MEMS sensor packaging structure and MEMS sensor

Abstract

The embodiment of the utility model discloses an MEMS sensor packaging structure and an MEMS sensor, and the MEMS sensor packaging structure comprises a substrate whole piece which comprises a plurality of substrate units which are connected with each other, and the substrate whole piece is of an integrated structure; the shell whole piece is connected with the substrate whole piece, and the shell whole piece is of an integrated structure; the whole shell comprises a plurality of shell units which are connected with one another, the shell units and the substrate units are in one-to-one correspondence, and a cavity is defined by the shell units and the substrate units; the shell unit comprises a plurality of sensor chips, the sensor chips and the substrate units are arranged on the substrate units in a one-to-one correspondence mode, and the sensor chips are contained in the cavity; wherein the whole shell is made of a plastic material. According to the utility model, the production efficiency and the consistency of products are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of micro-electromechanical sensors, in particular to a MEMS sensor packaging structure and a MEMS sensor. Background Art

[0002] Micro-Electro-Mechanical System (MEMS), also known as micro-electro-mechanical system, micro-system, micro-machine, etc., refers to devices with a size of a few millimeters or even smaller. A MEMS is a micro device or system that integrates micro-sensors, micro-actuators, micro-mechanical structures, micro-power sources, signal processing and control circuits, high-performance electronic integrated devices, interfaces, and communications.

[0003] In the MEMS sensor packaging process, it is necessary to cut a substrate with several sensor chips into several substrate units with single sensor chips, and then combine the housing with the substrate units one by one to form a MEMS sensor.

[0004] However, the packaging process is complicated and cumbersome, and has become a bottleneck in improving the manufacturing efficiency of MEMS sensors. Utility Model Content

[0005] The embodiments of the utility model provide a MEMS sensor packaging structure and a MEMS sensor to improve production efficiency and product consistency.

[0006] In order to solve the above technical problems, the embodiments of the present utility model disclose the following technical solutions:

[0007] On the one hand, a MEMS sensor packaging structure is provided, comprising:

[0008] A base plate assembly, which includes a plurality of base plate units connected to each other, and the base plate assembly is an integrated structure;

[0009] The entire shell is connected to the entire substrate, and the entire shell is an integrated structure; the entire shell includes a plurality of shell units connected to each other, the shell units correspond to the substrate units one by one, and the shell units and the substrate units are arranged to form a cavity;

[0010] A sensor chip, wherein a plurality of the sensor chips are arranged on the substrate unit in a one-to-one correspondence with the substrate unit, and the sensor chips are accommodated in the cavity;

[0011] Wherein, the entire shell is made of plastic.

[0012] In addition to or as an alternative to one or more of the features disclosed above, the housing unit comprises: a back plate portion and a connecting portion; the back plate portion is spaced apart from the substrate unit in the thickness direction of the entire substrate, and the connecting portion connects the back plate portion and the substrate unit; adjacent housing units are connected via the connecting portion;

[0013] The outer edge of one end of the connecting portion close to the entire substrate has a recessed portion, and the recessed portion adjacent to the connecting portion and the entire substrate are surrounded to form a cavity;

[0014] In addition to or as an alternative to one or more of the features disclosed above, an end surface of the connecting portion facing the entire base plate is a serrated surface or a wavy surface.

[0015] In addition to or as an alternative to one or more of the features disclosed above, a first thermal expansion coefficient α1 of the entire housing and a second thermal expansion coefficient α2 of the entire substrate satisfy 0≤|α1-α2|≤30ppm / K.

[0016] In addition to or as an alternative to one or more of the features disclosed above, a metal shielding layer is provided on a surface of the back plate portion that is away from the entire substrate.

[0017] In addition to or as an alternative to one or more of the features disclosed above, the back plate portion is provided with at least one sound hole communicating with the cavity.

[0018] In addition to or as an alternative to one or more of the features disclosed above, the connecting portion is connected to the entire substrate via a connecting agent, and the connecting agent includes glue, silver paste or solder paste.

[0019] In addition to one or more of the features disclosed above, or as an alternative, a surface of the substrate piece on one side facing the shell piece is provided with a positioning groove recessed along the thickness direction of the substrate piece, the positioning groove is adapted to the connecting portion, and the connecting portion is at least partially embedded in the positioning groove.

[0020] In addition to or as an alternative to one or more of the features disclosed above, the substrate unit is provided with a through hole penetrating along a thickness direction of the substrate unit, and the sensor chip is arranged on the through hole.

[0021] On the other hand, a MEMS sensor is also provided, comprising:

[0022] Baseboard unit;

[0023] A shell unit is arranged on one side of the substrate unit, and the shell unit and the substrate unit are arranged to form a cavity; the shell unit comprises: a back plate portion and a connecting portion; the back plate portion is arranged to be spaced apart from the substrate unit in the thickness direction of the substrate unit, and the connecting portion connects the back plate portion and the substrate unit; adjacent shell units are connected via the connecting portion;

[0024] A sensor chip, which is arranged on the substrate unit, and the sensor chip is accommodated in the cavity;

[0025] Wherein, the outer edge of one end of the connecting portion close to the entire substrate has a recessed portion.

[0026] One of the above technical solutions has the following advantages or beneficial effects: the present application can synchronously form a packaging structure composed of several MEMS sensors by integrally connecting an integrated substrate piece and an integrated shell piece, and then synchronously form several MEMS sensors after cutting the packaging structure, thereby eliminating the process steps of installing separate shells on the substrate one by one in the prior art, thereby improving manufacturing efficiency and product consistency.

[0027] The material of the entire shell of the present application adopts the same plastic material as the entire substrate, so that the thermal expansion coefficient of the entire shell is close to or even the same as the thermal expansion coefficient of the entire substrate, which greatly reduces the thermal stress to which the entire substrate and the entire shell are subjected during the connection process and the internal stress after the connection, thereby reducing the influence of stress on the sensor chip and thereby improving the accuracy and reliability of the product.

[0028] The present application forms a cavity between the recessed portion of the adjacent connecting portion and the entire substrate. During the process of cutting and separating the shell unit and the substrate unit, the cutting tool passes through the cavity without passing through the connecting surface between the connecting portion and the substrate unit, so as to avoid the impact of the cutting on the shell unit and the substrate unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The technical solutions and other beneficial effects of the present invention will be made apparent by describing in detail the specific embodiments of the present invention in conjunction with the accompanying drawings.

[0030] Figure 1 It is a structural schematic diagram of a MEMS sensor packaging structure provided according to the first embodiment of the utility model.

[0031] Figure 2 It is a bottom view of the entire housing in a MEMS sensor packaging structure provided according to the first embodiment of the utility model.

[0032] Figure 3 It is a structural schematic diagram of a MEMS sensor provided according to the first embodiment of the utility model.

[0033] Figure 4 It is a structural schematic diagram of a MEMS sensor provided according to an embodiment of the utility model.

[0034] Figure 5 It is a structural schematic diagram of a MEMS sensor packaging structure provided according to the second embodiment of the utility model.

[0035] Figure 6 It is a structural schematic diagram of the entire housing in a MEMS sensor packaging structure provided according to the third embodiment of the present utility model.

[0036] Figure 7 It is a structural schematic diagram of a MEMS sensor packaging structure provided according to the fourth embodiment of the utility model.

[0037] Figure 8 It is a structural schematic diagram of a MEMS sensor packaging structure provided according to the fifth embodiment of the present utility model.

[0038] In the figure: 10-housing as a whole; 100-housing unit; 110-back plate; 111-sound hole; 120-connecting part; 121-recessed part; 1201-cavity; 1202-end surface; 101-cavity;

[0039] 20-substrate whole piece; 200-substrate unit; 210-through hole; 220-positioning groove;

[0040] 300-connector;

[0041] 400 - sensor chip; 410 - wire; 401 - back cavity. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and beneficial effects of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described in this specification are only for explaining the utility model, and are not intended to limit the utility model.

[0043] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present utility model, the meaning of "multiple" refers to two or more, unless otherwise clearly and specifically defined.

[0044] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0045] In the present utility model, unless otherwise clearly stipulated and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0046] See also Figure 1 , Figure 1The schematic diagram of the structure of a MEMS sensor packaging structure provided by an embodiment of the utility model is shown. A MEMS sensor packaging structure provided by an embodiment of the present application includes a housing component 10, a substrate component 20 and a sensor chip 400. The substrate component 20 is a plate-like structure, which includes a plurality of interconnected substrate units 200, and the substrate component 20 is an integrated structure. The housing component 10 is connected to the substrate component 20, and the housing component 10 includes a plurality of interconnected housing units 100, and the housing units 100 correspond to the substrate units 200 one by one, and the housing units 100 and the substrate units 200 are surrounded to form a cavity 101. The housing component 10 is an integrated structure. A plurality of sensor chips 400 are arranged on the substrate unit 200 in a one-to-one correspondence and accommodated in the cavity 101, and the sensor chips 400 are electrically connected to the substrate unit 200 through wires 410. The substrate unit 200, the housing unit and the sensor chip 400 are configured to form a MEMS sensor, and the MEMS sensor packaging structure of the present application includes a plurality of interconnected MEMS sensors. The substrate unit 200 is provided with a through hole 210 penetrating along the thickness thereof. The sensor chip 400 is disposed on the through hole 210 . The sensor chip 400 has a back cavity 401 therein. The back cavity 401 is connected to the through hole 210 so as to be connected to the external environment.

[0047] The present application can synchronously form a packaging structure composed of several MEMS sensors by integrally connecting an integrated substrate whole piece 20 and an integrated shell whole piece 10. After the packaging structure is subsequently cut, several MEMS sensors can be synchronously formed, eliminating the process steps of installing separate shells on the substrate one by one in the prior art, thereby improving manufacturing efficiency and improving product consistency.

[0048] In this embodiment, the sensor chip 400 includes a detection structure for detecting air pressure. In other embodiments, the sensor chip 400 includes a detection structure for detecting other physical quantities such as angular velocity, acceleration, and sound pressure, so that the MEMS sensor structure of the present application is other MEMS sensors such as angular velocity sensors, acceleration sensors, or microphone sensors, which are not specifically limited here.

[0049] Combination Figure 2 As shown, Figure 2The bottom view of the entire housing 10 in a MEMS sensor packaging structure provided according to an embodiment of the utility model is shown. The housing unit 100 includes a back plate portion 110 and a connecting portion 120. The back plate portion 110 is a planar structure. The back plate portion 110 is arranged on one side of the substrate unit 200 and is spaced apart from the substrate unit 200. The connecting portion 120 is an annular structure. The back plate portion 110 is connected to the substrate unit 200 through the connecting portion 120. Adjacent housing units 100 are connected to each other through the connecting portion 120. The connecting portion 120 has an end face 1202 facing the substrate unit 200. The connecting portion 120 is connected to the substrate unit 200 at the end face 1202 through a connecting agent 300. Further, the connecting agent 300 includes glue, silver paste or solder paste; the connecting portion 120 is bonded and connected to the substrate unit 200 through glue, or the connecting portion 120 is welded and connected to the substrate unit 200 through silver paste or solder paste. The outer edge of the end surface 1202 is provided with a recessed portion 121 recessed toward the back plate portion 110, the recessed portions 121 of adjacent connecting portions 120 are connected to each other and surround the substrate unit 200 to form a cavity 1201, and there is a gap between adjacent connecting portions 120 and their corresponding connecting agent 300. In the thickness direction of the substrate whole piece 20, the area covered by the orthographic projection of the gap on the substrate whole piece 20 is the cutting road area, and the cutting road area is used for cutting the substrate whole piece 20 in the subsequent separation process of the MEMS sensor.

[0050] Combination Figure 3 As shown, in the subsequent MEMS sensor separation process, the MEMS sensor packaging structure of the present application is cut to form a number of independent MEMS sensors, and the cutting tool cuts the entire substrate 20 and the entire shell 10 along the cutting road area. Because the connector 300 of adjacent MEMS sensors has a gap, the cutting tool will not contact the connector 300 when passing through the cutting road area and the cavity 1201, thereby avoiding the cutting process from affecting the connection effect of the shell unit and the substrate unit 200.

[0051] The present application can simultaneously form a plurality of MEMS sensors by connecting the integrated substrate whole piece 20 with the integrated housing whole piece 10, so as to improve manufacturing efficiency. The recessed portion 121 of the adjacent connecting portion 120 forms a cavity 1201 with the substrate whole piece 20, and the cutting tool passes through the cavity 1201 during the process of cutting and separating the housing unit and the substrate unit 200, but does not pass through the connecting surface between the connecting portion 120 and the substrate unit 200, so as to avoid the influence of the cutting on the housing unit 100 and the substrate unit 200.

[0052] It should be noted that the recessed portion 121 is disposed at the outer edge of at least a portion of the connecting portion 120 connected to the adjacent MEMS sensor. Figure 2 The four directions of up, down, left, and right are combined Figure 4 As shown, the connection part 120 in the MEMS sensor arranged at the four corners of the substrate whole piece 20 has recessed parts 121 on only two outer edges, while the connection part 120 in the MEMS sensor arranged at the edge of the substrate whole piece 20 but not at the four corners has recessed parts 121 on three outer edges.

[0053] Specifically, the material of the entire shell 10 is plastic material, and the method of forming the entire shell 10 includes integral injection molding. Further, the first thermal expansion coefficient α1 of the entire shell 10 and the second thermal expansion coefficient α2 of the entire substrate 20 satisfy 5≤α1≤40ppm / K, 10≤α2≤60ppm / K, and 0≤|α1-α2|≤30ppm / K. In the prior art, the thermal expansion coefficient of the metal shell generally used is about 20ppm / K. The thermal expansion coefficient of the entire shell 10 made of plastic material in the present application is closer to the thermal expansion coefficient of the entire substrate 20 than that of the metal shell, which can reduce the thermal stress suffered by the entire substrate 20 and the entire shell 10 during the connection process and the internal stress after the connection, thereby reducing the influence of the stress on the sensor chip 400, so as to improve the reliability of the MEMS sensor and the accuracy of the detection results.

[0054] Furthermore, a metal shielding layer is provided on the surface of the back plate portion 110 facing away from the substrate unit 20, so that the housing unit 100 with the metal shielding layer has the same shielding performance as a housing made of metal material, so as to improve the anti-interference performance of the MEMS sensor. Furthermore, the method of forming the metal shielding layer includes: whole-plate chemical plating, electroplating, spraying, sputtering and other plating processes.

[0055] Reference Figure 5 As shown, Figure 5 The schematic diagram of the structure of a MEMS sensor packaging structure according to the second embodiment of the utility model is shown. In the second embodiment, a positioning groove 220 corresponding to the connecting part 120 in the shell whole 10 is provided on the surface of the substrate whole 20 facing the shell whole 10. The size of the positioning groove 220 is adapted to the size of the connecting part 120. The connecting part 120 is at least partially accommodated in the positioning groove 220, so as to facilitate the positioning of the shell certificate when the shell whole 10 is connected to the substrate whole 20, and the positioning accuracy is improved while the manufacturing efficiency is further improved. The connecting part 120 is connected to the positioning groove 220 through a connecting agent 300. The groove wall of the connecting groove increases the contact area between the connecting part 120 and the substrate whole 20. The gap between the groove wall of the connecting groove and the side wall of the connecting part 120 is filled with a connecting agent 300, so that the connection between the shell whole 10 and the substrate whole 20 is more reliable, and the connection effect between the shell whole 10 and the substrate whole 20 is further improved.

[0056] Reference Figure 6As shown, Figure 6 The schematic diagram of the structure of the housing piece 10 in a MEMS sensor packaging structure provided according to the third embodiment of the utility model is shown. In the third embodiment, the end surface 1202 where the connecting portion 120 is connected to the substrate piece 20 is a serrated surface, so as to increase the connection area between the end surface 1202 of the connecting portion 120 and the substrate piece 20, so as to improve the connection effect between the housing piece 10 and the substrate piece 20. In other embodiments, the end surface 1202 of the connecting portion 120 is a wavy surface or a concave-convex grid surface or other shapes, which are not specifically limited here.

[0057] Reference Figure 7 As shown, Figure 7 The schematic diagram of the structure of a MEMS sensor packaging structure provided according to the fourth embodiment of the utility model is shown. In the fourth embodiment, the sensor chip 400 includes a detection structure for detecting sound pressure, and a sound hole 111 is provided on the back plate portion 110 of the housing and passes through the back plate portion 110 along the thickness thereof. In this embodiment, the number of the sound hole 111 is one, and its shape is circular.

[0058] In other embodiments, the number of the sound hole 111 may be more than one, and the shape of the sound hole 111 may be square, triangle or other shapes, which are not specifically limited herein.

[0059] Reference Figure 8 As shown, Figure 8The schematic diagram of the structure of a MEMS sensor packaging structure provided according to the fifth embodiment of the present utility model is shown. In the fifth embodiment, the housing unit 10 includes a plurality of housing units 100 connected to each other, and the substrate unit 20 includes a plurality of substrate units 200 connected to each other. The housing unit 10 and the substrate unit 20 are both integrated structures. A plurality of sensor chips 400 are arranged on the substrate unit 200 in a one-to-one correspondence and accommodated in the cavity 101. The sensor chips 400 are electrically connected to the substrate unit 200 through wires 410. The substrate unit 200, the housing unit and the sensor chip 400 are configured to form a MEMS sensor. The MEMS sensor packaging structure of the present application includes a plurality of MEMS sensors connected to each other. The housing unit 100 corresponds to the substrate unit 200 in a one-to-one correspondence. The housing unit 100 and the substrate unit 200 are arranged to form a cavity 101. The housing unit 100 includes a back plate portion 110 and a connecting portion 120. The back plate portion 110 is a planar structure, and the back plate portion 110 is arranged on one side of the substrate unit 200 and is spaced apart from the substrate unit 200. The connecting portion 120 is an annular structure, and the back plate portion 110 is connected to the substrate unit 200 through the connecting portion 120. The end surface 1202 of the connecting portion 120 is connected to the substrate unit 200 through the connecting agent 300. Compared with the first embodiment, the connecting portion 120 in this embodiment does not have a recessed portion 121, and the corresponding housing 10 does not have a cavity 1201 formed by the recessed portion 121.

[0060] On the other hand, the present application also provides a MEMS sensor, referring to Figure 3 As shown, the MEMS sensor includes: a substrate unit 200, a shell unit 100 and a sensor chip 400; the substrate unit 200 is a plate-like structure; the shell unit 100 is arranged on one side of the substrate unit 200, and the shell unit 100 and the substrate unit 200 are surrounded to form a cavity 101; the shell unit 100 includes: a back plate portion 110 and a connecting portion 120; the back plate portion 110 is spaced apart from the substrate unit 200 in the thickness direction of the substrate unit 200, and the connecting portion 120 connects the back plate portion 110 and the substrate unit 200; adjacent shell units 100 are connected through the connecting portion 120; the sensor chip 400 is arranged on the substrate unit 200, and the sensor chip 400 is accommodated in the cavity 101; wherein, the outer edge of one end of the connecting portion 120 close to the substrate unit 20 has a recessed portion 121.

[0061] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0062] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A MEMS sensor packaging structure, characterized in that: include: A base plate assembly, which includes a plurality of base plate units connected to each other, and the base plate assembly is an integrated structure; The entire shell is connected to the entire substrate, and the entire shell is an integrated structure; the entire shell includes a plurality of shell units connected to each other, the shell units correspond to the substrate units one by one, and the shell units and the substrate units are arranged to form a cavity; A sensor chip, wherein a plurality of the sensor chips are arranged on the substrate unit in a one-to-one correspondence with the substrate unit, and the sensor chips are accommodated in the cavity; Wherein, the entire shell is made of plastic.

2. The MEMS sensor packaging structure according to claim 1, characterized in that: The housing unit comprises: a back plate portion and a connecting portion; the back plate portion is spaced apart from the substrate unit in the thickness direction of the entire substrate, and the connecting portion connects the back plate portion and the substrate unit; adjacent housing units are connected via the connecting portion; The outer edge of one end of the connecting portion close to the entire substrate piece is provided with a recessed portion, and the recessed portion adjacent to the connecting portion and the entire substrate piece are surrounded to form a cavity.

3. The MEMS sensor packaging structure according to claim 2, characterized in that: The end surface of the connecting portion facing the entire substrate is a serrated surface or a wavy surface.

4. The MEMS sensor packaging structure according to claim 1, characterized in that: The first thermal expansion coefficient α1 of the entire housing and the second thermal expansion coefficient α2 of the entire substrate satisfy 0≤|α1-α2|≤30ppm / K.

5. The MEMS sensor packaging structure according to claim 2, characterized in that: A metal shielding layer is provided on a surface of the back plate portion that is away from the entire substrate.

6. The MEMS sensor packaging structure according to claim 2, characterized in that: The back plate portion is provided with at least one sound hole communicating with the cavity.

7. The MEMS sensor packaging structure according to claim 2, characterized in that: The connecting portion is connected to the entire substrate via a connecting agent, and the connecting agent includes glue, silver paste or solder paste.

8. The MEMS sensor packaging structure according to claim 2, characterized in that: A positioning groove recessed along the thickness direction of the entire substrate piece is provided on one side surface of the entire substrate piece facing the entire housing piece. The positioning groove is matched with the connecting portion, and the connecting portion is at least partially embedded in the positioning groove.

9. The MEMS sensor packaging structure according to claim 1, characterized in that: The substrate unit is provided with a through hole penetrating along the thickness direction of the substrate unit, and the sensor chip is arranged on the through hole.

10. A MEMS sensor, characterized in that: include: Baseboard unit; A housing unit is arranged on one side of the substrate unit, and the housing unit and the substrate unit are arranged to form a cavity; The housing unit comprises: a back plate portion and a connection portion; the back plate portion is spaced apart from the substrate unit in the thickness direction of the substrate unit, and the connection portion connects the back plate portion and the substrate unit; adjacent housing units are connected via the connection portion; A sensor chip, which is arranged on the substrate unit, and the sensor chip is accommodated in the cavity; Wherein, the outer edge of one end of the connecting portion close to the entire substrate has a recessed portion.

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