Manual separator for wafer substrate
By designing a manual wafer substrate separator for semiconductor manufacturing, the uniform separation between the substrate and the wafer is achieved by using vacuum suction cups and heating rods, the problem of uneven separation is solved and the smooth progress of subsequent processing is ensured.
Patent Information
- Application Number
- CN202420866163.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-04-24
AI Technical Summary
During the semiconductor manufacturing process, if the heating, force or other parameters are improperly controlled during the separation of the wafer and the substrate, it may lead to uneven separation and affect subsequent processing steps.
A wafer substrate manual separator is designed, using a vacuum suction cup to adsorb and fix the substrate and heat it through a heating rod. The heat is uniformly transferred to the heating plate and the vacuum suction cup to soften the glue, thereby achieving uniform separation between the substrate and the wafer.
Through this manual separator, uniform separation between the wafer and the substrate can be achieved, and the problem of uneven separation is avoided, and the subsequent processing steps are ensured smoothly.
Smart Images
Figure CN222653918U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer processing, in particular to a manual wafer substrate separator. Background Art
[0002] Wafers are usually placed on substrates during the semiconductor manufacturing process. The substrate is the basis of semiconductor processing, and the wafer is the main carrier for various processing and manufacturing steps on the substrate. The separation between the wafer and the substrate is an important step in the semiconductor manufacturing process. When the wafer is separated from the substrate, if the heating, force or other parameters in the separation process are not properly controlled, it may cause uneven separation, resulting in incomplete or uneven separation of the wafer and the substrate, affecting subsequent processing steps. If the heating, force or other parameters in the separation process are not properly controlled, it may cause uneven separation, resulting in incomplete or uneven separation of the wafer and the substrate, affecting subsequent processing steps. Therefore, in response to the above problems, a manual wafer substrate separator is proposed. Utility Model Content
[0003] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a manual wafer substrate separator, comprising a shell, a notch is provided on the upper surface of the shell, a heating plate is provided on the front side of the notch, a placement plate is provided on the rear side of the notch, a vacuum suction cup is provided through the center of the heating plate, an air hole is provided below the vacuum suction cup, a heating tube is provided on the lower surface of the heating plate, two heating tubes are symmetrical with respect to the vacuum suction cup, and are provided on both sides of the vacuum suction cup, a power supply is provided inside the shell, a relay group is provided on one side of the power supply, a cooling fan is provided behind the power supply and on the rear side surface of the shell, a vacuum air pipe hole, a power switch and a power interface are provided on the rear side surface of the shell, and a controller is provided on the front side surface of the shell.
[0004] Furthermore, the controller includes a start button, a vacuum switch, a heating switch, a temperature controller, a regulating valve, an emergency stop switch, a delay controller, and a digital pressure switch. The air hole is connected to the vacuum air pipe hole through a pipeline and is connected to the vacuum pump. The regulating valve is connected to the pipeline, the temperature controller is electrically connected to the relay, the relay is connected to the heating switch, the delay controller is connected to the heating switch, and the digital pressure switch is electrically connected to the vacuum switch.
[0005] Furthermore, the placement plate and the heating plate are in the same plane.
[0006] Furthermore, a cover plate is arranged above the vacuum suction cup, and the area of the cover plate is larger than the upper surface area of the vacuum suction cup.
[0007] Furthermore, a plurality of heating rods with different diameters are arranged in the heating tube.
[0008] The utility model has the following beneficial effects:
[0009] In the utility model, the substrate is fixed by adsorption by the vacuum suction cup and heated by the heating rod, so that the heat is evenly transferred to the heating plate and then transferred to the vacuum suction cup through the heating plate, so that the glue is softened and the substrate and the wafer are separated. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 This is a structural schematic diagram of a manual wafer substrate separation machine proposed by the utility model;
[0011] Figure 2 This is an internal structure diagram of a manual wafer substrate separation machine proposed by the utility model;
[0012] Figure 3 The utility model is a cross-sectional view of a manual wafer substrate separator.
[0013] Legend:
[0014] 1. Shell; 2. Notch; 3. Heating plate; 4. Placement plate; 5. Vacuum suction cup; 6. Air hole; 7. Heating tube; 8. Power supply; 9. Relay group; 10. Cooling fan; 11. Vacuum air duct hole; 12. Power switch; 13. Power interface; 14. Controller; 15. Cover; 141. Start button; 142. Vacuum switch; 143. Heating switch; 144. Thermostat; 145. Regulating valve; 146. Emergency stop switch; 147. Delay controller; 148. Digital pressure switch. DETAILED DESCRIPTION
[0015] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0016] Reference Figure 1-3As shown, an embodiment of the utility model is: a manual wafer substrate separator, comprising a shell 1, a notch 2 is provided on the upper surface of the shell 1, a heating plate 3 is provided on the front side of the notch 2, the heating plate 3 transfers heat to a vacuum suction cup 5, so that the temperature of the substrate on the vacuum suction cup 5 gradually increases, the glue on the wafer is melted, and the wafer is separated from the substrate, a placement plate 4 is provided on the rear side of the notch 2, the placement plate 4 is used to support the substrate, a vacuum suction cup 5 is provided through the center of the heating plate 3, and an air hole 6 is provided below the vacuum suction cup 5, and air is sucked through the air hole 6 to absorb the substrate and the wafer on the vacuum suction cup 5 to prevent them from falling off during heating. , causing cracks in the wafer. A heating tube 7 is arranged on the lower surface of the heating plate 3. The two heating tubes 7 are symmetrical with respect to the vacuum suction cup 5 and are arranged on both sides of the vacuum suction cup 5. The heating tube 7 does not directly contact the wafer to prevent the wafer from being overheated and damaged. A power supply 8 is arranged inside the shell 1 to provide power. A relay group 9 is arranged on one side of the power supply 8. A cooling fan 10 is arranged behind the power supply 8 and is arranged on the rear side of the shell 1. The cooling fan 10 dissipates heat for the internal structure to prevent overheating from affecting the effect of heating the sol. A vacuum air pipe hole 11, a power switch 12 and a power interface 13 are arranged on the rear side of the shell 1, and a controller 14 is arranged on the front side of the shell 1.
[0017] Furthermore, the controller 14 includes a start button 141, a vacuum switch 142, a heating switch 143, a temperature controller 144, a regulating valve 145, an emergency stop switch 146, a delay controller 147, and a digital pressure switch 148. The air hole 6 is connected to the vacuum air pipe hole 11 through a pipeline and is connected to the vacuum pump. The regulating valve 145 is connected to the pipeline, the temperature controller 144 is electrically connected to the relay, the relay is connected to the heating switch 143, the delay controller 147 is connected to the heating switch 143, and the digital pressure switch 148 is electrically connected to the vacuum switch 142.
[0018] Furthermore, the placement plate 4 and the heating plate 3 are in the same plane. The wafer is usually a thinner and more brittle silicon wafer. To prevent the placement plate 4 and the heating plate 3 from having a height difference, bumps may occur and cause damage to the wafer.
[0019] Furthermore, a cover plate 15 is provided above the vacuum suction cup 5, and the area of the cover plate 15 is larger than the upper surface area of the vacuum suction cup 5, so that the cover plate 15 can completely cover the vacuum suction cup 5, and when not in use, reduce internal dust, affect the adsorption force, and cause the substrate to be unable to be firmly adsorbed.
[0020] Furthermore, a plurality of heating rods 71 of different diameters are arranged in the heating tube 7, and the heating rods 71 of different diameters can form a plurality of heating areas in the barrel, thereby achieving more uniform heating. The heating rods 71 of different diameters may have different surface areas and heat distributions, thus improving the uniformity of heating, reducing heat gradients, and avoiding local overheating or overcooling problems. The heating rods 71 of different diameters can adapt to objects of different sizes and shapes, and can better cover the entire surface of the object during the heating process, ensuring that the object is evenly heated.
[0021] Working principle: the start button 141 is electrically connected to the power supply 8, the air hole 6 is connected to the vacuum air pipe hole 11 through a pipeline and connected to the vacuum pump, the vacuum switch 142 is electrically connected to the vacuum pump, the regulating valve 145 is connected to the pipeline, the heating switch 143 is electrically connected to the heating tube 7, the temperature controller 144 is electrically connected to the relay, and the relay is connected to the heating switch 143. Press the start button 141 to start the device, then remove the cover plate (15) and place the substrate on the heating plate 3 and the placement plate 4, turn on the vacuum switch 142, so that the vacuum suction cup 5 generates suction to fix the substrate, and rotate the regulating valve 145 according to different wafers and substrates to adjust the pressure of the vacuum suction cup 5. The force controls the adsorption force on the substrate. When the pressure is too high, the digital pressure switch 148 will automatically disconnect to prevent the adsorption pressure from being too high and causing damage to the wafer. Then, the heating switch 143 is turned on to heat the heating rod 71, and the heat is transferred to the substrate through the heating plate 3 to increase the temperature of the substrate, thereby melting the glue on the wafer and separating the wafer and the substrate. At the same time, the temperature controller 144 monitors the temperature on the vacuum suction cup 5. When the detected temperature is lower than the set value, the temperature controller 144 will close the contact to energize the relay, thereby making the heating rod 71 work. When the temperature rises to the set value, the temperature controller 144 will open the contact, the relay will be powered off, and the heating rod 71 will stop working.
[0022] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A manual wafer substrate separator, characterized in that: The invention comprises a shell (1), wherein a notch (2) is provided on the upper surface of the shell (1), a heating plate (3) is provided on the front side of the notch (2), a placement plate (4) is provided on the rear side of the notch (2), a vacuum suction cup (5) is provided through the center of the heating plate (3), an air hole (6) is provided below the vacuum suction cup (5), a heating tube (7) is provided on the lower surface of the heating plate (3), two heating tubes (7) are symmetrical with respect to the vacuum suction cup (5) and are provided on both sides of the vacuum suction cup (5), a power supply (8) is provided inside the shell (1), a relay group (9) is provided on one side of the power supply (8), a cooling fan (10) is provided behind the power supply (8) and is provided on the rear side of the shell (1), a vacuum air pipe hole (11), a power switch (12) and a power interface (13) are provided on the rear side of the shell (1), and a controller (14) is provided on the front side of the shell (1).
2. A wafer substrate manual separation machine according to claim 1, characterized in that: The controller (14) comprises a start button (141), a vacuum switch (142), a heating switch (143), a temperature controller (144), a regulating valve (145), an emergency stop switch (146), a delay controller (147), and a digital pressure switch (148); the air hole (6) is connected to the vacuum air pipe hole (11) via a pipeline and is connected to a vacuum pump; the regulating valve (145) is connected to the pipeline; the temperature controller (144) is electrically connected to the relay; the relay is connected to the heating switch (143); the delay controller (147) is connected to the heating switch (143); and the digital pressure switch (148) is electrically connected to the vacuum switch (142).
3. The wafer substrate manual separation machine according to claim 1, characterized in that: The placement plate (4) and the heating plate (3) are located on the same plane.
4. The wafer substrate manual separation machine according to claim 1, characterized in that: A cover plate (15) is arranged above the vacuum suction cup (5), and the area of the cover plate (15) is larger than the upper surface area of the vacuum suction cup (5).
5. The wafer substrate manual separation machine according to claim 1, characterized in that: A plurality of heating rods (71) with different diameters are arranged in the heating tube (7).