LED device

Abstract

The utility model discloses an LED device, which comprises a support, a bonding pad arranged on the support, a plurality of LED chips arranged on the bonding pad and a plurality of connecting bonding wires arranged among the plurality of LED chips, and the plurality of LED chips are connected in parallel on the bonding pad of the support based on the plurality of connecting bonding wires. The plurality of connecting bonding wires are divided into a first bonding wire group and a second bonding wire group, any LED chip is provided with a positive electrode end and a negative electrode end, the positive electrode ends of the plurality of LED chips are connected in series based on the first bonding wire group, and the negative electrode ends of the plurality of LED chips are connected in series based on the second bonding wire group. According to the LED device, the same-polarity electrodes of the LED chips are connected in series, the bonding wire bonding distance between the adjacent LED chips is shortened, the LED chips form a parallel connection structure, the situation that welding wire arcs interfere with one another is avoided, the electrical connection stability of the LED chips is improved, and therefore the working reliability of the LED device is improved.

Description

Technical Field

[0001] The utility model mainly relates to the technical field of LEDs, and in particular to an LED device. Background Art

[0002] In order to improve the brightness of the product, the current LED devices need to be equipped with large-sized LED chips to meet the product's light brightness requirements. Due to the limited size of the product bracket, when multiple LED chips are installed, the free space on the soldering pad on the bracket is limited, affecting the convenience of connecting the LED chip to the soldering pad.

[0003] Existing technical solutions generally achieve the electrical connection requirements of multiple LED chips by overlapping the wire tails of multiple LED chips and connecting the wires of multiple LED chips to the same solder point position on the pad. However, this connection method is prone to interference between the wire arcs, resulting in poor contact or short circuit of the LED chip, affecting the working reliability of the LED device. Utility Model Content

[0004] The purpose of the utility model is to overcome the shortcomings of the prior art. The utility model provides an LED device. By connecting the same-sex electrodes of multiple LED chips in series, the multiple LED chips are connected in parallel, the bonding distance between the multiple LED chips is reduced, and the electrical connection stability of the multiple LED chips is improved, thereby improving the working reliability of the LED device.

[0005] The utility model provides an LED device, the LED device comprising: a bracket, a solder pad arranged on the bracket, a plurality of LED chips arranged on the solder pad, and a plurality of connecting solder wires arranged between the plurality of LED chips, the plurality of LED chips being connected in parallel to the solder pad of the bracket based on the plurality of connecting solder wires;

[0006] The plurality of connecting wires are divided into a first welding wire group and a second welding wire group. Any of the LED chips is provided with a positive terminal and a negative terminal. The positive terminals of the plurality of LED chips are connected in series based on the first welding wire group, and the negative terminals of the plurality of LED chips are connected in series based on the second welding wire group.

[0007] Furthermore, the first bonding wire group is provided with a plurality of positive electrode bonding wires, and the positive terminals of any two adjacent LED chips are electrically connected based on the positive electrode bonding wires.

[0008] Furthermore, the second bonding wire group is provided with a plurality of negative electrode bonding wires, and the negative electrode terminals between any two adjacent LED chips are electrically connected based on the negative electrode bonding wires.

[0009] Furthermore, a river channel is provided on the pad of the bracket, and the pad is divided into a positive pad and a negative pad based on the river channel, and the LED device is also provided with a first pad lead and a second pad lead;

[0010] The positive terminals of the plurality of LED chips are electrically connected to the positive electrode pad based on the first pad lead;

[0011] The cathode terminals of the plurality of LED chips are electrically connected to the cathode pad based on the second pad lead.

[0012] Furthermore, the plurality of LED chips are arranged in a queue on the soldering pad, the soldering pad leads are arranged on the LED chips at the end of the queue, and / or the soldering pad leads are arranged on the LED chips in the middle of the queue.

[0013] Furthermore, the plurality of LED chips are arranged in a staggered manner on the soldering pad, and the soldering pad forms a reserved electrical connection area based on the arrangement state of the plurality of LED chips.

[0014] Further, the connecting welding wire includes a base ball, a lead wire and a connecting ball;

[0015] The base ball and the connecting ball are respectively arranged on the same-polarity electrodes of two adjacent LED chips; one end of the lead wire is connected to the base ball, and the other end is connected to the connecting ball.

[0016] Furthermore, two base balls are arranged on any of the LED chips, and / or more than one connecting ball is arranged on any of the LED chips.

[0017] Furthermore, the plurality of LED chips are connected in series in sequence from one side to the other side based on the connecting wires.

[0018] Furthermore, the plurality of LED chips are connected in series in sequence from both sides to the middle based on the connecting wires.

[0019] The utility model provides an LED device, which connects the same-sex electrodes of multiple LED chips in series, shortens the wire bonding distance between adjacent LED chips, forms a parallel connection structure for the multiple LED chips, avoids mutual interference of wire arcs, improves the electrical connection stability of the multiple LED chips, and thus improves the working reliability of the LED device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 This is a schematic diagram of the structure of the LED device in the embodiment of the utility model;

[0022] Figure 2 This is a schematic diagram of the connection state of the positive terminal of the LED device in the embodiment of the utility model;

[0023] Figure 3 This is a schematic diagram of the connection state of the negative terminal of the LED device in the embodiment of the utility model;

[0024] Figure 4 This is a schematic diagram of the structure of the LED device in the embodiment of the utility model;

[0025] Figure 5 It is a schematic diagram of the connection state of the negative terminal of the LED device in the embodiment of the utility model. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] Embodiment 1:

[0028] Figure 1 A schematic structural diagram of an LED device in an embodiment of the utility model is shown, wherein the LED device comprises: a bracket 1, a soldering pad 3 arranged on the bracket 1, and a plurality of LED chips 2 arranged on the soldering pad 3, wherein a plurality of connecting soldering wires are arranged between the plurality of LED chips 2, and the plurality of LED chips 2 are connected in parallel to the soldering pad 3 of the bracket 1 based on the plurality of connecting soldering wires.

[0029] The plurality of connecting welding wires are divided into a first welding wire group 4 and a second welding wire group 5. Any of the LED chips 2 is provided with a positive terminal and a negative terminal. The positive terminals of the plurality of LED chips 2 are connected in series based on the first welding wire group 4, and the negative terminals of the plurality of LED chips 2 are connected in series based on the second welding wire group 5.

[0030] Specifically, the plurality of LED chips 2 include a first LED chip 21 , a second LED chip 22 and a third LED chip 23 , and electrodes of the same polarity of the first LED chip 21 , the second LED chip 22 and the third LED chip 23 are connected in series based on connecting wires.

[0031] The first welding wire group 4 includes a first positive welding wire 41 and a second positive welding wire 42, one end of the first positive welding wire 41 is arranged on the positive terminal of the first LED chip 21, the other end of the first positive welding wire 41 is arranged on the positive terminal of the second LED chip 22, one end of the second positive welding wire 42 is arranged on the positive terminal of the second LED chip 22, and the other end of the second positive welding wire 42 is arranged on the positive terminal of the third LED chip 23. Based on the first positive welding wire 41 and the second positive welding wire 42, the positive terminals of the first LED chip 21, the second LED chip 22 and the third LED chip 23 are connected in series.

[0032] The second welding wire group 5 includes a first negative electrode welding wire 51 and a second negative electrode welding wire 52, one end of the first negative electrode welding wire 51 is arranged on the negative terminal of the first LED chip 21, the other end of the first negative electrode welding wire 51 is arranged on the negative terminal of the second LED chip 22, one end of the second negative electrode welding wire 52 is arranged on the negative terminal of the second LED chip 22, and the other end of the second negative electrode welding wire 52 is arranged on the negative terminal of the third LED chip 23. Based on the first negative electrode welding wire 51 and the second negative electrode welding wire 52, the series connection between the negative terminals of the first LED chip 21, the second LED chip 22 and the third LED chip 23 can be realized.

[0033] Based on the first bonding wire group 4 and the second bonding wire group 5, the first LED chip 21, the second LED chip 22 and the third LED chip 23 are connected in parallel, thereby meeting the bonding wire connection requirements between the first LED chip 21, the second LED chip 22 and the third LED chip 23.

[0034] Furthermore, by providing connecting wires to realize series connection between like-polarity electrodes of any two adjacent LED chips 2, the bonding distance of connecting wires between multiple LED chips 2 in the LED device can be shortened, thereby improving the processing convenience of the LED device.

[0035] By connecting the like electrodes of several LED chips 2 in series, several LED chips 2 can be arranged in parallel in the bracket 1, thereby reducing the space occupied by the LED chips 2 in the bracket 1, thereby meeting the requirements for die-solidification packaging of multiple LED chips 2 in a small-sized bracket 1.

[0036] A river channel 33 is provided on the pad 3 of the bracket 1, and the pad 3 is divided into a positive pad 32 and a negative pad 31 based on the river channel 33. The LED device is also provided with a first pad lead 6 and a second pad lead 7. The positive ends of the several LED chips 2 are electrically connected to the positive pad 32 based on the first pad lead 6, that is, after the positive ends of the first LED chip 21, the second LED chip 22 and the third LED chip 23 are connected in series in sequence, they are electrically connected to the positive pad 32 based on the first pad lead 6.

[0037] The plurality of LED chips 2 are electrically connected to the negative electrode pad 31 based on the second pad lead 7, that is, after the negative ends of the third LED chip 23, the second LED chip 22 and the first LED chip 21 are connected in series in sequence, they are electrically connected to the negative electrode pad 31 based on the second pad lead 7, so that the first LED chip 21, the second LED chip 22 and the third LED chip 23 can be electrically connected to the pad 3 of the bracket 1, thereby meeting the lighting requirements of the first LED chip 21, the second LED chip 22 and the third LED chip 23.

[0038] Specifically, the first LED chip 21, the second LED chip 22 and the third LED chip 23 are arranged in a queue on the soldering pad 3, and the like electrodes of any two adjacent LED chips 2 are connected based on connecting wires to achieve series connection between the like electrodes of the first LED chip 21, the second LED chip 22 and the third LED chip 23.

[0039] Further, the pad lead is arranged on the LED chip 2 at the end of the queue, please refer to Figure 1 The positive terminals of the first LED chip 21, the second LED chip 22 and the third LED chip 23 are connected in series based on the connecting welding wire, and the third LED chip 23 is provided with the first solder pad lead 6, one end of the first solder pad lead 6 is connected to the positive terminal of the third LED chip 23, and the other end is connected to the positive electrode solder pad 32, thereby realizing the electrical connection between the positive terminals of the first LED chip 21, the second LED chip 22 and the third LED chip 23 and the positive electrode solder pad 32.

[0040] Furthermore, the negative terminals of the first LED chip 21, the second LED chip 22 and the third LED chip 23 are connected in series based on the connecting welding wire, and the first LED chip 21 is provided with the second soldering pad lead 7, one end of the second soldering pad lead 7 is connected to the negative terminal of the first LED chip 21, and the other end is connected to the negative electrode soldering pad 31, so as to realize the electrical connection between the negative terminals of the first LED chip 21, the second LED chip 22 and the third LED chip 23 and the negative electrode soldering pad 31.

[0041] For details, please refer to Figure 1 The first LED chip 21, the second LED chip 22 and the third LED chip 23 are arranged in a staggered manner, and the soldering pad 3 is formed with a reserved electrical connection area based on the arrangement of the first LED chip 21, the second LED chip 22 and the third LED chip 23, so as to perform wire bonding operations between the soldering pad 3 and the first LED chip 21, the second LED chip 22 and the third LED chip 23, thereby reducing wire interference during the wiring operation.

[0042] Figure 2 The figure shows the connection state of the positive terminal of the LED device in the embodiment of the utility model. Figure 3 A schematic diagram of the connection status of the negative terminal of the LED device in an embodiment of the utility model is shown. The first positive electrode welding wire 41 includes a first base ball 411, a first lead 412 and a first connecting ball 413. The first base ball 411 is arranged on the positive terminal of the first LED chip 21, and the first connecting ball 413 is arranged on the positive terminal of the second LED chip 22. One end of the first lead 412 is arranged on the first base ball 411, and the other end of the first lead 412 is arranged on the first connecting ball 413, thereby realizing the connection between the positive terminals of the first LED chip 21 and the second LED chip 22.

[0043] The connecting welding wire includes a base ball, a lead wire and a connecting ball. The base ball and the connecting ball are respectively arranged on the like electrodes of two adjacent LED chips 2. One end of the lead wire is connected to the base ball, and the other end is connected to the connecting ball. The base ball or the connecting ball is arranged on the electrode of the LED chip 2, and the wire bonding operation is performed between the base ball and the connecting ball between the like electrodes of adjacent LED chips 2, so as to avoid damage to the electrodes of the LED chip 2 during the wire bonding operation.

[0044] Furthermore, any of the LED chips 2 is provided with two base balls, and / or any of the LED chips 2 is provided with more than one connecting ball. When performing wire bonding operation on the LED chip 2, it is necessary to pad the electrode position with a ball to form the base ball to ensure the wire bonding safety of the LED chip 2.

[0045] Furthermore, the number of connection balls at the electrode positions of the LED chip 2 is adjusted according to the connection relationship between the LED chip 2 and adjacent chips, so as to meet the requirements of different connection conditions of multiple LED chips 2.

[0046] Specifically, the first LED chip 21, the second LED chip 22 and the third LED chip 23 are connected based on the BSOB (Bond Stick On Ball) wire bonding method, and the first LED chip 21, the second LED chip 22 and the third LED chip 23 are wired in the order of arrangement, that is, the first LED chip 21, the second LED chip 22 and the third LED chip 23 are connected in series in sequence from one side to the other side, thereby realizing the electrical connection between several LED chips 2.

[0047] For further information, please refer to Figure 2 , a first connecting ball 413 is set at the positive end of the second LED chip 22 based on the BSOB wire bonding method, a first base ball 411 is set at the positive end of the first LED chip 21, and a first lead 412 is drawn out from the first base ball 411 and connected to the first connecting ball 413, so as to realize the electrical connection between the first LED chip 21 and the second LED chip 22;

[0048] A second connecting ball 423 is arranged on the positive terminal of the third LED chip 23, a second base ball 421 is arranged on the first connecting ball 413, and a second lead 422 is drawn out from the second base ball 421 and connected to the second connecting ball 423, and a second positive electrode welding wire 42 is formed based on the second base ball 421, the second lead 422 and the second connecting ball 423, so as to realize the electrical connection between the positive terminals of the second LED chip 22 and the third LED chip 23;

[0049] The positive terminals of the first LED chip 21 , the second LED chip 22 and the third LED chip 23 are connected in series based on the first positive electrode bonding wire 41 and the second positive electrode bonding wire 42 .

[0050] Furthermore, the first pad lead 6 includes a positive lead 61 and a first lead base ball 62. The first lead base ball 62 is arranged on the second connecting ball 423 of the third LED chip 23, and the positive lead 61 is pulled out from the first lead base ball 62 and connected to the positive pad 32, thereby realizing electrical connection among the first LED chip 21, the second LED chip 22, the third LED chip 23 and the positive pad 32.

[0051] For further information, please refer to Figure 3, a fourth connecting ball 523 is arranged at the negative end of the second LED chip 22 based on the BSOB wire bonding method, a fourth base ball 521 is arranged at the negative end of the third LED chip 23, and a fourth lead 522 is drawn out from the fourth base ball 521 and connected to the fourth connecting ball 523, a second negative electrode bonding wire 52 is formed based on the fourth base ball 521, the fourth lead 522 and the fourth connecting ball 523, and the electrical connection between the third LED chip 23 and the second LED chip 22 is realized based on the second negative electrode bonding wire 52;

[0052] A third connecting ball 513 is arranged on the negative terminal of the first LED chip 21, a third base ball 511 is arranged on the fourth connecting ball 523, and a third lead 512 is drawn out from the third base ball 511 and connected to the third connecting ball 513, a first negative electrode bonding wire 51 is formed based on the third base ball 511, the third lead 512 and the third connecting ball 513, and the negative terminals of the second LED chip 22 and the first LED chip 21 are electrically connected based on the first negative electrode bonding wire 51;

[0053] The first negative electrode bonding wire 51 and the second negative electrode bonding wire 52 are used to realize the series connection between the negative terminals of the first LED chip 21 , the second LED chip 22 and the third LED chip 23 .

[0054] Furthermore, the second solder pad lead 7 includes a second lead base ball 71 and a negative lead 72. The second lead base ball 71 is arranged on the third connecting ball 513 of the first LED chip 21, and the negative lead 72 is pulled out from the second lead base ball 71 and connected to the negative solder pad 31, thereby realizing electrical connection between the first LED chip 21, the second LED chip 22, the third LED chip 23 and the negative solder pad 31.

[0055] The embodiment of the utility model provides an LED device, which connects the same-sex electrodes of multiple LED chips 2 in series, shortens the wire bonding distance between adjacent LED chips 2, and forms a parallel connection structure with the multiple LED chips 2, thereby avoiding the mutual interference of welding wire arcs, improving the electrical connection stability of the multiple LED chips 2, and thus improving the working reliability of the LED device.

[0056] Embodiment 2:

[0057] Figure 4A schematic structural diagram of an LED device in an embodiment of the utility model is shown, wherein the LED device comprises: a bracket 1, a soldering pad 3 arranged on the bracket 1, and a plurality of LED chips 2 arranged on the soldering pad 3, wherein a plurality of connecting soldering wires are arranged between the plurality of LED chips 2, and the plurality of LED chips 2 are connected in parallel to the soldering pad 3 of the bracket 1 based on the plurality of connecting soldering wires.

[0058] The plurality of connecting welding wires are divided into a first welding wire group 4 and a second welding wire group 5. Any of the LED chips 2 is provided with a positive terminal and a negative terminal. The positive terminals of the plurality of LED chips 2 are connected in series based on the first welding wire group 4, and the negative terminals of the plurality of LED chips 2 are connected in series based on the second welding wire group 5.

[0059] Specifically, the plurality of LED chips 2 include a first LED chip 21 , a second LED chip 22 and a third LED chip 23 , and electrodes of the same polarity of the first LED chip 21 , the second LED chip 22 and the third LED chip 23 are connected in series based on connecting wires.

[0060] The first welding wire group 4 includes a first positive welding wire 41 and a second positive welding wire 42, one end of the first positive welding wire 41 is arranged on the positive terminal of the first LED chip 21, the other end of the first positive welding wire 41 is arranged on the positive terminal of the second LED chip 22, one end of the second positive welding wire 42 is arranged on the positive terminal of the second LED chip 22, and the other end of the second positive welding wire 42 is arranged on the positive terminal of the third LED chip 23. Based on the first positive welding wire 41 and the second positive welding wire 42, the positive terminals of the first LED chip 21, the second LED chip 22 and the third LED chip 23 are connected in series.

[0061] The second welding wire group 5 includes a first negative electrode welding wire 51 and a second negative electrode welding wire 52, one end of the first negative electrode welding wire 51 is arranged on the negative terminal of the first LED chip 21, the other end of the first negative electrode welding wire 51 is arranged on the negative terminal of the second LED chip 22, one end of the second negative electrode welding wire 52 is arranged on the negative terminal of the second LED chip 22, and the other end of the second negative electrode welding wire 52 is arranged on the negative terminal of the third LED chip 23. Based on the first negative electrode welding wire 51 and the second negative electrode welding wire 52, the series connection between the negative terminals of the first LED chip 21, the second LED chip 22 and the third LED chip 23 can be realized.

[0062] Based on the first bonding wire group 4 and the second bonding wire group 5, the first LED chip 21, the second LED chip 22 and the third LED chip 23 are connected in parallel, thereby meeting the bonding wire connection requirements between the first LED chip 21, the second LED chip 22 and the third LED chip 23.

[0063] Furthermore, by providing connecting wires to realize series connection between like-polarity electrodes of any two adjacent LED chips 2, the bonding distance of connecting wires between multiple LED chips 2 in the LED device can be shortened, thereby improving the processing convenience of the LED device.

[0064] By connecting the like electrodes of several LED chips 2 in series, several LED chips 2 can be arranged in parallel in the bracket 1, thereby reducing the space occupied by the LED chips 2 in the bracket 1, thereby meeting the requirements for die-solidification packaging of multiple LED chips 2 in a small-sized bracket 1.

[0065] A river channel 33 is provided on the pad 3 of the bracket 1, and the pad 3 is divided into a positive pad 32 and a negative pad 31 based on the river channel 33. The LED device is also provided with a first pad lead 6 and a second pad lead 7. The positive ends of the several LED chips 2 are electrically connected to the positive pad 32 based on the first pad lead 6, that is, after the positive ends of the first LED chip 21, the second LED chip 22 and the third LED chip 23 are connected in series in sequence, they are electrically connected to the positive pad 32 based on the first pad lead 6.

[0066] The plurality of LED chips 2 are electrically connected to the negative electrode pad 31 based on the second pad lead 7, that is, after the negative ends of the third LED chip 23, the second LED chip 22 and the first LED chip 21 are connected in series, they are electrically connected to the negative electrode pad 31 based on the second pad lead 7, so that the first LED chip 21, the second LED chip 22 and the third LED chip 23 can be electrically connected to the pad 3 of the bracket 1, thereby meeting the lighting requirements of the first LED chip 21, the second LED chip 22 and the third LED chip 23.

[0067] Specifically, the first LED chip 21, the second LED chip 22 and the third LED chip 23 are arranged in a queue on the soldering pad 3, and the like electrodes of any two adjacent LED chips 2 are connected based on connecting wires to achieve series connection between the like electrodes of the first LED chip 21, the second LED chip 22 and the third LED chip 23.

[0068] Further, the pad lead is arranged on the LED chip 2 at the end of the queue, please refer to Figure 1The positive terminals of the first LED chip 21, the second LED chip 22 and the third LED chip 23 are connected in series based on the connecting welding wire, and the third LED chip 23 is provided with the first solder pad lead 6, one end of the first solder pad lead 6 is connected to the positive terminal of the third LED chip 23, and the other end is connected to the positive electrode solder pad 32, thereby realizing the electrical connection between the positive terminals of the first LED chip 21, the second LED chip 22 and the third LED chip 23 and the positive electrode solder pad 32.

[0069] Furthermore, the negative terminals of the first LED chip 21, the second LED chip 22 and the third LED chip 23 are connected in series based on the connecting welding wire, and the first LED chip 21 is provided with the second soldering pad lead 7, one end of the second soldering pad lead 7 is connected to the negative terminal of the first LED chip 21, and the other end is connected to the negative electrode soldering pad 31, so as to realize the electrical connection between the negative terminals of the first LED chip 21, the second LED chip 22 and the third LED chip 23 and the negative electrode soldering pad 31.

[0070] For details, please refer to Figure 4 The first LED chip 21, the second LED chip 22 and the third LED chip 23 are arranged in a staggered manner, and the soldering pad 3 is formed with a reserved electrical connection area based on the arrangement of the first LED chip 21, the second LED chip 22 and the third LED chip 23, so as to perform wire bonding operations between the soldering pad 3 and the first LED chip 21, the second LED chip 22 and the third LED chip 23, thereby reducing wire interference during the wiring operation.

[0071] Figure 5 A schematic diagram of the connection state of the negative terminal of the LED device in an embodiment of the utility model is shown, the connecting welding wire includes a base ball, a lead wire and a connecting ball, the base ball and the connecting ball are respectively arranged on the like electrodes of two adjacent LED chips 2, one end of the lead wire is connected to the base ball, and the other end is connected to the connecting ball, the base ball or the connecting ball is arranged on the electrode of the LED chip 2, and the wire bonding operation is performed between the base ball and the connecting ball between the like electrodes of adjacent LED chips 2, so as to avoid damage to the electrodes of the LED chip 2 during the wire bonding operation.

[0072] Furthermore, any of the LED chips 2 is provided with two base balls, and / or any of the LED chips 2 is provided with more than one connecting ball. When performing wire bonding operation on the LED chip 2, it is necessary to pad the electrode position with a ball to form the base ball to ensure the wire bonding safety of the LED chip 2.

[0073] Furthermore, the number of connection balls at the electrode positions of the LED chip 2 is adjusted according to the connection relationship between the LED chip 2 and adjacent chips, so as to meet the requirements of different connection conditions of multiple LED chips 2.

[0074] Specifically, the first negative electrode welding wire 51 includes a third base ball 511, a third lead 512 and a third connecting ball 513. The third base ball 511 is arranged on the negative terminal of the first LED chip 21, and the third connecting ball 513 is arranged on the negative terminal of the second LED chip 22. One end of the third lead 512 is arranged on the third base ball 511, and the other end of the third lead 512 is arranged on the third connecting ball 513, thereby realizing the connection between the negative terminals of the first LED chip 21 and the second LED chip 22.

[0075] Specifically, the first LED chip 21, the second LED chip 22 and the third LED chip 23 are connected in series based on the BSOB (Bond Stick On Ball) wire bonding method, and the first LED chip 21, the second LED chip 22 and the third LED chip 23 can be connected by wire bonding in the order of arrangement, that is, the first LED chip 21, the second LED chip 22 and the third LED chip 23 are connected in series in sequence from one side to the other side to achieve electrical connection between several LED chips 2; the first LED chip 21, the second LED chip 22 and the third LED chip 23 can be connected in series in sequence from both sides to the middle, that is, the first LED chip 21 and the third LED chip 23 are connected by wire bonding from both sides to the second LED chip 22 in the middle to achieve series connection between each LED chip 2.

[0076] For further information, please refer to Figure 5 In this embodiment, a fourth connecting ball 523 is provided at the negative terminal of the second LED chip 22 based on the BSOB wire bonding method, a fourth base ball 521 is provided at the negative terminal of the third LED chip 23, and a fourth lead 522 is drawn out from the fourth base ball 521 and connected to the fourth connecting ball 523, a second negative electrode bonding wire 52 is formed based on the fourth base ball 521, the fourth lead 522 and the fourth connecting ball 523, and the electrical connection between the negative terminals of the third LED chip 23 and the second LED chip 22 is achieved based on the second negative electrode bonding wire 52;

[0077] A third connecting ball 513 is arranged on the fourth connecting ball 523 of the negative terminal of the second LED chip 21, a third base ball 511 is arranged on the negative terminal of the first LED chip 21, and a third lead 512 is drawn out from the third base ball 511 and connected to the third connecting ball 513, a first negative electrode bonding wire 51 is formed based on the third base ball 511, the third lead 512 and the third connecting ball 513, and the negative terminals of the first LED chip 21 and the second LED chip 23 are electrically connected based on the first negative electrode bonding wire 51;

[0078] The first negative electrode bonding wire 51 and the second negative electrode bonding wire 52 are used to realize the series connection between the negative terminals of the first LED chip 21 , the second LED chip 22 and the third LED chip 23 .

[0079] Furthermore, the second solder pad lead 7 includes a second lead base ball 71 and a negative lead 72. The second lead base ball 71 is arranged on the third connecting ball 513 of the second LED chip 22, and the negative lead 72 is pulled out from the second lead base ball 71 and connected to the negative solder pad 31, thereby realizing electrical connection between the first LED chip 21, the second LED chip 22, the third LED chip 23 and the negative solder pad 31.

[0080] The embodiment of the utility model provides an LED device, which connects the same-sex electrodes of multiple LED chips 2 in series, shortens the wire bonding distance between adjacent LED chips 2, and forms a parallel connection structure with the multiple LED chips 2, thereby avoiding the mutual interference of welding wire arcs, improving the electrical connection stability of the multiple LED chips 2, and thus improving the working reliability of the LED device.

[0081] In addition, the above is a detailed introduction to an LED device provided in an embodiment of the utility model. Specific examples are used herein to illustrate the principle and implementation method of the utility model. The description of the above embodiments is only used to help understand the method of the utility model and its core idea. At the same time, for general technicians in this field, according to the idea of ​​the utility model, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the utility model.

Claims

1. An LED device, characterized in that: The LED device comprises: a bracket, a solder pad arranged on the bracket, a plurality of LED chips arranged on the solder pad, and a plurality of connecting solder wires arranged between the plurality of LED chips, wherein the plurality of LED chips are connected in parallel to the solder pad of the bracket based on the plurality of connecting solder wires; The plurality of connecting wires are divided into a first welding wire group and a second welding wire group. Any of the LED chips is provided with a positive terminal and a negative terminal. The positive terminals of the plurality of LED chips are connected in series based on the first welding wire group, and the negative terminals of the plurality of LED chips are connected in series based on the second welding wire group.

2. The LED device according to claim 1, characterized in that The first bonding wire group is provided with a plurality of positive electrode bonding wires, and the positive terminals of any two adjacent LED chips are electrically connected based on the positive electrode bonding wires.

3. The LED device according to claim 1, characterized in that The second bonding wire group is provided with a plurality of negative electrode bonding wires, and the negative electrode terminals between any two adjacent LED chips are electrically connected based on the negative electrode bonding wires.

4. The LED device according to claim 1, characterized in that A river channel is provided on the pad of the bracket, and the pad is divided into a positive pad and a negative pad based on the river channel, and the LED device is also provided with a first pad lead and a second pad lead; The positive terminals of the plurality of LED chips are electrically connected to the positive electrode pad based on the first pad lead; The cathode terminals of the plurality of LED chips are electrically connected to the cathode pad based on the second pad lead.

5. The LED device according to claim 4, characterized in that: The plurality of LED chips are arranged in a queue on the soldering pad, the soldering pad leads are arranged on the LED chips at the end of the queue, and / or the soldering pad leads are arranged on the LED chips in the middle of the queue.

6. The LED device according to claim 1, characterized in that: The plurality of LED chips are arranged on the soldering pad in a staggered manner, and the soldering pad forms a reserved electrical connection area based on the arrangement state of the plurality of LED chips.

7. The LED device according to claim 1, characterized in that The connecting welding wire comprises a base ball, a lead wire and a connecting ball; The base ball and the connecting ball are respectively arranged on the same-polarity electrodes of two adjacent LED chips; one end of the lead wire is connected to the base ball, and the other end is connected to the connecting ball.

8. The LED device according to claim 7, characterized in that Any of the LED chips is provided with two base balls, and / or any of the LED chips is provided with more than one connection ball.

9. The LED device according to claim 1, characterized in that The plurality of LED chips are connected in series in sequence from one side to the other side based on the connecting wires.

10. The LED device according to claim 1, characterized in that The plurality of LED chips are connected in series in sequence from both sides to the middle based on the connecting wires.

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