Mobile phone mainboard support and smart phone

Abstract

The utility model provides a mobile phone mainboard support and a smart phone. The mobile phone mainboard support comprises a heat dissipation support body, a fixed support body and heat dissipation fins, the fixed support body is connected to the outer periphery of the heat dissipation support body, the fixed support body and the heat dissipation support body jointly form a containing cavity, the containing cavity is used for containing a mobile phone mainboard, and the heat dissipation fins are arranged in the containing cavity. The cooling fin is located in the containing cavity and connected with the cooling support body, the fixing support body is provided with a first installation groove and a first receding hole, the first installation groove is communicated with the first receding hole, and the first receding hole is used for a camera to penetrate through. A first protection boss is arranged on the side face, away from the cooling fins, of the fixing support body in a protruding mode, and the first protection boss corresponds to the first receding hole. The radiating fins are matched with the radiating bracket body, so that the radiating area is increased, and the radiating performance of the mobile phone mainboard bracket is better.

Description

Technical Field

[0001] The present invention relates to the field of mobile phone motherboard brackets, and in particular to a mobile phone motherboard bracket and a smart phone. Background Art

[0002] Smartphones are devices with independent operating systems and independent operating spaces. Users can install software, games, navigation and other third-party service providers, and can access wireless networks through mobile communication networks. The motherboard, also called the main board, system board, or motherboard, is one of the most basic and important components of a computer. The increasingly powerful functions of smartphones are inseparable from the motherboard. During the assembly process, the motherboard needs to be fixed with the assistance of a dedicated bracket structure.

[0003] For example, a Chinese patent with application number CN202322833239.4 discloses a hardware bracket for a mobile phone motherboard, including a fixing plate and screw holes opened on the surface of the fixing plate, the surface of the fixing plate is fixedly provided with an insert block protruding outward, a plurality of circular holes are opened around the fixing plate, a square opening is opened on the side close to the circular hole, and the square opening is provided with a bent insertion block.

[0004] However, the structural design of the above-mentioned mobile phone motherboard hardware bracket has the following problems during use:

[0005] The above-mentioned mobile phone motherboard hardware bracket can fit and press the bracket into the mobile phone motherboard through the cooperation of the embedded block, and the bent insertion block is set to allow the bracket to be inserted into the mobile phone motherboard, thereby achieving the fixation of the mobile phone motherboard and the bracket. However, since the mobile phone motherboard generates heat when working, and the mobile phone motherboard and the metal bracket can dissipate heat to a certain extent, when the mobile phone motherboard is in high-performance mode, such as playing games or watching movies, the heat generated by the mobile phone motherboard is relatively high, and the metal bracket cannot conduct the heat of the mobile phone motherboard in time, that is, the heat dissipation performance is poor; on the other hand, the above-mentioned metal bracket is not provided with a camera mounting seat. When it comes to some mobile phone models where the camera is integrated with the mobile phone motherboard, the above-mentioned metal bracket has poor compatibility and protection effect.

[0006] Therefore, there is an urgent need for a mobile phone motherboard bracket with good heat dissipation performance and high compatibility. Utility Model Content

[0007] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a mobile phone motherboard bracket and a smart phone with better heat dissipation performance and higher compatibility.

[0008] The purpose of this disclosure is achieved through the following technical solutions:

[0009] A mobile phone mainboard bracket, comprising:

[0010] A heat dissipation bracket body and a fixed bracket body, wherein the fixed bracket body is connected to the outer periphery of the heat dissipation bracket body, and the fixed bracket body and the heat dissipation bracket body jointly form a receiving cavity, and the receiving cavity is used to receive the mobile phone motherboard.

[0011] The mobile phone motherboard bracket also includes a heat sink, which is located in the accommodating cavity and connected to the heat dissipation bracket body. The fixed bracket body is provided with a first mounting groove and a first avoidance hole, the first mounting groove is communicated with the first avoidance hole, the first mounting groove and the first avoidance hole are both arranged away from the heat sink, the first avoidance hole is used for the camera to pass through, and a first protective boss is convexly provided on a side of the fixed bracket body facing away from the heat sink, and the first protective boss is arranged corresponding to the first avoidance hole.

[0012] In one embodiment, the heat dissipation bracket body and the fixing bracket body are an integrally formed structure.

[0013] In one embodiment, the heat sink is a graphite heat sink.

[0014] In one of the embodiments, a plurality of mounting holes are formed on the periphery of the fixing bracket body, and the plurality of mounting holes are arranged at intervals.

[0015] In one embodiment, the cross section of the first protection boss is circular.

[0016] In one embodiment, the diameter of the first protective boss is 35 mm-36 mm.

[0017] In one embodiment, the height of the first protective boss is 3 mm-4 mm.

[0018] In one embodiment, the heat sink is bonded to the cavity wall of the accommodating cavity.

[0019] In one of the embodiments, the fixed bracket body is further provided with a second mounting groove, a third mounting groove, a second avoidance hole and a third avoidance hole, respectively. The second mounting groove is connected to the second avoidance hole, the third mounting groove is connected to the third avoidance hole, the second mounting groove and the third mounting groove are arranged adjacent to each other, and a second protective boss is protruding from a side of the fixed bracket body facing away from the heat sink, and the second avoidance hole and the third avoidance hole are located in the area surrounded by the second protective boss.

[0020] A smart phone comprises the mobile phone mainboard bracket described in any one of the above embodiments.

[0021] Compared with the prior art, the present invention has at least the following advantages:

[0022] 1. In the above-mentioned mobile phone motherboard bracket, the fixed bracket body and the heat dissipation bracket body jointly form a receiving cavity, the heat sink is located in the receiving cavity and connected to the heat dissipation bracket body. When the mobile phone is assembled, the mobile phone motherboard is installed in the receiving cavity and fits with the heat sink. The heat generated by the mobile phone motherboard is conducted to the heat sink, and at the same time, the heat on the heat sink is transferred to the heat dissipation bracket body, thereby increasing the heat dissipation area and making the heat dissipation of the mobile phone motherboard bracket better.

[0023] 2. The above-mentioned mobile phone motherboard bracket, the fixed bracket body is provided with a first mounting groove and a first avoidance hole which are connected to each other. The first mounting groove is used to accommodate a camera connected to the mobile phone motherboard, and the first avoidance hole is used for the camera to pass through so as to fix the camera, thereby improving the compatibility of the mobile phone motherboard bracket. At the same time, the first protective boss is convexly arranged on one side of the fixed bracket body, which has a better protection effect on the camera in the first avoidance hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 This is a structural schematic diagram of a mobile phone motherboard bracket according to an embodiment;

[0026] Figure 2 for Figure 1 Another structural schematic diagram of the mobile phone motherboard bracket is shown. DETAILED DESCRIPTION

[0027] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0028] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0030] The present invention discloses a mobile phone motherboard bracket, comprising a heat dissipation bracket body, a fixed bracket body and a heat sink, the fixed bracket body is connected to the outer periphery of the heat dissipation bracket body, the fixed bracket body and the heat dissipation bracket body jointly form a accommodating cavity, the accommodating cavity is used to accommodate a mobile phone motherboard, the heat sink is located in the accommodating cavity and is connected to the heat dissipation bracket body, the fixed bracket body is provided with a first mounting groove and a first avoidance hole, the first mounting groove is communicated with the first avoidance hole, the first mounting groove and the first avoidance hole are both arranged away from the heat sink, the first avoidance hole is used for a camera to pass through, and a first protective boss is convexly provided on a side of the fixed bracket body facing away from the heat sink, the first protective boss is arranged corresponding to the first avoidance hole.

[0031] The above-mentioned mobile phone motherboard bracket, the fixed bracket body and the heat dissipation bracket body jointly form a accommodating cavity, the heat sink is located in the accommodating cavity and connected to the heat dissipation bracket body, when the mobile phone is assembled, the mobile phone motherboard is installed in the accommodating cavity and fits with the heat sink, the heat generated by the mobile phone motherboard is conducted to the heat sink, and at the same time the heat on the heat sink is transferred to the heat dissipation bracket body, thus increasing the heat dissipation area, so that the heat dissipation of the mobile phone motherboard bracket is better; because the fixed bracket body is provided with a first mounting groove and a first avoidance hole that are connected to each other, the first mounting groove is used to accommodate a camera connected to the mobile phone motherboard, and the first avoidance hole is used for the camera to pass through so as to fix the camera, thereby improving the compatibility of the mobile phone motherboard bracket, and at the same time the first protective boss is convexly arranged on one side of the fixed bracket body, which has a better protection effect on the camera in the first avoidance hole.

[0032] In order to better understand the technical solutions and beneficial effects of the present invention, the present invention is further described in detail below in conjunction with specific embodiments:

[0033] like Figure 1 and Figure 2As shown, a mobile phone motherboard bracket 10 of an embodiment includes a heat dissipation bracket body 100, a fixed bracket body 200 and a heat sink 300, wherein the fixed bracket body 200 is connected to the outer periphery of the heat dissipation bracket body 100, and the fixed bracket body 200 and the heat dissipation bracket body 100 jointly form a receiving cavity 100a, and the receiving cavity 100a is used to receive the mobile phone motherboard. Furthermore, the heat sink 300 is located in the accommodating cavity 100a and is connected to the heat dissipation bracket body 100, and the fixed bracket body 200 is provided with a first mounting groove 210 and a first avoidance hole 220, and the first mounting groove 210 is communicated with the first avoidance hole 220, and the first mounting groove 210 and the first avoidance hole 220 are both arranged away from the heat sink 300, and the first avoidance hole 220 is used for the camera to pass through, and a first protective boss 230 is convexly provided on a side of the fixed bracket body 200 away from the heat sink 300, and the first protective boss 230 is arranged corresponding to the first avoidance hole 220, so that the first protective boss 230 can protect the camera in the first avoidance hole 220.

[0034] In this embodiment, the heat dissipation support body 100 is located in the middle of the fixed support body 200, and the outer periphery of the heat dissipation support body 100 is connected to the fixed support body 200, so that the heat dissipation support body 100 and the fixed support body 200 jointly form a receiving cavity 100a, and the heat sink 300 is located in the receiving cavity 100a and connected to the heat dissipation support body 100. When the mobile phone motherboard generates heat during operation, the heat is first transferred to the heat sink 300, and the heat is also transferred from the heat sink 300 to the heat dissipation support body 100 synchronously. Through the mutual cooperation between the heat sink 300 and the heat dissipation support body 100, the heat dissipation area is increased, so that the heat dissipation performance of the mobile phone motherboard support 10 is better. Further, the first mounting groove 210 and the first avoidance hole 220 are used to accommodate and install the camera so that the camera is fixed, which is suitable for the model of the mobile phone motherboard and the camera integrated. The first protective boss 230 is convexly arranged on one side of the fixed support body to protect the camera in the first avoidance hole 220.

[0035] In the above-mentioned mobile phone motherboard bracket 10, the fixed bracket body 200 and the heat dissipation bracket body 100 jointly form a receiving cavity 100a, the heat sink 300 is located in the receiving cavity 100a and is connected to the heat dissipation bracket body 100. When the mobile phone is assembled, the mobile phone motherboard is installed in the receiving cavity 100a and fits with the heat sink 300. The heat generated by the mobile phone motherboard is conducted to the heat sink 300, and the heat on the heat sink 300 is transferred to the heat dissipation bracket body 100, thereby increasing the heat dissipation area, so that the heat dissipation of the mobile phone motherboard bracket 10 is better; because the fixed bracket body 200 is provided with a first mounting groove 210 and a first avoidance hole 220 that are connected to each other, the first mounting groove 210 is used to accommodate a camera connected to the mobile phone motherboard, and the first avoidance hole 220 is used for the camera to pass through so that the camera is fixed, thereby improving the compatibility of the mobile phone motherboard bracket 10, and the first protective boss 230 is convexly arranged on one side of the fixed bracket body 200, and the protection effect of the camera in the first avoidance hole 220 is better.

[0036] In one embodiment, the heat dissipation support body 100 and the fixing support body 200 are an integrally formed structure. In this embodiment, the heat dissipation support body 100 and the fixing support body 200 are made of metal with good heat dissipation performance and light weight, such as aluminum or aluminum-titanium alloy, and the heat dissipation support body 100 and the fixing support body 200 are formed by an integral molding process.

[0037] In one embodiment, the heat sink 300 is a graphite heat sink 300. It can be understood that the graphite heat sink 300 has good thermal conductivity, so that when the mobile phone motherboard generates heat during operation, the heat of the mobile phone motherboard can be well conducted to the graphite heat sink 300.

[0038] like Figure 1 As shown, in one embodiment, the periphery of the fixing bracket body 200 is provided with a plurality of mounting holes 240, and the plurality of mounting holes 240 are arranged at intervals. It can be understood that the mounting holes 240 are used for screws to pass through, so as to fix the mobile phone motherboard to the mobile phone motherboard bracket 10, and to fix the mobile phone motherboard bracket 10 to the mobile phone housing.

[0039] like Figure 2 As shown, in one embodiment, the cross section of the first protective protrusion 230 is circular. In this embodiment, the cross section of the first protective protrusion 230 is circular to adapt to the shape of the camera. Of course, in other embodiments, the first protective protrusion 230 can also be other shapes such as rectangular or elliptical.

[0040] In one embodiment, the diameter of the first protection boss 230 is 35 mm-36 mm. In this embodiment, the diameter of the first protection boss 230 is 35 mm, so that the first protection boss 230 covers the camera in the middle.

[0041] In one embodiment, the height of the first protective protrusion 230 is 3 mm-4 mm. In this embodiment, the height of the first protective protrusion 230 is 4 mm, so that the first protective protrusion 230 is protruding from the camera, thereby achieving a protective effect.

[0042] In one embodiment, the heat sink 300 is bonded to the cavity wall of the accommodating cavity 100a. In this embodiment, the heat sink 300 is bonded to the cavity wall of the accommodating cavity 100a by heat dissipation adhesive, so that the heat sink 300 is fixed to the heat dissipation bracket body 100, further improving the heat dissipation performance.

[0043] like Figure 1 and Figure 2 As shown, in one embodiment, the fixing bracket body 200 is further provided with a second mounting groove 250, a third mounting groove 260, a second avoidance hole 270 and a third avoidance hole 280, the second mounting groove 250 is connected with the second avoidance hole 270, the third mounting groove 260 is connected with the third avoidance hole 280, the second mounting groove 250 and the third mounting groove 260 are arranged adjacent to each other, a second protective boss 290 is convexly provided on a side of the fixing bracket body 200 away from the heat sink 300, and the second avoidance hole 270 and the third avoidance hole 280 are located in the area surrounded by the second protective boss 290. In this embodiment, the mobile phone motherboard is provided with three cameras, one of which is located in the first mounting groove 210, and the other two cameras are respectively located in the second mounting groove 250 and the third mounting groove 260, and the second protective boss 290 protects the cameras in the second mounting groove 250 and the third mounting groove 270.

[0044] The present application also provides a smart phone, comprising the mobile phone motherboard bracket 10 described in any of the above embodiments.

[0045] Compared with the prior art, the present invention has at least the following advantages:

[0046] 1. In the above-mentioned mobile phone motherboard bracket 10, the fixed bracket body 200 and the heat dissipation bracket body 100 jointly form a receiving cavity 100a, and the heat sink 300 is located in the receiving cavity 100a and connected to the heat dissipation bracket body 100. When the mobile phone is assembled, the mobile phone motherboard is installed in the receiving cavity 100a and fits with the heat sink 300. The heat generated by the mobile phone motherboard is conducted to the heat sink 300, and at the same time, the heat on the heat sink 300 is transferred to the heat dissipation bracket body 100, thereby increasing the heat dissipation area, so that the heat dissipation of the mobile phone motherboard bracket 10 is better.

[0047] 2. The above-mentioned mobile phone motherboard bracket 10, the fixed bracket body 200 is provided with a first mounting groove 210 and a first avoidance hole 220 which are connected to each other. The first mounting groove 210 is used to accommodate a camera connected to the mobile phone motherboard, and the first avoidance hole 220 is used for the camera to pass through so as to fix the camera, thereby improving the compatibility of the mobile phone motherboard bracket 10. At the same time, the first protective boss 230 is convexly arranged on one side of the fixed bracket body 200, which has a better protection effect on the camera in the first avoidance hole 220.

[0048] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the patent of the present disclosure shall be based on the attached claims.

Claims

1. A mobile phone motherboard bracket, comprising a heat dissipation bracket body and a fixed bracket body, wherein the fixed bracket body is connected to the outer periphery of the heat dissipation bracket body, the fixed bracket body and the heat dissipation bracket body jointly form a receiving cavity, and the receiving cavity is used to receive the mobile phone motherboard, characterized in that: The mobile phone motherboard bracket also includes a heat sink, which is located in the accommodating cavity and connected to the heat dissipation bracket body. The fixed bracket body is provided with a first mounting groove and a first avoidance hole, the first mounting groove is communicated with the first avoidance hole, the first mounting groove and the first avoidance hole are both arranged away from the heat sink, the first avoidance hole is used for the camera to pass through, and a first protective boss is convexly provided on a side of the fixed bracket body facing away from the heat sink, and the first protective boss is arranged corresponding to the first avoidance hole.

2. The mobile phone motherboard bracket according to claim 1, characterized in that: The heat dissipation bracket body and the fixing bracket body are an integrally formed structure.

3. The mobile phone motherboard bracket according to claim 1, characterized in that: The heat sink is a graphite heat sink.

4. The mobile phone motherboard bracket according to claim 1, characterized in that: A plurality of mounting holes are provided on the periphery of the fixing bracket body, and the plurality of mounting holes are arranged at intervals.

5. The mobile phone motherboard bracket according to claim 1, characterized in that: The cross section of the first protection boss is circular.

6. The mobile phone motherboard bracket according to claim 5, characterized in that: The diameter of the first protective boss is 35 mm-36 mm.

7. The mobile phone motherboard bracket according to claim 1, characterized in that: The height of the first protective boss is 3mm-4mm.

8. The mobile phone motherboard bracket according to claim 1, characterized in that: The heat sink is bonded to the cavity wall of the accommodating cavity.

9. The mobile phone motherboard bracket according to claim 1, characterized in that: The fixing bracket body is also respectively provided with a second mounting groove, a third mounting groove, a second avoidance hole and a third avoidance hole, the second mounting groove is connected with the second avoidance hole, the third mounting groove is connected with the third avoidance hole, the second mounting groove and the third mounting groove are arranged adjacent to each other, a second protective boss is convexly provided on a side of the fixing bracket body facing away from the heat sink, and the second avoidance hole and the third avoidance hole are located in the area surrounded by the second protective boss.

10. A smart phone, characterized in that: A mobile phone mainboard bracket comprising any one of claims 1 to 9.

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