006] A packaging board capable of reducing scrap rate comprises: a conductive member, a packaging board body, and a main pad and an auxiliary pad arranged on the packaging board body;
[0007] A component fixing area is arranged on the package board body, the auxiliary pad is arranged around the outer side of the component fixing area of the package board body, the main pad is arranged between the component fixing area and the auxiliary pad, a plurality of corresponding solder joints are arranged on the main pad and the auxiliary pad, and the corresponding solder joints are conductively connected one by one, and the components on the component fixing area are electrically connected to the main pad and the auxiliary pad respectively through the conductive member.
[0008] In one embodiment, the main pad and the auxiliary pad are respectively fixedly connected to the package board body, and the main pad and the auxiliary pad are detachably arranged.
[0009] In one embodiment, the size of the solder joint of the main pad is 0.1 mm*0.1 mm, and the size of the solder joint of the auxiliary pad is 0.12 mm*0.12 mm.
[0010] In one embodiment, the solder joints of the main solder pad and the auxiliary solder pad are evenly arranged on four sides of the component fixing area.
[0011] In one embodiment, the solder joints corresponding to the main solder pads and the auxiliary solder pads are arranged and distributed in a one-to-one correspondence.
[0012] In one embodiment, the distance between the main pad and the auxiliary pad is in the range of 1 mm to 2 mm.
[0013] In one embodiment, the distance between the main pad and the auxiliary pad is 1.2 mm.
[0014] In one embodiment, the conductive member is a conductive gold wire.
[0015] In one embodiment, the component fixing area is provided with a component adhesive.
[0016] In one embodiment, the packaging board body is square.
[0017] Compared with the prior art, the utility model has at least the following advantages:
[0018] The packaging board of the utility model which can reduce the scrap rate is provided with a main soldering pad and a sub-soldering pad on the component fixing area of the packaging board body, and the corresponding soldering points in the main soldering pad and the sub-soldering pad are conductively connected one by one. When the soldering point between the main soldering pad and the component fails, the soldering point on the sub-soldering pad is used for welding, thereby completing the packaging of the component, reducing the scrap rate, thereby saving materials and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.
[0020] Figure 1 The figure is a schematic structural diagram of a packaging plate capable of reducing the scrap rate in one embodiment of the utility model.
[0021] Reference numerals:
[0022] The package board body 10 , the main pad 20 , the auxiliary pad 30 , the solder joint 40 , the conductive member 50 , and the component fixing area 60 . DETAILED DESCRIPTION
[0023] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.
[0024] The present application embodiment proposes a packaging board that can reduce the scrap rate. Figure 1, including: a conductive member 50, a package board body 10, and a main pad 20 and a secondary pad 30 arranged on the package board body 10. A component fixing area 60 is arranged on the package board body 10, and the component fixing area 60 is used to fix the components to be packaged. The secondary pad 30 is arranged around the outer side of the component fixing area 60 of the package board body 10, and the main pad 20 is arranged between the component fixing area 60 and the secondary pad 30. A plurality of corresponding solder joints 40 are arranged on the main pad 20 and the secondary pad 30, and the corresponding solder joints 40 in the main pad 20 and the secondary pad 30 are electrically connected one by one, and the corresponding connection points of the components are electrically connected to the main pad 20 and the secondary pad 30 respectively through the conductive member 50.
[0025] The packaging board of the present application which can reduce the scrap rate is provided with a main solder pad 20 and a sub-solder pad 30 on the component fixing area 60 of the packaging board body 10. When the welding between the main solder pad 20 and the solder joint 40 of the component fails, the solder joint 40 on the sub-solder pad 30 is used for welding, thereby completing the packaging of the component, reducing the scrap rate, thereby saving materials and reducing production costs.
[0026] In one of the embodiments, the conductive part 50 in the prior art is usually an electric wire with insulating glue, which is easy to melt at a higher temperature. However, the conductive part 50 of the present application is a conductive gold wire, which is resistant to high temperatures and prevents the heat generated by the components from being unable to be discharged in time during operation, thereby causing malfunctions.
[0027] Furthermore, the main solder pad 20 and the auxiliary solder pad 30 are respectively fixedly connected to the packaging board body 10, and the main solder pad 20 and the auxiliary solder pad 30 are detachably arranged to prevent the auxiliary solder pad 30 from falling off together when the inner main solder pad 20 falls off, thereby causing the packaging board to be scrapped.
[0028] In the prior art, the size of the solder joint 40 is usually set to 0.1mm*0.1mm, which can be welded to the conductive member 50 once. If the welding fails, the solder joint 40 of the auxiliary pad 30 is used, but the auxiliary pad 30 is set outside the main pad 20. The circumference of the auxiliary pad 30 is longer than that of the main pad 20, so the size of the solder joint 40 of the auxiliary pad 30 can be set to 0.12mm*0.12mm. When the solder joint 40 between the conductive member 50 and the auxiliary pad 30 fails to be welded, a second welding can be performed at the remaining position of the solder joint 40. Among them, the size of the solder joint 40 of the main pad 20 is 0.1mm*0.1mm.
[0029] Further, see Figure 1 The solder joints 40 corresponding to the main solder pad 20 and the auxiliary solder pad 30 are arranged and distributed one by one, which makes it easy for the staff to visually identify the solder joints 40 corresponding to the main solder pad 20 and the auxiliary solder pad 30, thereby reducing the welding error rate, thereby reducing the production of welding jigs and simplifying the process.
[0030] In one embodiment, the distance between the main pad 20 and the auxiliary pad 30 is in the range of 1 mm to 2 mm, which is convenient for a high temperature needle to weld the conductive member 50 and the solder joint 40 in the pad, thereby reducing the size of the package board and making the internal structure compact. In a preferred embodiment, the distance between the main pad 20 and the auxiliary pad 30 is 1.2 mm.
[0031] Preferably, the packaging board body is square.
[0032] In one of the embodiments, the component fixing area 60 is provided with a component adhesive, which fixes the device to be packaged in the component fixing area 60, thereby facilitating the staff to weld the device to the solder joints 40 on the main pad 20 and the auxiliary pad 30, preventing the device from shifting, thereby reducing the production and use of special fixtures.
[0033] Also, see Figure 1 The solder joints 40 of the main solder pad 20 and the auxiliary solder pad 30 are evenly arranged on the four sides of the component fixing area 60, and the intervals between the solder joints 40 are large, so as to facilitate the welding and wiring of the staff. In addition, the solder joints 40 are not arranged at the four corners of the component fixing area 60 to prevent impact and damage to the electrical connection between the conductive gold wire and the solder pad and the device.
[0034] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A packaging board capable of reducing the scrap rate, characterized in that: include: A conductive member, a package board body, and a main pad and a secondary pad disposed on the package board body; A component fixing area is arranged on the package board body, the auxiliary pad is arranged around the outer side of the component fixing area of the package board body, the main pad is arranged between the component fixing area and the auxiliary pad, a plurality of corresponding solder joints are arranged on the main pad and the auxiliary pad, and the corresponding solder joints are conductively connected one by one, and the components on the component fixing area are electrically connected to the main pad and the auxiliary pad respectively through the conductive member.
2. The packaging board capable of reducing scrap rate according to claim 1, characterized in that: The main pad and the auxiliary pad are respectively fixedly connected to the packaging board body, and the main pad and the auxiliary pad are detachably arranged.
3. The packaging board capable of reducing scrap rate according to claim 2, characterized in that: The solder joint size of the main solder pad is 0.1 mm*0.1 mm, and the solder joint size of the auxiliary solder pad is 0.12 mm*0.12 mm.
4. The packaging board capable of reducing scrap rate according to claim 3, characterized in that: The solder joints of the main solder pad and the auxiliary solder pad are evenly arranged on four sides of the component fixing area.
5. The packaging board capable of reducing scrap rate according to claim 4, characterized in that: The soldering points corresponding to the main soldering pad and the auxiliary soldering pad are arranged and distributed in a one-to-one correspondence.
6. The packaging board capable of reducing scrap rate according to claim 1, characterized in that: The distance between the main pad and the auxiliary pad is in the range of 1 mm to 2 mm.
7. The packaging board capable of reducing scrap rate according to claim 6, characterized in that: The distance between the main pad and the auxiliary pad is 1.2 mm.
8. The packaging board capable of reducing scrap rate according to claim 1, characterized in that: The conductive member is a conductive gold wire.
9. The packaging board capable of reducing scrap rate according to claim 1, characterized in that: The component fixing area is provided with a component adhesive piece.
10. The packaging board capable of reducing scrap rate according to claim 1, characterized in that: The packaging board body is square.