Heat dissipation structure of mobile power supply circuit board
By designing a heat dissipation structure of a mobile power circuit board including a bracket body, a protective frame and an efficient heat dissipation component, the problems of poor heat dissipation effect and lack of a protective structure in the prior art are solved, effective heat dissipation and protection are achieved, and the service life of the power circuit board is extended.
Patent Information
- Application Number
- CN202421112389.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-21
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-05-21
AI Technical Summary
The existing mobile power circuit board has poor heat dissipation effect and lacks a protective structure, which is easily damaged by external forces, resulting in a shortened service life.
A heat dissipation structure including a bracket body, a protective frame and a heat dissipation assembly is designed. The heat dissipation assembly consists of heat dissipation fins, grease filling slots, mounting frames, support frames and cooling fans. It can effectively dissipate heat through the grease filling slots and cooling fans, and provides protection through the protective frame and the support body.
This heat dissipation structure can not only effectively reduce the working temperature of the power circuit board and ensure its normal operation, but also enhance the bending resistance of the power circuit board and extend its service life.
Smart Images
Figure CN222638946U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of mobile power supply circuit boards, in particular to a heat dissipation structure of a mobile power supply circuit board. Background Art
[0002] The names of circuit boards include ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. Circuit boards miniaturize and visualize circuits, and play an important role in the mass production of fixed circuits and optimizing the layout of electrical appliances.
[0003] The existing power supply circuit board has poor heat dissipation effect after long-term use. At the same time, the circuit board is basically not provided with a protective structure and is easily damaged by external forces, which leads to a shortened service life.
[0004] Therefore, in view of this, the existing structural deficiencies are studied and improved, and a heat dissipation structure of a mobile power supply circuit board is proposed. Utility Model Content
[0005] The purpose of the utility model is to provide a heat dissipation structure of a mobile power supply circuit board to solve the problems raised in the above background technology.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heat dissipation structure of a mobile power supply circuit board, comprising a bracket main body and a heat dissipation component, a protective frame is provided on the top of the bracket main body, and the heat dissipation component for reducing the working temperature of the power supply circuit board is installed on the top of the protective frame, the heat dissipation component comprises heat dissipation fins, a silicone grease filling groove, a mounting frame, a support frame and a heat dissipation fan, a silicone grease filling groove is provided at the bottom of the heat dissipation fin, and a mounting frame is provided at the rear end of the heat dissipation fin, support frames are symmetrically installed on both sides of the interior of the mounting frame, and a heat dissipation fan is installed at the rear end of the support frame.
[0007] Preferably, a circuit board slot is provided on the inner wall of the protection frame, and the circuit board slot has an overall "C"-shaped structure.
[0008] Preferably, a connecting shaft is rotatably provided at the front end of the left side of the protection frame, and a cover plate is fixedly installed on the outer wall of the middle section of the connecting shaft.
[0009] Preferably, a fixing screw is penetrated through the front end of the right side of the cover plate, and the cover plate is threadedly connected to the protection frame through the fixing screw.
[0010] Preferably, four corners of the bottom of the bracket body are penetrated with mounting screws, and the bracket body is provided with first through holes at positions corresponding to the mounting screws.
[0011] Preferably, second through holes are provided at positions on both sides of the heat dissipation fins corresponding to the first through holes, and the bracket body, the protection frame and the heat dissipation fins are fixed by mounting screws.
[0012] Preferably, a cable groove is provided at the bottom of the front end of the bracket body, and the cable groove is arranged in a rectangular structure as a whole.
[0013] Compared with the prior art, the beneficial effect of the utility model is that the heat dissipation structure of the mobile power circuit board can not only provide heat dissipation for the power circuit board and ensure the temperature of the power circuit board when it is working, but also wrap and protect the power circuit board to improve its overall anti-bending ability.
[0014] 1. The utility model injects heat dissipation silicone grease into the silicone grease filling groove opened at the bottom of the heat dissipation fin by setting the heat dissipation component, and makes the silicone grease filling groove evenly contact with the back of the power circuit board and the bottom of the heat dissipation fin. The heat generated by the power circuit board when working is transferred to the heat dissipation fin through the silicone grease, and then the heat dissipation fan is set at the rear end of the heat dissipation fin to cool the heat on the heat dissipation fin, so as to achieve the purpose of providing heat dissipation for the power circuit board and ensure the temperature stability of the power circuit board when working;
[0015] 2. The utility model inserts the power circuit board into the circuit board slot by coordinating the protection frame with the circuit board slot, closes the cover plate with the connecting axis as the center, and then fixes the right end of the cover plate to the protection frame by fixing screws, so that the power circuit board is fixed inside the protection frame, and then installs the bracket body and the heat dissipation fins on the upper and lower sides of the protection frame by installing screws, so that the power circuit board is completely wrapped and protected, and the heat dissipation fins and the bracket body have much higher anti-bending capabilities than the power circuit board, thereby achieving the purpose of improving the anti-bending capabilities of the power circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic diagram of the overall three-dimensional structure of a heat dissipation structure of a mobile power supply circuit board of the utility model;
[0017] Figure 2 This is a schematic diagram of the heat dissipation component structure of a heat dissipation structure of a mobile power supply circuit board of the utility model;
[0018] Figure 3 This is a schematic diagram of the internal structure of a protection frame of a heat dissipation structure of a mobile power supply circuit board of the utility model;
[0019] Figure 4 The utility model is a heat dissipation structure of a mobile power supply circuit board Figure 3 Enlarged structural diagram at A in the middle.
[0020] In the figure: 1. bracket body; 2. protection frame; 3. heat dissipation assembly; 301. heat dissipation fins; 302. silicone grease filling slot; 303. mounting frame; 304. support frame; 305. cooling fan; 4. circuit board slot; 5. connecting shaft; 6. cover plate; 7. fixing screw; 8. mounting screw; 9. first through hole; 10. second through hole; 11. cable tray. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] like Figure 1-Figure 2 As shown, a heat dissipation structure of a mobile power supply circuit board includes a bracket body 1 and a heat dissipation component 3. A protective frame 2 is provided on the top of the bracket body 1. The heat dissipation component 3 for reducing the working temperature of the power supply circuit board is installed on the top of the protective frame 2. The heat dissipation component 3 includes heat dissipation fins 301, silicone grease filling grooves 302, a mounting frame 303, a support frame 304 and a heat dissipation fan 305. A silicone grease filling groove 302 is provided at the bottom of the heat dissipation fin 301, and a mounting frame 303 is provided at the rear end of the heat dissipation fin 301. Support frames 304 are symmetrically installed on both sides of the interior of the mounting frame 303, and a heat dissipation fan 305 is installed at the rear end of the support frame 304.
[0023] By injecting heat dissipating silicone grease into the silicone grease filling groove 302 opened at the bottom of the heat dissipating fin 301, and making the silicone grease filling groove 302 evenly and fully contact with the back side of the power circuit board and the bottom of the heat dissipating fin 301, the heat generated by the power circuit board when working is transmitted to the heat dissipating fin 301 through the silicone grease, and then the heat dissipating fan 305 is set at the rear end of the heat dissipating fin 301 to cool the heat on the heat dissipating fin 301, so as to achieve the purpose of providing heat dissipation for the power circuit board and ensure the temperature of the power circuit board when working.
[0024] like Figure 3-Figure 4 As shown, a circuit board slot 4 is provided on the inner wall of the protection frame 2, and the circuit board slot 4 is provided with an overall "C"-shaped structure.
[0025] The circuit board slot 4 facilitates better installation of the power supply circuit board inside the protection frame 2 .
[0026] Furthermore, a connecting shaft 5 is rotatably provided at the front end of the left side of the protection frame 2 , and a cover plate 6 is fixedly installed on the outer wall of the middle section of the connecting shaft 5 .
[0027] The cover plate 6 is used to restrict the installed power circuit board to prevent the power circuit board from sliding out from the front end of the protection frame 2 .
[0028] Furthermore, a fixing screw 7 is penetrated through the front end of the right side of the cover plate 6 , and the cover plate 6 is threadedly connected to the protection frame 2 via the fixing screw 7 .
[0029] Furthermore, mounting screws 8 are provided through the four corners of the bottom of the bracket body 1 , and first through holes 9 are provided at positions of the bracket body 1 corresponding to the mounting screws 8 .
[0030] The first through hole 9 is convenient for installing the screw 8 through the bracket body 1 to be connected with the protection frame 2 .
[0031] Furthermore, second through holes 10 are provided at positions on both sides of the heat dissipation fins 301 corresponding to the first through holes 9 , and the bracket body 1 , the protection frame 2 and the heat dissipation fins 301 are fixed by installing screws 8 .
[0032] The mounting screws 8 are used to tightly fix the bracket body 1 , the protection frame 2 and the heat dissipation fins 301 together.
[0033] Furthermore, a cable groove 11 is provided at the bottom of the front end of the bracket body 1, and the cable groove 11 is arranged in a rectangular structure as a whole.
[0034] The cable slot 11 reduces the number of wires extending from the power supply circuit board passing through the bracket body 1 to connect with the power supply.
[0035] Working principle: When using the heat dissipation structure of the mobile power supply circuit board, first insert the power supply circuit board into the circuit board slot 4, and close the cover plate 6 with the connecting axis 5 as the center of the circle, and then fix the right end of the cover plate 6 to the protective frame 2 by the fixing screw 7, so that the power supply circuit board is fixed inside the protective frame 2, and then install the bracket body 1 and the heat dissipation fins 301 on the upper and lower sides of the protective frame 2 by installing screws 8, so that the power supply circuit board is completely wrapped and protected, and then inject the heat dissipation silicone grease into the silicone grease filling groove 302 opened at the bottom of the heat dissipation fin 301, and make the silicone grease filling groove 302 evenly and fully contact with the back of the power supply circuit board and the bottom of the heat dissipation fin 301, and the heat generated by the power supply circuit board when working is transmitted to the heat dissipation fin 301 through the silicone grease, and then the heat dissipation fan 305 is set at the rear end of the heat dissipation fin 301 to cool the heat on the heat dissipation fin 301, so as to achieve the purpose of providing heat dissipation for the power supply circuit board and ensure the temperature stability of the power supply circuit board when working. This is the working principle of the heat dissipation structure of the mobile power supply circuit board.
Claims
1. A heat dissipation structure of a mobile power supply circuit board, comprising a support body (1) and a heat dissipation component (3), characterized in that: A protective frame (2) is provided on the top of the bracket body (1); a heat dissipation component (3) for reducing the temperature of the power supply circuit board during operation is installed on the top of the protective frame (2); the heat dissipation component (3) comprises a heat dissipation fin (301), a silicone grease filling groove (302), a mounting frame (303), a support frame (304) and a heat dissipation fan (305); a silicone grease filling groove (302) is provided at the bottom of the heat dissipation fin (301), and a mounting frame (303) is provided at the rear end of the heat dissipation fin (301); support frames (304) are symmetrically installed on both sides of the interior of the mounting frame (303), and a heat dissipation fan (305) is installed at the rear end of the support frame (304).
2. The heat dissipation structure of a mobile power supply circuit board according to claim 1, characterized in that: The inner wall of the protection frame (2) is provided with a circuit board slot (4), and the circuit board slot (4) is arranged in an overall "C"-shaped structure.
3. The heat dissipation structure of a mobile power supply circuit board according to claim 1, characterized in that: A connecting shaft (5) is rotatably provided at the left front end of the protection frame (2), and a cover plate (6) is fixedly installed on the outer wall of the middle section of the connecting shaft (5).
4. The heat dissipation structure of a mobile power supply circuit board according to claim 3, characterized in that: A fixing screw (7) is provided through the front end of the right side of the cover plate (6), and the cover plate (6) is threadedly connected to the protection frame (2) via the fixing screw (7).
5. The heat dissipation structure of a mobile power supply circuit board according to claim 1, characterized in that: The four corners of the bottom of the bracket body (1) are penetrated by mounting screws (8), and the bracket body (1) is provided with a first through hole (9) at a position corresponding to the mounting screw (8).
6. The heat dissipation structure of a mobile power supply circuit board according to claim 1, characterized in that: Second through holes (10) are provided at positions on both sides of the heat dissipation fins (301) corresponding to the first through holes (9), and the bracket body (1), the protection frame (2) and the heat dissipation fins (301) are fixed by means of mounting screws (8).
7. The heat dissipation structure of a mobile power supply circuit board according to claim 1, characterized in that: A cable routing groove (11) is provided at the bottom of the front end of the bracket body (1), and the cable routing groove (11) is arranged in a rectangular structure as a whole.