Heat dissipation structure for PCB and pre-charging resistor
By designing a fully open or partially open hole structure on the PCB board, all-round air convection heat dissipation with pre-charge resistance is solved, and the problem of heat dissipation in the prior art increases the structural complexity or stability of the PCB board is improved, and the stability and reliability of the system are improved.
Patent Information
- Application Number
- CN202421104944.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-21
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-05-21
AI Technical Summary
The prior art increases the structural complexity of the PCB board or affects the stability of the PCB board when dissipating heat for the precharge resistor.
Design a heat dissipation structure for PCB and pre-charge resistors. By opening a fully open or partially open structure on the PCB board, it ensures that all six surfaces of the pre-charge resistor can come into contact with the air, achieving all-round air convection heat dissipation.
The heat from the precharge resistor is effectively dissipated, the contact area between the high-temperature resistor and the PCB board is reduced, and the way heat is transmitted to the PCB board is improved, thereby improving the stability and reliability of the PCB board and other components.
Smart Images
Figure CN222655396U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation of pre-charging resistors, in particular to a heat dissipation structure for PCB and pre-charging resistors. Background Art
[0002] In BMS (Battery Management System), in order to prevent the instantaneous short-term large current from damaging the circuit components and equipment, a slow charge can be performed at the initial power-on stage. A pre-charge circuit is designed in the loop. The pre-charge resistor (cement, aluminum shell, ceramic, etc.) in the pre-charge circuit is the key to ensure the safety of the circuit. The pre-charge resistor limits the large current through its own characteristics, and dissipates the electrical energy by converting it into heat energy, thus protecting the circuit. Therefore, the resistor is a heat source. If the heat cannot be effectively dissipated or transferred back to its carrier PCB, it will affect the stability of the circuit or the stability and reliability of other components around the PCB.
[0003] There are two common methods to solve the above problems. The first method is to connect the pre-charge resistor externally, lead out the wires from the PCB board, and then connect it to the pre-charge resistor installed somewhere in the chassis. This method adds the process of connecting the pre-charge resistor leads to the PCB board, adds wires, and occupies chassis space, which is time-consuming, labor-intensive and costly. The second method is to stand up the pre-charge resistor and insert and weld it. This method raises the center of gravity of the pre-charge resistor, which can easily cause its installation to be unstable, and may also cause the height of the device on the PCB board to be too high, affecting the entire structure.
[0004] In summary, although the prior art can dissipate heat for the pre-charging resistor, it will increase the structural complexity of the PCB board or affect the stability of the PCB board. Utility Model Content
[0005] Therefore, the technical problem to be solved by the present invention is to overcome the problem in the prior art that the heat dissipation of the pre-charging resistor will increase the structural complexity of the PCB board or affect the stability of the PCB board.
[0006] In order to solve the above technical problems, the utility model provides a heat dissipation structure for PCB and pre-charging resistor, comprising:
[0007] The heat dissipation structure is arranged on the PCB board, and is used to dissipate heat for the PCB board and the pre-charge resistor arranged on the PCB board at the same time, wherein:
[0008] The heat dissipation structure is an open hole structure opened on the PCB board, and the open hole structure is a full open hole structure or a partial open hole structure; when the open hole structure is a full open hole structure, the length of the full open hole structure is less than the length of the pre-charging resistor, and the width of the full open hole structure is less than the width of the pre-charging resistor; when the open hole structure is a partial open hole structure, the length of the partial open hole structure is greater than or equal to the length of the pre-charging resistor, or the width of the partial open hole structure is greater than or equal to the width of the pre-charging resistor.
[0009] In one embodiment of the utility model, when the open hole structure is a fully open hole structure, the area of the fully open hole structure is smaller than the area of the pre-charging resistor, wherein the area of the pre-charging resistor is the projection area of the contact direction between the pre-charging resistor and the PCB board.
[0010] In one embodiment of the present invention, the area of the fully open-pore structure is 80%-95% of the area of the pre-charging resistor.
[0011] In one embodiment of the utility model, when the opening structure is less than a preset distance from the edge of the PCB board and the opening structure is a full-opening structure, the full-opening structure is provided with a support bar for reinforcement, and the support bar is connected to the PCB board.
[0012] In one embodiment of the utility model, when the opening structure is a partial opening structure, the area of the partial opening structure is greater than or equal to the area of the pre-charging resistor, wherein the area of the pre-charging resistor is the projection area of the contact direction between the pre-charging resistor and the PCB board.
[0013] In one embodiment of the present invention, the area of the partially open structure is 100%-120% of the area of the pre-charging resistor.
[0014] In an embodiment of the present invention, the partial opening structure is a stripe structure opened on the PCB board, and the stripe structure is arranged in parallel.
[0015] In one embodiment of the present invention, the stripe structure includes a plurality of non-perforated stripes and a plurality of perforated stripes, wherein the width of the perforated stripes is greater than the width of the non-perforated stripes.
[0016] In an embodiment of the present invention, the partial opening structure is a plurality of circular hole structures opened on the PCB board, and the plurality of circular hole structures are distributed in an array.
[0017] The above technical solution of the utility model has the following advantages compared with the prior art:
[0018] The heat dissipation structure for PCB and pre-charging resistor described in the utility model enables the six surfaces of the high-heat pre-charging resistor to be in contact with the air, realizes air convection heat dissipation in all directions, and dissipates the heat of the resistor itself in a limited manner, ensuring the function of the pre-charging circuit. At the same time, the contact area between the high-temperature pre-charging resistor and the PCB board is reduced, blocking the way for the pre-charging resistor to conduct heat to the PCB board, reducing its impact on the PCB board, which is beneficial to the stable operation of the PCB board and other components, and increasing the stability and reliability of the entire system;
[0019] The utility model designs the opening structure on the PCB board as a full opening structure or a partial opening structure, and the user can select a suitable structure according to actual needs. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to make the content of the utility model easier to understand, the utility model is further described in detail according to the specific embodiments of the utility model in combination with the accompanying drawings, wherein
[0021] Figure 1 is a top view of a PCB board with a heat dissipation structure in an embodiment of the utility model;
[0022] Figure 2 It is a top view of a fully open-hole structure with support bars in an embodiment of the utility model;
[0023] Figure 3 It is a top view of a PCB board with a circular hole structure in an embodiment of the utility model.
[0024] Explanation of the reference numerals in the specification: 1. PCB board; 2. Pre-charging resistor; 3. Fully open-hole structure; 4. Partially open-hole structure; 5. Support bar. DETAILED DESCRIPTION
[0025] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.
[0026] Reference Figure 1 As shown, the utility model relates to a heat dissipation structure for a PCB and a pre-charging resistor, wherein the heat dissipation structure is arranged on a PCB board 1, and is used to dissipate heat for the PCB board 1 and the pre-charging resistor 2 arranged on the PCB board 1 at the same time, wherein the heat dissipation structure is an open hole structure opened on the PCB board 1, and the open hole structure is a full open hole structure 3 or a partial open hole structure 4.
[0027] Further, when the open hole structure of this embodiment is a full open hole structure 3, the length of the full open hole structure 3 is less than the length of the pre-charging resistor 2, and the width of the full open hole structure 3 is less than the width of the pre-charging resistor 2. For details, please refer to Figure 1 In (a), in short, in this embodiment, a slot (usually rectangular) slightly smaller than the bottom surface of the pre-charging resistor 2 is opened on the PCB board 1 at the position where the pre-charging resistor 2 contacts the PCB board 1, so that the bottom surface of the pre-charging resistor 2 can be mostly exposed to the air to achieve convection heat dissipation, while also providing some support; at the same time, the path for heat transfer to the PCB board 1 is blocked without completely sinking into the slot.
[0028] Furthermore, when the opening structure of the present embodiment is a full-opening structure 3, the area of the full-opening structure 3 is smaller than the area of the pre-charging resistor 2, wherein the area of the pre-charging resistor 2 is the projected area of the contact direction between the pre-charging resistor 2 and the PCB board 1. This design method can effectively prevent the pre-charging resistor 2 from falling into the slot.
[0029] Furthermore, the area of the fully open structure 3 in this embodiment is 80%-95% of the area of the pre-charging resistor 2. Figure 1 It is not difficult to find in (a) that the area of the fully open hole structure 3 (gray part) is smaller than the area of the pre-charging resistor 2. Under the condition that the pre-charging resistor 2 does not collapse, the area of the fully open hole structure 3 is increased as much as possible. The larger the area of the fully open hole structure 3, the better the heat dissipation effect of the pre-charging resistor 2. At the same time, the heat conduction of the pre-charging resistor 2 to the PCB board 1 is also blocked, which effectively reduces the impact on the PCB board 1 and is beneficial to the stable operation of the PCB board 1 and other components.
[0030] Furthermore, when the opening structure of this embodiment is less than a preset distance from the edge of the PCB board 1 and the opening structure is a full opening structure 3, the full opening structure 3 is provided with a support bar 5 for reinforcement at the edge of the PCB board 1. The support bar 5 is connected to the PCB board 1. When the full opening structure 3 is provided, a portion of the PCB board is left as the support bar 5 to strengthen the structure, so that the edge of the PCB board 1 is not easily broken. Please refer to Figure 2 The support bar 5 of this embodiment is part of the PCB board 1, and its function is similar to that of a reinforcing rib. The closer the full-open hole structure 3 is to the edge of the PCB board 1, the easier it is for the edge of the PCB board 1 to break, and the structure of the PCB tends to be unstable. Therefore, when the assembly position of the pre-charging resistor 2 is close to the edge of the PCB board 1, the full-open hole structure 3 usually retains the support bar 5.
[0031] Furthermore, when the opening structure of the present embodiment is a partially opening structure 4, the length of the partially opening structure 4 is greater than or equal to the length of the pre-charging resistor 2, or the width of the partially opening structure 4 is greater than or equal to the width of the pre-charging resistor 2. Of course, in order to achieve the best heat dissipation effect of the pre-charging resistor 2 and minimize the conduction of the resistance heat to the PCB board 1, it is usually possible to set the length of the partially opening structure 4 to be greater than the length of the pre-charging resistor 2, and the width of the partially opening structure 4 to be greater than or equal to the width of the pre-charging resistor 2. The reason why the opening structure is designed as a partially opening structure 4 in the present embodiment is largely because different pre-charging resistors 2 have different lengths and widths. In order to make the product more versatile, a partially opening structure 4 is designed for the PCB board 1 so that it can be put into use directly without measuring the size of the pre-charging resistor 2 each time. If the product is relatively fixed and single, it is recommended to use a fully opening structure 3.
[0032] Generally speaking, the strength of the partially open-pore structure 4 is usually stronger than that of the fully open-pore structure 3, but the heat dissipation is slightly inferior to that of the fully open-pore structure 3. The reason why the partially open-pore structure 4 is designed in this embodiment is that the partially open-pore structure 4 has better support and greater versatility, is more stable while achieving heat dissipation, and can also be used as an effective choice of the open-pore structure.
[0033] Furthermore, when the opening structure of the present embodiment is a partial opening structure 4, the area of the partial opening structure 4 is greater than or equal to the area of the pre-charging resistor 2, wherein the area of the pre-charging resistor 2 is the projection area of the contact direction between the pre-charging resistor and the PCB board; the area of the partial opening structure 4 is 100%-120% of the area of the pre-charging resistor 2. It should be noted that the area of the partial opening structure 4 in the present embodiment refers to the area composed of the part with the slot and the part without the slot. Due to the shape characteristics of the partial opening structure 4, it can stably support the PCB board 1 without sinking into the slot, so its area is usually larger than the area of the pre-charging resistor 2.
[0034] See also Figure 1 In (b), the partial open hole structure 4 of this embodiment includes slot holes (ie, the gray part in the partial open hole structure 4) and non-slot holes (ie, the white part in the partial open hole structure 4).
[0035] Furthermore, the partially open hole structure 4 of the present embodiment is a stripe structure opened on the PCB board 1, and the stripe structure is arranged in parallel. Specifically, with the X direction of the PCB board 1 as the horizontal direction and the Y direction as the vertical direction, the partially open hole structure 4 can open slots in the vertical direction. It is recommended not to open slots in the horizontal direction (i.e., the length direction of the pre-charging resistor 2) because the slots opened in the horizontal direction are more likely to break due to the length. It is usually selected to open slots in the vertical direction. Of course, the slots opened can also have a certain inclination angle.
[0036] Furthermore, the stripe structure of the present embodiment includes a plurality of non-opening stripes (i.e., non-slot holes) and a plurality of opening stripes (i.e., slot holes), wherein the width of the opening stripes is greater than the width of the non-opening stripes, with the purpose of allowing the bottom surface of the pre-charging resistor 2 to be exposed to the air as much as possible, while also reducing the heat transfer from the pre-charging resistor 2 to the PCB board 1.
[0037] For further information, see Figure 3 The partial opening structure 4 of this embodiment is a plurality of circular hole structures opened on the PCB board 1, and the plurality of circular hole structures are distributed in an array. The circular hole structure can not only maximize the slot area, but also is more stable than the above-mentioned stripe structure.
[0038] It can be seen that the heat dissipation structure enables the six surfaces of the high-heat pre-charge resistor to be in contact with the air, achieving all-round air convection heat dissipation, and dissipating the heat of the resistor itself to a limited extent, ensuring the function of the pre-charge circuit. At the same time, it reduces the contact area between the high-temperature pre-charge resistor and the PCB board, blocks the way for the pre-charge resistor to conduct heat to the PCB board, reduces its impact on the PCB board, is conducive to the stable operation of the PCB board and other components, and increases the stability and reliability of the entire system.
[0039] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the invention of the utility model.
Claims
1. A heat dissipation structure for a PCB and a pre-charge resistor, characterized in that: The heat dissipation structure is arranged on the PCB board, and is used to dissipate heat for the PCB board and the pre-charge resistor arranged on the PCB board at the same time, wherein: The heat dissipation structure is an open hole structure opened on the PCB board, and the open hole structure is a full open hole structure or a partial open hole structure; when the open hole structure is a full open hole structure, the length of the full open hole structure is less than the length of the pre-charging resistor, and the width of the full open hole structure is less than the width of the pre-charging resistor; when the open hole structure is a partial open hole structure, the length of the partial open hole structure is greater than or equal to the length of the pre-charging resistor, or the width of the partial open hole structure is greater than or equal to the width of the pre-charging resistor.
2. The heat dissipation structure for PCB and pre-charging resistor according to claim 1, characterized in that: When the open hole structure is a fully open hole structure, the area of the fully open hole structure is smaller than the area of the pre-charging resistor, wherein the area of the pre-charging resistor is the projection area of the contact direction between the pre-charging resistor and the PCB board.
3. The heat dissipation structure for PCB and pre-charging resistor according to claim 1, characterized in that: The area of the fully open-pore structure is 80%-95% of the area of the pre-charge resistor.
4. The heat dissipation structure for PCB and pre-charging resistor according to claim 1, characterized in that: When the opening structure is less than a preset distance from the edge of the PCB board and the opening structure is a full-opening structure, the full-opening structure is provided with a support bar for reinforcement, and the support bar is connected to the PCB board.
5. The heat dissipation structure for PCB and pre-charging resistor according to claim 1, characterized in that: When the open hole structure is a partial open hole structure, the area of the partial open hole structure is greater than or equal to the area of the pre-charging resistor, wherein the area of the pre-charging resistor is the projection area of the contact direction between the pre-charging resistor and the PCB board.
6. The heat dissipation structure for PCB and pre-charging resistor according to claim 1, characterized in that: The area of the partially open-pore structure is 100%-120% of the area of the pre-charging resistor.
7. The heat dissipation structure for PCB and pre-charging resistor according to claim 1, characterized in that: The partial opening structure is a stripe structure opened on the PCB board, and the stripe structure is arranged in parallel.
8. The heat dissipation structure for PCB and pre-charging resistor according to claim 7, characterized in that: The stripe structure includes a plurality of non-perforated stripes and a plurality of perforated stripes, wherein the width of the perforated stripes is greater than the width of the non-perforated stripes.
9. The heat dissipation structure for PCB and pre-charging resistor according to claim 1, characterized in that: The partial opening structure is a plurality of circular hole structures opened on the PCB board, and the plurality of circular hole structures are distributed in an array.