Lead frame for Hall device

Abstract

The utility model belongs to the technical field of Hall devices, particularly relates to a lead frame for a Hall device, and aims to solve the problems that static electricity and high temperature can damage the Hall device and pins are easy to break in the background technology. And a semiconductor is arranged at the top of the plastic packaging bottom plate. According to the utility model, the transition block widens the end part of the lead plate, thereby increasing the contact area between the lead plate and a semiconductor, relieving the pulse of instantaneous high voltage, having good anti-static capability, and improving the impact resistance of the Hall device, and the heat dissipation strip increases the heat dissipation area of the plastic package bottom plate 1, so that heat can be timely discharged, and the service life of the Hall device is prolonged. And the lower rubber pinch plate and the upper rubber pinch plate are connected between the plastic package bottom plate and the plastic package cover plate, so that a buffer section is added between the pins and the plastic package shell, the pins are not easy to break, and a certain protection effect is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of Hall devices, in particular to a lead frame for Hall devices. Background Art

[0002] Hall devices are semiconductor devices made using the Hall effect. When the direction of the current in a stationary current-carrying conductor placed in a magnetic field is inconsistent with the direction of the magnetic field, an electromotive force difference is generated between the two surfaces of the current-carrying conductor that are parallel to the current and magnetic field directions. This phenomenon is called the Hall effect.

[0003] Hall devices have the following disadvantages:

[0004] First of all, since the Hall device is a micro-power device, the power of each crystal in the integrated circuit is very small, and there are certain requirements for voltage resistance. If it is washed by static electricity, it is easy to be damaged.

[0005] Secondly, during the operation, the Hall device will have a high temperature regardless of whether it is affected by itself or the external environment. If the temperature cannot be dissipated in time, the high temperature can easily damage the Hall device.

[0006] In addition, the pins located outside the plastic package shell are easily broken when they are bent at the connection with the plastic package shell. Utility Model Content

[0007] In view of the deficiencies in the prior art, the utility model provides a lead frame for a Hall device, which overcomes the deficiencies in the prior art by using a transition block, a heat dissipation strip, a lower rubber buckle plate and an upper rubber buckle plate in coordination with each other, and effectively solves the problem that static electricity and high temperature will damage the Hall device and the pins are easily broken.

[0008] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0009] A lead frame for a Hall device comprises a plastic-sealed bottom plate, a plastic-sealed cover plate is bonded to the top of the plastic-sealed bottom plate, a semiconductor is arranged on the top of the plastic-sealed bottom plate, a transition block is welded to the outer wall of the top of the semiconductor, and a lead plate is welded to the outer wall of the transition block;

[0010] The outer wall of the bottom of the plastic-sealed bottom plate is provided with heat dissipation strips distributed at equal distances;

[0011] A lower rubber buckle plate is arranged on the outer wall of one side of the plastic sealing bottom plate, and an upper rubber buckle plate is arranged on the outer wall of one side of the plastic sealing cover plate.

[0012] Preferably, the top outer wall of the plastic package bottom plate is provided with lead grooves which are distributed at equal distances, and the inner wall of the lead groove is provided with pins, and the outer wall of one end of the pin is welded to the outer wall of one end of the lead plate.

[0013] Preferably, a substrate is placed on the bottom inner wall of the plastic package bottom plate, and the semiconductor is connected to the top outer wall of the substrate.

[0014] Preferably, the top outer wall of the substrate is connected to positioning posts distributed at equal distances, and the lead plate is plugged into the outer wall of the positioning posts.

[0015] Preferably, the top outer wall of the lower rubber gusset plate is provided with symmetrically distributed slots, and the bottom outer wall of the upper rubber gusset plate is connected with symmetrically distributed plug-in blocks, and the plug-in blocks are adapted to the size of the slots.

[0016] Preferably, a model identification area is provided on the top of the plastic cover plate.

[0017] Preferably, the outer wall of the bottom of the plastic package bottom plate is provided with fitting areas on both sides of the heat dissipation strip.

[0018] The beneficial effects of the utility model are:

[0019] 1. The lead frame of the Hall device of this design has a transition block between the semiconductor and the lead plate. The transition block widens the end of the lead plate, thereby increasing the contact area between the lead plate and the semiconductor, alleviating the instantaneous high voltage pulse, having good anti-static ability, and improving the impact resistance of the Hall device;

[0020] 2. The Hall device of this design uses a lead frame, and heat dissipation strips are arranged at equal distances at the bottom of the plastic package base plate. The heat dissipation strips increase the heat dissipation area of ​​the plastic package base plate 1, which can discharge heat in time and avoid high temperature damage to the Hall device.

[0021] 3. The Hall device of this design uses a lead frame, and a lower rubber buckle plate and an upper rubber buckle plate are connected between the plastic package bottom plate and the plastic package cover plate. This adds a buffer section between the pin and the plastic package shell, making the pin not easily broken and having a certain protective effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a front view of the overall structure of a lead frame for a Hall device proposed by the utility model;

[0023] Figure 2 This is a schematic diagram of the overall structure of a lead frame for a Hall device proposed in the utility model;

[0024] Figure 3 This is a bottom view of the overall structure of a lead frame for a Hall device proposed by the utility model;

[0025] Figure 4 The utility model provides a schematic diagram of the connection structure of the plastic package base plate of the lead frame for the Hall device.

[0026] In the figure: 1. Plastic package base plate; 2. Plastic package cover plate; 3. Semiconductor; 4. Transition block; 5. Lead plate; 6. Heat dissipation strip; 7. Lower rubber buckle plate; 8. Upper rubber buckle plate; 9. Lead groove; 10. Pin; 11. Substrate; 12. Positioning column; 13. Slot; 14. Insert block; 15. Model identification area; 16. Fitting area. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0028] Embodiment 1, refer to Figure 1-4 A lead frame for a Hall device includes a plastic package base plate 1, a plastic package cover plate 2 is bonded to the top of the plastic package base plate 1, a semiconductor 3 is arranged on the top of the plastic package base plate 1, and a transition block 4 is welded to the outer wall of the top of the semiconductor 3, and a lead plate 5 is welded to the outer wall of the transition block 4.

[0029] In this embodiment, a transition block 4 is provided between the semiconductor 3 and the lead plate 5. The transition block 4 widens the end portion of the lead plate 5, thereby increasing the contact area between the lead plate 5 and the semiconductor 3, alleviating instantaneous high voltage pulses, having good anti-static capability, and improving the impact resistance of the Hall device.

[0030] Example 2, refer to Figure 3 , a lead frame for a Hall device, the outer wall of the bottom of a plastic package base plate 1 is provided with heat dissipation strips 6 distributed at equal distances.

[0031] In this embodiment, heat dissipation strips 6 are arranged at equal distances at the bottom of the plastic package bottom plate 1. The heat dissipation strips 6 increase the heat dissipation area of ​​the plastic package bottom plate 1, and can discharge heat in time to avoid high temperature damage to the Hall device.

[0032] Example 3, refer to Figure 2-3 A lead frame for a Hall device, a lower rubber gusset plate 7 is arranged on the outer wall of one side of a plastic package bottom plate 1, and an upper rubber gusset plate 8 is arranged on the outer wall of one side of a plastic package cover plate 2.

[0033] In this embodiment, a lower rubber buckle plate 7 and an upper rubber buckle plate 8 are connected between the plastic package bottom plate 1 and the plastic package cover plate 2, thereby adding a buffer section between the pin 10 and the plastic package shell, making the pin 10 not easily broken and having a certain protective effect.

[0034] Reference Figure 1-4 The top outer wall of the plastic package bottom plate 1 is provided with lead grooves 9 which are distributed at equal distances, and the inner wall of the lead groove 9 is provided with pins 10 , and the outer wall of one end of the pin 10 is welded to the outer wall of one end of the lead plate 5 .

[0035] Reference Figure 4 A substrate 11 is placed on the bottom inner wall of the plastic package base plate 1 , and the semiconductor 3 is connected to the top outer wall of the substrate 11 .

[0036] Reference Figure 4 The top outer wall of the substrate 11 is connected with positioning posts 12 which are distributed at equal distances, and the lead plate 5 is plugged into the outer wall of the positioning posts 12 .

[0037] Reference Figure 3 The top outer wall of the lower rubber gusset plate 7 is provided with symmetrically distributed slots 13 , and the bottom outer wall of the upper rubber gusset plate 8 is connected with symmetrically distributed plug-in blocks 14 , and the plug-in blocks 14 are adapted to the size of the slots 13 .

[0038] Reference Figure 1 A model identification area 15 is provided on the top of the plastic cover plate 2 .

[0039] Reference Figure 3 The outer wall of the bottom of the plastic package bottom plate 1 is provided with a bonding area 16 on both sides of the heat dissipation strip 6 .

[0040] Working principle: When the four lead plates 5 are connected to the semiconductor 3, since the transition block 4 is provided at the end of the lead plate 5, the transition block 4 widens the end of the lead plate 5, thereby increasing the contact area between the lead plate 5 and the semiconductor 3, and increasing the anti-static ability of the Hall device. In a high temperature environment, the heat dissipation strip 6 can increase the heat dissipation area of ​​the plastic package base plate 1 and discharge heat in time. The lower rubber buckle plate 7 and the upper rubber buckle plate 8 are connected between the plastic package base plate 1 and the plastic package cover plate 2, which increases a buffer section between the pin 10 and the plastic package shell to prevent the pin 10 from being broken.

[0041] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A lead frame for a Hall device, comprising a plastic package base plate (1), characterized in that: A plastic sealing cover plate (2) is bonded to the top of the plastic sealing bottom plate (1), a semiconductor (3) is arranged on the top of the plastic sealing bottom plate (1), a transition block (4) is welded to the outer wall of the top of the semiconductor (3), and a lead plate (5) is welded to the outer wall of the transition block (4); The outer wall of the bottom of the plastic-sealed bottom plate (1) is provided with heat dissipation strips (6) distributed at equal distances; A lower rubber buckle plate (7) is provided on the outer wall of one side of the plastic-sealed bottom plate (1), and an upper rubber buckle plate (8) is provided on the outer wall of one side of the plastic-sealed cover plate (2).

2. A lead frame for a Hall device according to claim 1, characterized in that: The top outer wall of the plastic package bottom plate (1) is provided with lead grooves (9) distributed at equal distances, and the inner wall of the lead groove (9) is provided with pins (10), and the outer wall of one end of the pin (10) is welded to the outer wall of one end of the lead plate (5).

3. A lead frame for a Hall device according to claim 1, characterized in that: A substrate (11) is placed on the bottom inner wall of the plastic package base plate (1), and the semiconductor (3) is connected to the top outer wall of the substrate (11).

4. A lead frame for a Hall device according to claim 3, characterized in that: The top outer wall of the substrate (11) is connected to positioning posts (12) distributed at equal distances, and the lead plate (5) is plugged into the outer wall of the positioning posts (12).

5. The lead frame for a Hall device according to claim 1, characterized in that: The top outer wall of the lower rubber gusset plate (7) is provided with symmetrically distributed slots (13), and the bottom outer wall of the upper rubber gusset plate (8) is connected with symmetrically distributed plug blocks (14), and the plug blocks (14) are adapted in size to the slots (13).

6. The lead frame for a Hall device according to claim 1, characterized in that: A model identification area (15) is provided on the top of the plastic-sealed cover plate (2).

7. The lead frame for a Hall device according to claim 1, characterized in that: The outer wall of the bottom of the plastic-sealed bottom plate (1) is provided with a fitting area (16) on both sides of the heat dissipation strip (6).

Images