Anti-splashing electrode cap coping device
By installing a copper chip collection shield on the outside of the grinding tool of the electrode cap grinding device, the problem of copper chip splash is solved, and environmental protection and production costs are reduced.
Patent Information
- Application Number
- CN202421190774.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-28
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-05-28
AI Technical Summary
The copper chips generated by the existing electrode cap grinding device cannot be completely enclosed during the grinding process, causing the copper chips to splash and fall to the ground, destroying the environment, and increasing cleaning time and production costs.
A splash-proof electrode cap grinding device is designed to form a closed space by installing a copper chip collection shield on the outside of the grinding tool to ensure that the copper chip is completely enclosed. The copper chip collection shield includes a skeleton assembly, a shield sealing soft material, a fixed plate gold and a copper chip rotation interface.
It effectively prevents copper chip splash, avoids environmental pollution, reduces cleaning and production costs, and ensures the efficiency and quality of the grinding process.
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Figure CN222644217U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of welding equipment, and in particular to an electrode cap grinding device for preventing splashing. Background Art
[0002] The electrode cap is a type of welding electrode, used for welding of resistance welding equipment, such as single-sided spot welders, fixed spot welders, hanging spot welders, manipulator spot welders and robot spot welders. Because it is placed on the electrode connecting rod, it is called an electrode cap. The material is mostly chromium zirconium copper, and there is also dispersed copper. After a certain number of welding, the welding surface of the electrode cap will be deformed and worn, so that the electrode cap needs to be repaired or replaced before continuing welding.
[0003] However, in the process of grinding the electrode cap by the electrode cap grinding device in the prior art, the grinding tool will rotate and cut along the axis of the electrode cap, and the copper chips generated by the cutting will splash under the action of the airflow of the cleaning tool. The copper chips generated by some special material weldments or workstations are sticky or oily and adhere to the tool. After the grinding is completed and the welding clamp is left, the grinder needs to be started again to clean the tool to ensure the quality of the next cutting and shaping. The copper chip collector installed on the conventional electrode cap grinding device cannot completely enclose it, resulting in copper chips splashing and falling to the ground, damaging the environment, and increasing the cleaning time and production cost. Summary of the invention
[0004] The embodiment of the present application provides an anti-splash electrode cap grinding device, which aims to solve the problem that in the prior art method, the copper chips generated by the electrode cap grinding device during the grinding process of the electrode cap cannot be completely contained, causing the copper chips to splash to the ground, damaging the environment, and increasing cleaning time and production costs.
[0005] In a first aspect, the present application discloses an anti-splash electrode cap grinding device, comprising an electrode cap grinding device and a copper chip collecting shield;
[0006] The copper chip collecting shield is fixed to the outside of the grinding tool of the electrode cap grinding device, and the copper chip collecting shield encloses the outside of the grinding tool of the electrode cap grinding device to form a closed space;
[0007] The copper chip collection shield includes a skeleton component, a shield enclosing soft material, a fixed sheet metal and a copper chip transfer interface; the outer surface of the skeleton component is provided with a soft material fixing surface and an interface fixing surface; the fixed sheet metal fixes the shield enclosing soft material to the soft material fixing surface by rivets, and one end of the copper chip transfer interface is fixed to the interface fixing surface.
[0008] The present application discloses an anti-splash electrode cap grinding device, including an electrode cap grinding device and a copper chip collecting shield; the copper chip collecting shield is fixed to the outside of the grinding tool of the electrode cap grinding device, and the copper chip collecting shield encloses the outside of the grinding tool of the electrode cap grinding device to form a closed space; the copper chip collecting shield includes a skeleton component, a shield enclosed soft material, a fixed sheet metal, and a copper chip transfer interface; the outer surface of the skeleton component is provided with a soft material fixing surface and an interface fixing surface; the fixed sheet metal fixes the shield enclosed soft material to the soft material fixing surface by rivets, and one end of the copper chip transfer interface is fixed to the interface fixing surface. By installing the copper chip collecting shield at the grinding position of the electrode cap grinding device, the copper chips generated during the grinding process can be completely enclosed, and the problem of copper chip splashing caused by secondary startup is prevented, and the copper chip splashing and falling to the ground to damage the environment are avoided, and the cleaning time and production cost are reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0010] Figure 1 A schematic diagram of an anti-splash electrode cap grinding device provided in an embodiment of the present application;
[0011] Figure 2 A schematic diagram of a copper chip collecting shield of an anti-splash electrode cap grinding device provided in an embodiment of the present application;
[0012] Figure 3 An exploded view of a copper chip collecting shield of an anti-splash electrode cap grinding device provided in an embodiment of the present application;
[0013] Figure 4 Another schematic diagram of a copper chip collecting shield of an anti-splash electrode cap grinding device provided in an embodiment of the present application;
[0014] Figure 5 A schematic diagram of the copper chip collection shield provided in an embodiment of the present application when in operation;
[0015] Figure 6 A cross-sectional view of the copper chip collection shield provided in an embodiment of the present application when in operation.
[0016] Among them, the reference numerals in the figures are as follows:
[0017] 1. Electrode cap grinding device; 110. Chip blowing pipe; 2. Copper chip collecting shield; 210. Frame assembly; 2101. First frame; 2102. Second frame; 220. Shield sealing soft material; 221. Electrode cap entry and exit position; 2211. Slotting; 2212. Fan-shaped petals; 2213. Round hole; 230. Fixed sheet metal; 240. Copper chip transfer interface; 250. Double indexing pin; 3. Electrode cap. DETAILED DESCRIPTION
[0018] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0019] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.
[0020] It should also be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, the singular forms "a", "an" and "the" are intended to include plural forms unless the context clearly indicates otherwise.
[0021] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.
[0022] See also Figures 1 to 6 , Figure 1 A schematic diagram of an anti-splash electrode cap grinding device provided in an embodiment of the present application; Figure 2 A schematic diagram of a copper chip collecting shield of an anti-splash electrode cap grinding device provided in an embodiment of the present application; Figure 3 An exploded view of a copper chip collecting shield of an anti-splash electrode cap grinding device provided in an embodiment of the present application; Figure 4 Another schematic diagram of a copper chip collecting shield of an anti-splash electrode cap grinding device provided in an embodiment of the present application; Figure 5 A schematic diagram of the copper chip collection shield provided in an embodiment of the present application when in operation;
[0023] Figure 6This is a cross-sectional view of the copper chip collection shield provided in the embodiment of the present application when it is working. Figures 1 to 6 As shown, the embodiment of the present application provides an anti-splash electrode cap grinding device, including an electrode cap grinding device 1 and a copper chip collecting shield 2;
[0024] The copper chip collecting shield 2 is fixed to the outside of the grinding tool of the electrode cap grinding device 1, and the copper chip collecting shield 2 encloses the outside of the grinding tool of the electrode cap grinding device 1 to form a closed space;
[0025] The copper chip collection shield 2 includes a skeleton component 210, a shield enclosing soft material 220, a fixed sheet metal 230 and a copper chip transfer interface 240; the outer surface of the skeleton component 210 is provided with a soft material fixing surface and an interface fixing surface; the fixed sheet metal 230 fixes the shield enclosing soft material 220 to the soft material fixing surface by rivets, and one end of the copper chip transfer interface 240 is fixed to the interface fixing surface.
[0026] In this embodiment, the anti-splash electrode cap grinding device is composed of the electrode cap grinding device 1 and the copper chip collecting shield 2; the copper chip collecting shield 2 is fixed to the outside of the grinding tool of the electrode cap grinding device 1 to surround the outside of the grinding tool of the electrode cap grinding device 1 inside the copper chip collecting shield 2; in this way, when the grinding tool of the electrode cap grinding device 1 is working, the copper chips generated by grinding the electrode cap 3 will be blocked by the copper chip collecting shield 2 to prevent copper chips from splashing to the outside of the copper chip collecting shield 2; copper chips are avoided from splashing and falling to the ground to damage the environment, and the cleaning time and production costs are reduced.
[0027] The copper chip collection shield 2 is mainly composed of the skeleton component 210, the shield enclosing soft material 220, the fixed sheet metal 230 and the copper chip transfer interface 240; the skeleton component 210 is used to support the shield enclosing soft material 220 and fix the copper chip transfer interface 240; the outer surface of the skeleton component 210 is provided with a soft material fixing surface and an interface fixing surface; the fixed sheet metal 230 fixes the shield enclosing soft material 220 to the soft material fixing surface by rivets. Since the shield enclosing soft material 220 is an elastic material, when fixing the shield enclosing soft material 220, it is necessary to press the edges of the shield enclosing soft material 220 by the fixed sheet metal 230 to fix it. One end of the copper chip transfer interface 240 is fixed to the interface fixing surface. The copper chip collection shield 2 can be connected to other devices through the copper chip transfer interface 240 to quickly clean the copper chips in the copper chip collection shield 2.
[0028] In one embodiment, if Figure 2 , Figure 4 , Figure 5 and Figure 6As shown, the shield sealing soft material 220 is provided with an electrode cap entry and exit position 221, and the electrode cap entry and exit position 221 includes a plurality of slots 2211, each of which is arranged in a circular array at 60° intervals with the center of the electrode cap entry and exit position 221 as the axis, forming a plurality of fan-shaped petals 2212.
[0029] In this embodiment, the shield enclosing soft material 220 is provided with the electrode cap inlet and outlet position 221; the electrode cap inlet and outlet position 221 is used to enter the copper scrap collection shield 2 through the electrode cap inlet and outlet position 221 of the shield enclosing soft material 220 when the electrode cap 3 needs to be ground, thereby entering the grinding tool of the electrode cap grinding device 1; the electrode cap inlet and outlet position 221 includes a plurality of slots 2211, each of which is arranged in a circle at intervals of 60° with the center of the electrode cap inlet and outlet position 221 as the axis, so as to form a plurality of fan-shaped petals 2212 on the shield enclosing soft material 220 at the electrode cap inlet and outlet position 221; As the shield sealing soft material 220 is a material with super toughness, when the electrode cap 3 needs to be ground, the electrode cap 3 needs to push open the shield sealing soft material 220 so as to contact the internal grinding tool. At this time, the pressure of the electrode cap 3 acts on the electrode cap entry and exit position 221, and the multiple fan-shaped petals 2212 on the shield sealing soft material 220 are bent inward to make way for the electrode cap 3. After the electrode cap 3 enters, it can also form a new closed space together with the electrode cap 3 to prevent copper chips from splashing out. When the grinding is completed and the electrode cap leaves, the multiple fan-shaped petals 2212 return to their original state due to the elasticity of their own material to achieve a closed space, thereby preventing the residual copper chips from splashing out during the second start-up.
[0030] In one embodiment, if Figure 2 , Figure 4 , Figure 5 and Figure 6 As shown, a circular hole 2213 is provided at one end of the slot 2211 away from the center of the electrode cap entry and exit position 221 , and the circular hole 2213 is communicated with the slot 2211 .
[0031] In this embodiment, the circular hole 2213 is provided at one end of the slot 2211 away from the center of the electrode cap entry and exit position 221, and the circular hole 2213 is connected to the slot 2211; the circular hole 2213 can reduce the length of the connection between the fan-shaped petals 2212 and the protective cover closing soft material 220, so that the fan-shaped petals 2212 are easier to bend inward to make way for the electrode cap 3.
[0032] In one embodiment, if Figure 2 , Figure 4 , Figure 5 and Figure 6As shown, the width of the slot 2211 is 1 mm, and the diameter of the circular hole 2213 is 2 mm-3 mm.
[0033] In this embodiment, the width of the slot 2211 is 1 mm, so that the distance between each adjacent fan-shaped petal 2212 is 1 mm, so that the fan-shaped petal 2212 can be evenly stressed when bending inward; the diameter of the circular hole 2213 is 2 mm-3 mm, and the circular hole 2213 can reasonably reduce the length of the connection between the fan-shaped petal 2212 and the shield closing soft material 220, so that the fan-shaped petal 2212 is easier to bend inward.
[0034] In one embodiment, if Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the shield sealing soft material 220 is made of elastomeric glue, rubber or silicone.
[0035] In this embodiment, the material of the shield enclosing soft material 220 is high-strength rubber, rubber or silicone; the selection of the material of the shield enclosing soft material 220 can be determined according to work requirements; when the material of the shield enclosing soft material 220 is high-strength rubber, high-strength rubber has super toughness and heat resistance, and the one-piece molding will not produce stratification. The pulling and pulling of the electrode cap in and out has little effect on it, and its service life is about 3 times that of PVC soft glass material. It perfectly replaces PVC material and is suitable for operation under conventional working conditions; when the material of the shield enclosing soft material 220 is rubber, rubber has good elasticity and ductility. When making the shield enclosing soft material, it can be proportionally reduced and stretched to the required size during installation, so that the surface of the shield enclosing soft material is taut after installation and the spacing groove length is The length of the shield is shortened to make it almost equal to the diameter of the electrode cap. This method can block 99% of the copper chips in the copper chip collection shield and discharge it along the vacuum valve. The collection effect is good and the service life is long. However, because rubber is not resistant to high temperatures, the shield sealing soft material made of rubber material needs to be used in a station where the electrode cap is fully cooled. When the shield sealing soft material 220 is made of silicone, silicone has very good elasticity, beautiful appearance, high temperature resistance, and an integral structure inside that will not be delaminated, and has a long service life. However, although its soft texture can perfectly rebound to its original position, in actual production, the dusty copper chips at this position will stick to the deformed cross-section, hindering its rebound. Therefore, the shield sealing soft material made of silicone material is suitable for small-pressure grinding and grinding operations, and the copper chips are small and the copper chips are formed into a roller needle-shaped shaping method.
[0036] In one embodiment, if Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, the length of the slot 2211 is greater than the radius of the electrode cap 3 .
[0037] In this embodiment, the length of the slot 2211 is greater than the radius of the electrode cap 3, so that the radius of each of the fan-shaped petals 2212 is greater than the radius of the electrode cap 3, wherein the greater here is slightly greater; in this way, when the plurality of fan-shaped petals 2212 are bent inward to make way for the electrode cap 3, the channel can just fit with the electrode cap 3, allowing the electrode cap to just enter the channel while also preventing the channel from being too large to cause copper chips to splash out.
[0038] In one embodiment, if Figure 1 , Figure 2 and Figure 3 As shown, the copper chip collecting shield 2 further includes a double indexing pin 250 , which passes through the frame assembly 210 and is locked and fixed on the electrode cap grinding device 1 .
[0039] In this embodiment, the copper chip collection shield 2 also includes the double indexing pin 250, which passes through the skeleton assembly 210 and is locked and fixed on the electrode cap grinding device 1, so that the copper chip collection shield 2 is fixed on the electrode cap grinding device 1.
[0040] In one embodiment, if Figure 1 , Figure 2 and Figure 3 As shown, the skeleton assembly 210 includes a first skeleton 2101 and a second skeleton 2102 , and the bottom end of the first skeleton 2101 is connected to the top end of the second skeleton 2102 .
[0041] In this embodiment, the skeleton assembly 210 is composed of the first skeleton 2101 and the second skeleton 2102. Figure 3 Taking the direction in as an example, the bottom end of the first skeleton 2101 is connected to the top end of the second skeleton 2102 to form the skeleton assembly 210, and the skeleton assembly 210 can provide support for the shield enclosing soft material 220 and provide a fixed position for the copper chip transfer interface 240.
[0042] In one embodiment, if Figure 1 , Figure 2 and Figure 3 As shown, the first skeleton 2101 and the second skeleton 2102 are symmetrical about the central axis.
[0043] In this embodiment, the first frame 2101 and the second frame 2102 are symmetrical about the central axis, and the shape of the first frame 2101 and the shape of the second frame 2102 are symmetrical about the central axis. Figure 3Taking the direction in as an example, when the bottom end of the first skeleton 2101 is connected to the top end of the second skeleton 2102, they can fit tightly.
[0044] In one embodiment, if Figure 1 As shown, the other end of the copper chip transfer port 240 is connected to the chip blowing pipe 110 of the electrode cap grinding device 1 .
[0045] In this embodiment, the other end of the copper chip adapter 240 is connected to the chip blowing pipe 110 of the electrode cap grinding device 1, so that the interior of the copper chip collecting shield 2 is connected to the chip blowing pipe 110, and a vacuum valve is also provided in the copper chip collecting shield 2. The chip blowing pipe 110 can be aligned with the electrode cap grinding position through the copper chip adapter 240, ensuring that the copper chips generated during grinding are quickly moved away from the electrode cap under the action of the airflow, and the vacuum valve is used to use the pressure difference to suck out the copper chips, so as to ensure that the copper chips do not accumulate inside the copper chip collecting shield 2.
[0046] The present application discloses an anti-splash electrode cap grinding device, including an electrode cap grinding device and a copper chip collecting shield; the copper chip collecting shield is fixed to the outside of the grinding tool of the electrode cap grinding device, and the copper chip collecting shield encloses the outside of the grinding tool of the electrode cap grinding device to form a closed space; the copper chip collecting shield includes a skeleton component, a shield enclosed soft material, a fixed sheet metal, and a copper chip transfer interface; the outer surface of the skeleton component is provided with a soft material fixing surface and an interface fixing surface; the fixed sheet metal fixes the shield enclosed soft material to the soft material fixing surface by rivets, and one end of the copper chip transfer interface is fixed to the interface fixing surface. By installing the copper chip collecting shield at the grinding position of the electrode cap grinding device, the copper chips generated during the grinding process can be completely enclosed, and the problem of copper chip splashing caused by secondary startup is prevented, and the copper chip splashing and falling to the ground to damage the environment are avoided, and the cleaning time and production cost are reduced.
[0047] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.
Claims
1. A splash-proof electrode cap grinding device, characterized in that: It includes an electrode cap grinding device and a copper chip collecting shield; The copper chip collecting shield is fixed to the outside of the grinding tool of the electrode cap grinding device, and the copper chip collecting shield encloses the outside of the grinding tool of the electrode cap grinding device to form a closed space; The copper chip collection shield comprises a skeleton component, a shield enclosing soft material, a fixed sheet metal and a copper chip transfer interface; the outer surface of the skeleton component is provided with a soft material fixing surface and an interface fixing surface; the fixed sheet metal fixes the shield enclosing soft material to the soft material fixing surface by rivets, and one end of the copper chip transfer interface is fixed to the interface fixing surface; a vacuum valve is also provided inside the copper chip collection shield; The other end of the copper chip transfer interface is connected to the chip blowing pipe of the electrode cap grinding device.
2. The anti-splash electrode cap grinding device according to claim 1, characterized in that: The shield enclosing soft material is provided with an electrode cap entry and exit position, and the electrode cap entry and exit position includes a plurality of slots, each of which is arranged in a circle with a 60° interval around the center of the electrode cap entry and exit position, forming a plurality of fan-shaped petals.
3. The anti-splash electrode cap grinding device according to claim 2, characterized in that: A circular hole is provided at one end of the slot away from the center of the electrode cap entry and exit position, and the circular hole is communicated with the slot.
4. The anti-splash electrode cap grinding device according to claim 3, characterized in that: The width of the slot is 1 mm, and the diameter of the circular hole is 2 mm-3 mm.
5. The anti-splash electrode cap grinding device according to claim 4, characterized in that: The material of the protective cover sealing soft material is elastomeric glue, rubber or silicone.
6. The anti-splash electrode cap grinding device according to claim 5, characterized in that: The length of the slot is greater than the radius of the electrode cap.
7. The anti-splash electrode cap grinding device according to claim 6, characterized in that: The copper chip collecting shield also includes a double indexing pin, which passes through the frame assembly and is locked and fixed on the electrode cap grinding device.
8. The anti-splash electrode cap grinding device according to claim 7, characterized in that: The frame assembly includes a first frame and a second frame, and the bottom end of the first frame is connected to the top end of the second frame.
9. The anti-splash electrode cap grinding device according to claim 8, characterized in that: The first skeleton is symmetrical to the second skeleton through its central axis.