Ceramic substrate for integrated packaging

Abstract

The utility model discloses a ceramic substrate used for integrated packaging. The ceramic substrate comprises a ceramic body and a metal box dam. The upper surface of the ceramic body is concavely provided with an accommodating groove for embedding a UV chip, the periphery of the accommodating groove is provided with a first bonding pad, the lower surface of the ceramic body is provided with a second bonding pad, a through hole is formed in the surface of the ceramic body in a penetrating manner, and a conduction column is embedded in the through hole; the metal box dam is arranged on the upper surface of the ceramic body and located on the periphery of the first bonding pad. The upper surface of the ceramic body is concavely provided with the annular waterproof groove, and the annular waterproof groove is filled with the packaging resin after packaging, so that the path of external moisture entering the packaging cavity is longer and more complicated, the waterproof performance of the ceramic substrate is improved, the external moisture is effectively prevented from entering the packaging cavity and damaging the UV wafer, and the service life of the UV wafer is prolonged. And the insulating reinforcing layer is clamped between the upper ceramic base layer and the lower ceramic base layer, so that the strength of the ceramic substrate is improved, the ceramic substrate is not easy to break and damage, and the service life of the ceramic substrate is prolonged.

Description

Technical Field

[0001] The utility model relates to the field of substrate technology, in particular to a ceramic substrate used for integrated packaging. Background Art

[0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of alumina or aluminum nitride ceramic substrate at high temperature. The ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent soft solderability and high adhesion strength, and can be etched with various patterns like PCB boards, and has a large current carrying capacity. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. Ultraviolet light-emitting diodes have the advantages of energy saving and environmental protection, long life, small size, and controllable wavelength. Among them, the emission wavelength of deep ultraviolet LEDs is less than 300nm, which can be used in sterilization, water purification, biochemical detection and other fields. Ultraviolet light-emitting diodes are usually packaged with ceramic substrates. In order to facilitate the packaging of UV chips, the ceramic substrates are all provided with metal dams, and a packaging cavity is formed by the metal dams. After the UV chip is packaged, a transparent cover is provided to seal the opening of the packaging cavity.

[0003] The existing ceramic substrates have poor waterproof protection for UV chips and do not have sufficient waterproof ability to protect the UV chips from being damaged, thus affecting the service life of the UV chips. At the same time, the existing ceramic substrates are generally single-layer ceramic substrates, and the structural strength of the ceramics is weak, and they are easily broken and damaged, resulting in a short service life. Therefore, it is necessary to improve the existing ceramic substrates. Utility Model Content

[0004] In view of this, the utility model aims to address the deficiencies in the prior art, and its main purpose is to provide a ceramic substrate for integrated packaging, which can effectively solve the problems of the existing ceramic substrate having poor waterproof performance, external moisture easily entering the packaging cavity through the gap, thereby causing damage to the UV chip, and the ceramic substrate having weak strength, easy breakage and damage, and short service life.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A ceramic substrate for integrated packaging, comprising a ceramic body and a metal dam; a recessed receiving groove for embedding a UV chip is formed on the upper surface of the ceramic body, a first solder pad is arranged on the periphery of the recessed groove, a second solder pad is arranged on the lower surface of the ceramic body, and a through hole is formed through the surface of the ceramic body, a conductive column is embedded in the through hole, one end of the conductive column is conductively connected to the first solder pad, and the other end of the conductive column is conductively connected to the second solder pad; the metal dam is arranged on the upper surface of the ceramic body and is located on the periphery of the first solder pad, and a packaging cavity is formed by the metal dam; a recessed annular waterproof groove is formed on the upper surface of the ceramic body, the annular waterproof groove is located on the inner side of the metal dam, and the ceramic body comprises an upper ceramic base layer, a lower ceramic base layer and an insulating reinforcement layer, the upper ceramic base layer and the lower ceramic base layer are arranged one above the other, and the insulating reinforcement layer is sandwiched between the upper ceramic base layer and the lower ceramic base layer.

[0007] As a preferred solution, the inner wall of the accommodating groove is coated with a heat dissipation layer, and a heat dissipation groove is opened on the lower surface of the ceramic body. The heat dissipation groove is connected to the accommodating groove, and a heat dissipation part is filled in the heat dissipation groove.

[0008] As a preferred solution, the heat dissipation layer and the heat dissipation part are both made of graphene. Graphene has excellent thermal conductivity and can conduct heat out of the external environment more quickly.

[0009] As a preferred solution, the surface of the heat dissipation portion is flush with the surface of the lower ceramic substrate.

[0010] As a preferred solution, the cross-section of the metal dam is trapezoidal, which increases the contact area between the packaging resin and the metal dam. The height of the metal dam is 0.4-0.6mm. If the height of the metal dam is lower than 0.4mm, it is likely to cause the lead to be exposed after the packaging resin is packaged. Moreover, the control requirements for the amount of resin used are very high. A little more will easily cause overflow. When the height of the metal dam is higher than 0.6mm, the demand for packaging resin is relatively large, the cost is greatly increased, and the overall transmittance is low, and the luminous flux will also be reduced.

[0011] As a preferred solution, the lower ceramic base layer is provided with a plurality of positioning holes, the insulating reinforcement layer is provided with a plurality of through holes, each through hole is directly connected to the corresponding positioning hole, and the upper ceramic base layer is provided with a plurality of positioning columns, each positioning column passes through the corresponding through hole and is inserted into the corresponding positioning hole for positioning.

[0012] As a preferred solution, the insulating reinforcement layer is made of glass fiber.

[0013] As a preferred solution, grooves are provided on both sides of the lower ceramic substrate, and buffer members are provided in the grooves.

[0014] As a preferred solution, the buffer is made of rubber material, the buffer has a buffer air cavity inside, and a buffer bracket is arranged inside the buffer air cavity.

[0015] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0016] An annular waterproof groove is concavely provided on the upper surface of the ceramic body. After packaging, the annular waterproof groove is filled with packaging resin, so that the path for external moisture to enter the packaging cavity is longer and more complicated, thereby improving the waterproof performance of the ceramic substrate, effectively preventing external moisture from entering the packaging cavity and damaging the UV chip, and then an insulating reinforcement layer is sandwiched between the upper ceramic base layer and the lower ceramic base layer to improve the strength of the ceramic substrate, making it not easy to break or be damaged, thereby extending its service life.

[0017] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments: BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a cross-sectional view of a preferred embodiment of the utility model.

[0019] Description of the accompanying drawings:

[0020] 10. Ceramic body 101. Receiving groove

[0021] 102, first pad 103, second pad

[0022] 104, through hole 105, conductive column

[0023] 106. Annular waterproof groove 107. Heat dissipation layer

[0024] 108. heat dissipation slot 109. heat dissipation unit

[0025] 11. Upper ceramic base 111. Positioning column

[0026] 12. Lower ceramic base 121. Positioning hole

[0027] 13. Insulation reinforcement layer 131. Through hole

[0028] 20. Metal dam 201. Packaging cavity

[0029] 30. Buffering member 31. Buffering air cavity

[0030] 32. Buffer bracket. DETAILED DESCRIPTION

[0031] Please refer to Figure 1As shown, it shows the specific structure of a preferred embodiment of the utility model, including a ceramic body 10 and a metal dam 20.

[0032] The upper surface of the ceramic body 10 is concavely provided with a receiving groove 101 for embedding the UV chip, and the periphery of the receiving groove 101 is provided with a first soldering pad 102, and the lower surface of the ceramic body 10 is provided with a second soldering pad 103, and a through hole 104 is formed through the surface of the ceramic body 10, and a conducting column 105 is embedded in the through hole 104, one end of the conducting column 105 is conductively connected to the first soldering pad 102, and the other end of the conducting column 105 is conductively connected to the second soldering pad 103. The upper surface of the accommodating groove 101 is concavely provided with an annular waterproof groove 106. Specifically, the ceramic body 10 includes an upper ceramic base 11, a lower ceramic base 12 and an insulating reinforcement layer 13. The upper ceramic base 11 and the lower ceramic base 12 are arranged up and down, and the insulating reinforcement layer 13 is sandwiched between the upper ceramic base 11 and the lower ceramic base 12. In this embodiment, the inner wall of the accommodating groove 101 is coated with a heat dissipation layer 107, and a heat dissipation groove 108 is opened on the lower surface of the ceramic body 10. The heat dissipation groove 108 is connected to the accommodating groove 101. The heat dissipation groove 108 is connected to the heat dissipation groove 101, and a heat dissipation portion 109 is filled in the heat dissipation groove 108. The heat dissipation layer 107 and the heat dissipation portion 109 are both made of graphene. Graphene has excellent thermal conductivity and can conduct heat out of the external environment more quickly. The surface of the heat dissipation portion 109 is flush with the surface of the lower ceramic base 12. In addition, the lower ceramic base 12 is provided with a plurality of positioning holes 121, and the insulation reinforcement layer 13 is provided with a plurality of through holes 131. Each through hole 131 is directly connected to the corresponding positioning hole 121. The upper ceramic base 11 is provided with a plurality of positioning columns 111. Each positioning column 111 passes through the corresponding through hole 131 and is inserted into the corresponding positioning hole 121 for positioning; and the insulation reinforcement layer 13 is made of glass fiber. Grooves 122 are provided on both sides of the lower ceramic base 12, and a buffer 30 is provided in the groove 122. The buffer 30 is made of rubber, and the buffer 30 has a buffer air cavity 31 inside, and a buffer bracket 32 ​​is provided inside the buffer air cavity 31.

[0033] The metal dam 20 is arranged on the upper surface of the ceramic body 10 and is located on the periphery of the first welding pad 102. The aforementioned annular waterproof groove 106 is located on the inner side of the metal dam 20, and the metal dam 20 is structured to form a packaging cavity 201; in the present embodiment, the cross-section of the metal dam 20 is trapezoidal, which increases the contact area between the packaging resin and the metal dam, increases the bonding force, and makes it difficult for the packaging resin to fall off. The height of the metal dam 20 is 0.4-0.6mm. If the height of the metal dam 20 is lower than 0.4mm, it is likely to cause the problem of lead exposure after the packaging resin is packaged. Moreover, the control requirements for the amount of resin used are very high. A little more will easily cause glue overflow. When the height of the metal dam 20 is higher than 0.6mm, the demand for packaging resin is relatively large, the cost is greatly increased, and the overall transmittance is low, and the luminous flux will also be reduced.

[0034] The production process of this embodiment is described in detail as follows:

[0035] First, the buffer member 30 is set in the groove 122, and then the upper ceramic base layer 11, the lower ceramic base layer 12 and the insulating reinforcement layer 13 are assembled and fixed together. A plurality of positioning columns 111 respectively pass through the corresponding through holes 131 and are inserted into the corresponding positioning holes 121 for positioning. Next, the UV chip is embedded in the accommodating groove 101 and welded to the first pad 102 through leads. Then, resin is injected into the packaging cavity 201 for packaging, and the resin completely fills the annular waterproof groove 106.

[0036] The design focus of the utility model is that an annular waterproof groove is concavely provided on the upper surface of the ceramic body, and after packaging, the annular waterproof groove is filled with packaging resin, so that the path for external moisture to enter the packaging cavity is longer and more complicated, thereby improving the waterproof performance of the ceramic substrate, effectively preventing external moisture from entering the packaging cavity and damaging the UV chip, and then cooperating with an insulating reinforcement layer sandwiched between the upper ceramic base layer and the lower ceramic base layer to improve the strength of the ceramic substrate, making it not easy to break or be damaged, thereby extending its service life.

[0037] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A ceramic substrate for integrated packaging, comprising a ceramic body and a metal dam; a recessed groove for embedding a UV chip is formed on the upper surface of the ceramic body, a first pad is disposed on the periphery of the recess, a second pad is disposed on the lower surface of the ceramic body, and a through hole is formed through the surface of the ceramic body, a conductive column is embedded in the through hole, one end of the conductive column is conductively connected to the first pad, and the other end of the conductive column is conductively connected to the second pad; the metal dam is disposed on the upper surface of the ceramic body and is located on the periphery of the first pad, and the metal dam surrounds a packaging cavity; the characteristics are: The upper surface of the ceramic body is concavely provided with an annular waterproof groove, which is located on the inner side of the metal dam, and the ceramic body includes an upper ceramic base layer, a lower ceramic base layer and an insulating reinforcement layer, the upper ceramic base layer and the lower ceramic base layer are arranged up and down, and the insulating reinforcement layer is sandwiched between the upper ceramic base layer and the lower ceramic base layer.

2. The ceramic substrate for integrated packaging according to claim 1, characterized in that: The inner wall of the containing groove is coated with a heat dissipation layer, and the lower surface of the ceramic body is provided with a heat dissipation groove, which is communicated with the containing groove, and a heat dissipation part is filled in the heat dissipation groove.

3. The ceramic substrate for integrated packaging according to claim 2, characterized in that: The heat dissipation layer and the heat dissipation part are both made of graphene.

4. The ceramic substrate for integrated packaging according to claim 2, characterized in that: The surface of the heat dissipation portion is flush with the surface of the lower ceramic substrate.

5. The ceramic substrate for integrated packaging according to claim 1, characterized in that: The cross section of the metal dam is trapezoidal, and the height of the metal dam is 0.4-0.6 mm.

6. The ceramic substrate for integrated packaging according to claim 1, characterized in that: The lower ceramic base layer is provided with a plurality of positioning holes, the insulating reinforcement layer is provided with a plurality of through holes, each through hole is directly connected to the corresponding positioning hole, and the upper ceramic base layer is provided with a plurality of positioning columns, each positioning column passes through the corresponding through hole and is inserted into the corresponding positioning hole for positioning.

7. The ceramic substrate for integrated packaging according to claim 1, characterized in that: The insulating reinforcement layer is made of glass fiber.

8. The ceramic substrate for integrated packaging according to claim 1, characterized in that: Grooves are provided on both sides of the lower ceramic substrate, and buffer components are provided in the grooves.

9. The ceramic substrate for integrated packaging according to claim 8, characterized in that: The buffer is made of rubber material, and has a buffer air cavity inside. A buffer bracket is arranged inside the buffer air cavity.

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