Drying device for wafer processing

Abstract

The utility model relates to a circular crystal processing drying device with a fixing mechanism, in particular to a circular crystal processing drying device which comprises a drying box, a hot air box is fixedly connected to the right side face of the drying box, a drying assembly is arranged on the upper surface of the drying box, and a servo motor c drives two threaded sleeves b and two movable frames to be close to each other. The distance between the two moving frames is adjusted according to the length of a wafer, the two moving frames get close to each other to clamp the wafer, a servo motor b drives four rubber clamping sleeves to get close to each other to fix the wafer, a servo motor a drives a gear b and a gear a to rotate, and the gear a rotates to drive a shunt pipe, a fixed frame, the moving frames and the wafer to rotate. According to the wafer drying device, hot air discharged into the drying box through the drying assembly is matched to dry the wafer, meanwhile, the flow dividing pipe rotates to drive the wafer to rotate to throw away water stains attached to the surface of the wafer, the wafer drying efficiency is improved, and the problems that an existing device is low in drying speed and efficiency are solved.

Description

Technical Field

[0001] The utility model relates to a drying device for round wafer processing, in particular to a drying device for round wafer processing with a fixing mechanism. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer.

[0003] In the process of preparing the wafer, it needs to be cleaned and dried. The existing drying method usually lays the wafer flat on a placement plate, then dries it with warm air, and then turns the wafer over to the other side and dries it again. The drying speed is slow and the efficiency is low. Utility Model Content

[0004] In order to solve the problems raised in the above background technology, the utility model provides a drying device for round wafer processing.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a drying device for round wafer processing, comprising a drying box, a hot air box is fixedly connected to the right side of the drying box, a drying component is arranged on the upper surface of the drying box, a shunt pipe is installed in the bearing on the upper surface of the drying box, a rotating component is arranged on the outer surface of the shunt pipe, a plurality of fixed frames are symmetrically fixed to the outer surface of the shunt pipe, a second fixed component is arranged inside the fixed frame, the front side of the fixed frame is slidably connected to the back sides of two movable frames respectively, a first fixed component is arranged inside the movable frame, a plurality of exhaust holes are symmetrically opened on the outer surface of the shunt pipe, and the lower surface of the drying box is connected to one end of the waste pipe.

[0006] Preferably, the rotating assembly includes a gear a installed on the outer surface of the shunt pipe, the outer surface of the gear a is meshed with the outer surface of the gear b, the upper surface of the gear b is fixedly connected to the output shaft of the servo motor a, and the servo motor a is installed on the upper surface of the drying box.

[0007] Preferably, the drying component includes a high-temperature air pump installed on the upper surface of the drying box, the suction end of the high-temperature air pump is connected to the upper surface of the hot air box through an suction pipe, the exhaust end of the high-temperature air pump is connected to one end of the exhaust pipe, and the other end of the exhaust pipe is connected to the top end of the diversion pipe through a rotating joint.

[0008] Preferably, a fan is installed on the lower surface of the hot air box, and a heating plate and a filter are installed inside the hot air box from top to bottom.

[0009] Preferably, the first fixing component includes a servo motor b on the front side of the inner wall of the mobile frame, the output shaft of the servo motor b is fixedly connected to one end of the front side of the screw a, one end of the back side of the screw a is fixedly connected to one end of the front side of the screw b, one end of the back side of the screw b is rotatably connected to the back side of the inner wall of the mobile frame, the outer surfaces of the screw a and the screw b are both threadedly connected with threaded sleeves a, and the upper surfaces of the two threaded sleeves a are respectively fixed with two rubber ferrules.

[0010] Preferably, the second fixing assembly includes a screw rod d rotatably connected to the lower surface of the inner wall of the fixing frame, the top end of the screw rod d is fixedly connected to the bottom end of the screw rod c, the top end of the screw rod c passes through the upper surface of the inner wall of the fixing frame and is fixedly connected to the output shaft of the servo motor c, the servo motor c is installed on the upper surface of the fixing frame, the outer surfaces of the screw rod d and the screw rod c are both threadedly connected with threaded sleeves b, and the front faces of the two threaded sleeves b are respectively fixedly connected to the back faces of the two movable frames.

[0011] Preferably, two scrapers are fixedly connected to the left and right side surfaces of the diverter pipe respectively, and the left side surface of the scraper is slidably connected to the left side surface of the inner wall of the drying box.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] The utility model drives two threaded sleeves b and two moving frames to approach each other through a servo motor c, adjusts the distance between the two moving frames according to the length of the wafer, the two moving frames approach each other to clamp the wafer, the servo motor b drives four rubber clamping sleeves to approach each other to fix the wafer, the servo motor a drives the gear b and the gear a to rotate, the rotation of the gear a drives the shunt pipe, the fixed frame, the moving frame and the wafer to rotate, and the hot air discharged into the drying box by the drying component is used to dry the wafer. At the same time, the rotation of the shunt pipe drives the wafer to rotate to throw out the water stains adhered to the surface thereof, thereby improving the drying efficiency of the wafer and solving the problems of slow drying speed and low efficiency of the existing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0015] Figure 1 It is a schematic diagram of the structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the cross-sectional structure of the utility model in the front view;

[0017] Figure 3 It is a right side cross-sectional structural schematic diagram of the hot air box of the utility model;

[0018] In the figure: 1. Drying box; 2. Hot air box; 3. Diverter pipe;

[0019] Rotating assembly: 41, gear a; 42, gear b; 43, servo motor a;

[0020] Drying components: 51, high temperature air pump; 52, exhaust pipe; 53, exhaust pipe; 6, fan; 7, filter; 8, heating plate; 9, fixed frame; 10, exhaust hole; 11, waste pipe; 12, mobile frame;

[0021] First fixing assembly: 131, servo motor b; 132, screw a; 133, screw b; 134, threaded sleeve a; 135, rubber sleeve;

[0022] 14. Scraper;

[0023] The second fixing component: 151, servo motor c; 152, screw c; 153, screw d; 154, threaded sleeve b. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Example

[0026] See also Figure 1-3 The utility model provides the following technical solutions: a drying device for round wafer processing, comprising a drying box 1, a hot air box 2 is fixedly connected to the right side of the drying box 1, a drying component is arranged on the upper surface of the drying box 1, a shunt pipe 3 is installed in the bearing on the upper surface of the drying box 1, a rotating component is arranged on the outer surface of the shunt pipe 3, a plurality of fixed frames 9 are symmetrically fixedly connected to the outer surface of the shunt pipe 3, a second fixed component is arranged inside the fixed frame 9, the front side of the fixed frame 9 is slidably connected to the back side of two movable frames 12 respectively, a first fixed component is arranged inside the movable frame 12, a plurality of exhaust holes 10 are symmetrically opened on the outer surface of the shunt pipe 3, and the lower surface of the drying box 1 is connected to one end of a waste pipe 11.

[0027] Specifically, the rotating assembly includes a gear a41 installed on the outer surface of the shunt pipe 3, the outer surface of the gear a41 is meshed with the outer surface of the gear b42, the upper surface of the gear b42 is fixedly connected to the output shaft of the servo motor a43, and the servo motor a43 is installed on the upper surface of the drying box 1;

[0028] The servo motor a43 drives the gear b42 and the gear a41 to rotate. The rotation of the gear a41 drives the shunt pipe 3, the fixed frame 9, the movable frame 12 and the wafer to rotate. The hot air discharged into the drying box 1 by the drying component is used to dry the wafer. At the same time, the rotation of the shunt pipe 3 drives the wafer to rotate to throw away the water stains adhered to its surface, thereby increasing the drying efficiency of the heated wafer.

[0029] Specifically, the drying assembly includes a high-temperature air pump 51 installed on the upper surface of the drying box 1, the air extraction end of the high-temperature air pump 51 is connected to the upper surface of the hot air box 2 through the air extraction pipe 52, the exhaust end of the high-temperature air pump 51 is connected to one end of the exhaust pipe 53, and the other end of the exhaust pipe 53 is connected to the top of the shunt pipe 3 through a rotating joint;

[0030] The high-temperature air pump 51 extracts the hot air inside the hot air box 2 through the exhaust pipe 52, discharges it into the diverter pipe 3 through the exhaust pipe 53, and discharges it into the drying box 1 through the exhaust hole 10 opened on the outer surface of the diverter pipe 3, thereby increasing the temperature inside the drying box 1.

[0031] Specifically, a fan 6 is installed on the lower surface of the hot air box 2, and a heating plate 8 and a filter screen 7 are installed inside the hot air box 2 from top to bottom;

[0032] The fan 6 draws external air and discharges it into the hot air box 2 through the exhaust port. The filter 7 filters the dust contained in the air to prevent the dusty air from contaminating the wafer. The air passes through the heating plate 8, and the heating plate 8 heats the air to form hot air.

[0033] Specifically, the first fixing assembly includes a servo motor b131 on the front side of the inner wall of the mobile frame 12, the output shaft of the servo motor b131 is fixedly connected to one end of the front side of the screw a132, one end of the back side of the screw a132 is fixedly connected to one end of the front side of the screw b133, one end of the back side of the screw b133 is rotatably connected to the back side of the inner wall of the mobile frame 12, the outer surfaces of the screw a132 and the screw b133 are both threadedly connected with threaded sleeves a134, and the upper surfaces of the two threaded sleeves a134 are respectively fixedly connected with two rubber ferrules 135;

[0034] The servo motor b131 drives the screw a132 and the screw b133 to rotate. The rotation of the screw a132 and the screw b133 drives the two threaded sleeves a134 and the two rubber ferrules 135 to approach each other. The four rubber ferrules 135 approach each other to fix the wafer. The internal shape of the rubber ferrule 135 is arc-shaped, which is convenient for fixing the wafer.

[0035] Specifically, the second fixing assembly includes a screw rod d153 rotatably connected to the lower surface of the inner wall of the fixing frame 9, the top end of the screw rod d153 is fixedly connected to the bottom end of the screw rod c152, the top end of the screw rod c152 passes through the upper surface of the inner wall of the fixing frame 9 and is fixedly connected to the output shaft of the servo motor c151, the servo motor c151 is installed on the upper surface of the fixing frame 9, the outer surfaces of the screw rod d153 and the screw rod c152 are both threadedly connected with threaded sleeves b154, and the front surfaces of the two threaded sleeves b154 are respectively fixedly connected to the back surfaces of the two moving frames 12;

[0036] The servo motor c151 drives the screw c152 and the screw d153 to rotate. The rotation of the screw c152 and the screw d153 drives the two threaded sleeves b154 and the two movable racks 12 to approach each other. The distance between the two movable racks 12 is adjusted according to the length of the wafer. At the same time, the two movable racks 12 approach each other to clamp the wafer.

[0037] Specifically, two scrapers 14 are fixedly connected to the left and right sides of the diverter pipe 3, and the left side of the scraper 14 is slidably connected to the left side of the inner wall of the drying box 1;

[0038] The rotation of the shunt pipe 3 drives the scraper 14 to slide around the inner wall of the drying box 1 , scraping off water stains and the like adhered to the inner wall of the drying box 1 by the wafers, and discharging them through the waste pipe 11 .

[0039] The working principle and use process of this utility model:

[0040] The utility model, when in use:

[0041] The servo motor c151 drives the screw rod c152 and the screw rod d153 to rotate. The rotation of the screw rod c152 and the screw rod d153 drives the two threaded sleeves b154 and the two moving frames 12 to approach each other. The distance between the two moving frames 12 is adjusted according to the length of the wafer. At the same time, the two moving frames 12 approach each other to clamp the wafer. The servo motor b131 drives the screw rod a132 and the screw rod b133 to rotate. The rotation of the screw rod a132 and the screw rod b133 drives the two threaded sleeves a134 and the two rubber ferrules 135 to approach each other. The four rubber ferrules 135 The wafers are fixed close to each other, and the servo motor a43 drives the gear b42 and the gear a41 to rotate. The rotation of the gear a41 drives the shunt pipe 3, the fixed frame 9, the movable frame 12 and the wafer to rotate. At the same time, the rotation of the shunt pipe 3 drives the wafer to rotate to throw off the water stains adhered to its surface. The high-temperature air pump 51 draws the hot air inside the hot air box 2 through the exhaust pipe 52, and discharges it into the shunt pipe 3 through the exhaust pipe 53, and then discharges it into the drying box 1 through the exhaust hole 10 opened on the outer surface of the shunt pipe 3, so as to increase the temperature inside the drying box 1 and cooperate with the drying component to dry the wafer.

[0042] The circuits, electronic components and modules involved are all prior art and can be fully implemented by those skilled in the art. Needless to say, the content protected by this utility model does not involve improvements to software and methods.

[0043] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A drying device for wafer processing, comprising a drying box (1), characterized in that: The right side of the drying box (1) is fixedly connected to a hot air box (2); the upper surface of the drying box (1) is provided with a drying assembly; a shunt pipe (3) is installed in a bearing on the upper surface of the drying box (1); the outer surface of the shunt pipe (3) is provided with a rotating assembly; the outer surface of the shunt pipe (3) is symmetrically fixedly connected to a plurality of fixed frames (9); a second fixed assembly is provided inside the fixed frame (9); the front surface of the fixed frame (9) is slidably connected to the back surfaces of two movable frames (12) respectively; the movable frame (12) is provided with a first fixed assembly; the outer surface of the shunt pipe (3) is symmetrically provided with a plurality of exhaust holes (10); the lower surface of the drying box (1) is connected to one end of a waste discharge pipe (11).

2. A drying device for wafer processing according to claim 1, characterized in that: The rotating assembly comprises a gear a (41) mounted on the outer surface of the shunt pipe (3), the outer surface of the gear a (41) meshing with the outer surface of the gear b (42), the upper surface of the gear b (42) being fixedly connected to the output shaft of a servo motor a (43), and the servo motor a (43) being mounted on the upper surface of the drying box (1).

3. The drying device for wafer processing according to claim 1, characterized in that: The drying assembly comprises a high-temperature air pump (51) installed on the upper surface of the drying box (1); the suction end of the high-temperature air pump (51) is connected to the upper surface of the hot air box (2) through an suction pipe (52); the exhaust end of the high-temperature air pump (51) is connected to one end of an exhaust pipe (53); and the other end of the exhaust pipe (53) is connected to the top end of the shunt pipe (3) through a rotating joint.

4. The drying device for wafer processing according to claim 1, characterized in that: A fan (6) is installed on the lower surface of the hot air box (2), and a heating plate (8) and a filter (7) are installed inside the hot air box (2) from top to bottom.

5. The drying device for wafer processing according to claim 1, characterized in that: The first fixing component comprises a servo motor b (131) on the front side of the inner wall of the movable frame (12); the output shaft of the servo motor b (131) is fixedly connected to one end of the front side of the screw rod a (132); one end of the back side of the screw rod a (132) is fixedly connected to one end of the front side of the screw rod b (133); one end of the back side of the screw rod b (133) is rotatably connected to the back side of the inner wall of the movable frame (12); the outer surfaces of the screw rod a (132) and the screw rod b (133) are both threadedly connected to threaded sleeves a (134), and the upper surfaces of the two threaded sleeves a (134) are respectively fixedly connected to two rubber sleeves (135).

6. The drying device for wafer processing according to claim 1, characterized in that: The second fixing assembly comprises a screw rod d (153) rotatably connected to the lower surface of the inner wall of the fixing frame (9); the top end of the screw rod d (153) is fixedly connected to the bottom end of the screw rod c (152); the top end of the screw rod c (152) passes through the upper surface of the inner wall of the fixing frame (9) and is fixedly connected to the output shaft of the servo motor c (151); the servo motor c (151) is mounted on the upper surface of the fixing frame (9); the outer surfaces of the screw rod d (153) and the screw rod c (152) are both threadedly connected to threaded sleeves b (154), and the front surfaces of the two threaded sleeves b (154) are respectively fixedly connected to the back surfaces of the two movable frames (12).

7. The drying device for wafer processing according to claim 1, characterized in that: Two scrapers (14) are fixedly connected to the left and right side surfaces of the diversion pipe (3), respectively, and the left side surface of the scraper (14) is slidably connected to the left side surface of the inner wall of the drying box (1).

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