Detection and die bonding integrated multi-head chip mounter

Abstract

The utility model relates to the technical field of die bonding chip mounters, in particular to a detection and die bonding integrated multi-head chip mounter which comprises a bearing plate, one side of the top end of the bearing plate is fixedly connected with a first bearing block, the top end of the first bearing block is fixedly connected with a limiting frame, and the middle of the surface of the limiting frame is connected with a rebound assembly in a penetrating mode. The other side of the top end of the bearing plate is fixedly connected with a second bearing block, and the middle of the top end of the second bearing block is fixedly connected with a fixing frame. According to the utility model, through the arrangement of the rebound assembly and the collection assembly, a wafer can be placed in the limiting frame on the first bearing block during use, and then the quality of the wafer is detected by using the detection machine body on one side of the top end of the supporting plate; if the quality of the wafer is unqualified, a connecting rod is pushed to enable a limiting piece to be matched with a hollow column to compress a telescopic spring, meanwhile, a limiting plate pushes out unqualified objects in a limiting frame, and the unqualified objects enter a collecting box through a groove in a bearing plate; if the wafer is qualified, a chip mounter body is used for carrying out wafer fixing work.

Description

Technical Field

[0001] The utility model relates to the technical field of solid crystal placement machines, in particular to a multi-head placement machine with integrated detection and solid crystal placement. Background Art

[0002] Surface mount technology is the most popular technology and process in the current electronic assembly industry. It is a circuit assembly technology that mounts pinless or short-lead surface mount components on the surface of a printed circuit board or other substrate, and assembles them by soldering through methods such as reflow soldering or dip soldering. The placement machine is also called a "mounting machine" or "surface mount system". In the production line where components are installed on PCB boards, the placement machine is usually configured after the dispensing machine or screen printer. It is a device that accurately places components on the PCB board by moving the placement head. A placement machine is often used in solid crystal work.

[0003] For example, a multi-head placement machine that is easy to move disclosed in the authorization announcement number CN212786496U, although it adopts the cooperation between the slide bars on the left and right sides of the workbench and the slide outside the slide bars to facilitate the forward and backward movement of the slicing head, and then a slide rail is set at the bottom of the cross bar, and a slider is slidably connected to the outside of the slide rail to facilitate the left and right movement of the slicing head, and then the electric push rod is set to move up and down to drive the slicing head to move up and down, so that it can move quickly back and forth and left and right to process multiple objects to be mounted, achieving the advantage of fast mounting speed, thereby effectively solving the problem that the mounting head is not easy to move during the mounting process and affects its mounting efficiency, but it does not solve the problem that the existing multi-head placement machine with integrated detection and solid crystal bonding lacks a collection function, and it is difficult to quickly collect unqualified chips during use, resulting in low work efficiency; it also lacks a fixing function, and it is difficult to fix the mounting substrate during use, resulting in displacement of the mounting substrate and affecting the quality of solid crystal bonding. Utility Model Content

[0004] The purpose of the utility model is to provide a multi-head chip mounter with integrated detection and solid crystal function, so as to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A multi-head placement machine with integrated crystal solidification detection comprises a carrying plate, a first carrying block is fixedly connected to one side of the top of the carrying plate, a limit frame is fixedly connected to the top of the first carrying block, a rebound component is connected through the middle of the surface of the limit frame, a second carrying block is fixedly connected to the other side of the top of the carrying plate, a fixed frame is fixedly connected to the middle of the top of the second carrying block, fixed components are connected through the middle of both sides of the fixed frame, a support plate is fixedly connected to the edge of the top of the carrying plate, a detection machine body is fixedly connected to both sides of the top of the support plate, a placement machine body is fixedly connected to the middle of the bottom of the support plate, two slide grooves are provided on one side of the bottom end of the carrying plate, and a collection component is slidably connected inside the slide grooves.

[0007] Preferably, the rebound assembly includes a hollow column, one end of the hollow column is connected to the middle of the limit frame surface, the interior of the hollow column is slidably connected with a connecting rod, one side of the connecting rod surface is fixedly connected to a limit plate, the other side of the connecting rod surface is sleeved with a telescopic spring, and one side of the connecting rod is fixedly connected to the limit plate.

[0008] Preferably, the fixing assembly includes a frame body, one end of the frame body is connected to the middle part of one side of the fixing frame, the top end of the frame body is threadedly connected to a fixing bolt, the inside of the frame body is slidably connected to a fixing rod, one end of the fixing rod is fixedly connected to a fixing plate, and the other end of the fixing rod is fixedly connected to a fixing sheet.

[0009] Preferably, the collecting assembly comprises a connecting strip, both sides of which are slidably connected in a slide groove opened on one side of the bottom end of the supporting plate, the bottom end of the connecting strip is fixedly connected to a collecting box, and the top end of one side of the collecting box is fixedly connected to a handle.

[0010] Preferably, a groove is provided in the middle of the surface of the collection box, and a glass plate is fixedly connected to the inside of the groove.

[0011] Preferably, four corners of the bottom end of the carrying plate are fixedly connected with support columns, and the bottom ends of the support columns are fixedly connected with a support base.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. This kind of multi-head chip mounter with integrated detection and solid crystal, through the setting of rebound component and collection component, can place the chip in the limit frame on the first supporting block when in use, and then use the detection machine body on the top side of the support plate to detect the quality of the chip. If the chip quality is unqualified, the connecting rod is pushed to allow the limit plate to cooperate with the hollow column to compress the telescopic spring. At the same time, the limit plate pushes the unqualified objects in the limit frame through the groove on the supporting plate into the collection box. If the chip is qualified, the chip mounter body is used to perform solid crystal work.

[0014] 2. This multi-head chip mounter with integrated crystal solidification detection can place the chip substrate in a fixed frame on the second supporting block through the setting of the fixed component when in use, and then adjust the position of the fixing rod in the frame according to the chip substrate, so that the fixing plate is close to the chip substrate, and then use the fixing bolts to cooperate with the frame to fix the position of the fixing rod, so as to achieve the effect of preventing the chip substrate from being displaced and affecting the quality of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is an overall schematic diagram of the utility model;

[0016] Figure 2 It is a schematic diagram of the fixing assembly of the utility model;

[0017] Figure 3 It is a schematic diagram of the rebound component of the utility model;

[0018] Figure 4 It is a schematic diagram of the collection component of the utility model.

[0019] In the figure: 1. load-bearing plate; 2. first load-bearing block; 3. limit frame; 4. rebound assembly; 401. hollow column; 402. connecting rod; 403. limit plate; 404. telescopic spring; 405. limit plate; 5. second load-bearing block; 6. fixing frame; 7. fixing assembly; 701. frame body; 702. fixing bolt; 703. fixing rod; 704. fixing plate; 705. fixing plate; 8. support plate; 9. collection assembly; 901. connecting strip; 902. collection box; 903. handle; 10. detection machine body; 11. placement machine body; 12. glass plate; 13. support column. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-Figure 4 As shown, a technical solution provided by the utility model:

[0022] A multi-head chip placement machine for integrated crystal solidification detection includes a carrier plate 1, characterized in that: a first carrier block 2 is fixedly connected to one side of the top of the carrier plate 1, a limited position frame 3 is fixedly connected to the top of the first carrier block 2, a rebound component 4 is connected through the middle of the surface of the limited position frame 3, the rebound component 4 includes a hollow column 401, one end of the hollow column 401 is connected through the middle of the surface of the limited position frame 3, a connecting rod 402 is slidably connected inside the hollow column 401, a limited position piece 403 is fixedly connected to one side of the surface of the connecting rod 402, a telescopic spring 404 is sleeved on the other side of the surface of the connecting rod 402, a limited position plate 405 is fixedly connected to one side of the connecting rod 402, and a second carrier block 406 is fixedly connected to the other side of the top of the carrier plate 1 The carrier block 5, the middle part of the top of the second carrier block 5 is fixedly connected with a fixing frame 6, the middle parts of both sides of the fixing frame 6 are connected through with fixing components 7, the edge of the top of the carrier plate 1 is fixedly connected with a support plate 8, both sides of the top of the support plate 8 are fixedly connected with a detection machine body 10, the middle part of the bottom of the support plate 8 is fixedly connected with a placement machine body 11, one side of the bottom end of the carrier plate 1 is provided with two slide grooves, the inside of the slide grooves is slidably connected with a collecting component 9, the collecting component 9 includes a connecting bar 901, both sides of the connecting bar 901 are slidably connected in the slide grooves provided on one side of the bottom end of the carrier plate 1, the bottom end of the connecting bar 901 is fixedly connected with a collecting box 902, and the top of one side of the collecting box 902 is fixedly connected with a handle 903;

[0023] By setting the rebound component 4 and the collection component 9, the wafer can be placed in the limit frame 3 on the first carrier block 2 when in use, and then the quality of the wafer can be detected by the detection machine body 10 on the top side of the support plate 8. If the quality of the wafer is unqualified, the connecting rod 402 is pushed to allow the limit plate 403 to cooperate with the hollow column 401 to compress the telescopic spring 404. At the same time, the limit plate 405 pushes the unqualified objects in the limit frame 3 through the groove on the carrier plate 1 into the collection box 902. If the wafer is qualified, the chip mounter body 11 is used to perform the crystal bonding work;

[0024] In this embodiment, preferably, the fixing assembly 7 includes a frame 701, one end of the frame 701 is connected to the middle of one side of the fixing frame 6, the top of the frame 701 is threadedly connected with a fixing bolt 702, the inside of the frame 701 is slidably connected with a fixing rod 703, one end of the fixing rod 703 is fixedly connected with a fixing plate 704, and the other end of the fixing rod 703 is fixedly connected with a fixing sheet 705;

[0025] By setting the fixing assembly 7, the patch substrate can be placed in the fixing frame 6 on the second carrier block 5 when in use, and then the position of the fixing rod 703 in the frame 701 is adjusted according to the patch substrate, so that the fixing plate 704 is close to the patch substrate, and then the fixing bolt 702 is used to cooperate with the frame 701 to fix the position of the fixing rod 703, thereby preventing the patch substrate from being displaced and affecting the patch quality;

[0026] In this embodiment, preferably, a groove is provided in the middle of the surface of the collection box 902, and a glass plate 12 is fixedly connected inside the groove;

[0027] In this embodiment, preferably, four corners of the bottom end of the carrying plate 1 are fixedly connected with support columns 13 , and the bottom end of the support column 13 is fixedly connected with a support base.

[0028] When using a multi-head chip mounter with integrated detection and solid crystal in the present embodiment, the chip substrate is placed in the fixed frame 6 on the second supporting block 5, and then the position of the fixing rod 703 in the frame 701 is adjusted according to the chip substrate, so that the fixing plate 704 is close to the chip substrate, and then the position of the fixing rod 703 is fixed by the fixing bolt 702 in cooperation with the frame 701, and then the chip is placed in the limit frame 3 on the first supporting block 2, and then the quality of the chip and the chip substrate is respectively detected by the detection machine body 10 at the top of the support plate 8. If the quality of the chip is unqualified, the connecting rod 402 is pushed to allow the limit plate 403 to cooperate with the hollow column 401 to compress the telescopic spring 404. At the same time, the limit plate 405 pushes the unqualified items in the limit frame 3 through the groove on the supporting plate 1 into the collection box 902. If the chip is qualified, the chip mounter body 11 is used to perform solid crystal work.

[0029] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A multi-head chip mounter with integrated die bonding detection, comprising a carrier plate (1), characterized in that: A first bearing block (2) is fixedly connected to one side of the top of the bearing plate (1), a limit frame (3) is fixedly connected to the top of the first bearing block (2), a rebound component (4) is connected through the middle of the surface of the limit frame (3), a second bearing block (5) is fixedly connected to the other side of the top of the bearing plate (1), a fixed frame (6) is fixedly connected to the middle of the top of the second bearing block (5), and a fixed component (7) is connected through the middle of both sides of the fixed frame (6), a support plate (8) is fixedly connected to the edge of the top of the bearing plate (1), a detection machine body (10) is fixedly connected to both sides of the top of the support plate (8), a placement machine body (11) is fixedly connected to the middle of the bottom of the support plate (8), and two slide grooves are provided on one side of the bottom of the bearing plate (1), and a collection component (9) is slidably connected inside the slide grooves.

2. The multi-head chip mounter with integrated detection and die bonding according to claim 1, characterized in that: The rebound component (4) comprises a hollow column (401), one end of which is connected to the middle part of the surface of the limit frame (3), the interior of the hollow column (401) is slidably connected to a connecting rod (402), one side of the surface of the connecting rod (402) is fixedly connected to a limit plate (403), the other side of the surface of the connecting rod (402) is sleeved with a telescopic spring (404), and one side of the connecting rod (402) is fixedly connected to a limit plate (405).

3. The multi-head chip mounter with integrated detection and die bonding according to claim 1, characterized in that: The fixing assembly (7) comprises a frame (701), one end of the frame (701) is connected to the middle part of one side of the fixing frame (6), the top end of the frame (701) is threadedly connected to a fixing bolt (702), the interior of the frame (701) is slidably connected to a fixing rod (703), one end of the fixing rod (703) is fixedly connected to a fixing plate (704), and the other end of the fixing rod (703) is fixedly connected to a fixing sheet (705).

4. The multi-head chip mounter with integrated detection and die bonding according to claim 1, characterized in that: The collecting assembly (9) comprises a connecting strip (901), the two sides of which are slidably connected to a slide groove provided at one side of the bottom end of the carrying plate (1), the bottom end of the connecting strip (901) is fixedly connected to a collecting box (902), and the top end of one side of the collecting box (902) is fixedly connected to a handle (903).

5. The multi-head chip mounter with integrated detection and die bonding according to claim 4, characterized in that: A groove is provided in the middle of the surface of the collection box (902), and a glass plate (12) is fixedly connected inside the groove.

6. The multi-head chip mounter with integrated detection and die bonding according to claim 1, characterized in that: The four corners of the bottom end of the bearing plate (1) are fixedly connected to support columns (13), and the bottom ends of the support columns (13) are fixedly connected to a support base.

Images