Multi-station wafer cleaning equipment
By adopting a combination design of a drive motor and lifting assembly in the wafer cleaning device, efficient cleaning of the wafer surface is achieved, and the problems of low flushing efficiency and great limitations of cleaning solution in the prior art are solved.
Patent Information
- Application Number
- CN202420830138.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-22
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-04-22
AI Technical Summary
During the washing process of the existing wafer cleaning device, the cleaning liquid is low in flushing efficiency, and it is impossible to effectively remove stains on the wafer surface, and the cleaning limitations are high.
A multi-station wafer cleaning equipment is designed, using a driving motor to cooperate with the lifting assembly. Through the rotation centered on the shaft column and the lifting sleeve, the large revolution of the cleaning frame group is combined with the lifting and lowering to improve the cleaning strength.
It achieves a more efficient cleaning effect, can remove stains on the wafer surface more thoroughly, and improves the cleaning strength and efficiency.
Smart Images

Figure CN222672989U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer processing, in particular to a multi-station wafer cleaning device. Background Art
[0002] As is known to all, a wafer cleaning device is a device used to clean wafers during wafer processing, and is widely used in the field of wafer processing equipment; the existing wafer cleaning device comprises an operating table, a washing liquid tank, a wafer and a clamp, wherein the washing liquid tank is provided with a cleaning chamber, and the bottom end of the washing liquid tank is connected to the top end of the operating table; when the existing wafer cleaning device is used, firstly, a proper amount of cleaning liquid is added into the washing liquid tank, and then the wafer is clamped with a clamp, and the staff holds the clamp handle end of the clamp and immerses the wafer into the wafer washing liquid to rinse;
[0003] It has been found in the use of existing wafer cleaning devices that, firstly, during the rinsing process of the wafer, the cleaning liquid cannot achieve a very high rinsing efficiency for the wafer, which results in a low efficiency, resulting in the stains attached to the outer surface of the wafer being unable to be removed by the strong impact force of the cleaning liquid, and thus the practicability is poor; and during the rinsing process of the wafer, the shaking angle of the wafer is relatively fixed, and the cleaning liquid cannot ensure a strong impact on various parts of the wafer to remove the stains on the surface of the wafer, which results in high limitations. Utility Model Content
[0004] The purpose of the utility model is to provide a multi-station wafer cleaning device to solve the above-mentioned technical problems.
[0005] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions:
[0006] A multi-station wafer cleaning device comprises a cleaning cylinder, a mounting frame mounted above the cleaning cylinder, a driving motor arranged on the top of the mounting frame, a cleaning frame group, and a lifting assembly connecting the cleaning frame group and the driving motor; a transmission assembly is also arranged between the driving motor and the lifting assembly;
[0007] Furthermore, the transmission assembly includes a fixed main wheel and a lifting wheel meshed with the fixed main wheel; a plurality of the lifting wheels are equidistantly distributed around the fixed main wheel at an outer periphery of the fixed main wheel with the fixed main wheel as the center; the lifting wheels are connected to the lifting assembly; the fixed main wheel and the lifting wheels are both installed in the transmission housing;
[0008] Furthermore, the lifting assembly includes a main shaft, a connecting sleeve, a lifting sleeve and a lifting shaft; the main shaft is connected to a driving motor, the connecting sleeve is slidably sleeved on the lower end of the main shaft, and is connected to a plurality of lifting shafts through a multi-arm plate, the lifting shaft is sleeved in the lifting sleeve, and the lifting sleeve passes into a transmission housing;
[0009] Furthermore, a screw structure is provided in the lifting sleeve, and the lifting shaft is lifted and lowered by the screw structure; and the lifting wheel is connected to the lifting sleeve and the screw structure; the lower end of the lifting shaft is connected to the cleaning rack group;
[0010] Furthermore, the cleaning rack assembly includes a connecting plate, a sawtooth disc rack assembled on the connecting plate, and an assembly connecting frame for fixing the bottom of the sawtooth disc rack.
[0011] Compared with the prior art, the beneficial effects of the utility model are as follows:
[0012] The utility model has a simple overall structure and an optimized structural design. The driving motor cooperates with the lifting component to perform revolution around the shaft column and lifting formed by the lifting sleeve. The large revolution and lifting of the cleaning frame group are combined, thereby improving the cleaning intensity of the wafers and chips as a whole, and clearing the stains on the surface of the wafers more efficiently. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0014] Figure 2 It is a schematic diagram of the structure of the utility model after partial concealment. DETAILED DESCRIPTION
[0015] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0016] refer to Figure 1-2 As shown, a multi-station wafer cleaning device comprises a cleaning cylinder 1, a mounting frame 2 mounted above the cleaning cylinder 1, a driving motor 3 arranged on the top of the mounting frame 2, a cleaning frame group 5, and a lifting assembly connecting the cleaning frame group 5 and the driving motor 3; a transmission assembly is also provided between the driving motor 3 and the lifting assembly;
[0017] Furthermore, the transmission assembly includes a fixed main wheel 31 and a lifting wheel 32 meshing with the fixed main wheel 31; a plurality of the lifting wheels 32 are equidistantly distributed around the fixed main wheel 31; the lifting wheels 32 are connected to the lifting assembly; the fixed main wheel 31 and the lifting wheels 32 are both installed in a transmission housing 33;
[0018] Further, the lifting assembly includes a main shaft 45, a connecting sleeve 43, a lifting sleeve 41 and a lifting shaft 42; the main shaft 45 is connected to the driving motor 3, the connecting sleeve 43 is slidably sleeved on the lower end of the main shaft 45, and is connected to a plurality of lifting shafts 42 through a multi-arm plate 44, the lifting shaft 42 is sleeved in the lifting sleeve 41, and the lifting sleeve 41 passes into the transmission housing 33; further, a screw structure is provided in the lifting sleeve 41, and the lifting shaft 42 is lifted and lowered by the screw structure; and the lifting wheel 32 is connected to the screw structure of the lifting sleeve 41; the lower end of the lifting shaft 42 is connected to the cleaning rack group 5;
[0019] In this embodiment, the main shaft 45 is connected to the driving motor 3, and the driving motor 3 drives the main shaft 45 to rotate, thereby driving the connecting sleeve 43. The connecting sleeve 43 and the main shaft can slide up and down, but do not rotate relative to each other; then the connecting sleeve 43 drives the multi-arm plate 44 to rotate, thereby driving the lifting shaft 42 and the lifting sleeve 41; when the lifting sleeve 41 rotates around the main shaft 45 as a whole, the lifting wheel 32 engages with the fixed main tooth 31, thereby generating rotation, driving the lead screw in the lifting sleeve 4, thereby driving the lifting shaft 42 to extend and retract up and down, thereby driving the multi-arm plate 44 to further drive the cleaning rack group 5 to lift and lower, thereby realizing the rotation angle of the cleaning rack group 5 centered on the main shaft 5, and the lifting and lowering changes.
[0020] Furthermore, the cleaning frame assembly 5 includes a connecting plate 53 , a sawtooth disc frame 51 assembled on the connecting plate 53 , and an assembly connecting frame 52 fixing the bottom of the sawtooth disc frame 51 .
[0021] In this embodiment, the sawtooth wafer rack 51 is used to rack and place wafers, and can be combined with the assembly connecting rack 52 to further improve the structural stability of the cleaning rack assembly 5 .
[0022] The utility model has a simple overall structure and an optimized structural design. The driving motor cooperates with the lifting component to perform revolution around the shaft column and lifting formed by the lifting sleeve. The large revolution and lifting of the cleaning frame group are combined, thereby improving the cleaning intensity of the wafers and chips as a whole, and clearing the stains on the surface of the wafers more efficiently.
[0023] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the scope defined by the spirit of the present invention.
Claims
1. A multi-station wafer cleaning device, characterized in that: The cleaning device comprises a cleaning cylinder (1), a mounting frame (2) mounted above the cleaning cylinder (1), a driving motor (3) arranged on the top of the mounting frame (2), a cleaning frame group (5), and a lifting assembly connecting the cleaning frame group (5) and the driving motor (3); a transmission assembly is also arranged between the driving motor (3) and the lifting assembly; the transmission assembly comprises a fixed main wheel (31) and a lifting wheel (32) meshing with the fixed main wheel; a plurality of the lifting wheels (32) are arranged at equal intervals on the periphery of the fixed main wheel (31) with the fixed main wheel (31) as the center; the lifting wheels (32) are connected to the lifting assembly; the fixed main wheel (31) and the lifting wheels (32) are both mounted in a transmission housing (33); The lifting assembly comprises a main shaft (45), a connecting sleeve (43), a lifting sleeve (41) and a lifting shaft (42); the main shaft (45) is connected to a driving motor (3); the connecting sleeve (43) is slidably sleeved on the lower end of the main shaft (45) and connected to a plurality of lifting shafts (42) via a multi-arm plate (44); the lifting shaft (42) is sleeved in the lifting sleeve (41), and the lifting sleeve (41) is passed into a transmission housing (33); a screw rod structure is provided in the lifting sleeve (41), and the lifting shaft (42) is lifted and lowered by the screw rod structure; and the lifting wheel (32) is connected to the screw rod structure of the lifting sleeve (41); and the lower end of the lifting shaft (42) is connected to a cleaning rack assembly (5).
2. The multi-station wafer cleaning equipment according to claim 1, characterized in that: The cleaning frame assembly (5) comprises a connecting plate (53), a sawtooth disc frame (51) mounted on the connecting plate (53), and an assembly connecting frame (52) for fixing the bottom of the sawtooth disc frame (51).