Wafer loading mechanism and semiconductor process equipment

Abstract

The utility model provides a wafer loading mechanism and semiconductor process equipment. The wafer loading mechanism comprises a bearing assembly and a transmission assembly. The bearing assembly comprises a supporting piece and a locking structure arranged on the supporting piece, and the transmission assembly is used for loading a wafer bearing box onto the supporting piece; the locking structure is used for locking the bottom of the wafer bearing box or unlocking the bottom of the wafer bearing box; the transmission assembly is provided with an avoiding space for avoiding the locking structure, so that the bearing assembly can lock the wafer bearing box from the bottom position of the wafer bearing box, the stability and compatibility of the wafer bearing box in the loading and unloading process are enhanced, and damage to a base of the wafer bearing box is avoided.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to, but are not limited to, the field of semiconductor process equipment, and in particular, to a wafer loading mechanism and semiconductor process equipment. Background Art

[0002] The semiconductor industry has been experiencing a surge in global chip demand, and the requirements for semiconductor process equipment reliability and high-precision automation are increasing. In the semiconductor process, a wafer carrier (Foup) is a closed container used to transport, store and protect semiconductor wafers. It is widely used for the entry and exit of batch wafers to ensure that the wafers are highly protected during manufacturing, storage and transportation.

[0003] To adapt to the clean environment, semiconductor equipment is usually equipped with a mini-stocker module, which contains a wafer box positioning and opening device to realize the feeding and unloading of the wafer transfer system. The mini-stocker module is a device in semiconductor manufacturing equipment, which is used to cache and store wafer carrier boxes (Foup) that need to be processed in the semiconductor process. This module is usually located at the front end of the semiconductor equipment, and its function is to provide an area for temporary storage of wafer carrier boxes to facilitate subsequent processing steps. Specifically, the wafer box positioning and opening device is used to load, position and store wafer carrier boxes. This module is designed to improve the processing efficiency of wafers, especially for loading and unloading wafers in a clean environment.

[0004] In the prior art, the wafer box positioning and opening device adopts a two-side locking method to fix the wafer carrier box on the positioning and transfer platform. However, there are problems such as poor compatibility with wafer carrier boxes of different brands and possible damage to the wafer carrier box base. Utility Model Content

[0005] The utility model aims to solve at least one of the technical problems existing in the prior art, and proposes a wafer loading mechanism and semiconductor process equipment. By improving the fixing method of the carrying component and the wafer carrying box, the stability and compatibility of the wafer carrying box during loading and unloading are enhanced, and damage to the base of the wafer carrying box is avoided. The problem of poor compatibility with wafer carrying boxes of different brands and possible damage to the base of the wafer carrying box existing in the related technology is solved.

[0006] In order to achieve the purpose of the utility model, a wafer loading mechanism is provided, including a carrying component and a transmission component; the carrying component includes a support member and a locking structure arranged on the support member, and the transmission component is used to load a wafer carrier box onto the support member; the locking structure is used to lock to the bottom of the wafer carrier box, or release the lock on the bottom of the wafer carrier box; the transmission component has an avoidance space to avoid the locking structure.

[0007] In some embodiments, the locking structure includes a locking member and a driving member, the driving member is connected to a supporting member, and the locking member is movably arranged on the driving member; the supporting member has a supporting surface for supporting a wafer carrier box, and the driving member is used to drive the locking member to swing back and forth around a preset rotating axis perpendicular to the supporting surface, so that the locking member can switch between a locked state and an unlocked state.

[0008] In some embodiments, a locking groove adapted to the locking piece is provided at the bottom of the wafer carrier box; the driving piece is used to drive the locking piece to swing clockwise or counterclockwise, and the locking piece presses the side wall of the locking groove when it swings into the locking groove to limit the relative movement of the wafer carrier box and the support piece in a direction parallel to the preset rotation axis, or drives the locking piece to swing counterclockwise or clockwise, and releases the pressing of the side wall of the locking groove when the locking piece swings out of the locking groove.

[0009] In some embodiments, the support member has a loading area; the locking structure is used to lock the bottom of the wafer carrier box when the transmission component loads the wafer carrier box to the loading area; the wafer loading mechanism also includes a positioning component, which is used to confirm that the wafer carrier box is loaded into the loading area.

[0010] In some embodiments, the positioning assembly includes a positioning member and a positioning sensing member. The positioning member is arranged on the supporting member. The positioning member is used to be inserted into the positioning hole on the wafer carrier box when the wafer carrier box is loaded into the loading area to limit the relative movement of the wafer carrier box on the supporting member; the positioning sensing member is used to confirm that the wafer carrier box is loaded into the loading area when the positioning member is inserted into the positioning hole.

[0011] In some embodiments, the positioning assembly includes a plurality of positioning members and a plurality of positioning sensing members, and the plurality of positioning members and the plurality of positioning sensing members are the same in number and are arranged in a one-to-one correspondence.

[0012] In some embodiments, the wafer carrier box includes a box body, a cover body and a lock core, and the box body and the cover body together form a closed space for accommodating wafers; the lock core is used to lock the cover body to the box body, or to unlock the cover body; the wafer loading mechanism also includes a base and an unlocking assembly, and the support member and the unlocking assembly are both connected to the base; the wafer loading mechanism also includes an adjustment assembly located between the base and the support member, and the adjustment assembly is used to adjust the support member to move relative to the base in a first preset direction and a second preset direction until the unlocking assembly can drive the lock core to switch between a locked state and an unlocked state.

[0013] In some embodiments, the first preset direction is perpendicular to the second preset direction.

[0014] In some embodiments, the adjustment assembly includes a connecting member, an adjusting member, a first adjusting structure and a second adjusting structure, the connecting member is connected to the base; the adjusting member is connected to the connecting member through the first adjusting structure, and the first adjusting structure is used to drive the adjusting member and the supporting member to move in a first preset direction relative to the connecting member; the adjusting member is connected to the supporting member through the second adjusting structure, and the second adjusting structure is used to drive the supporting member to move in a second preset direction relative to the adjusting member.

[0015] The utility model also provides a semiconductor process equipment, comprising the above-mentioned wafer loading mechanism.

[0016] The utility model has the following beneficial effects:

[0017] The wafer loading mechanism of the present application has a transmission component that can avoid the locking structure locked to the bottom of the wafer carrier box when loading the wafer carrier box onto the support, so that the locking structure of the present application can lock the wafer carrier box from the bottom position of the wafer carrier box. The stability of the wafer carrier box during loading is improved, and because the bottom fixing structure provided at the bottom of the wafer carrier box for locking the locking structure has an industry standard, even if different brands of wafer carrier boxes have different size parameters, the size parameters of the bottom fixing structure on the wafer carrier box are the same, so that the wafer loading mechanism can be fully compatible with different brands of wafer carrier boxes, and will not cause damage to the base of the wafer carrier box.

[0018] Other objects and features of the present invention will become clear by reading the specification, claims and drawings of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0020] Figure 1 It is a top view of the robot in the docking position when the robot loads the wafer box to the positioning and transfer platform in the related technology.

[0021] Figure 2 It is a structural schematic diagram of a wafer box in the related art.

[0022] Figure 3 It is a structural schematic diagram of a wafer box in the related art in another viewing direction.

[0023] Figure 4 It is a bottom view of the robot in the related art when the robot is located at the docking position when loading the wafer box onto the positioning and transfer platform.

[0024] Figure 5 It is a schematic diagram of the relative position relationship between the box opening device and the positioning and transferring platform in the related art.

[0025] Figure 6 It is a schematic diagram of the relative position relationship between the vacuum suction cup and the key in the related art.

[0026] Figure 7 It is a schematic diagram of a wafer box moving toward a vacuum chuck in the related art.

[0027] Figure 8 It is a structural schematic diagram of a frame in the related art.

[0028] Fig. 9 It is a structural schematic diagram of a positioning and transferring platform in the related art, in which a left vertical plate and a right vertical plate are respectively connected to a left horizontal beam and a right horizontal beam of a frame.

[0029] Fig.10 It is a top view of the transmission component avoidance locking structure of the embodiment of the utility model.

[0030] Fig.11 It is a top view of the locking structure of the load-bearing assembly according to the embodiment of the utility model switched to an unlocked state.

[0031] Fig.12 It is a top view of the locking structure of the load-bearing assembly according to the embodiment of the utility model switched to a locked state.

[0032] Fig.13 It is a structural schematic diagram of the locking structure of the embodiment of the utility model.

[0033] Fig.14 It is an axial view of the support member of the embodiment of the utility model connected to the base through the adjustment component.

[0034] Fig.15 It is a front view of the support member of the embodiment of the utility model connected to the base through the adjustment component.

[0035] Fig.16 It is a side view of the support member of the embodiment of the utility model connected to the base through the adjustment assembly.

[0036] Fig.17 It is a structural schematic diagram of the adjustment component of the embodiment of the utility model.

[0037] Fig.18 It is a structural schematic diagram of a support member according to an embodiment of the utility model for carrying a calibration component.

[0038] Fig.19 It is an axial view of the calibration assembly of the embodiment of the utility model.

[0039] Fig. 20 It is a front view of the calibration component of the embodiment of the utility model.

[0040] Description of main component symbols:

[0041] 1. Robot; 2. Positioning and transferring platform; 21. Left vertical board; 22. Right vertical board;

[0042] 3. Docking position; 4. Locking device; 5. Wafer box; 50. Cover; 50a. Lock hole; 51. Side connection structure; 52. Bottom fixing structure; 6. Vacuum suction cup; 7. Key; 8. Box opening device; 9. Frame; 91. Left beam; 92. Right beam; 93. Connecting parts;

[0043] 200, bearing assembly; 210, support member; 211, support surface; 212, loading area;

[0044] 220. Locking structure; 221. Locking member; 222. Driving member;

[0045] 300, transmission component; 310, avoidance space;

[0046] 400, positioning assembly; 410, positioning member; 420, positioning sensing member;

[0047] 500, base;

[0048] 600, unlocking assembly;

[0049] 700, adjustment assembly; 710, connecting member; 711, first side plate; 712, second side plate; 720, adjustment member; 721, third side plate; 722, fourth side plate; 730, first adjustment structure; 731, first top screw; 732, first fastener; 740, second adjustment structure; 741, second top screw; 742, second fastener;

[0050] 800, calibration component; 810, alignment hole; 820, observation hole; 830, positioning hole. DETAILED DESCRIPTION

[0051] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0052] See also Figure 1In the mini stocker module of the related art, the wafer box 5 is generally transported by a robot 1. In order to avoid the robot 1, a docking position 3 for placing the robot 1 is reserved in the middle of the positioning and transfer platform 2. In the existing wafer box positioning and opening device 8, the wafer box 5 is fixed on the positioning and transfer platform 2 by locking both sides.

[0053] Specifically, the swing arm of the locking device 4 is pressed Figure 1 The direction of rotation shown in ( Figure 1 By rotating the wafer box 5 in the direction indicated by the two arrows in FIG. 2 , the wafer box 5 can be locked from both sides of the wafer box 5, thereby fixing the wafer box 5 on the positioning and transferring platform 2.

[0054] See also Figures 2 to 4 The wafer box 5 includes a box body and a cover body 50, and the box body and the cover body 50 form a closed space for accommodating wafers. There are lock holes 50a (two in total) on the cover body 50. After the key 7 is inserted into the lock hole 50a and rotated, the cover body 50 can be removed from the box body or locked to the box body. Side connection structures 51 are respectively provided on both sides of the wafer box 5, so the two locking devices 4 on the positioning and transfer platform 2 fix the wafer box 5 through the side connection structure 51 respectively. However, since there are no regulatory requirements for this position in the industry, the base thickness and base shape of wafer boxes 5 of different brands at the side connection structure 51 are different, resulting in poor brand compatibility of the wafer box 5 when the wafer box 5 is fixed at this position.

[0055] See also Figure 3 The bottom of the wafer box 5 is provided with a bottom fixing structure 52. The industry has clear regulatory requirements for the bottom fixing structure 52 at this position, so the wafer box 5 is fixed from the bottom fixing structure 52, which can be compatible with wafer boxes 5 of different brands. The SEMI standard provides regulatory requirements for the bottom fixing structure 52. The bottom fixing structures 52 of wafer boxes 5 of different brands all meet the regulatory requirements, making the bottom fixing structure 52 consistent. However, when the robot 1 lifts the wafer box 5, the robot 1 blocks the bottom fixing structure 52. For details, please refer to Figure 4 , resulting in the positioning and transfer platform 2 being unable to cooperate with the bottom fixing structure 52 , which is also the reason why the wafer box 5 is fixed from both sides of the wafer box 5 in the related art.

[0056] In the related art, the positioning and transferring platform 2 is fixed from both sides of the wafer box 5. Since the shapes of the two sides of the bottom of wafer boxes 5 of different brands are not consistent, the positioning and transferring platform 2 has poor compatibility with wafer boxes 5 of different brands and may cause damage to both sides of the base of the wafer box 5.

[0057] In view of the above technical problems, the present application proposes a wafer loading mechanism, which can lock the wafer carrier box from the bottom of the wafer carrier box when loading the wafer carrier box. The stability of the wafer carrier box during loading and subsequent unlocking is improved, and because the bottom fixing structure 52 at the bottom of the wafer carrier box has industry standards, the wafer loading mechanism can be fully compatible with wafer carrier boxes of different brands and will not cause damage to the base of the wafer carrier box.

[0058] See also Figures 10 to 12 , the wafer loading mechanism includes a carrier assembly 200 and a transmission assembly 300. The carrier assembly 200 includes a support 210 and a locking structure 220, and the locking structure 220 is arranged on the support 210. The transmission assembly 300 is used to load the wafer carrier box onto the support 210, and is also used to unload the wafer carrier box from the support 210. The wafer carrier box is used to provide a closed and clean environment to prevent external particles and contaminants from entering the box, thereby ensuring that the wafer is not affected by pollution, moisture or other factors that may affect its quality. The wafer carrier box is usually made of special materials and has the characteristics of anti-static, chemical resistance and low particle emission. It should be noted that the wafer carrier box of the present application complies with relevant industry standards to ensure compatibility between different manufacturing equipment, such as the Semiconductor Equipment and Materials International (SEMI) standard, where SEMI is an international non-profit industry association.

[0059] In some embodiments, the transfer assembly 300 is located below the wafer carrier, such as at the middle of the bottom, to stably support the wafer carrier.

[0060] The locking structure 220 is locked to the bottom of the wafer carrier box, or unlocks the bottom of the wafer carrier box. Specifically, the locking structure 220 is used to lock the bottom fixing structure 52 located at the bottom of the wafer carrier box to the support 210. It can be understood that the locking structure 220 is used to lock the bottom fixing structure 52 when the wafer carrier box is placed on the support 210, and is also used to unlock the bottom fixing structure 52 when the wafer carrier box is removed from the support 210. The bottom fixing structure 52 is a standard universal part, and the size is the same on wafer carriers of different brands. In particular, the bottom fixing structure 52 is located in the middle of the bottom of the wafer carrier box to improve the stability of the wafer carrier box loading.

[0061] The transmission component 300 has an escape space 310 for evading the locking structure 220. The bottom fixing structure 52 of the wafer carrier box that can cooperate with the locking structure 220 is exposed through the escape space 310, so that the bottom fixing structure 52 can be locked by the locking structure 220. When the transmission component 300 loads the wafer carrier box onto the support 210, the escape space 310 can avoid the locking structure 220, so that the locking structure 220 can be locked to the bottom fixing structure 52.

[0062] The wafer loading mechanism of the present application, its transmission component 300 can avoid the locking structure 220 matched with the bottom fixing structure 52 at the bottom of the wafer carrying box when loading the wafer carrying box onto the support 210, so that the locking structure 220 of the present application can lock the wafer carrying box from the bottom position of the wafer carrying box. The stability of the wafer carrying box during loading is improved, and because the bottom fixing structure 52 at the bottom of the wafer carrying box has industry standards, the wafer loading mechanism can be fully compatible with wafer carrying boxes of different brands, and will not cause damage to the base of the wafer carrying box.

[0063] See also Fig.13 The locking structure 220 includes a locking member 221 and a driving member 222. The driving member 222 is connected to the support member 210, and the locking member 221 is movably disposed on the driving member 222, so that the driving member 222 and the locking member 221 can move synchronously with the support member 210. Optionally, the driving member 222 is fixed to the support member 210. In some embodiments, the driving member 222 may include a rotary cylinder, and the locking member 221 may be a swing arm structure connected to the rotary cylinder. For details, see Fig.13 Specifically, the locking member 221 includes a rotating shaft and a block structure. The block structure is configured as a polygonal structure having a certain thickness. One end of the rotating shaft is connected to the driving member 222, and the other end of the rotating shaft is connected to the block structure. The driving member 222 drives the rotating shaft to rotate to drive the block structure to rotate. The block structure extends from the edge of the support member 210 to the avoidance space 310, and is used to be located at the bottom of the wafer carrier box when the wafer carrier box is placed on the support member 210, and rotates under the transmission action of the rotating shaft to be stuck on the shell wall at the bottom of the wafer carrier box.

[0064] The support member 210 has a support surface 211 for supporting the wafer carrier, and the support surface 211 faces the bottom of the wafer carrier. The driving member 222 is used to drive the locking member 221 to swing back and forth around a preset rotation axis perpendicular to the support surface 211, so that the locking member 221 switches between a locked state and an unlocked state. For example, the driving member 222 is used to drive the locking member 221 to swing left around a preset rotation axis perpendicular to the support surface 211, so that the locking member 221 switches to a locked state. For details, see Fig.12Or drive the locking member 221 to swing rightward around a preset rotation axis perpendicular to the support surface 211, so that the locking member 221 switches to the unlocking state. For details, please refer to Fig.11 Of course, the driving member 222 may be used to drive the locking member 221 to swing rightward around a preset rotation axis perpendicular to the support surface 211 so that the locking member 221 switches to a locked state, or to drive the locking member 221 to swing leftward around a preset rotation axis perpendicular to the support surface 211 so that the locking member 221 switches to an unlocked state.

[0065] It should be noted that the preset rotation axis perpendicular to the support surface 211 can be seen in Fig.13 The dotted line O in the figure.

[0066] The bottom of the wafer carrier is provided with a locking groove matched with the locking member 221. The driving member 222 is used to drive the locking member 221 to swing clockwise, and when the locking member 221 swings into the locking groove, it presses the side wall of the locking groove to limit the relative movement of the wafer carrier and the support member 210 in a direction parallel to the preset rotation axis. Alternatively, the driving member 222 is also used to drive the locking member 221 to swing counterclockwise, and when the locking member 221 swings out of the locking groove, it releases the pressing of the side wall of the locking groove.

[0067] Alternatively, the driving member 222 is used to drive the locking member 221 to swing counterclockwise, and when the locking member 221 swings into the locking groove, it presses the side wall of the locking groove to limit the relative movement of the wafer carrier and the supporting member 210 on the preset rotation axis. Alternatively, the driving member 222 is also used to drive the locking member 221 to swing clockwise, and when the locking member 221 swings out of the locking groove, it releases the pressing of the side wall of the locking groove.

[0068] It should be noted that the direction parallel to the preset rotation axis can be seen in Fig.14 The Z direction in .

[0069] The present application uses the locking structure 220 to work together with the support member 210 to limit the relative movement of the wafer carrier and the support member 210 in a direction parallel to the preset rotation axis, so as to improve the stability of the wafer carrier during loading. When the support member 210 is used to lift the wafer carrier, the preset rotation axis can be in a vertical direction.

[0070] The support member 210 has a loading area 212. The locking structure 220 is used to lock to the bottom of the wafer carrier box when the transmission component 300 loads the wafer carrier box to the loading area 212. It should be noted that the support member 210 is arranged around the loading area 212 to support the wafer carrier box while avoiding the bottom fixing structure 52 located at the bottom of the wafer carrier box.

[0071] See also Fig.11The wafer loading mechanism further includes a positioning assembly 400 , and the positioning assembly 400 is used to confirm that the wafer carrier box is loaded into the loading area 212 .

[0072] See also Fig.11 , the positioning assembly 400 includes a positioning member 410 and a positioning sensor 420. The positioning member 410 is arranged on the support member 210, and the positioning sensor 420 and the positioning member 410 can be arranged on the support surface 211 of the support member 210. The positioning member 410 is used to be inserted into the positioning hole on the wafer carrier box when the wafer carrier box is loaded into the loading area 212, so as to limit the relative movement of the wafer carrier box on the support member 210 along a direction perpendicular to the preset axis. Optionally, the size of the positioning hole is adapted to the positioning member 410. In other words, the positioning member 410 arranged on the support member 210 can not only be used to assist in confirming that the wafer carrier box is loaded into the loading area 212, but also can be used together with the positioning hole on the wafer carrier box to limit the movement of the wafer carrier box to improve the stability of the wafer carrier box loading.

[0073] The positioning sensor 420 is used to confirm that the wafer carrier box is loaded into the loading area when the positioning member 410 is inserted into the positioning hole. Specifically, the positioning sensor 420 can be a sensor for detecting and confirming whether the wafer carrier box has reached the loading area 212. The positioning sensor 420 can be used to ensure the accurate position of the wafer carrier box during loading, positioning or other operations, which helps to avoid incorrect position loading or other situations that may cause equipment failure or process problems, thereby improving the accuracy and stability of the automation system.

[0074] In some embodiments, the positioning member 410 may be a positioning pin. The positioning hole is located at the bottom of the wafer carrier box.

[0075] In some embodiments, the positioning assembly 400 includes a plurality of positioning members 410 and a plurality of positioning sensing members 420. The number of the plurality of positioning members 410 and the plurality of positioning sensing members 420 is the same and they are arranged one by one. For example, the positioning assembly 400 includes three positioning members 410 and three positioning sensing members 420. The three positioning members 410 and the three positioning sensing members 420 are arranged one by one, and each positioning sensing member 420 is located around the corresponding positioning member 410 to improve the accuracy of detection. For details, see Fig.11 .

[0076] See also Figures 5 to 9 The wafer box 5 in the related art is loaded on the positioning and transfer platform 2, and the positioning and transfer platform 2 can drive the wafer box 5 along Figure 7The wafer box 5 moves in the X direction as shown in the figure until the cover 50 of the wafer box 5 contacts the box opening device 8. The vacuum suction cup 6 on the box opening device 8 vacuum absorbs the cover 50 of the wafer box 5, and the two keys 7 are respectively inserted into the two lock holes 50a of the cover of the wafer box 5. By rotating the key 7, the cover 50 of the wafer box 5 can be unlocked, and the cover 50 of the wafer box 5 can be separated from the cover 50.

[0077] The frame 9 in the related art includes a left crossbeam 91 and a right crossbeam 92, and the positioning and transferring platform 2 includes a left vertical plate 21 and a right vertical plate 22. The left vertical plate 21 is fixedly connected to the left crossbeam 91 by a connecting component 93, and the right vertical plate 22 is fixedly connected to the right crossbeam 92 by a connecting component 93, so that the positioning and transferring platform 2 is fixedly installed on the frame 9. Since the box opening device 8 is also fixedly installed on the positioning and transferring platform 2, the relative position between the positioning and transferring platform 2 and the box opening device 8 is fixed and cannot be adjusted. However, due to assembly errors during the assembly process, the key 7 on the box opening device 8 may rub against the edge of the lock hole 50a when inserted into the lock hole 50a on the wafer box 5, causing damage to the wafer box 5.

[0078] In order to solve the above technical problems, the wafer loading mechanism of the present application also includes a base 500, an unlocking assembly 600 and an adjusting assembly 700. The support member 210 is mounted on the base 500 through the adjusting assembly 700, and the unlocking assembly 600 is fixed on the base 500. The relative position between the support member 210 and the unlocking assembly 600 can be adjusted by the adjusting assembly 700, so as to ensure that the key on the unlocking assembly 600 will not rub against the edge of the lock hole when inserted into the lock hole on the wafer carrier box. In addition, the accuracy and stability of opening the wafer carrier box can be improved by adjusting the relative position between the support member 210 and the unlocking assembly 600.

[0079] In some embodiments, the wafer carrier box includes a box body, a cover body and a lock core, and the box body and the cover body together form a closed space for accommodating the wafer. The lock core is used to lock the cover body to the box body, or to unlock the cover body. The lock core has a lock hole formed on the cover body, and a matching key can be inserted into the lock hole to cooperate with the lock core.

[0080] See also Figures 14 to 16 , the support member 210 and the unlocking assembly 600 are both connected to the base 500. The adjusting assembly 700 is located between the base 500 and the support member 210. The adjusting assembly 700 is used to adjust the support member 210 to move relative to the base 500 in the first preset direction and the second preset direction until the unlocking assembly 600 can drive the lock core to switch between the locked state and the unlocked state.

[0081] It should be noted that Fig.14 The Y direction in the figure may be the first preset direction, and the Z direction may be the second preset direction.

[0082] The support member 210 in the present application is installed on the base 500 through the adjustment component 700. The position of the wafer carrier box on the support member 210 relative to the unlocking component 600 can be adjusted by the adjustment component 700, so as to achieve the adjustment of the relative position of the support member 210 and the unlocking component 600, thereby solving the problem of friction between the lock hole on the wafer carrier box and the key on the unlocking component 600, and improving the accuracy and stability of opening the wafer carrier box.

[0083] In some embodiments, the wafer loading mechanism includes four adjustment components 700 , two adjustment components 700 are respectively disposed on both sides of the support member 210 in the first preset direction, and the unlocking component 600 is located in the third preset direction of the support member 210 .

[0084] In some embodiments, the first preset direction is perpendicular to the second preset direction. Specifically, the second preset direction is parallel to the direction of gravity.

[0085] See also Fig.17 The adjustment assembly 700 includes a connecting member 710, an adjusting member 720, a first adjusting structure 730, and a second adjusting structure 740. The connecting member 710 is connected to the base 500. The adjusting member 720 is connected to the connecting member 710 through the first adjusting structure 730, and the first adjusting structure 730 is used to drive the adjusting member 720 and the support member 210 to move in a first preset direction relative to the connecting member 710. The adjusting member 720 is connected to the support member 210 through the second adjusting structure 740, and the second adjusting structure 740 is used to drive the support member 210 to move in a second preset direction relative to the adjusting member 720.

[0086] In some embodiments, the connector 710 is fixedly connected to the base 500 via fasteners.

[0087] The first adjustment structure 730 and the second adjustment structure 740 may include the same parts. The first adjustment structure 730 includes a first fastener 732 and a first top screw 731, the first top screw 731 is used to adjust the relative distance between the connecting member 710 and the adjusting member 720, and the first fastener 732 is used to fix the relative position between the connecting member 710 and the adjusting member 720 after the first top screw 731 is adjusted. The second adjustment structure 740 includes a second fastener 742 and a second top screw 741, the second top screw 741 is used to adjust the relative distance between the adjusting member 720 and the supporting member 210, and the second fastener 742 is used to fix the relative position between the adjusting member 720 and the supporting member 210 after the second top screw 741 is adjusted.

[0088] Optionally, the connecting member 710 is in a right L shape, and the first side plate 711 of the right L-shaped connecting member 710 is connected to the right crossbeam of the base 500 through a fastener. The adjusting member 720 is in an inverted L shape, and the second side plate 712 of the right L-shaped connecting member 710 is used to support the third side plate 721 of the inverted L-shaped adjusting member 720, and the first side plate 711 of the right L-shaped connecting member 710 is connected to the third side plate 721 of the inverted L-shaped adjusting member 720 through a first adjusting structure 730. The fourth side plate 722 of the inverted L-shaped adjusting member 720 is connected to the right vertical plate of the supporting member 210 through a second adjusting structure 740, which can be specifically referred to Fig.17 .

[0089] The support member 210 of the present application is connected to the base 500 through the adjustment component 700, and the unlocking component 600 is fixedly connected to the base 500, so that the support member 210 can move in two different directions relative to the unlocking component 600. When the support member 210 is loaded with a wafer carrier, if there is friction between the lock hole on the wafer carrier and the key on the unlocking component 600, the relative position of the lock hole and the key can be adjusted by the adjustment component 700, thereby solving the friction problem.

[0090] In order to improve the accuracy of the unlocking assembly 600 in opening the wafer carrier when the wafer loading mechanism loads the wafer carrier, the calibration assembly 800 can be used to preview in advance the situation in which the carrying assembly 200 is used to load the wafer carrier into the loading area.

[0091] In order to better explain this embodiment, the following is described in combination with the drawings. It should be noted that the structure in the drawings is only for schematic illustration and does not specifically limit the structure in this embodiment. Other structures derived therefrom are also within the protection scope of the present utility model.

[0092] See also Figures 18 to 20 In order to more intuitively calibrate the relative position of the keyhole and the key, a calibration component 800 may be provided on the support 210, wherein the calibration component 800 and the support 210 are matched with each other through a pin hole. The calibration component 800 may simulate the state where the wafer carrier is loaded on the support 210, and the observation hole 820 on the calibration component 800 simulates the keyhole on the wafer carrier. With the aid of the calibration component 800, the relative position of the observation hole 820 and the key, that is, the relative position of the keyhole and the key, may be more intuitively observed.

[0093] In addition, the calibration component 800 can also assist in the docking position of the support 210 and the transmission component 300. During the teaching stage of the manipulator (transmission component 300), it is necessary to teach the docking point between the manipulator and the wafer carrier box. At this time, the calibration component 800 can simulate the loading state of the wafer carrier box on the manipulator, and the docking cooperation between the positioning pins on the teaching manipulator and the positioning holes 830 of the calibration component 800 is realized to achieve the teaching of the docking point between the wafer carrier box and the manipulator. Similarly, during the teaching stage of the support 210, it is necessary to teach the docking point between the support 210 and the wafer carrier box. At this time, the calibration component 800 can also simulate the loading state of the wafer carrier box on the support 210, and the docking cooperation between the positioning pins of the support 210 and the alignment holes 810 of the calibration component 800 is realized to achieve the teaching of the docking point between the wafer carrier box and the support 210.

[0094] The semiconductor process equipment includes the above-mentioned wafer loading mechanism.

[0095] The semiconductor process equipment of the present application, the transmission component 300 of the wafer loading mechanism can avoid the locking structure 220 matched with the bottom fixing structure 52 at the bottom of the wafer carrying box when loading the wafer carrying box onto the support 210, so that the locking structure 220 of the present application can lock the wafer carrying box from the bottom position of the wafer carrying box. The stability of the wafer carrying box during loading is improved, and because the bottom fixing structure 52 at the bottom of the wafer carrying box has industry standards, the wafer loading mechanism can be fully compatible with wafer carrying boxes of different brands, and will not cause damage to the base of the wafer carrying box.

[0096] In the description of the present utility model, it should be understood that the terms "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0097] In the description of this specification, the description with reference to the terms "one embodiment", "certain embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0098] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A wafer loading mechanism, characterized in that: It includes a bearing component and a transmission component; The carrying assembly includes a support and a locking structure arranged on the support, and the transmission assembly is used to load the wafer carrying box onto the support; the locking structure is used to lock to the bottom of the wafer carrying box, or release the lock on the bottom of the wafer carrying box; The transmission component has an escape space for escaping the locking structure.

2. The wafer loading mechanism according to claim 1, characterized in that: The locking structure comprises a locking member and a driving member, wherein the driving member is connected to the supporting member, and the locking member is movably arranged on the driving member; The supporting member has a supporting surface for supporting the wafer carrier box, and the driving member is used to drive the locking member to swing back and forth around a preset rotation axis perpendicular to the supporting surface, so that the locking member switches between a locked state and an unlocked state.

3. The wafer loading mechanism according to claim 2, characterized in that: The bottom of the wafer carrier box is provided with a locking groove adapted to the locking member; The driving member is used to drive the locking member to swing clockwise or counterclockwise, and to press the side wall of the locking groove when the locking member swings into the locking groove to limit the relative movement of the wafer carrier box and the support member in a direction parallel to the preset rotating axis, or to drive the locking member to swing counterclockwise or clockwise, and to release the pressing of the side wall of the locking groove when the locking member swings out of the locking groove.

4. The wafer loading mechanism according to any one of claims 1 to 3, characterized in that: The support member has a loading area; the locking structure is used to lock the bottom of the wafer carrier box when the transmission component loads the wafer carrier box to the loading area; The wafer loading mechanism further includes a positioning component, and the positioning component is used to confirm that the wafer carrier box is loaded into the loading area.

5. The wafer loading mechanism according to claim 4, characterized in that: The positioning assembly includes a positioning member and a positioning sensing member, wherein the positioning member is arranged on the supporting member, and the positioning member is used to be inserted into the positioning hole on the wafer carrying box when the wafer carrying box is loaded into the loading area, so as to limit the relative movement of the wafer carrying box on the supporting member; The positioning sensing member is used to confirm that the wafer carrier box is loaded into the loading area when the positioning member is inserted into the positioning hole.

6. The wafer loading mechanism according to claim 5, characterized in that: The positioning assembly includes a plurality of the positioning members and a plurality of the positioning sensing members. The plurality of the positioning members and the plurality of the positioning sensing members are the same in number and are arranged in a one-to-one correspondence.

7. The wafer loading mechanism according to claim 1, characterized in that: The wafer carrying box comprises a box body, a cover body and a lock core, wherein the box body and the cover body together form a closed space for accommodating wafers; the lock core is used to lock the cover body to the box body, or to unlock the cover body; The wafer loading mechanism further comprises a base and an unlocking assembly, wherein the support member and the unlocking assembly are both connected to the base; The wafer loading mechanism also includes an adjustment component located between the base and the support member, and the adjustment component is used to adjust the support member to move relative to the base in a first preset direction and a second preset direction until the unlocking component can drive the lock core to switch between a locked state and an unlocked state.

8. The wafer loading mechanism according to claim 7, characterized in that: The first preset direction is perpendicular to the second preset direction.

9. The wafer loading mechanism according to claim 7, characterized in that: The adjustment assembly includes a connecting member, an adjusting member, a first adjusting structure and a second adjusting structure, wherein the connecting member is connected to the base; The adjusting member is connected to the connecting member via the first adjusting structure, and the first adjusting structure is used to drive the adjusting member and the supporting member to move relative to the connecting member in the first preset direction; The adjusting member is connected to the supporting member via the second adjusting structure, and the second adjusting structure is used to drive the supporting member to move in the second preset direction relative to the adjusting member.

10. A semiconductor process equipment, characterized in that: A wafer loading mechanism comprising the wafer loading mechanism described in any one of claims 1 to 9.

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