Charging die for semiconductor packaging

Abstract

The utility model discloses a charging die for semiconductor packaging, which comprises a mounting seat and a die seat, the top of the die seat is provided with a placing groove, the bottom of the left side of an inner cavity of the die seat is fixedly connected with a first spring, and the right side of the first spring is fixedly connected with a sliding plate. By means of the first spring, the sliding plate can be effectively driven to move through the elasticity of the first spring, so that the sliding plate drives the insertion rod to move, insertion connection or insertion disconnection is conducted on the insertion hole through movement of the insertion rod, the stability of contraction placement of the reset plate is guaranteed, and the trouble of workers is solved; and the reset plate can be effectively pushed to move in a reset mode through the elasticity of the reset plate, so that the reset plate pushes the push rod to move in a reset mode, packaging boxes placed on the surface of the containing groove are conveniently pushed to move through the reset movement of the push rod, workers can conveniently take the packaging boxes, and therefore the working efficiency of the workers is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a charging mold for semiconductor packaging. Background Art

[0002] Conductor packaging refers to the process of processing the tested wafers according to the product model and functional requirements to obtain independent chips. The packaging process is as follows: the wafers from the wafer front-end process are cut into small chips (Die) through the dicing process, and then the cut chips are glued to the corresponding substrate (lead frame) frame island, and then the chip bonding pads (BondPad) are connected to the corresponding pins (Lead) of the substrate using ultra-fine metal (gold, tin, copper, aluminum, etc.) wires or conductive resins to form the required circuit; then the independent chips are packaged and protected with plastic shells, and a series of operations are required after the plastic packaging. After the packaging is completed, the finished product is tested, usually after the incoming inspection, test and packaging processes, and finally put into storage for shipment. When packaging semiconductors, a loading mold is needed to assist the staff in the packaging operation;

[0003] However, during the use of the existing loading mold, the packaging box is usually placed in the groove of the mold, and the inner wall of the groove is used to fit the outer surface of the packaging box to ensure the stability of the packaging box. Then the staff puts the semiconductor chip in the inner cavity of the packaging box to complete the packaging work. Since the inner wall of the packaging box is in contact with the inner wall of the groove and the gap is small, the area subjected to force is also small, so the material removal work brings trouble to the staff. For this reason, we propose a loading mold for semiconductor packaging to solve the above problems. Utility Model Content

[0004] 1. Technical issues to be resolved

[0005] In view of the shortcomings of the prior art, the purpose of the utility model is to provide a charging mold for semiconductor packaging, which achieves the function of facilitating material removal.

[0006] (II) Technical solution

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a loading mold for semiconductor packaging, comprising a mounting seat and a mold seat, a placement groove is provided on the top of the mold seat, a first spring is fixedly connected to the bottom of the left side of the inner cavity of the mold seat, a sliding plate is fixedly connected to the right side of the first spring, a pull rod is fixedly connected to the left side of the sliding plate, an insertion rod is fixedly connected to the right side of the sliding plate, a fixing rod is fit-connected to the right side of the insertion rod, a reset plate is fixedly connected to the top of the fixing rod, a second spring is fixedly connected to the bottom of the reset plate, a push rod is fixedly connected to the top of the reset plate, and the surface of the push rod is fit-connected to the inner wall of the placement groove.

[0008] As a preferred solution, fixing columns are fixedly connected to the four sides of the bottom of the mounting seat, and an anti-slip pad is fixedly connected to the bottom of the fixing column.

[0009] Through the above technical solution, the device can be easily supported by fixing the column.

[0010] As a preferred solution, electric push rods are fixedly connected to both sides of the inner cavity of the mounting seat, a movable plate is fixedly connected to one side of the electric push rod, an insertion block is fixedly connected to one side of the movable plate, a mounting block is plugged into one side of the insertion block, and the top of the mounting block is fixedly connected to the bottom of the mold seat.

[0011] Through the above technical solution, the electric push rod can be used to easily drive the movable plate to move, so that the movable plate drives the plug block to plug or unplug the mounting block, which is convenient for disassembly, assembly and replacement of the mold base, thereby improving the work efficiency of the staff.

[0012] As a preferred solution, slots are provided on both sides of the installation block, and one side of the inserting block is inserted into the inner cavity of the slot.

[0013] With the above technical solution, the plug-in block can be easily plugged in through the slot.

[0014] As a preferred solution, both sides of the bottom of the inner cavity of the mounting seat are provided with sliding grooves, and the bottom of the movable plate is slidably connected in the inner cavity of the sliding grooves.

[0015] Through the above technical solution, the sliding stability of the moving plate is improved through the sliding groove.

[0016] As a preferred solution, a sealing cover plate is slidably connected to the left side of the top of the mold base, and a handle is fixedly connected to the surface of the sealing cover plate.

[0017] Through the above technical solution, the top of the mold base can be sealed and shielded by the sealing cover plate, thereby playing a dust-proof role.

[0018] As a preferred solution, both sides of the reset plate are closely connected to the inner wall of the mold base, and a socket is provided on the left side of the fixing rod.

[0019] Through the above technical solution, the insertion rod can be easily plugged in through the insertion hole.

[0020] (III) Beneficial effects

[0021] Compared with the prior art, the utility model provides a charging mold for semiconductor packaging, which has the following beneficial effects.

[0022] 1. The utility model can effectively utilize the first spring to drive the sliding plate to move by its own elasticity, so that the sliding plate drives the insertion rod to move, and the insertion hole is plugged or unplugged by the movement of the insertion rod, thereby ensuring the stability of the retracted placement of the reset plate and solving the troubles of the staff. The second spring can effectively utilize its own elasticity to push the reset plate to reset and move, so that the reset plate pushes the push rod to reset and move, and the push rod can be reset and moved, which is convenient for pushing the packaging box placed on the surface of the placement groove to move, making it convenient for the staff to take the packaging box, thereby improving the work efficiency of the staff.

[0023] 2. The utility model facilitates the movement of the movable plate by means of an electric push rod, so that the movable plate drives the plug block to plug or unplug the mounting block, making it convenient to disassemble and replace the mold base, thereby improving the work efficiency of the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the structure of the utility model;

[0025] Figure 2 This is a cross-sectional view of the mold base structure of the utility model;

[0026] Figure 3 This is a cross-sectional view of the mounting seat structure of the utility model;

[0027] Figure 4 This is a schematic diagram of the installation block structure of the utility model.

[0028] In the figure: 1. mounting base; 2. fixing column; 3. grip; 4. sealing cover plate; 5. pull rod; 6. placement groove; 7. push rod; 8. mold base; 9. first spring; 10. sliding plate; 11. insertion rod; 12. second spring; 13. fixing rod; 14. reset plate; 15. socket; 16. mounting block; 17. moving plate; 18. electric push rod; 19. insertion block. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] See also Figure 1-4 The utility model: a charging mold for semiconductor packaging, comprising a mounting base 1 and a mold base 8, a placement groove 6 is opened on the top of the mold base 8, a first spring 9 is fixedly connected to the bottom of the left side of the inner cavity of the mold base 8, a sliding plate 10 is fixedly connected to the right side of the first spring 9, a pull rod 5 is fixedly connected to the left side of the sliding plate 10, an insertion rod 11 is fixedly connected to the right side of the sliding plate 10, a fixing rod 13 is fit-connected to the right side of the insertion rod 11, a reset plate 14 is fixedly connected to the top of the fixing rod 13, a second spring 12 is fixedly connected to the bottom of the reset plate 14, a push rod 7 is fixedly connected to the top of the reset plate 14, and the surface of the push rod 7 is fit-connected to the inner wall of the placement groove 6.

[0031] Through the above technical scheme, the first spring 9 can effectively utilize its own elasticity to drive the sliding plate 10 to move, so that the sliding plate 10 drives the insertion rod 11 to move, and the insertion hole 15 is plugged or unplugged by the movement of the insertion rod 11, thereby ensuring the stability of the retracted placement of the reset plate 14 and solving the troubles of the staff. Through the second spring 12, the elasticity of the reset plate 14 can be effectively utilized to push the reset plate 14 to reset and move, so that the reset plate 14 pushes the push rod 7 to reset and move. By resetting the push rod 7, it is convenient to push the packaging box placed on the surface of the placement slot 6 to move, so that it is convenient for the staff to take the packaging box, thereby improving the work efficiency of the staff.

[0032] Specifically, the bottom of the mounting seat 1 is fixedly connected with a fixing column 2 on all sides, the bottom of the fixing column 2 is fixedly connected with an anti-slip pad, the inner cavity of the mounting seat 1 is fixedly connected with an electric push rod 18 on both sides, a movable plate 17 is fixedly connected to one side of the electric push rod 18, a plug block 19 is fixedly connected to one side of the movable plate 17, a mounting block 16 is plugged into one side of the plug block 19, the top of the mounting block 16 is fixedly connected to the bottom of the mold seat 8, slots are provided on both sides of the mounting block 16, and one side of the plug block 19 is plugged into the inner cavity of the slot, and both sides of the bottom of the inner cavity of the mounting seat 1 are A slide groove is provided, and the bottom of the movable plate 17 is slidably connected to the inner cavity of the slide groove. A sealing cover plate 4 is slidably connected to the left side of the top of the mold base 8, and a handle 3 is fixedly connected to the surface of the sealing cover plate 4. Both sides of the reset plate 14 are fitted with the inner wall of the mold base 8. A socket 15 is provided on the left side of the fixed rod 13. Through the electric push rod 18, it is convenient to drive the movable plate 17 to move, so that the movable plate 17 drives the plug block 19 to plug or unplug the mounting block 16, which is convenient for disassembly, assembly and replacement of the mold base 8, thereby improving the work efficiency of the staff.

[0033] The working principle of the utility model is as follows: first, the user presses the push rod 7 downward, and the push rod 7 drives the reset plate 14 to shrink and move, and the reset plate 14 drives the fixing rod 13 and the second spring 12 to shrink and move at the same time. When the fixing rod 13 drives the insertion hole 15 to shrink and move downward and is parallel to the insertion rod 11, the limiting pressure of the insertion rod 11 is eliminated, and the limiting pressure of the first spring 9 is eliminated at the same time. At this time, the first spring 9 automatically resets, and the sliding plate 10 is pushed to reset and move by the first spring 9, and the insertion rod 11 is pushed to reset and move and plugged into the inner cavity of the insertion hole 15 by the sliding plate 10, so as to limit and fix the fixing rod 13. At this time, the top of the push rod 7 is parallel to the bottom of the placement groove 6, and then the user places the packaging box on the surface of the placement groove 6 to package the semiconductor chips. When the packaging is completed and the material needs to be taken, the user pulls the pull rod 5, and the pull rod 5 pulls the sliding plate 10 to move, and the sliding plate 1 0 drives the insertion rod 11 and the first spring 9 to shrink and move at the same time, and the insertion rod 11 shrinks and moves to separate from the inner cavity of the insertion hole 15. At this time, the limiting pressure of the fixed rod 13 is eliminated, and the limiting pressure of the second spring 12 is also eliminated. At this time, the second spring 12 is automatically reset, and the second spring 12 facilitates the reset plate 14 to reset and move, so that the reset plate 14 pushes the push rod 7 to reset and move, and the push rod 7 is reset and moved to push the packaging box placed in the inner cavity of the placement groove 6 out of the inner cavity of the placement groove 6, and then the user can take away the packaging box with the semiconductor chip. When the mold seat 8 needs to be disassembled and maintained, the user starts the reset of the electric push rod 18 through the external controller, and the electric push rod 18 drives the moving plate 17 to reset and move, and the moving plate 17 drives the insert block 19 to reset and move out of the inner cavity of the slot. At this time, the limiting pressure of the mounting block 16 is eliminated, and the user can take away the mold seat 8 for maintenance.

[0034] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit the protection scope of the utility model. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the utility model.

Claims

1. A charging mold for semiconductor packaging, comprising a mounting seat (1) and a mold seat (8), characterized in that: A placement groove (6) is provided on the top of the mold base (8), a first spring (9) is fixedly connected to the bottom of the left side of the inner cavity of the mold base (8), a sliding plate (10) is fixedly connected to the right side of the first spring (9), a pull rod (5) is fixedly connected to the left side of the sliding plate (10), an insertion rod (11) is fixedly connected to the right side of the sliding plate (10), a fixed rod (13) is fit-connected to the right side of the insertion rod (11), a reset plate (14) is fixedly connected to the top of the fixed rod (13), a second spring (12) is fixedly connected to the bottom of the reset plate (14), a push rod (7) is fixedly connected to the top of the reset plate (14), and the surface of the push rod (7) is fit-connected to the inner wall of the placement groove (6).

2. A semiconductor packaging charging mold according to claim 1, characterized in that: The bottom of the mounting seat (1) is fixedly connected to fixing columns (2) on all sides, and the bottom of the fixing columns (2) is fixedly connected to an anti-slip pad.

3. A semiconductor packaging charging mold according to claim 1, characterized in that: Both sides of the inner cavity of the mounting seat (1) are fixedly connected with electric push rods (18), one side of the electric push rod (18) is fixedly connected with a moving plate (17), one side of the moving plate (17) is fixedly connected with an insert block (19), one side of the insert block (19) is plugged with a mounting block (16), and the top of the mounting block (16) is fixedly connected to the bottom of the mold seat (8).

4. A semiconductor packaging charging mold according to claim 3, characterized in that: Slots are provided on both sides of the installation block (16), and one side of the inserting block (19) is inserted into the inner cavity of the slot.

5. The semiconductor packaging charging mold according to claim 3, characterized in that: Slide grooves are provided on both sides of the bottom of the inner cavity of the mounting seat (1), and the bottom of the movable plate (17) is slidably connected in the inner cavity of the slide grooves.

6. The semiconductor packaging charging mold according to claim 1, characterized in that: A sealing cover plate (4) is slidably connected to the left side of the top of the mold base (8), and a handle (3) is fixedly connected to the surface of the sealing cover plate (4).

7. A semiconductor packaging charging mold according to claim 1, characterized in that: Both sides of the reset plate (14) are closely connected to the inner wall of the mold base (8), and a plug hole (15) is provided on the left side of the fixing rod (13).

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