Ultrasonic assembly and ultrasonic sound head

Abstract

The utility model provides an ultrasonic assembly and ultrasonic sound head, ultrasonic sound head includes ultrasonic assembly, ultrasonic assembly includes flexible circuit board and piezoelectric layer, piezoelectric layer's surface has first electrode gold-plated layer and second electrode gold-plated layer mutually insulated, first electrode gold-plated layer is electrically connected with the first electrode of piezoelectric layer, and second electrode gold-plated layer is electrically connected with the second electrode of piezoelectric layer. The second electrode gold-plated layer is electrically connected with a second electrode of the piezoelectric layer; the flexible circuit board is provided with a first electrode connection area and a second electrode connection area which are insulated from each other; the first electrode gold-plated layer is electrically connected with the first electrode connecting area, and the second electrode gold-plated layer is electrically connected with the second electrode connecting area. The first electrode and the second electrode of the piezoelectric layer are led out through the gold plating layer to be electrically connected with the flexible circuit board, so that the thickness of the negative electrode material is effectively reduced, the influence of the negative electrode material on the performance of the sound head due to sound attenuation is reduced, and the overall performance of the sound head is improved.

Description

Technical Field

[0001] The utility model belongs to the field of ultrasonic sensors, and in particular relates to an ultrasonic component and an ultrasonic sound head. Background Art

[0002] See also Figure 1 The ultrasonic sound head is mainly composed of a backing, a flexible circuit board, a piezoelectric layer, a negative electrode material, a matching layer and a lens layer. The backing absorbs excess sound waves and supports the sound head; the flexible circuit board connects the positive electrode of the chip on the one hand, and connects the circuit on the other hand; the piezoelectric layer includes multiple array elements, and the piezoelectric material used in the piezoelectric layer is the core component of the ultrasonic sensor, which plays the role of transmitting and receiving ultrasonic waves; the negative electrode material is connected to the negative electrode of the piezoelectric layer, and is connected to the grounding point of the flexible circuit board to play the role of grounding; the matching layer is generally a single-layer material with low acoustic impedance or a multi-layer acoustic impedance gradient material, which plays the role of reducing acoustic impedance.

[0003] At present, the difficulty in the manufacturing process of ultrasonic sensors at home and abroad is how to effectively lead out the positive and negative electrodes of the piezoelectric material and easily connect them to the flexible circuit board without causing failure or short circuit of the 004 array element.

[0004] In the related art, metal materials with good conductivity are generally used as negative electrode materials, and the negative electrode materials are bonded to the piezoelectric layer, so that the negative electrode (ground wire) can be led out. However, since the negative electrode material itself has a certain thickness, it will increase the attenuation of sound waves, which will have a certain impact on the quality of ultrasound images. Utility Model Content

[0005] The technical purpose of the utility model is to provide an ultrasonic component and an ultrasonic sound head, aiming to solve the problem in the related art that the thickness of the negative electrode material itself causes sound wave attenuation and affects the quality of the ultrasonic image.

[0006] To solve the above technical problems, the utility model is implemented as follows:

[0007] Provided is an ultrasonic component, comprising a flexible circuit board and a piezoelectric layer, wherein the surface of the piezoelectric layer has a first electrode gold-plated layer and a second electrode gold-plated layer that are insulated from each other, the first electrode gold-plated layer is electrically connected to the first electrode of the piezoelectric layer, and the second electrode gold-plated layer is electrically connected to the second electrode of the piezoelectric layer; the flexible circuit board has a first electrode connection area and a second electrode connection area that are insulated from each other; the first electrode gold-plated layer is electrically connected to the first electrode connection area, and the second electrode gold-plated layer is electrically connected to the second electrode connection area.

[0008] Furthermore, the piezoelectric layer has a top surface, a bottom surface, a first side surface and a second side surface, the first side surface and the second side surface are opposite to each other; at least part of the first electrode gold-plated layer and the second electrode gold-plated layer are located on the bottom surface, and a first disconnection area is provided between the first electrode gold-plated layer and the second electrode gold-plated layer on the bottom surface; the top side of the flexible circuit board is attached to the bottom surface, the first electrode connection area and the second electrode connection area are both located on the top side of the flexible circuit board, an insulating area is provided between the first electrode connection area and the second electrode connection area, the first electrode connection area is electrically connected to the first electrode gold-plated layer at one end of the first disconnection area, the second electrode connection area is electrically connected to the second electrode gold-plated layer at the other end of the first disconnection area, and the position of the insulating area corresponds to the position of the first disconnection area.

[0009] Furthermore, the width of the insulating region is greater than or equal to the gap length of the first disconnection region.

[0010] Furthermore, a second disconnection area is provided between the first electrode gold-plated layer and the second electrode gold-plated layer, and the second disconnection area is located on the top surface and / or the second side surface.

[0011] Furthermore, the first disconnection zone is located on the bottom surface, the second disconnection zone is located on the top surface, and the first disconnection zone and the second disconnection zone are centrally symmetrically distributed relative to the center of the piezoelectric layer; the first electrode gold-plated layer covers a portion of the top surface, the second side surface and a portion of the bottom surface; the second electrode gold-plated layer covers a portion of the top surface, the first side surface and a portion of the bottom surface.

[0012] Furthermore, the lengths of the first break zone and the second break zone are both 0-2.5 mm; the shortest distance between the first break zone and the first side surface is 0-5 mm, and the shortest distance between the second break zone and the second side surface is 0-5 mm.

[0013] Furthermore, the second disconnected area is located on the second side surface, and the length of the second disconnected area is less than or equal to the thickness of the second side surface.

[0014] Furthermore, the flexible circuit board also has a first electrode circuit area and a second electrode circuit area, the first electrode connection area is electrically connected to the first electrode circuit area, and the second electrode connection area is electrically connected to the second electrode circuit area.

[0015] Furthermore, the thickness of the first electrode gold-plated layer and the second electrode gold-plated layer are respectively 0-5 microns.

[0016] Furthermore, an ultrasonic acoustic head is provided, comprising a backing, a matching layer and a lens layer, and also comprising an ultrasonic component as described in any one of the above items.

[0017] Compared with the prior art, the ultrasonic sound head component of the utility model has the following beneficial effects: a first electrode gold-plated layer and a second electrode gold-plated layer are arranged on the surface of the piezoelectric layer, the first electrode and the second electrode of the piezoelectric layer are connected to the flexible circuit board through the gold-plated layer, and the gold-plated layer is used to replace the negative electrode material, which effectively reduces the thickness of the negative electrode material, reduces the influence of the negative electrode material on the sound head performance due to sound attenuation, and improves the overall performance of the sound head. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of an ultrasonic sound head in the prior art;

[0019] Figure 2 It is a schematic diagram of the overall structure of the ultrasonic sound head in the embodiment of the utility model;

[0020] Figure 3 It is a schematic diagram of the overall structure of an ultrasonic component in the first implementation mode of the embodiment of the utility model;

[0021] Figure 4 is a top view of the flexible circuit board of the ultrasonic assembly in the embodiment of the utility model;

[0022] Figure 5 It is a schematic diagram of the overall structure of an ultrasonic component in the second implementation mode of the embodiment of the utility model;

[0023] Figure 6 It is a schematic diagram of the overall structure of an ultrasonic component in the third implementation mode of the embodiment of the utility model;

[0024] In the accompanying drawings, each reference numeral represents:

[0025] 1. Backing; 2. Flexible circuit board; 3. Piezoelectric layer; 4. Negative electrode material; 5. Matching layer; 6. Lens layer;

[0026] 21. First electrode gold-plated layer; 22. Second electrode gold-plated layer; 23. First disconnection area; 24. Second disconnection area;

[0027] 31. First electrode connection area; 32. Second electrode connection area; 33. Insulation area; 34. First electrode circuit area; 35. Second electrode circuit area. DETAILED DESCRIPTION

[0028] The embodiments of the utility model are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the utility model, and cannot be understood as limiting the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the utility model.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "circumferential", "radial" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0031] In order to allow the positive and negative electrodes of the piezoelectric material to be connected and easily welded to the flexible circuit board 2 without causing the element failure or short circuit of the piezoelectric layer 3, the following two methods are usually used in the related art:

[0032] 1. The negative electrode material 4 is replaced by another flexible circuit board (hereinafter referred to as the second flexible circuit board);

[0033] Because the circuit on the second flexible circuit board is connected to the electrode plate, the second flexible circuit board only needs to be bonded to the piezoelectric material to lead out the negative electrode (ground wire) without welding. However, the disadvantages are also obvious. The introduction of the second flexible circuit board will inevitably increase the attenuation of sound waves and affect the quality of ultrasound images.

[0034] 2. The negative electrode material 4 uses metal foil;

[0035] The specific process is to paste the other layers including the metal foil in order, and finally cut the array elements. The advantage is that the ground wire is easier to lead out and the sound attenuation is small. The disadvantage is that because the metal foil is thin, brittle, and not strong, when cutting the array elements of the piezoelectric layer 3, the metal foil is easily damaged and causes a short circuit, making some array elements ineffective. At the same time, in the bonding process, in order to ensure that the glue overflowing from both ends will not break the foil after the glue is cured, the upper and lower sides of the metal foil need to be repeatedly cleaned after bonding. This process is time-consuming and labor-intensive, and is not conducive to mass production.

[0036] In view of the above problems, the present application proposes a solution to overcome at least one of the defects existing in the above-mentioned related technologies.

[0037] See also Figure 2 The ultrasonic head includes a backing 1, an ultrasonic component, a matching layer 5, a lens layer 6, etc., wherein the ultrasonic component includes a flexible circuit board 2, a piezoelectric layer 3, a first electrode gold-plated layer 21 and a second electrode gold-plated layer 22 which are insulated from each other on the surface of the piezoelectric layer 3. The backing 1, the flexible circuit board 2, the piezoelectric layer 3, the matching layer 5 and the lens layer 6 are bonded in sequence. Among them, the backing 1 plays the role of absorbing excess sound waves and supporting the sound head; the flexible circuit board 2, i.e., the flexible circuit board 2, plays the role of connecting the positive electrode of the chip on the one hand, and plays the role of circuit connection on the other hand; the piezoelectric layer 3 includes a plurality of array elements, and the piezoelectric material used in the piezoelectric layer 3 is the core element of the ultrasonic sensor, which plays the role of transmitting and receiving ultrasonic waves; the matching layer 5 is generally a single-layer material with low acoustic impedance or a multi-layer acoustic impedance gradient material, which plays the role of reducing acoustic impedance; the first electrode gold-plated layer 21 is used to lead out the first electrode of the piezoelectric layer 3 and electrically connect it to the flexible circuit board 2; the second electrode gold-plated layer 22 is used to lead out the second electrode of the piezoelectric layer 3 and electrically connect it to the flexible circuit board 2.

[0038] It should be noted that the first electrode and the second electrode refer to positive electrodes or negative electrodes. If the first electrode is a positive electrode, the second electrode is a negative electrode; if the first electrode is a negative electrode, the second electrode is a positive electrode.

[0039] It should be understood that the composition of the above-mentioned ultrasonic sound head is only used for illustration. In actual application, the composition structure of the ultrasonic sound head can be adaptively changed and is not limited here.

[0040] See also Figure 3 and Figure 4The ultrasonic component includes a flexible circuit board 2 and a piezoelectric layer 3. The surface of the piezoelectric layer 3 has a first electrode gold-plated layer 21 and a second electrode gold-plated layer 22 that are insulated from each other. The first electrode gold-plated layer 21 is electrically connected to the first electrode of the piezoelectric layer 3, and the second electrode gold-plated layer 22 is electrically connected to the second electrode of the piezoelectric layer 3; the flexible circuit board 2 has a first electrode connecting area 31 and a second electrode connecting area 32 that are insulated from each other; the first electrode gold-plated layer 21 is electrically connected to the first electrode connecting area 31, and the second electrode gold-plated layer 22 is electrically connected to the second electrode connecting area 32.

[0041] The first electrode gold-plated layer 21 is electrically connected to the first electrode of the piezoelectric layer 3 and the first electrode connection area 31 of the flexible circuit board 2 respectively, and the second electrode gold-plated layer 22 is electrically connected to the second electrode of the piezoelectric layer 3 and the second electrode connection area 32 of the flexible circuit board 2 respectively, so that the first electrode and the second electrode of the piezoelectric layer 3 can be led out and electrically connected to the flexible circuit board 2. The negative electrode material 4 is replaced by a gold-plated layer, and a gold-plated layer is arranged on the surface of the piezoelectric layer 3, and the gold-plated layer is connected to the flexible circuit board 2. Compared with the related art that uses the second flexible circuit board 2 as the negative electrode material 4, the thickness of the negative electrode material 4 is effectively reduced, and the influence of the negative electrode material 4 on the performance of the sound head due to sound attenuation is reduced, thereby improving the overall performance of the sound head. At the same time, the gold-plated layer is used to replace the traditional foil, and there is no need to repeatedly remove the glue after bonding, which shortens the process time and solves the problem that the array element of the piezoelectric layer 3 is easy to fail when the metal foil process is used.

[0042] Preferably, the gold plating method is vacuum sputtering gold plating.

[0043] Preferably, the thickness of the first electrode gold-plated layer 21 and the second electrode gold-plated layer 22 are 0-5 microns respectively. Specifically, the thickness of the first electrode gold-plated layer 21 and the second electrode gold-plated layer 22 can be 1 micron, 2 microns, 3 microns, 4 microns, 5 microns, etc. respectively.

[0044] For further information, see Figures 3 to 6 The piezoelectric layer 3 has a top surface, a bottom surface, a first side surface and a second side surface, and the first side surface and the second side surface are opposite to each other; at least part of the first electrode gold-plated layer 21 and the second electrode gold-plated layer 22 are located on the bottom surface, and a first disconnection area 23 is provided between the first electrode gold-plated layer 21 and the second electrode gold-plated layer 22 on the bottom surface; the top side of the flexible circuit board 2 is attached to the bottom surface; the first electrode connection area 31 and the second electrode connection area 32 are both located on the top side of the flexible circuit board 2; an insulating area 33 is provided between the first electrode connection area 31 and the second electrode connection area 32; the first electrode connection area 31 is electrically connected to the first electrode gold-plated layer 21 at one end of the first disconnection area 23; the second electrode connection area 32 is electrically connected to the second electrode gold-plated layer 22 at the other end of the first disconnection area 23; and the position of the insulating area 33 corresponds to the position of the first disconnection area 23.

[0045] The first electrode of the piezoelectric layer 3 is electrically connected to the first electrode gold-plated layer 21 covering the bottom surface of the piezoelectric layer 3, and the first electrode gold-plated layer 21 covering the bottom surface of the piezoelectric layer 3 is electrically connected to the first electrode connection area 31 on the top side of the flexible circuit board 2; the second electrode of the piezoelectric layer 3 is electrically connected to the second electrode gold-plated layer 22 covering the top surface of the piezoelectric layer 3, and the second electrode gold-plated layer 22 extends from the top surface of the piezoelectric layer 3 through the first side surface of the piezoelectric layer 3 to the bottom surface of the piezoelectric layer 3, so as to be electrically connected to the first electrode connection area 31 on the top side of the flexible circuit board 2. In this way, the first electrode and the second electrode of the piezoelectric layer 3 can be more conveniently brought out and electrically connected to the flexible circuit board 2.

[0046] Preferably, the piezoelectric layer 3 and the flexible circuit board 2 are bonded with epoxy resin adhesive. The epoxy resin adhesive has good performance, is a universal and general adhesive, and has low cost.

[0047] Furthermore, the width of the insulating area 33 is greater than or equal to the gap length of the first disconnected area 23. This prevents electrical breakdown between the electrodes at both ends of the first disconnected area 23, and makes it easier for the position of the insulating area 33 to correspond to the first disconnected area 23 when the flexible circuit board 2 is bonded to the piezoelectric layer 3.

[0048] For further information, see Figure 4 The flexible circuit board 2 further has a first electrode circuit area 34 and a second electrode circuit area 35 , the first electrode connection area 31 is electrically connected to the first electrode circuit area 34 , and the second electrode connection area 32 is electrically connected to the second electrode circuit area 35 .

[0049] An insulating area 33 is set between the first electrode connection area 31 and the second motor connection area to prevent the first electrode connection area 31 and the second electrode connection area 32 from being directly connected to each other and causing a short circuit. The first electrode circuit area 34 is electrically connected to the external circuit, and the first electrode circuit area 34 is used to lead out the first electrode. The second electrode circuit area 35 is electrically connected to the external circuit, and the second electrode circuit area 35 is used to lead out the second electrode.

[0050] For further information, see Figure 3 , Figure 5 and Figure 6 There is also a second disconnection zone 24 between the first electrode gold-plated layer 21 and the second electrode gold-plated layer 22. The second disconnection zone 24 is located on the top surface and / or the second side surface. The first disconnection zone 23 and the second disconnection zone 24 are established to insulate the first electrode gold-plated layer 21 and the second electrode gold-plated layer 22.

[0051] See also Figure 3In the first implementation, the first disconnection area 23 is located on the bottom surface of the piezoelectric layer 3, and the second disconnection area 24 is located on the top surface of the piezoelectric layer 3. The first disconnection area 23 and the second disconnection area 24 are centrally symmetrically distributed relative to the center of the piezoelectric layer 3. The first electrode gold-plated layer 21 covers a portion of the top surface of the piezoelectric layer 3, the second side surface of the piezoelectric layer 3, and a portion of the bottom surface of the piezoelectric layer 3; the second electrode gold-plated layer 22 covers a portion of the top surface of the piezoelectric layer 3, the first side surface of the piezoelectric layer 3, and a portion of the bottom surface of the piezoelectric layer 3.

[0052] Among them, the lengths of the first disconnection zone 23 and the second disconnection zone 24 are both 0-2.5mm. If the length is too short, it is not conducive to welding. If it is too long, it will lead to more invalid array elements, affecting the acoustic performance. Because the disconnection zone is not gold-plated, this area cannot produce piezoelectric effect, that is, invalid area. When the length of the disconnection zone is too long, such as greater than 2.5mm, it will cause too many invalid areas, reduce the effective area, and reduce the performance of the ultrasonic probe. The shortest distance between the first disconnection zone 23 and the first side of the piezoelectric layer 3 is 0-5mm, and the shortest distance between the second disconnection zone 24 and the second side of the piezoelectric layer 3 is 0-5mm. In practical applications, the disconnection zone is as close to the edge as possible, in the margin area, because if it is too far from the boundary, such as greater than 5mm, the piezoelectric material has a long section along the width direction with both the upper and lower sides being negative or positive, causing this section to be unable to generate ultrasonic waves, that is, invalid area. Considering the processability, the invalid area should be minimized during design. In this solution, the first disconnection area 23 and the second disconnection area 24 are equivalent to diagonal distribution. Generally, piezoelectric materials will have a margin along the width direction as a margin for process manufacturing, and even if damaged, it will not affect the performance. Therefore, placing the disconnection area in the margin area on both sides can make full use of the space and reduce the invalid area. The two disconnection areas cannot be on the same side. If they are on the same side, such as on the left side, the upper and lower surfaces of the piezoelectric material are positive or negative, and this design cannot generate ultrasonic waves. Therefore, if the positive gold-plated disconnection area is on the lower left side, the negative disconnection area can only be on the diagonal or lower right side.

[0053] Specifically, the lengths of the first disconnection zone 23 and the second disconnection zone 24 can be 0.5mm, 1mm, 1.5mm, 2mm, 2.5mm, etc., the shortest distance between the first disconnection zone 23 and the first side of the piezoelectric layer 3 can be 1mm, 2mm, 3mm, 4mm, 5mm, etc., and the shortest distance between the second disconnection zone 24 and the second side of the piezoelectric layer 3 can be 1mm, 2mm, 3mm, 4mm, 5mm, etc.

[0054] See also Figure 5In the second implementation, the first disconnection zone 23 is located on the bottom surface of the piezoelectric layer 3, the second disconnection zone 24 is located on the second side surface of the piezoelectric layer 3, and the length of the second disconnection zone 24 is equal to the thickness of the second side surface. The first electrode gold-plated layer 21 covers a portion of the bottom surface of the piezoelectric layer 3; the second electrode gold-plated layer 22 covers the top surface of the piezoelectric layer 3, the first side surface of the piezoelectric layer 3, and a portion of the bottom surface of the piezoelectric layer 3.

[0055] See also Figure 6 In the third implementation, the first disconnection zone 23 is located on the bottom surface of the piezoelectric layer 3, the second disconnection zone 24 is located on the second side surface, and the length of the second disconnection zone 24 is less than the thickness of the second side surface. The first electrode gold-plated layer 21 covers a portion of the bottom surface of the piezoelectric layer 3 and a portion of the second side surface of the piezoelectric layer 3; the second electrode gold-plated layer 22 covers a portion of the second side surface of the piezoelectric layer 3, the top surface of the piezoelectric layer 3, the first side surface of the piezoelectric layer 3, and a portion of the bottom surface of the piezoelectric layer 3.

[0056] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An ultrasonic component, characterized in that: It comprises a flexible circuit board and a piezoelectric layer, wherein the surface of the piezoelectric layer comprises a first electrode gold-plated layer and a second electrode gold-plated layer which are insulated from each other, the first electrode gold-plated layer is electrically connected to the first electrode of the piezoelectric layer, and the second electrode gold-plated layer is electrically connected to the second electrode of the piezoelectric layer; the flexible circuit board comprises a first electrode connection area and a second electrode connection area which are insulated from each other; the first electrode gold-plated layer is electrically connected to the first electrode connection area, and the second electrode gold-plated layer is electrically connected to the second electrode connection area.

2. An ultrasonic component according to claim 1, characterized in that: The piezoelectric layer has a top surface, a bottom surface, a first side surface and a second side surface, the first side surface and the second side surface are opposite to each other; at least part of the first electrode gold-plated layer and the second electrode gold-plated layer are located on the bottom surface, and a first disconnection area is provided between the first electrode gold-plated layer and the second electrode gold-plated layer on the bottom surface; the top side of the flexible circuit board is attached to the bottom surface, the first electrode connection area and the second electrode connection area are both located on the top side of the flexible circuit board, an insulating area is provided between the first electrode connection area and the second electrode connection area, the first electrode connection area is electrically connected to the first electrode gold-plated layer at one end of the first disconnection area, the second electrode connection area is electrically connected to the second electrode gold-plated layer at the other end of the first disconnection area, and the position of the insulating area corresponds to the position of the first disconnection area.

3. An ultrasonic component according to claim 2, characterized in that: The width of the insulating region is greater than or equal to the gap length of the first disconnected region.

4. An ultrasonic component according to claim 2, characterized in that: A second disconnection area is further provided between the first electrode gold-plated layer and the second electrode gold-plated layer, and the second disconnection area is located on the top surface and / or the second side surface.

5. An ultrasonic component according to claim 4, characterized in that: The first disconnection zone is located on the bottom surface, and the second disconnection zone is located on the top surface. The first disconnection zone and the second disconnection zone are centrally symmetrically distributed relative to the center of the piezoelectric layer; the first electrode gold-plated layer covers a portion of the top surface, the second side surface, and a portion of the bottom surface; the second electrode gold-plated layer covers a portion of the top surface, the first side surface, and a portion of the bottom surface.

6. An ultrasonic component according to claim 5, characterized in that: The lengths of the first break zone and the second break zone are both 0-2.5 mm; the shortest distance between the first break zone and the first side surface is 0-5 mm, and the shortest distance between the second break zone and the second side surface is 0-5 mm.

7. An ultrasonic component according to claim 4, characterized in that: The second disconnected area is located at the second side surface, and the length of the second disconnected area is less than or equal to the thickness of the second side surface.

8. An ultrasonic component according to claim 1, characterized in that: The flexible circuit board further comprises a first electrode circuit area and a second electrode circuit area, the first electrode connection area is electrically connected to the first electrode circuit area, and the second electrode connection area is electrically connected to the second electrode circuit area.

9. An ultrasonic component according to any one of claims 1 to 8, characterized in that: The thickness of the first electrode gold-plated layer and the second electrode gold-plated layer are 0-5 microns respectively.

10. An ultrasonic sound head, comprising a backing, a matching layer and a lens layer, characterized in that: It also includes an ultrasound component as described in any one of claims 1-9.

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