Semiconductor chilling plate
Through modular design and semiconductor particle components with different arrangement methods, the problem of semiconductor refrigeration sheet stopping due to failure is solved, achieving higher practicality and reducing maintenance costs.
Patent Information
- Application Number
- CN202323584542.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-27
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2033-12-27
AI Technical Summary
When a semiconductor particle pair fails, the entire refrigeration sheet will stop working and a new refrigeration sheet needs to be replaced, which is poor in practicality and high in cost.
By modularizing semiconductor particle components, multiple semiconductor particle modules are connected in parallel and through different arrangement methods, such as adjacent arrangement, surrounding arrangement and interval arrangement, the impact of faults on the refrigeration effect is reduced.
In the event that some semiconductor particle modules are damaged, the normal function of cooling or heating can still be maintained, reducing maintenance costs and improving the uniformity of cooling or heating.
Smart Images
Figure CN222639031U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of refrigeration appliances, for example, to a semiconductor refrigeration sheet. Background Art
[0002] At present, based on the Peltier effect, thermoelectric semiconductor materials are made into semiconductor refrigerators. When direct current passes through thermoelectric materials and electrodes, heat is absorbed at one electrode and released at the other electrode, so that one end of the semiconductor refrigerator is cooled and the other end is heated.
[0003] In the related art, a plurality of semiconductor particle pairs are connected in series to form a semiconductor particle assembly, and substrates are arranged at opposite ends of the semiconductor particle assembly to achieve cooling at one end of the semiconductor refrigeration plate and heating at the other end.
[0004] In the publicly available implementation process, the following problems were found in the relevant technology:
[0005] In the related art, although one end of the semiconductor refrigeration plate is cooled and the other end is heated, in actual use, if one semiconductor particle pair in the semiconductor particle assembly fails, the semiconductor refrigeration plate will stop working. A new semiconductor refrigeration plate needs to be replaced, which is of poor practicality and has a high cost of replacement.
[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content
[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.
[0008] The disclosed embodiments provide a semiconductor refrigerator, which improves the practicality of the semiconductor refrigerator, reduces the cost of repairing the semiconductor refrigerator, and reduces the influence of damage to some semiconductor particle modules on the cooling or heating effect of the semiconductor refrigerator through the arrangement of semiconductor particle modules, thereby improving the uniformity of cooling or heating of the semiconductor refrigerator.
[0009] In some embodiments, a semiconductor refrigeration plate is provided, including: a semiconductor particle component, including multiple semiconductor particle modules, and each semiconductor particle module is connected in parallel; a substrate component is arranged at opposite ends of the semiconductor particle component and connected to the semiconductor particle component.
[0010] Optionally, the arrangement of multiple semiconductor particle modules in the semiconductor particle component includes one or more of an adjacent arrangement in which each semiconductor particle module is adjacent to each other, an enclosing arrangement in which one semiconductor particle module surrounds another semiconductor particle module, and an interval arrangement in which multiple semiconductor particle modules are layered and spaced apart from each other.
[0011] Optionally, the semiconductor particle module includes a strip semiconductor particle module or a block semiconductor particle module; the semiconductor particle assembly includes a strip semiconductor particle module and / or a block semiconductor particle module, and the strip semiconductor particle module and / or the block semiconductor particle module are adjacently arranged to form an adjacent arrangement.
[0012] Optionally, the semiconductor particle module includes: one or more semiconductor particle pairs; when the semiconductor particle module includes one semiconductor particle pair, multiple semiconductor modules are arranged adjacent to each other to form an adjacent arrangement; when the semiconductor particle module includes multiple semiconductor particle pairs, multiple semiconductor particle pairs are connected in series to form a strip-shaped semiconductor particle module and / or a block-shaped semiconductor particle module; multiple strip-shaped semiconductor particle modules and / or multiple block-shaped semiconductor particle modules are arranged adjacent to each other to form an adjacent arrangement.
[0013] Optionally, the multiple semiconductor particle modules include: an inner semiconductor particle module; one or more outer semiconductor particle modules, multiple particle pairs of each outer semiconductor particle module are connected in series and arranged in a circle shape; the outer semiconductor particle module is surrounded by the inner semiconductor particle module; when there are multiple outer semiconductor particle modules, the outer semiconductor particle modules located on the outside are surrounded by the outer semiconductor particle modules located on the inside.
[0014] Optionally, in the plurality of semiconductor particle modules, the plurality of particle pairs of each semiconductor particle module are connected in series and arranged into a plurality of nested ring-shaped sub-modules; the ring-shaped sub-modules of the plurality of semiconductor particle modules are sequentially arranged at intervals to form an interval arrangement.
[0015] Optionally, multiple semiconductor particle modules include: a third semiconductor particle module, the third semiconductor particle module is arranged as a first circle module and a second circle module, and the second circle module is located at the periphery of the first circle module; a fourth semiconductor particle module, the fourth semiconductor particle module is arranged as a third circle module and a fourth circle module, and the fourth circle module is located at the periphery of the third circle module; wherein the third circle module is arranged between the first circle module and the second circle module, and the fourth circle module is arranged on the periphery of the second circle module to form an interval arrangement.
[0016] Optionally, the semiconductor particle component also includes: a first port, which is electrically connected to multiple semiconductor particle modules and is used to be electrically connected to the positive pole or the negative pole of the power supply; a second port, which is electrically connected to multiple semiconductor particle modules and is used to be electrically connected to the positive pole or the negative pole of the power supply; wherein, when the first port is electrically connected to the positive pole of the power supply, the second port is electrically connected to the negative pole of the power supply; when the first port is electrically connected to the negative pole of the power supply, the second port is electrically connected to the positive pole of the power supply.
[0017] Optionally, each semiconductor particle module includes a first interface and a second interface; the first interfaces of multiple semiconductor particle modules in the semiconductor particle assembly are connected to form a first port; and the second interfaces of multiple semiconductor particle modules in the semiconductor particle assembly are connected to form a second port.
[0018] Optionally, the substrate assembly includes: a first substrate, arranged on one end surface of the semiconductor particle assembly and connected to the semiconductor particle assembly; a second substrate, arranged on the other end surface of the semiconductor particle assembly and connected to the semiconductor particle assembly; wherein the first substrate and the second substrate are respectively arranged on the opposite end surfaces of the semiconductor particle assembly.
[0019] The semiconductor cooling sheet provided in the embodiments of the present disclosure can achieve the following technical effects:
[0020] The semiconductor cooling sheet provided by the embodiment of the present disclosure modularizes the semiconductor particle assembly, connects multiple semiconductor particle modules in the semiconductor particle assembly in parallel, and makes it possible for the damage of some semiconductor particle modules to not affect the operation of the remaining semiconductor particle modules. The practicality of the semiconductor cooling sheet is improved, and when some conductor particle modules are damaged, only the damaged semiconductor particle modules need to be replaced, thereby reducing the cost of repairing the semiconductor cooling sheet.
[0021] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:
[0023] Figure 1 It is a schematic diagram of the structure of the semiconductor cooling plate provided by the embodiment of the present disclosure;
[0024] Figure 2 yes Figure 1 A side view of a semiconductor cooling plate in the illustrated embodiment;
[0025] Figure 3is a schematic diagram of an adjacent arrangement provided by an embodiment of the present disclosure;
[0026] Figure 4 is a schematic diagram of an enclosing arrangement provided by an embodiment of the present disclosure;
[0027] Figure 5 It is a schematic diagram of the spacing arrangement provided in an embodiment of the present disclosure.
[0028] Reference numerals:
[0029] 10. Semiconductor particle assembly; 101. First semiconductor particle module; 102. Second semiconductor particle module; 103. Third semiconductor particle module; 1031. First circle module; 1032. Second circle module; 104. Fourth semiconductor particle module; 1041. Third circle module; 1042. Fourth circle module; 105. First port; 106. Second port; 107. Block semiconductor particle module; 20. Substrate assembly; 201. First substrate; 202. Second substrate. DETAILED DESCRIPTION
[0030] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.
[0031] The terms "first", "second", etc. in the specification and claims of the embodiments of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so that the embodiments of the embodiments of the present disclosure described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.
[0032] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.
[0033] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.
[0034] Unless otherwise stated, the term "plurality" means two or more.
[0035] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B indicates: A or B.
[0036] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.
[0037] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.
[0038] Combination Figures 1 to 5 As shown, the embodiment of the present disclosure provides a semiconductor cooling sheet, including: a semiconductor particle component 10 and a substrate component 20. The semiconductor particle component 10 includes a plurality of semiconductor particle modules, and each semiconductor particle module is connected in parallel. The substrate component 20 is disposed at opposite ends of the semiconductor particle component 10 and is connected to the semiconductor particle component 10.
[0039] The semiconductor cooling plate provided by the embodiment of the present disclosure modularizes the semiconductor particle assembly 10, connects multiple semiconductor particle modules in the semiconductor particle assembly 10 in parallel, and makes it possible for the damage of some semiconductor particle modules to not affect the operation of the remaining semiconductor particle modules. The practicality of the semiconductor cooling plate is improved, and when some conductor particle modules are damaged, only the damaged semiconductor particle modules need to be replaced, thereby reducing the cost of repairing the semiconductor cooling plate.
[0040] Specifically, when a semiconductor particle module is damaged, the cooling capacity or heating capacity of the entire semiconductor refrigeration plate can be kept unchanged by increasing the operating voltage of the semiconductor refrigeration plate to maintain the normal cooling function or heating function of the semiconductor refrigeration plate.
[0041] Optionally, combined Figures 3 to 5 As shown, the arrangement of the multiple semiconductor particle modules in the semiconductor particle component 10 includes one or more of an adjacent arrangement in which each semiconductor particle module is adjacent to each other, an enclosing arrangement in which one semiconductor particle module surrounds another semiconductor particle module, and an interval arrangement in which multiple semiconductor particle modules are layered and spaced from each other.
[0042] In this embodiment, by setting the arrangement of multiple semiconductor particle modules in the semiconductor particle assembly 10, it is achieved that when some semiconductor particle modules are damaged, the semiconductor refrigeration plate can still cool or heat after power is turned on, so as to maintain the normal cooling function or heating function of the semiconductor refrigeration plate. In addition, through different arrangements, it can be achieved that when some semiconductor particle modules are damaged and cannot generate cold or heat, the semiconductor particle modules near the damaged semiconductor particle modules can still generate cooling or heating. In order to reduce the impact of the damage of some semiconductor particle modules on the cooling effect or heating effect of the semiconductor refrigeration plate, the uniformity of cooling or heating of the semiconductor refrigeration plate with damaged semiconductor particle modules is improved.
[0043] Optionally, combined Figure 3 As shown, the semiconductor particle module includes a strip semiconductor particle module or a block semiconductor particle module 107. The semiconductor particle assembly 10 includes a strip semiconductor particle module and / or a block semiconductor particle module 107, and the strip semiconductor particle module and / or the block semiconductor particle module 107 are adjacently arranged to form an adjacent arrangement.
[0044] In this embodiment, the semiconductor particle module is set as a strip semiconductor particle module so that a plurality of strip semiconductor particle modules can be arranged in an adjacent manner. In the case where some strip semiconductor particle modules are damaged, other strip semiconductor particle modules near the damaged strip semiconductor particle module can still generate cold or heat. This can reduce the impact of the damage of some semiconductor particle modules on the cooling effect or heating effect of the semiconductor refrigeration plate, and improve the uniformity of cooling or heating of the semiconductor refrigeration plate with damaged semiconductor particle modules.
[0045] By setting the semiconductor particle module as a block semiconductor particle module 107, it is convenient to arrange a plurality of block semiconductor particle modules 107 in an adjacent manner. In the case where a portion of the block semiconductor particle module 107 is damaged, other block semiconductor particle modules 107 near the damaged block semiconductor particle module 107 can still generate cold or heat. This reduces the impact of the damage of a portion of the semiconductor particle module on the cooling effect or heating effect of the semiconductor refrigeration plate, and improves the uniformity of cooling or heating of the semiconductor refrigeration plate with the damaged semiconductor particle module.
[0046] Optionally, the semiconductor particle module includes: one or more semiconductor particle pairs. In the case where the semiconductor particle module includes one semiconductor particle pair, multiple semiconductor modules are arranged adjacent to each other to form an adjacent arrangement. In the case where the semiconductor particle module includes multiple semiconductor particle pairs, multiple semiconductor particle pairs are connected in series to form a strip semiconductor particle module and / or a block semiconductor particle module 107. Multiple strip semiconductor particle modules and / or multiple block semiconductor particle modules 107 are arranged adjacent to each other to form an adjacent arrangement.
[0047] In this embodiment, when the semiconductor particle module includes a semiconductor particle pair, multiple semiconductor modules are arranged adjacent to each other, that is, multiple semiconductor particle pairs are arranged in parallel. In this way, even if one of the semiconductor particle pairs is damaged and cannot generate cold or heat, the normal cooling function or heating function of the semiconductor refrigeration plate can be maintained by the cold or heat generated by other semiconductor particle pairs. Moreover, through the adjacent arrangement, it can be achieved that the semiconductor particle pairs near the damaged semiconductor particle pair can still generate cold or heat. In order to reduce the impact of the damage of some semiconductor particle modules on the cooling effect or heating effect of the semiconductor refrigeration plate, the uniformity of cooling or heating of the semiconductor refrigeration plate with damaged semiconductor particle modules is improved.
[0048] When the semiconductor particle module includes multiple semiconductor particle pairs, the semiconductor particle modules formed by connecting the multiple semiconductor particle pairs in series are connected in parallel to form a semiconductor refrigeration plate, which can reduce the installation and manufacturing steps of the semiconductor refrigeration plate and reduce the complexity of the production of the semiconductor refrigeration plate.
[0049] It is understandable that the arrangement of the semiconductor particle pairs in the semiconductor particle string formed by connecting multiple semiconductor particle pairs in series in the embodiment of the present disclosure may be that the semiconductor particle pairs are arranged according to a set rectangular matrix. The rectangular matrix may be 1×n or 5×n, where n is set according to the number of specific semiconductor particle pairs. The embodiment of the present disclosure does not limit the arrangement of the semiconductor particle pairs in the semiconductor particle string formed by connecting multiple semiconductor particle pairs in series, as long as the formed semiconductor particle module is in the shape of a strip or a block.
[0050] Optionally, combined Figure 4 As shown, the plurality of semiconductor particle modules include: an inner semiconductor particle module and one or more outer semiconductor particle modules. The plurality of particle pairs of each outer semiconductor particle module are connected in series and arranged in a circle. The outer semiconductor particle module is arranged around the inner semiconductor particle module. When there are a plurality of outer semiconductor particle modules, the outer semiconductor particle module located on the outer side is arranged around the outer semiconductor particle module located on the inner side.
[0051] In this embodiment, an inner semiconductor particle module and one or more outer semiconductor particle modules are provided, and the outer semiconductor particle modules are arranged around the inner semiconductor particle modules to achieve an encircling arrangement. In this way, when some semiconductor particle modules are damaged, the undamaged semiconductor particle modules can still generate heat or cold, and the semiconductor refrigeration sheet can still cool or heat after power is turned on to maintain the normal cooling function or heating function of the semiconductor refrigeration sheet. In order to reduce the impact of the damage of some semiconductor particle modules on the cooling effect or heating effect of the semiconductor refrigeration sheet, the uniformity of cooling or heating of the semiconductor refrigeration sheet with damaged semiconductor particle modules is improved.
[0052] Specifically, the inner semiconductor particle module includes one or more semiconductor particle pairs. In the case where the inner semiconductor particle module includes multiple semiconductor particle pairs, the multiple semiconductor particle pairs are connected in series to form a strip semiconductor particle module or a block semiconductor particle module. The outer semiconductor particle module is surrounded by the strip semiconductor particle module or the block semiconductor particle module. The strip semiconductor particle module or the block semiconductor particle module here refers to the description of the aforementioned adjacent arrangement mode, which will not be repeated here.
[0053] For example, Figure 4 As shown, the plurality of semiconductor particle modules include: a first semiconductor particle module 101 (i.e., an inner semiconductor particle module) and a second semiconductor particle module 102 (i.e., an outer semiconductor particle module). The plurality of particle pairs of the second semiconductor particle module 102 are connected in series and arranged in a ring shape, with a notch formed inside, and the first semiconductor particle module 101 is disposed in the notch.
[0054] In this way, when the first semiconductor particle module 101 or the second semiconductor particle module 102 is damaged, the second semiconductor particle module 102 or the first semiconductor particle module 101 can still generate heat or cold to realize the cooling function or heating function of the semiconductor refrigeration sheet.
[0055] Optionally, combined Figure 5 As shown, in the plurality of semiconductor particle modules, the plurality of particle pairs of each semiconductor particle module are connected in series and arranged into a plurality of nested ring-shaped sub-modules. The ring-shaped sub-modules of the plurality of semiconductor particle modules are sequentially arranged at intervals to form an interval arrangement.
[0056] In this embodiment, a plurality of semiconductor ion modules are arranged in a nested manner, i.e., an intermittent arrangement, so as to reduce the impact of damage to some semiconductor particle modules on the cooling function or heating function of the semiconductor refrigeration plate, and improve the uniformity of cooling or heating of the semiconductor refrigeration plate with damaged semiconductor particle modules.
[0057] Optionally, combined Figure 5 As shown, multiple semiconductor particle modules include: a third semiconductor particle module 103 and a fourth semiconductor particle module 104. The third semiconductor particle module 103 is arranged as a first circle module 1031 and a second circle module 1032, and the second circle module 1032 is located at the periphery of the first circle module 1031. The fourth semiconductor particle module 104 is arranged as a third circle module 1041 and a fourth circle module 1042, and the fourth circle module 1042 is located at the periphery of the third circle module 1041. Among them, the third circle module 1041 is arranged between the first circle module 1031 and the second circle module 1032, and the fourth circle module 1042 is arranged on the periphery of the second circle module 1032 to form an interval arrangement.
[0058] In this embodiment, the third semiconductor particle module 103 and the fourth semiconductor particle module 104 are provided to realize a mutually nested arrangement of the semiconductor particle modules, i.e., an interval arrangement. In this way, even if the third semiconductor particle module 103 is damaged, the third circle module 1041 and the fourth circle module 1042 of the fourth semiconductor particle module 104 can still generate heat or cold, and the third circle module 1041 and the fourth circle module 1042 are spaced apart in the semiconductor refrigeration sheet, so that the heat or cold generated by the semiconductor refrigeration sheet is more uniform, thereby improving the uniformity of cooling or heating of the semiconductor refrigeration sheet with the damaged semiconductor particle module.
[0059] Optionally, combined Figure 1 , Figure 3 , Figure 4 and Figure 5As shown, the semiconductor particle assembly 10 further includes: a first port 105 and a second port 106. The first port 105 is electrically connected to a plurality of semiconductor particle modules, and is used to be electrically connected to the positive electrode or the negative electrode of the power supply. The second port 106 is electrically connected to a plurality of semiconductor particle modules, and is used to be electrically connected to the positive electrode or the negative electrode of the power supply. Wherein, when the first port 105 is electrically connected to the positive electrode of the power supply, the second port 106 is electrically connected to the negative electrode of the power supply. When the first port 105 is electrically connected to the negative electrode of the power supply, the second port 106 is electrically connected to the positive electrode of the power supply.
[0060] In this embodiment, the first port 105 and the second port 106 are provided to realize that after the semiconductor cooling plate is powered through the first port 105 and the second port 106 , the semiconductor cooling plate can realize a heating function or a cooling function.
[0061] Optionally, each semiconductor particle module includes a first interface and a second interface. The first interfaces of multiple semiconductor particle modules in the semiconductor particle assembly 10 are connected to form a first port 105. The second interfaces of multiple semiconductor particle modules in the semiconductor particle assembly 10 are connected to form a second port 106.
[0062] In this embodiment, a first port 105 formed by connecting the first interface of each semiconductor particle module and a second port 106 formed by connecting the second interface of each semiconductor particle module are used to realize parallel connection between multiple semiconductor particle modules, so that damage to some semiconductor particle modules does not affect the operation of the remaining semiconductor particle modules.
[0063] Optionally, combined Figure 1 and Figure 2 As shown, the substrate assembly 20 includes: a first substrate 201 and a second substrate 202. The first substrate 201 is disposed on one end surface of the semiconductor particle assembly 10 and connected to the semiconductor particle assembly 10. The second substrate 202 is disposed on the other end surface of the semiconductor particle assembly 10 and connected to the semiconductor particle assembly 10. The first substrate 201 and the second substrate 202 are respectively disposed on two opposite end surfaces of the semiconductor particle assembly 10.
[0064] In this embodiment, the first substrate 201 and the second substrate 202 are provided to realize that after the semiconductor refrigeration chip is powered on, the semiconductor refrigeration chip realizes a heating function or a cooling function.
[0065] Specifically, each semiconductor particle module includes one or more pairs of semiconductor particles. One end of each pair of semiconductor particles is connected to the first substrate 201 , and the other end of each pair of semiconductor particles is connected to the second substrate 202 .
[0066] Exemplarily, each of the plurality of semiconductor particle modules is provided with a first substrate 201 and a second substrate 202, and the shapes of the first substrate 201 and the second substrate 202 are provided corresponding to the shapes of the semiconductor particle modules, so that when the semiconductor refrigeration sheet is repaired, the damaged semiconductor particle group in the semiconductor refrigeration sheet and the first substrate 201 and the second substrate 202 corresponding to the semiconductor particle group are replaced together as a whole. The steps of welding and the like for replacing the damaged semiconductor particle module separately are reduced, the speed of repairing the semiconductor refrigeration sheet is improved, and the practicality of the semiconductor refrigeration sheet is improved.
[0067] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims
1. A semiconductor refrigeration sheet, characterized in that: include: The semiconductor particle assembly includes a plurality of semiconductor particle modules, and each semiconductor particle module is connected in parallel; The substrate component is arranged at two opposite ends of the semiconductor particle component and is connected to the semiconductor particle component.
2. The semiconductor cooling sheet according to claim 1, characterized in that: The arrangement of the multiple semiconductor particle modules in the semiconductor particle assembly includes one or more of an adjacent arrangement in which each semiconductor particle module is adjacent to each other, an enclosing arrangement in which one semiconductor particle module surrounds another semiconductor particle module, and an interval arrangement in which multiple semiconductor particle modules are layered and spaced from each other.
3. The semiconductor cooling sheet according to claim 2, characterized in that: The semiconductor particle module includes a strip-shaped semiconductor particle module or a block-shaped semiconductor particle module; The semiconductor particle assembly includes a strip-shaped semiconductor particle module and / or a block-shaped semiconductor particle module, and the strip-shaped semiconductor particle module and / or the block-shaped semiconductor particle module are adjacently arranged to form an adjacent arrangement.
4. The semiconductor cooling sheet according to claim 3, characterized in that: The semiconductor particle module includes: one or more semiconductor particle pairs; In the case where the semiconductor particle module includes a semiconductor particle pair, a plurality of semiconductor modules are disposed adjacent to each other to form an adjacent arrangement; When the semiconductor particle module includes multiple semiconductor particle pairs, the multiple semiconductor particle pairs are connected in series to form a strip semiconductor particle module and / or a block semiconductor particle module; multiple strip semiconductor particle modules and / or multiple block semiconductor particle modules are arranged adjacent to each other to form an adjacent arrangement.
5. The semiconductor cooling sheet according to claim 2, characterized in that: Multiple semiconductor particle modules include: Inner semiconductor particle module; One or more outer semiconductor particle modules, each outer semiconductor particle module has multiple particle pairs connected in series and arranged in a ring shape; the outer semiconductor particle module is arranged around the inner semiconductor particle module; When there are a plurality of outer semiconductor particle modules, the outer semiconductor particle modules located on the outer side surround the outer semiconductor particle modules located on the inner side.
6. The semiconductor cooling sheet according to claim 2, characterized in that: In the plurality of semiconductor particle modules, the plurality of particle pairs of each semiconductor particle module are connected in series and arranged into a plurality of nested ring-shaped submodules; the ring-shaped submodules of the plurality of semiconductor particle modules are arranged in sequence and at intervals to form an interval arrangement.
7. The semiconductor cooling sheet according to claim 6, characterized in that: Multiple semiconductor particle modules, including: A third semiconductor particle module, the third semiconductor particle module is arranged as a first circle module and a second circle module, and the second circle module is located at the periphery of the first circle module; A fourth semiconductor particle module, wherein the fourth semiconductor particle module is arranged as a third circle module and a fourth circle module, and the fourth circle module is located at the periphery of the third circle module; Among them, the third circle module is arranged between the first circle module and the second circle module, and the fourth circle module is arranged on the outer peripheral side of the second circle module to form an interval arrangement.
8. The semiconductor cooling sheet according to any one of claims 1 to 7, characterized in that: Semiconductor particle components also include: A first port is electrically connected to the plurality of semiconductor particle modules and is used to be electrically connected to a positive electrode or a negative electrode of a power source; The second port is electrically connected to the plurality of semiconductor particle modules and is used to be electrically connected to the positive electrode or the negative electrode of the power supply; When the first port is electrically connected to the positive pole of the power supply, the second port is electrically connected to the negative pole of the power supply; when the first port is electrically connected to the negative pole of the power supply, the second port is electrically connected to the positive pole of the power supply.
9. The semiconductor cooling sheet according to claim 8, characterized in that: Each semiconductor particle module includes a first interface and a second interface; The first interfaces of the plurality of semiconductor particle modules in the semiconductor particle assembly are all connected to form a first port; the second interfaces of the plurality of semiconductor particle modules in the semiconductor particle assembly are all connected to form a second port.
10. The semiconductor cooling sheet according to any one of claims 1 to 7, characterized in that: The baseboard assembly includes: A first substrate is disposed on one end surface of the semiconductor particle component and connected to the semiconductor particle component; A second substrate is disposed on the other end surface of the semiconductor particle component and connected to the semiconductor particle component; The first substrate and the second substrate are respectively arranged on two opposite end surfaces of the semiconductor particle component.