Semiconductor wafer heat insulation test equipment
By designing a semiconductor wafer thermal insulation testing equipment, using technical means such as electric slide rails, drums and motor-driven rotating plates, the problem of difficulty in removing the wafer due to thermal stress cracking after high temperature tests is solved, and the operation safety and testing efficiency are improved.
Patent Information
- Application Number
- CN202421046544.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-14
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-05-14
AI Technical Summary
In the existing wafer testing technology, some wafers crack due to thermal stress after high temperature tests, resulting in difficulty in manual removal and may even cause personal injury.
A semiconductor wafer thermal insulation testing equipment was designed, using electric slide rails and sliders to drive the heater for lifting and lowering, and at the same time, the thermometer was driven to rotate through the drum and torsion spring, so as to speed up the preparation work before the test. The equipment also drives the rotating plate by motor to squeeze the clamps by tilting blocks to ensure the stability of the wafer during the test process, and collects cracked wafer fragments through the collection pot.
It improves testing efficiency, ensures the safety and simplicity of operation. At the same time, through the design of the collection pot, the difficulty of collecting cracked wafer fragments is solved and personnel injury is avoided.
Smart Images
Figure CN222652879U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer testing equipment, in particular to a semiconductor wafer thermal insulation testing equipment. Background Art
[0002] In the field of semiconductor manufacturing, wafer quality inspection is a crucial link. Among them, thermal insulation performance test is one of the important indicators for evaluating wafer performance. Thermal insulation testing usually involves simulating a high-temperature environment, heating the wafer and monitoring its temperature changes to evaluate its thermal insulation performance.
[0003] In the existing wafer testing technology, the tested wafers are taken out directly by hand. However, after undergoing high-temperature testing, some wafers will crack into multiple sharp fragments due to thermal stress. In this case, it becomes difficult to take out the wafers directly by hand, and even personal injury may be caused due to improper operation. Utility Model Content
[0004] In order to overcome the shortcomings of existing wafer testing technology, in which some wafers will crack into multiple sharp fragments due to thermal stress after high-temperature testing, and it is difficult to directly remove them manually in this case, and even personal injury may be caused due to improper operation, the utility model provides a semiconductor wafer insulation testing equipment.
[0005] Technical solution: A semiconductor wafer insulation testing equipment, including a base, a fixed rod one, a connecting frame, a support plate, an electric slide rail, an electric slide seat, a heater, a fixed rod two, a thermometer and a collection basin. Two fixed rods one are symmetrically fixed to the top of the base, a connecting frame is rotatably connected between the upper parts of the two fixed rods one, the upper part of the connecting frame is fixed to the support plate, two electric slide rails are symmetrically fixed to the top of the base, both electric slide rails are slidably connected to the electric slide seats, a heater is commonly fixed between the two electric slide seats, the heater is located above the support plate, a fixed rod two is fixed to the top of the base, the fixed rod two is adjacent to one of the electric slide seats, a thermometer is rotatably provided on the top of the fixed rod two, a collection basin is placed on the top of the base, and the collection basin is located below the support plate.
[0006] In addition, it is particularly preferred that it also includes a rotating drum and a torsion spring, the top of the second fixed rod is rotatably connected to the rotating drum, the thermometer is fixed to the lower part of the rotating drum, the lower part of the rotating drum is sleeved with a torsion spring, and the two free ends of the torsion spring are respectively connected to the bottom of the thermometer and the top of the second fixed rod.
[0007] In addition, it is particularly preferred that it also includes a fixed rod three, a contact rod and an elastic member one, the fixed rod three is fixedly connected to the side of the electric slide seat adjacent to the fixed rod two close to the rotating drum, the fixed rod three is slidably connected to the side of the fixed rod close to the rotating drum, one end of the elastic member one is connected to the contact rod, and the other end is connected to the fixed rod three.
[0008] In addition, it is particularly preferred that a sliding groove for contacting and cooperating with the contact rod is opened on the upper part of the rotating drum.
[0009] In addition, it is particularly preferred that it also includes a motor, a rotating plate, an inclined block, a clamping plate and two elastic members, the motor is installed at the lower part of the connecting frame, the rotating plate is fixedly connected to the output shaft of the motor, the rotating plate is located below the supporting plate, two inclined blocks are symmetrically fixedly connected to the top axis of the rotating plate, two clamping plates are symmetrically slidably connected to the supporting plate, the two clamping plates are respectively in contact with and cooperate with the inclined surfaces of the two inclined blocks, one end of the two elastic members are respectively connected to the two clamping plates, and the other end is respectively connected to the opposite side of the supporting plate.
[0010] In addition, it is particularly preferred that a turning handle is further included, and one end of the connecting frame is fixedly connected to the turning handle.
[0011] Compared with the prior art, the utility model has the following advantages:
[0012] 1. The utility model rotates the support plate to make unqualified wafers slide into the collection basin by gravity for collection. The operation is simple, safe and reliable. At the same time, through the cooperation of the contact rod and the rotating drum, the electric slide rail drives the heater to rise and fall while driving the thermometer to rotate, which speeds up the preparation work before the test, thereby improving the test efficiency.
[0013] 2. The utility model drives the rotating plate through a motor to make the inclined block squeeze the clamping plate, and then the clamping plate clamps and limits the wafer, which can ensure the stability of the wafer during the test and has the advantage of simple operation. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.
[0015] Figure 2 It is a three-dimensional structural schematic diagram of the utility model, including a rotating drum, a torsion spring, a fixing rod and a contact rod.
[0016] Figure 3 It is a cross-sectional view of the fixing rod three of the utility model.
[0017] Figure 4 It is a rear view of the motor, rotating plate, inclined block and clamping plate of the utility model.
[0018] Among them, the above-mentioned drawings include the following figure marks: 1-base, 2-fixed rod one, 3-connecting frame, 4-support plate, 5-electric slide rail, 6-electric slide seat, 7-heater, 8-fixed rod two, 9-thermometer, 10-rotating drum, 101-slide groove, 11-torsion spring, 12-fixed rod three, 13-contact rod, 14-elastic part one, 15-motor, 16-rotating plate, 17-inclined block, 18-clamping plate, 19-elastic part two, 20-collection basin, 21-handle. DETAILED DESCRIPTION
[0019] Although the present invention may be described with respect to a specific application or industry, those skilled in the art will recognize the broader applicability of the present invention. Those of ordinary skill in the art will recognize that terms such as: above, below, upward, downward, etc. are used to describe the drawings and do not represent limitations on the scope of the present invention as defined by the appended claims. Any numerical designations such as: first or second are merely exemplary and are not intended to limit the scope of the present invention in any way.
[0020] Embodiment: A semiconductor wafer thermal insulation test device, such as Figure 1 As shown, it includes a base 1, a fixed rod 2, a connecting frame 3, a support plate 4, an electric slide rail 5, an electric slide seat 6, a heater 7, a fixed rod 2 8, a thermometer 9 and a collecting basin 20. Two fixed rods 2 are symmetrically fixed to the top of the base 1, and a connecting frame 3 is rotatably connected between the upper parts of the two fixed rods 2. The upper part of the connecting frame 3 is fixed to the supporting plate 4. Two electric slide rails 5 are symmetrically fixed to the top of the base 1. The two electric slide rails 5 are slidably connected to the electric slide seat 6. A heater 7 is commonly fixed between the two electric slide seats 6. The heater 7 is located above the supporting plate 4. When the electric slide rail 5 drives the electric slide seat 6 to move, it can synchronously drive the heater 7 to move. A fixed rod 2 8 is fixed to the top of the base 1. The fixed rod 2 8 is adjacent to the electric slide seat 6 on the right. A thermometer 9 is rotatably provided on the top of the fixed rod 2 8. A collecting basin 20 is placed on the top of the base 1, and the collecting basin 20 is located below the supporting plate 4.
[0021] like Figure 2 As shown, it also includes a rotating drum 10 and a torsion spring 11. The top of the fixed rod 8 is rotatably connected to the rotating drum 10, and the thermometer 9 is fixedly connected to the lower part of the rotating drum 10. The lower part of the rotating drum 10 is sleeved with a torsion spring 11. The two free ends of the torsion spring 11 are respectively connected to the bottom of the thermometer 9 and the top of the fixed rod 8. When the rotating drum 10 is subjected to external force and rotates on the top of the fixed rod 8, it will synchronously drive the thermometer 9 to rotate, thereby causing the torsion spring 11 to deform. When the rotating drum 10 is subjected to external force and drives the thermometer 9 to rotate in the opposite direction to reset, the torsion spring 11 restores its original state due to its elastic characteristics, and can limit the excessive rotation of the rotating drum 10 and the thermometer 9.
[0022] like Figure 2 and Figure 3 As shown, it also includes a fixed rod three 12, a contact rod 13 and an elastic member 14. The fixed rod three 12 is fixedly connected to the side of the right electric slide 6 close to the rotating drum 10, and the contact rod 13 is slidably connected to the side of the fixed rod three 12 close to the rotating drum 10. One end of the elastic member 14 is connected to the contact rod 13, and the other end is connected to the fixed rod three 12. When the contact rod 13 slides toward the inside of the fixed rod three 12 due to an external force, the elastic member 14 will be compressed. When the contact rod 13 is not affected by an external force, the elastic member 14 will restore its original state due to its elastic characteristics, thereby driving the contact rod 13 to slide in the opposite direction and reset.
[0023] like Figure 2 As shown, a slide groove 101 is opened on the upper part of the rotating drum 10, and the track of the slide groove 101 is lower on the left and higher on the right. When the contact rod 13 moves along the slide groove 101, it can drive the rotating drum 10 to rotate.
[0024] When in use, the wafer is first placed on the top of the support plate 4, and then the electric slide 6 is driven downward by the electric slide rail 5, so that the electric slide 6 will drive the heater 7 and the fixed rod three 12 to move downward to the top surface of the wafer. In this process, the contact rod 13 will first contact the rotating drum 10, and the rotating drum 10 will squeeze the contact rod 13, so that the contact rod 13 slides toward the inside of the fixed rod three 12 and compresses the elastic member 14. Then, when the contact rod 13 slides downward with the fixed rod three 12 into the slide groove 101, the contact rod 13 is no longer squeezed by the surface of the rotating drum 10, and the elastic member 14 returns to its original state due to the elastic action, and drives the contact rod 13 to slide and reset inside the fixed rod three 12, so that the contact rod 13 contacts the inner surface of the slide groove 101, and when continuing to slide downward with the fixed rod three 12, the contact rod 13 will slide along the trajectory of the slide groove 101, thereby driving the rotating drum 10 to rotate on the fixed rod two 8 to the side close to the wafer, so that the rotating drum 10 will bring The thermometer 9 rotates to the surface close to the wafer. At the same time, the torsion spring 11 will be deformed, and then the wafer is heated by the heater 7, and the surface temperature of the wafer is measured in real time by the thermometer 9. After the test, the electric slide 6 is driven to move upward by the electric slide rail 5, so that the heater 7 and the fixed rod are moved upward and reset. During this process, the contact rod 13 will gradually slide out of the slide groove 101 and gradually lose contact with the rotating drum 10. The rotating drum 10 will gradually rotate and reset to the side away from the wafer, driving the thermometer 9 to rotate and reset. At the same time, the torsion spring 11 will gradually restore its original state due to its elastic characteristics, and limit the excessive rotation of the rotating drum 10 and the thermometer 9. When the tested wafer is in good shape, the wafer is directly taken out from the support plate 4 manually. When the tested wafer is cracked due to thermal stress, the cracked wafer fragments can be slid down by gravity to the collection basin 20 for collection by rotating the connecting frame 3 and the support plate 4. The operation is simple, safe and reliable.
[0025] like Figure 4 As shown, it also includes a motor 15, a rotating plate 16, an inclined block 17, a clamping plate 18 and an elastic member 19. The motor 15 is installed at the lower part of the connecting frame 3. The rotating plate 16 is fixedly connected to the output shaft of the motor 15. The rotating plate 16 is located below the supporting plate 4. Two inclined blocks 17 are symmetrically fixed to the top of the rotating plate 16. The two clamping plates 18 are symmetrically slidably connected to the supporting plate 4. The two clamping plates 18 are respectively in contact with the inclined surfaces of the two inclined blocks 17. When the motor 15 drives the rotating plate 16 to rotate, the two inclined blocks 17 will apply pressure to the corresponding clamping plates 18 through their inclined surfaces, so that the two clamping plates 18 move closer to each other. The two elastic members 19 can move sideways, thereby clamping and limiting the wafer placed on the top of the support plate 4. One end of the two elastic members 19 is respectively connected to the side where the two clamping plates 18 are close to each other, and the other end is respectively connected to the opposite side of the support plate 4. When the two clamping plates 18 move toward the side where they are close to each other, the corresponding elastic member 19 will be compressed. When the motor 15 drives the rotating plate 16 to rotate in the opposite direction until the two inclined blocks 17 are out of contact with the corresponding clamping plates 18, the elastic member 19 returns to its original state due to the elastic effect, thereby driving the two clamping plates 18 to move toward the side away from each other, so that both clamping plates 18 are out of contact with the wafer.
[0026] When the wafer is placed on the top of the support plate 4, the rotating plate 16 is driven to rotate by the motor 15, so that the inclined block 17 contacts the corresponding clamping plate 18, and squeezes the clamping plate 18 through its inclined surface, forcing the clamping plate 18 to slide on the support plate 4, so that the two clamping plates 18 can clamp and limit the wafer, and the clamping plate 18 will compress the corresponding elastic member 19 during the sliding process; when the wafer needs to be taken out, the rotating plate 16 is driven to rotate in the opposite direction by the motor 15, so that the inclined block 17 is out of contact with the clamping plate 18, so that the clamping plate 18 will slide back and forth due to the elastic action of the elastic member 19, and then both clamping plates 18 are out of contact with the wafer, and the wafer is released from limitation.
[0027] like Figure 4 As shown, it also includes a turning handle 21, one end of the connecting frame 3 is fixedly connected with the turning handle 21, the turning handle 21 is rotatably connected to the fixing rod 2, and the turning handle 21 can facilitate manual rotation operation of the connecting frame 3 and the support plate 4.
[0028] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A semiconductor wafer thermal insulation test device, characterized in that: The invention comprises a base (1), a fixing rod (2), a connecting frame (3), a support plate (4), an electric slide rail (5), an electric slide seat (6), a heater (7), a fixing rod (8), a temperature measuring instrument (9) and a collecting basin (20). The top of the base (1) is symmetrically fixed with two fixing rods (2), the upper parts of the two fixing rods (2) are rotatably connected with a connecting frame (3), the upper part of the connecting frame (3) is fixedly connected with a support plate (4), and the top of the base (1) is symmetrically fixed with two electric slide rails ( 5), the two electric slide rails (5) are both slidably connected with electric slide seats (6), a heater (7) is fixedly connected between the two electric slide seats (6), the heater (7) is located above the support plate (4), a second fixing rod (8) is fixedly connected to the top of the base (1), the second fixing rod (8) is adjacent to one of the electric slide seats (6), a temperature measuring instrument (9) is rotatably provided on the top of the second fixing rod (8), a collection basin (20) is placed on the top of the base (1), and the collection basin (20) is located below the support plate (4).
2. A semiconductor wafer thermal insulation testing device according to claim 1, characterized in that: It also includes a rotating drum (10) and a torsion spring (11), the top of the second fixing rod (8) is rotatably connected to the rotating drum (10), the thermometer (9) is fixedly connected to the lower part of the rotating drum (10), the lower part of the rotating drum (10) is sleeved with the torsion spring (11), and the two free ends of the torsion spring (11) are respectively connected to the bottom of the thermometer (9) and the top of the second fixing rod (8).
3. A semiconductor wafer thermal insulation testing device according to claim 2, characterized in that: The invention also comprises a fixing rod three (12), a contact rod (13) and an elastic member one (14); the fixing rod three (12) is fixedly connected to a side of the electric slide seat (6) adjacent to the fixing rod two (8) and close to the rotating drum (10); the fixing rod three (12) is slidably connected to a side of the fixing rod three (12) and close to the rotating drum (10); one end of the elastic member one (14) is connected to the contact rod (13), and the other end is connected to the fixing rod three (12).
4. A semiconductor wafer thermal insulation testing device according to claim 3, characterized in that: The upper part of the rotating drum (10) is provided with a sliding groove (101) for contacting and cooperating with the contact rod (13).
5. A semiconductor wafer thermal insulation testing device according to claim 4, characterized in that: The invention also comprises a motor (15), a rotating plate (16), an inclined block (17), a clamping plate (18) and a second elastic member (19). The motor (15) is installed at the lower part of the connecting frame (3). The output shaft of the motor (15) is fixedly connected to the rotating plate (16). The rotating plate (16) is located below the supporting plate (4). Two inclined blocks (17) are symmetrically fixedly connected to the top of the rotating plate (16) about the axis. Two clamping plates (18) are symmetrically slidably connected to the supporting plate (4). The two clamping plates (18) are respectively in contact with the inclined surfaces of the two inclined blocks (17). One end of the two second elastic members (19) is respectively connected to the two clamping plates (18), and the other end is respectively connected to the opposite side of the supporting plate (4).
6. A semiconductor wafer thermal insulation testing device according to claim 5, characterized in that: It also includes a turning handle (21), and one end of the connecting frame (3) is fixedly connected to the turning handle (21).