OPS computer mainboard heat dissipation structure

Abstract

The utility model relates to the technical field of OPS computer mainboard heat dissipation, and discloses an OPS computer mainboard heat dissipation structure which comprises a protective shell and further comprises a placing plate arranged at the top of the protective shell and used for placing an OPS computer mainboard. The water inlet pipe is transversely arranged on one side of the protective shell, a first valve is arranged on the outer side of the water inlet pipe, one end of the water inlet pipe communicates with a water guide pipe, a supporting frame is arranged on the outer side of the water guide pipe, and the bottom of the supporting frame is fixedly connected with the inner wall of the protective shell; cooling water can be conveniently supplemented into the water guide pipe through the water inlet pipe, water-cooling heat dissipation can be conveniently carried out on the computer mainboard through the water guide pipe, heat dissipation can be conveniently carried out on the interior of the protective shell through the ventilation openings, and therefore the cooling speed of the cooling water is increased, and the situation that due to the fact that the temperature of the mainboard is too high, the mainboard is damaged is prevented. Therefore, the aging of electronic components inside the mainboard is accelerated under high-temperature operation, and the service life of the mainboard is shortened.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of an OPS computer mainboard, in particular to a heat dissipation structure of an OPS computer mainboard. Background Art

[0002] OPS computer is an open pluggable computer, a mini PC, and a standardized digital signage interface specification jointly developed by Intel and display manufacturers. OPS computer helps to standardize the design and development of digital signage equipment and plug it into the media player terminal.

[0003] With the continuous development of computer technology, especially the growing demand for high-performance computing, the power consumption of computer motherboards is also increasing. High-power operation will cause the temperature of the motherboard to rise, which will in turn affect the stability and service life of the entire computer. The existing OPS computer motherboard heat dissipation structure usually installs an aluminum heat sink on the motherboard to conduct heat with the heat source to achieve the purpose of heat dissipation. However, this method has problems such as poor thermal conductivity and high noise. Due to the excessively high temperature of the motherboard, the internal electronic components will accelerate aging under high temperature operation, thereby reducing the service life of the motherboard and causing pollution to the environment. Utility Model Content

[0004] The purpose of the utility model is to provide an OPS computer mainboard heat dissipation structure to solve the problems raised in the above background technology.

[0005] To achieve the above purpose, the utility model provides the following technical solutions: an OPS computer motherboard heat dissipation structure, including a protective shell, and also including:

[0006] A placement plate provided on the top of the protective shell for placing the OPS computer motherboard;

[0007] A water inlet pipe is arranged transversely on one side of the protective shell, a first valve is arranged on the outside of the water inlet pipe, one end of the water inlet pipe is connected with a water pipe, a support frame is arranged on the outside of the water pipe, and the bottom of the support frame is fixedly connected to the inner wall of the protective shell, the other end of the water pipe is connected with a transversely arranged water outlet pipe, and a second valve is arranged on the outside of the water outlet pipe.

[0008] Preferably, a plurality of vents are provided on both sides of the protective shell, and the vents are used to dissipate heat inside the protective shell.

[0009] Preferably, three through holes are opened on the top of the protective shell, and the through holes are arranged in a rectangular shape. A plurality of heat conducting plates are fixedly connected to the top of the protective shell.

[0010] Preferably, a transversely arranged shell is fixedly connected to the top of the placement plate, and a plurality of slide grooves are provided on the top of the shell.

[0011] Preferably, a first limiting rod and a second limiting rod are fixedly connected to the inner wall of the shell, and the number of the first limiting rod and the number of the second limiting rod are both two.

[0012] Preferably, two springs are disposed on the inner wall of the shell, and the two springs are disposed opposite to each other.

[0013] Preferably, a clamping plate is slidably connected to the inner wall of the slide groove, the inner wall of the clamping plate is slidably connected to the outer sides of the first limiting rod and the second limiting rod, and a rubber pad is fixedly connected to one side of the clamping plate.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0015] The utility model can facilitate the replenishment of cooling water in the water pipe by arranging the water inlet pipe, can facilitate the water cooling of the computer motherboard by arranging the water pipe, can facilitate the heat dissipation of the inside of the protective shell by arranging the vents, thereby accelerating the cooling speed of the cooling water and preventing the electronic components inside the motherboard from aging faster under high temperature operation due to the excessive temperature of the motherboard, thereby reducing the service life of the motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic structural diagram of a preferred embodiment of the heat dissipation structure of an OPS computer motherboard provided by the utility model;

[0017] Figure 2 A schematic diagram of the structure of the clamping plate provided by the utility model;

[0018] Figure 3 A schematic diagram of the protective shell structure provided by the utility model;

[0019] Figure 4 This is a schematic diagram of the shell structure provided by the utility model.

[0020] In the figure: 1. protective shell; 2. placement plate; 3. water inlet pipe; 4. first valve; 5. water guide pipe; 6. support frame; 7. water outlet pipe; 8. second valve; 9. vent; 10. through hole; 11. heat conduction plate; 12. shell; 13. slide groove; 14. first limit rod; 15. second limit rod; 16. spring; 17. clamping plate; 18. rubber pad. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4 As shown, an OPS computer motherboard heat dissipation structure includes a protective shell 1, by setting the protective shell 1, it is convenient to protect the water pipe 5, and a placement plate 2 is set on the top of the protective shell 1 for placing the OPS computer motherboard; by setting the placement plate 2, it is convenient to support the shell 12, and a water inlet pipe 3 is set horizontally on one side of the protective shell 1. By setting the water inlet pipe 3, it is convenient to add cooling water to the water pipe 5, and a first valve 4 is set on the outside of the water inlet pipe 3. By setting the first valve 4, it is convenient to control the switch of the water inlet pipe 3, and one side of the water inlet pipe 3 The end of the water pipe 5 is connected with a water pipe 5. By setting the water pipe 5, cooling water can be stored conveniently, so as to perform water cooling on the computer motherboard. A support frame 6 is arranged on the outside of the water pipe 5, and the bottom of the support frame 6 is fixedly connected to the inner wall of the protective shell 1. By setting the support frame 6, the water pipe 5 can be supported conveniently. The other end of the water pipe 5 is connected with a transversely arranged water outlet pipe 7. By setting the water outlet pipe 7, the cooling water in the water pipe 5 can be discharged conveniently. A second valve 8 is arranged on the outside of the water outlet pipe 7. By setting the second valve 8, the switch of the water outlet pipe 7 can be conveniently controlled.

[0023] refer to Figure 3 As shown, a plurality of vents 9 are provided on both sides of the protective shell 1. By providing the vents 9, the vents 9 are used to dissipate heat from the inside of the protective shell 1; the heat from the inside of the protective shell 1 can be dissipated, thereby accelerating the cooling speed of the cooling water. Three through holes 10 are provided on the top of the protective shell 1. The through holes 10 are arranged in a rectangular shape. By providing the through holes 10, the heat from the inside of the protective shell 1 can be dissipated, thereby accelerating the cooling speed of the cooling water. A plurality of heat conducting plates 11 are fixedly connected to the top of the protective shell 1. By providing the heat conducting plates 11, the heat of the computer motherboard can be easily introduced into the protective shell 1, thereby performing water cooling on the computer motherboard.

[0024] refer to Figure 2 and Figure 4As shown, a transversely arranged shell 12 is fixedly connected to the top of the placement plate 2. By setting the shell 12, the spring 16 can be protected and the computer motherboard can be placed. A plurality of slide grooves 13 are opened on the top of the shell 12; by setting the slide grooves 13, the clamping plate 17 can be moved conveniently. A first limiting rod 14 and a second limiting rod 15 are fixedly connected to the inner wall of the shell 12, and the number of the first limiting rod 14 and the second limiting rod 15 is two. By setting the first limiting rod 14 and the second limiting rod 15, the clamping plate 17 can be limited conveniently.

[0025] refer to Figure 2 and Figure 4 As shown, the inner wall of the shell 12 is provided with two springs 16, and the two springs 16 are arranged opposite to each other; by arranging the springs 16, it is convenient to reset the clamping plate 17, so as to clamp and fix the computer motherboard, the inner wall of the slide groove 13 is slidably connected with the clamping plate 17, and the inner wall of the clamping plate 17 is slidably connected with the outer sides of the first limiting rod 14 and the second limiting rod 15. By arranging the clamping plate 17, it is convenient to clamp and fix the computer motherboard, and a rubber pad 18 is fixedly connected to one side of the clamping plate 17. By arranging the rubber pad 18, it is convenient to protect the computer motherboard.

[0026] Working principle: When in use, first push the two clamping plates 17 left and right to place the computer motherboard on the shell 12, reset the clamping plate 17 by the spring 16, and clamp the computer motherboard along the first limit rod 14 and the second limit rod 15. Then, add cooling water to the water pipe 5 through the water inlet pipe 3, and guide the heat of the computer motherboard from the through hole 10 into the inside of the protective shell 1 through the heat conducting plate 11 above the protective shell 1. Use the cooling water in the water pipe 5 to dissipate the heat, and dissipate the cooling water inside the protective shell 1 through the vent 9, thereby accelerating the cooling speed of the cooling water and improving the cooling efficiency of the main body to the computer motherboard.

[0027] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An OPS computer motherboard heat dissipation structure, comprising a protective shell (1), characterized in that: Also includes: A placement plate (2) disposed on the top of the protective shell (1) and used for placing the OPS computer motherboard; A water inlet pipe (3) is arranged transversely on one side of the protective shell (1), a first valve (4) is arranged on the outside of the water inlet pipe (3), one end of the water inlet pipe (3) is connected to a water guide pipe (5), a support frame (6) is arranged on the outside of the water guide pipe (5), and the bottom of the support frame (6) is fixedly connected to the inner wall of the protective shell (1), the other end of the water guide pipe (5) is connected to a water outlet pipe (7) arranged transversely, and a second valve (8) is arranged on the outside of the water outlet pipe (7).

2. The heat dissipation structure of an OPS computer motherboard according to claim 1, characterized in that: A plurality of ventilation holes (9) are provided on both sides of the protective shell (1), and the ventilation holes (9) are used to dissipate heat inside the protective shell (1).

3. The heat dissipation structure of an OPS computer motherboard according to claim 1, characterized in that: The top of the protective shell (1) is provided with three through holes (10), the through holes (10) are arranged in a rectangular shape, and the top of the protective shell (1) is fixedly connected with a plurality of heat conducting plates (11).

4. The OPS computer motherboard heat dissipation structure according to claim 1, characterized in that: A transversely arranged outer shell (12) is fixedly connected to the top of the placement plate (2), and a plurality of slide grooves (13) are provided on the top of the outer shell (12).

5. The heat dissipation structure of an OPS computer motherboard according to claim 4, characterized in that: The inner wall of the housing (12) is fixedly connected with a first limiting rod (14) and a second limiting rod (15), and the number of the first limiting rod (14) and the number of the second limiting rod (15) are both two.

6. The heat dissipation structure of an OPS computer motherboard according to claim 4, characterized in that: Two springs (16) are arranged on the inner wall of the housing (12), and the two springs (16) are arranged opposite to each other.

7. The heat dissipation structure of an OPS computer motherboard according to claim 4, characterized in that: The inner wall of the slide groove (13) is slidably connected to a clamping plate (17), the inner wall of the clamping plate (17) is slidably connected to the outer sides of the first limiting rod (14) and the second limiting rod (15), and one side of the clamping plate (17) is fixedly connected to a rubber pad (18).

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